Process Control Plan to Monitor Acceptable Levels of Flux and other residues
IPC J-STD –001G, Amendment 1 requires that the assembler have a sampling plan to assure that the process remains in control once qualified and validated. It is well documented that electrochemical failures occur at component sites where flux residues are not fully activated. It is also well known that specific components have a higher risk of electrochemical failure. Selecting a control plan that monitors the process and its performance on challenging components provides assurance that the process maintains control once established during process qualification. The test board used to qualify the process establishes an upper and lower spec limit for each of the component types on the test board. Surface Insulation Resistance upper and lower control limits, using challenging components that are representative of production hardware, represent a golden process condition. The golden image is a measure of process deviations that represents the performance of a resistance curve within a specific period. The objective is to judge whether the process in or out of control.