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At least 397 records · Page 22

STS-26/Discovery Preparations for Launch

This NASA Kennedy Space Center two-part video release is comprised of footage covering STS-26 launch preparations from the arrival of the Tracking and Data Relay Satellite (TDRS) at the Orbiter Processing Facility (OPF) to the lift and mate of the external tanks. The STS-26 flight crew include: Frederick H. (Rick) Hauck, mission commander; Richard O. Covey, pilot; John M. (Mike) Lounge, mission specialist; David C. Hilmers, mission specialist; and George D. (Pinky) Nelson, mission specialist. The primary payload of STS-26 is the TDRS while the secondary payloads include the Physical Vapor Transport of Organic Solids (PVTOS); Protein Crystal Growth (PCG); Infrared Communications Flight Experiment (IRCFE); Aggregation of Red Blood Cells (ARC); Isoelectric Focusing Experiment (IFE); Mesoscale Lightning Experiment (MLE); Phase Partitioning Experiment (PPE); Earth-Limb Radiance Experiment (ELRAD); Automated Directional Solidification Furnace (ADSF) and two Shuttle Student Involvement Program (SSIP) experiments. Launch preparation footage includes flight crew arrival at KSC, rollout of Discovery to Pad B, OV-103 Discovery power-up, main engine unpacking and installation, solid rocket boosters' arrival prep and stacking, and aft skirt to aft segment mating.

Source record↗

Silicon Carbide Sensors and Electronics Technology for Extreme Environments: Opportunities for Nuclear Power Applications

Over the past five decades, NASA Glenn Research Center had been advancing the development of single crystal silicon carbide growth, sensors and electronics device technologies, culminating in the recent demonstration of Micro-Electro-Mechanical Systems scale batch fabricated pressure sensors operating at 800 °C and integrated circuit electronics with demonstrated durability of over 1000 hours at 500 °C. As a result of the progress made in demonstrating the high temperature capability of the technology, insertion into actual operational environments, such as in jet engines and planet Venus, are in progress. The high temperature, near inert surface chemistry, and radiation hardness attributes of SiC, coupled with the relative maturation of the device batch microfabrication, contact metallization, and packaging technologies, make the material a prime candidate for use as part of future advanced nuclear reactor instrumentation and control strategy. Hence the current research efforts at NASA Glenn are aimed toward harnessing these attributes in developing SiC sensors and electronics for nuclear reactor applications, potentially for future Lunar/Martian nuclear power and the emerging terrestrial micro nuclear power plants.

silicon carbide↗

Command and Data Handling Branch Internship

Modular Integrated Stackable Layers (MISL) is a computer system designed for simple, fast, and cost effective flexible reconfiguration in space environments such as the ISS and Orion projects for various uses. Existing applications include wireless and wired communications, data acquisition and instrumentation, and camera systems, and potential applications include bus protocol converters and subsystem control. MISL is based on Texas Instruments (TI)' MSP430 16-bit ultra-low-power microcontroller device. The purpose of my project was to integrate the MISL system with a liquid crystal display (LCD) touchscreen. The LCD, manufactured by Crystalfontz and part number CFAF320240F-035T-TS, is a 320 by 240 RGB resistive color screen including an optional carrier board. The vast majority of the project was done with Altium Designer, a tool for printed circuit board (PCB) schematic capture, 3D design, and FPGA (Field Programmable Gate Array) development. The new PCB was to allow the LCD to directly stack to the rest of MISL. Research was done with datasheets for the TI microcontroller and touchscreen display in order to meet desired hardware specifications. Documentation on prior MISL projects was also utilized. The initial step was to create a schematic for the LCD, power bus, and data bus connections between components. A layout was then designed with the required physical dimensions, routed traces and vias, power and ground planes, layer stacks, and other specified design rules such as plane clearance and hole size. Multiple consultation sessions were held with Hester Yim, the technical discipline lead for the Command and Data Handling Branch, and Christy Herring, the lead PCB layout designer in the Electronic Design and Manufacturing Branch in order to ensure proper configuration. At the moment, the PCB is awaiting revision by the latter-mentioned branch. Afterwards, the board will begin to undergo the manufacturing and testing process. Throughout the internship at Johnson Space Center, I gained several technical and professional skills. I gained proficiency in Altium Designer and experience using subversion clients, as well as knowledge in PSpice with OrCAD and battery design for spaceflight from on-site. I also gained networking, organization, and communication skills throughout meetings with coworkers and other interns. This internship at Johnson Space Center has impacted my future aspirations by further inspiring me to follow a career path into space rated engineering technology and human spaceflight applications. After graduation, I plan to attend graduate Modular Integrated Stackable Layers (MISL) is a computer system designed for simple, fast, and cost effective flexible reconfiguration in space environments such as the ISS and Orion projects for various uses. Existing applications include wireless and wired communications, data acquisition and instrumentation, and camera systems, and potential applications include bus protocol converters and subsystem control. MISL is based on Texas Instruments’ MSP430 16 bit ultra-low power microcontroller device. The purpose of my project was to integrate the MISL system with a liquid crystal display touchscreen. The LCD, manufactured by Crystalfontz and part number CFAF320240F-035T-TS, is a 320x240 RGB resistive color screen including an optional carrier board.The vast majority of the project was done with Altium Designer, a tool for printed circuit board (PCB) schematic capture, 3D design, and FPGA development. The new PCB was to allow the LCD to directly stack to the rest of MISL. Research was done with datasheets for the TI microcontroller and touchscreen display in order to meet desired hardware specifications. Documentation on prior MISL projects was also utilized. The initial step was to create a schematic for the LCD, power bus, and data bus connections between components. A layout was then designed with the required physical dimensions, routed traces and vias, power and ground planes, layer stacks, and other specified design rules such as plane clearance and hole size. Multiple consultation sessions were held with Hester Yim, the technical discipline lead for the Command and Data Handling Branch, and Christy Herring, the lead PCB layout designer in the Electronic Design and Manufacturing Branch in order to ensure proper configuration. At themoment, the PCB is awaiting revision by the latter-mentioned branch. Afterwards, the board will begin to undergo the manufacturing and testing process.Throughout the internship at Johnson Space Center, I gained several technical and professional skills. I gained proficiency in Altium Designer and experience using subversion clients, as well as knowledge in PSpice with OrCAD and battery design for spaceflight from on-site. I also gained networking, organization, and communication skills throughout meetings with coworkers and other interns. This internship at Johnson Space Center has impacted my future aspirations by further inspiring me to follow a career path into space rated engineering technology and human spaceflight applications. After graduation, I plan to attend graduate school for a master's or doctorate degree in electrical or computer engineering.

Billings, Rachel Mae↗

Space Processing Applications Rocket project SPAR III

This document presented the engineering report and science payload III test report and summarized the experiment objectives, design/operational concepts, and final results of each of five scientific experiments conducted during the third Space Processing Applications Rocket (SPAR) flight flown by NASA in December 1976. The five individual SPAR experiments, covering a wide and varied range of scientific materials processing objectives, were entitled: Liquid Mixing, Interaction of Bubbles with Solidification Interfaces, Epitaxial Growth of Single Crystal Film, Containerless Processing of Beryllium, and Contact and Coalescence of Viscous Bodies.

Reeves, F.↗

Silicon carbide, an emerging high temperature semiconductor

In recent years, the aerospace propulsion and space power communities have expressed a growing need for electronic devices that are capable of sustained high temperature operation. Applications for high temperature electronic devices include development instrumentation within engines, engine control, and condition monitoring systems, and power conditioning and control systems for space platforms and satellites. Other earth-based applications include deep-well drilling instrumentation, nuclear reactor instrumentation and control, and automotive sensors. To meet the needs of these applications, the High Temperature Electronics Program at the Lewis Research Center is developing silicon carbide (SiC) as a high temperature semiconductor material. Research is focussed on developing the crystal growth, characterization, and device fabrication technologies necessary to produce a family of silicon carbide electronic devices and integrated sensors. The progress made in developing silicon carbide is presented, and the challenges that lie ahead are discussed.

Matus, Lawrence G.↗

High-Temperature Thermometer Using Cr-Doped GdAlO3 Broadband Luminescence

A new concept has been developed for a high-temperature luminescence-based optical thermometer that both shows the desired temperature sensitivity in the upper temperature range of present state-of-the-art luminescence thermometers (above 1,300 C), while maintaining substantial stronger luminescence signal intensity that will allow these optical thermometers to operate in the presence of the high thermal background radiation typical of industrial applications. This objective is attained by using a Cr-doped GdAlO3 (Cr:GdAlO3) sensor with an orthorhombic perovskite structure, resulting in broadband luminescence that remains strong at high temperature due to the favorable electron energy level spacing of Cr:GdAlO3. The Cr:GdAlO3 temperature (and pressure) sensor can be incorporated into, or applied onto, a component s surface when a non-contact surface temperature measurement is desired, or alternatively, the temperature sensor can be attached to the end of a fiber-optic probe that can then be positioned at the location where the temperature measurement is desired. In the case of the fiber-optic probe, both the pulsed excitation and the luminescence emission travel through the fiber-optic light guide. In either case, a pulsed light source provides excitation of the luminescence, and the broadband luminescence emission is collected. Real-time temperature measurements are obtain ed using a least-squares fitting algorithm that determines the luminescence decay time, which has a known temperature dependence established by calibration. Due to the broad absorption and emission bands for Cr:GdAlO3, there is considerable flexibility in the choice of excitation wavelength and emission wavelength detection bands. The strategic choice of the GdAlO3 host is based on its high crystal field, phase stability, and distorted symmetry at the Cr3+ occupation sites. The use of the broadband emission for temperature sensing at high temperatures is a key feature of the invention and is novel since broadband luminescence emission normally shows severe thermal quenching. The tightly bound AlO6 octahedra in GdAlO3 results in a larger energy barrier to nonradiative decays than in other materials and therefore makes using broadband emission for temperature sensing possible at high temperatures. This approach results in a substantial increase in temperature capability. For example, the most commonly used Cr-doped crystal used for luminescence-based temperature measurements, ruby, has only been demonstrated up to 600 C, whereas the Cr:GdAlO3 optical thermometer under development has already been shown to exhibit useful luminescence up to 1,300 C. Because GdAlO3 is non-reactive and is stable in harsh, high-temperature environments, sensors composed of Cr:GdAlO3 will be very well suited for remote high-temperature measurements in engine or industrial environments where its intense high-temperature luminescence will stand out above significant thermal radiation background levels.

Eldridge, Jeffrey↗

Multi-Scale Computational Modeling of Two-Phased Metal Using GMC Method

A multi-scale computational model for determining plastic behavior in two-phased CMSX-4 Ni-based superalloys is developed on a finite element analysis (FEA) framework employing crystal plasticity constitutive model that can capture the microstructural scale stress field. The generalized method of cells (GMC) micromechanics model is used for homogenizing the local field quantities. At first, GMC as stand-alone is validated by analyzing a repeating unit cell (RUC) as a two-phased sample with 72.9% volume fraction of gamma'-precipitate in the gamma-matrix phase and comparing the results with those predicted by finite element analysis (FEA) models incorporating the same crystal plasticity constitutive model. The global stress-strain behavior and the local field quantity distributions predicted by GMC demonstrated good agreement with FEA. High computational saving, at the expense of some accuracy in the components of local tensor field quantities, was obtained with GMC. Finally, the capability of the developed multi-scale model linking FEA and GMC to solve real life sized structures is demonstrated by analyzing an engine disc component and determining the microstructural scale details of the field quantities.

nickel alloys↗

Testing and Application of Commercial Thermodynamics Software for Solid-Gas Equilibria in Planetary Science Applications

The ability to calculate chemical equilibria from thermochemical constants (e.g., H, S, Cp) or other experimental data is a tool widely employed by scientists. However, phase equilibria for planetary science problems is limited by easy access to libraries of thermochemical data, as well as the software to invert that data. Many academic software packages are focused on specific types of problems (e.g., aqueous solutions or melting and crystallization of magmas). This focus makes them excellent tools for specific uses, but poorer tools for other scenarios, especially those involving elements or chemical species that are less well-studied in that specific scientific field (e.g. NaCl vapor). Amongst the more general thermodynamic software tools, there are closed academic software packages, open-source options, as well as commercial software. We have explored the extent to which commercial chemistry/chemical engineering software may be able to satisfy the need for thermochemical modeling packages that can accommodate the diverse species and conditions of planetary science problems. Here we compare the output of software package HSC Chemistry™ (Metso Outotec) to published vapor-solid phase diagrams for a variety of major and minor elements. HSC Chemistry™ has been used in several recent geochemical studies of terrestrial volcanic systems [2- 4]. However, it has not to our knowledge been benchmarked against peer-reviewed model results for the conditions and compositions relevant to planetary science. We present one such comparison here, the low- pressure environment of the solar nebula, using literature data. In short, we find excellent agreement between HSC Chemistry™ and the well-regarded academic software package CONDOR. These preliminary results suggest that at least some commercial software packages are capable of robust thermochemical calculations for planetary science.

planetary science↗

Compact, Engineered, 2-Micron Coherent Doppler Wind Lidar Prototype: A New NASA Instrument Incubator Program Project

A new project, selected in 2005 by NASA s Science Mission Directorate (SMD) under the Instrument Incubator Program (IIP), will be described. The 3-year effort is intended to design, fabricate, and demonstrate a packaged, rugged, compact, space-qualifiable coherent Doppler wind lidar (DWL) transceiver capable of future validation in an aircraft and/or Unmanned Aerial Vehicle (UAV). The packaged DWL will utilize the numerous advances in pulsed, solid-state, 2-micron laser technology at NASA s Langley Research Center (LaRC) in such areas as crystal composition, architecture, efficiency, cooling techniques, pulse energy, and beam quality. The extensive experience of Raytheon Space and Airborne Systems (RSAS) in coherent lidar systems, in spacebased sensors, and in packaging rugged lidar systems will be applied to this project. The packaged transceiver will be as close to an envisioned space-based DWL system as the resources and technology readiness allow. We will attempt to facilitate a future upgrade to a coherent lidar system capable of simultaneous wind and CO2 concentration profile measurements. Since aerosol and dust concentration is also available from the lidar signal, the potential for a triple measurement lidar system is attractive for both Earth and Mars remote sensing. A key follow on step after the IIP will be to add a telescope, scanner, and software for aircraft validation. This IIP should also put us in a position to begin a parallel formulation study in the 2006-2007 timeframe for a space-based DWL demonstration mission early next decade.

Kavaya, Michael J.↗

SiC Technology

Silicon carbide (SiC)-based semiconductor electronic devices and circuits are presently being developed for use in high-temperature, high-power, and/or high-radiation conditions under which conventional semiconductors cannot adequately perform. Silicon carbide's ability to function under such extreme conditions is expected to enable significant improvements to a far-ranging variety of applications and systems. These range from greatly improved high-voltage switching [1- 4] for energy savings in public electric power distribution and electric motor drives to more powerful microwave electronics for radar and communications [5-7] to sensors and controls for cleaner-burning more fuel-efficient jet aircraft and automobile engines. In the particular area of power devices, theoretical appraisals have indicated that SiC power MOSFET's and diode rectifiers would operate over higher voltage and temperature ranges, have superior switching characteristics, and yet have die sizes nearly 20 times smaller than correspondingly rated silicon-based devices [8]. However, these tremendous theoretical advantages have yet to be realized in experimental SiC devices, primarily due to the fact that SiC's relatively immature crystal growth and device fabrication technologies are not yet sufficiently developed to the degree required for reliable incorporation into most electronic systems [9]. This chapter briefly surveys the SiC semiconductor electronics technology. In particular, the differences (both good and bad) between SiC electronics technology and well-known silicon VLSI technology are highlighted. Projected performance benefits of SiC electronics are highlighted for several large-scale applications. Key crystal growth and device-fabrication issues that presently limit the performance and capability of high temperature and/or high power SiC electronics are identified.

Neudeck, Philip G.↗

LSA Large Area Silicon Sheet Task Enhanced I.D. Slicing Technology for Silicon Ingots

Development of inside diameter slicing technology to significantly increase the number of useable slices per inch of crystal over industry practice is discussed. The required reduction of both blade and slice thickness is to be accomplished by a combination of three key elements of slicing technology: (1) ingot rotation with minimum exposed blade area; (2) dynamic cutting edge control; and (3) the use of prefabricated insert blades. Design modifications on a slicing saw with microprocessor controls and hardware fabrication to complete this conversion were initiated. Several runs were conducted on the engineering saw incorporating the method of ingot rotation. Ingots with diameters up to six inches were sliced successfully on a production saw.

Walters, D.↗

Use of a liquid-crystal, heater-element composite for quantitative, high-resolution heat transfer coefficients on a turbine airfoil, including turbulence and surface roughness effects

Local heat transfer coefficients were measured along the midchord of a three-times-size turbine vane airfoil in a static cascade operated at roon temperature over a range of Reynolds numbers. The test surface consisted of a composite of commercially available materials: a Mylar sheet with a layer of cholestric liquid crystals, which change color with temperature, and a heater made of a polyester sheet coated with vapor-deposited gold, which produces uniform heat flux. After the initial selection and calibration of the composite sheet, accurate, quantitative, and continuous heat transfer coefficients were mapped over the airfoil surface. Tests were conducted at two free-stream turbulence intensities: 0.6 percent, which is typical of wind tunnels; and 10 percent, which is typical of real engine conditions. In addition to a smooth airfoil, the effects of local leading-edge sand roughness were also examined for a value greater than the critical roughness. The local heat transfer coefficients are presented for both free-stream turbulence intensities for inlet Reynolds numbers from 1.20 to 5.55 x 10 to the 5th power. Comparisons are also made with analytical values of heat transfer coefficients obtained from the STAN5 boundary layer code.

Hippensteele, Steven A.↗

Use of a liquid-crystal and heater-element composite for quantitative, high-resolution heat-transfer coefficients on a turbine airfoil including turbulence and surface-roughness effects

Local heat transfer coefficients were measured along the midchord of a three-times-size turbine vane airfoil in a static cascade operated at room temperature over a range of Reynolds numbers. The test surface consisted of a composite of commercially available materials: a Mylar sheet with a layer of cholestric liquid crystals, which change color with temperature, and a heater made of a polyester sheet coated with vapor-deposited gold, which produces uniform heat flux. After the initial selection and calibration of the composite sheet, accurate, quantitative, and continuous heat transfer coefficients were mapped over the airfoil surface. Tests were conducted at two free-stream turbulence intensities: 0.6 percent, which is typical of wind tunnels; and 10 percent, which is typical of real engine conditions. In addition to a smooth airfoil, the effects of local leading-edge sand roughness were also examined for a value greater than the critical roughness. The local heat transfer coefficients are presented for both free-stream turbulence intensities for inlet Reynolds numbers from 1.20 to 5.55 x 10 to the 5th power. Comparisons are also made with analytical values of heat transfer coefficients obtained from the STAN5 boundary layer code.

Hippensteele, S. A.↗

Results of the long range position-determining system tests

The long range position-determining system (LRPDS) has been developed by the Corps of Engineers to provide the Field Army with a rapid and accurate positioning capability. The LRPDS consists of an airborne reference position set (RPS), up to 30 ground based positioning sets (PS), and a position computing central (PCC). The PCC calculates the position of each PS based on the range change information provided by each Set. The positions can be relayed back to the PS again via RPS. Each PS unit contains a double oven precise crystal oscillator. The RPS contains a Hewlett-Packard cesium beam standard. Frequency drifts and off-sets of the crystal oscillators are taken in account in the data reduction process. A field test program was initiated in November 1972. A total of 54 flights were made which included six flights for equipment testing and 48 flights utilizing the field test data reduction program. The four general types of PS layouts used were: short range; medium range; long range; tactical configuration. The overall RMS radial error of the unknown positions varied from about 2.3 meters for the short range to about 15 meters for the long range. The corresponding elevation RMS errors vary from about 12 meters to 37 meters.

Rhode, F. W.↗

A New Direction for the NASA Materials Science Research Using the International Space Station

In 2001 NASA created a fifth Strategic Enterprise, the Office of Biological and Physical Research (OBPR), to bring together physics, chemistry, biology, and engineering to foster interdisciplinary research. The Materials Science Program is one of five Microgravity Research disciplines within this new Enterprise's Division of Physical Sciences Research. The Materials Science Program will participate within this new enterprise structure in order to facilitate effective use of ISS facilities, target scientific and technology questions and transfer results for Earth benefits. The Materials Science research will use a low gravity environment for flight and ground-based research in crystallization, fundamental processing, properties characterization, and biomaterials in order to obtain fundamental understanding of various phenomena effects and relationships to the structures, processing, and properties of materials. Completion of the International Space Station's (ISS) first major assembly, during the past year, provides new opportunities for on-orbit research and scientific utilization. The Enterprise has recently completed an assessment of the science prioritization from which the future materials science ISS type payloads will be implemented. Science accommodations will support a variety of Materials Science payload hardware both in the US and international partner modules with emphasis on early use of Express Rack and Glovebox facilities. This paper addresses the current scope of the flight and ground investigator program. These investigators will use the various capabilities of the ISS lab facilities to achieve their research objectives. The type of research and classification of materials being studied will be addressed. This includes the recent emphasis being placed on radiation shielding, nanomaterials, propulsion materials, and biomaterials type research. The Materials Science Program will pursue a new, interdisciplinary approach, which contributes, to Human Space Flight Exploration research. The Materials Science Research Facility (MSRF) and other related American and International experiment modules will serve as the foundation for the flight research environment. A summary will explain the concept for materials science research processing capabilities aboard the ISS along with the various ground facilities necessary to support the program.

Schlagheck, Ronald A.↗

Wholly Aromatic Ether-Imides as n-Type Semiconductors

Some wholly aromatic ether-imides consisting of rod-shaped, relatively-low-mass molecules that can form liquid crystals have been investigated for potential utility as electron-donor-type (ntype) organic semiconductors. It is envisioned that after further research to improve understanding of their physical and chemical properties, compounds of this type would be used to make thin film semiconductor devices (e.g., photovoltaic cells and field-effect transistors) on flexible electronic-circuit substrates. This investigation was inspired by several prior developments: Poly(ether-imides) [PEIs] are a class of engineering plastics that have been used extensively in the form of films in a variety of electronic applications, including insulating layers, circuit boards, and low-permittivity coatings. Wholly aromatic PEIs containing naphthalene and perylene moieties have been shown to be useful as electrochromic polymers. More recently, low-molecular-weight imides comprising naphthalene-based molecules with terminal fluorinated tails were shown to be useful as n-type organic semiconductors in such devices as field-effect transistors and Schottky diodes. Poly(etherimide)s as structural resins have been extensively investigated at NASA Langley Research Center for over 30 years. More recently, the need for multi-functional materials has become increasingly important. This n-type semiconductor illustrates the scope of current work towards new families of PEIs that not only can be used as structural resins for carbon-fiber reinforced composites, but also can function as sensors. Such a multi-functional material would permit so-called in-situ health monitoring of composite structures during service. The work presented here demonstrates that parts of the PEI backbone can be used as an n-type semiconductor with such materials being sensitive to damage, temperature, stress, and pressure. In the near future, multi-functional or "smart" composite structures are envisioned to be able to communicate such important parameters to the flight crew and provide vital information with respect to the operational status of their aircraft.

Weiser, Erik↗

Silicon Carbide Technology

Silicon carbide based semiconductor electronic devices and circuits are presently being developed for use in high-temperature, high-power, and high-radiation conditions under which conventional semiconductors cannot adequately perform. Silicon carbide's ability to function under such extreme conditions is expected to enable significant improvements to a far-ranging variety of applications and systems. These range from greatly improved high-voltage switching for energy savings in public electric power distribution and electric motor drives to more powerful microwave electronics for radar and communications to sensors and controls for cleaner-burning more fuel-efficient jet aircraft and automobile engines. In the particular area of power devices, theoretical appraisals have indicated that SiC power MOSFET's and diode rectifiers would operate over higher voltage and temperature ranges, have superior switching characteristics, and yet have die sizes nearly 20 times smaller than correspondingly rated silicon-based devices [8]. However, these tremendous theoretical advantages have yet to be widely realized in commercially available SiC devices, primarily owing to the fact that SiC's relatively immature crystal growth and device fabrication technologies are not yet sufficiently developed to the degree required for reliable incorporation into most electronic systems. This chapter briefly surveys the SiC semiconductor electronics technology. In particular, the differences (both good and bad) between SiC electronics technology and the well-known silicon VLSI technology are highlighted. Projected performance benefits of SiC electronics are highlighted for several large-scale applications. Key crystal growth and device-fabrication issues that presently limit the performance and capability of high-temperature and high-power SiC electronics are identified.

Neudeck, Philip G.↗

NASA Tech Briefs, January 2001

The topics include: 1) A "Model" of Interactive Engineering; 2) Feature Section: Communications Technology; 3) lnReview; 4) Application Briefs; 5) Submillimeter-Wave Image Sensor; 6) Ultrasonic/Sonic Drill/Corers With Integrated Sensors; 7) Normally Closed, Piezoelectrically Actuated Microvalve; 8) Magnetostrictively Actuated Valves for Cryosurgical Probes; 9) Remote Sensing of Electric Fields in Clouds; 10) Wireless-Communication Headset Subsystem To Enhance Signaling; 11) Power Amplifier With 9 to 13 dB of Gain From 65 to 146 GHz; 12) Humidity Interlock for Protecting a Cooled Laser Crystal; 13) A Lightweight Ambulatory Physiological Monitoring System; 14) Improvements in a Lightning-Measuring Instrument; 15) Broad-Band, Noninvasive Radio-Frequency Current Probe; 16) Web-Based Technology Distributes Lean Models; 17) Software Guides Aeroelastic-Systems Design; and 18) Postprocessing Software for Micromechanics Analysis Code. A Photonics West 2001 Preview Tech Brief supplement to this January 2001 issue is also included.

Source record↗