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At least 397 records · Page 22

Steady Deflagration of PBX-9501 Within a Copper Cylinder

A copper cylinder cook-off experiment has been designed to cause steady deflagration in PBX-9501 explosive material. The design is documented and preliminary copper expansion results are presented for steady deflagration with a reaction speed of 1092 +/- 24 m/s. The expansion of reaction products from the detonation of an explosive is something that is well understood, and reasonably simulated using documented equations of state (EOS) for many explosives of interest. These EOS were historically measured using a 'standard' copper cylinder test design; this design comprised an annealed, oxygen-free high conductivity (OFHC) copper tube filled with explosive material and detonated from one end. Expansion of the copper wall was measured as a function of time using either a streak camera (for classic testing), or more recently using laser velocimetry techniques. Expansion data were then used to derive the EOS in various preferred forms - which are not discussed here for the sake of brevity. When an explosive deflagrates rather than detonating, simulation becomes more difficult. Reaction products are released on a slower time scale, and the reactions are much more affected by the geometry and local temperature within the reaction environment. It is assumed that the standard, documented EOS will no longer apply. In an effort to establish a first order approximation of deflagration product behavior, a cook-off test has been designed to cause steady deflagration in PBX-9501 explosive material, and to record the copper expansion profile as a function of time during this test. The purpose of the current paper is to document the initial test design and report some preliminary results. A proposal for modification of the design is also presented.

45 MILITARY TECHNOLOGY, WEAPONRY, AND NATIONAL DEF↗

Fabrication of high quality copper indium disulphide absorbers by bell-like wave modulated electrodeposition

Highlights: • Cu/In bilayer was fabricated by BMSMW deposition technique. • High quality CIS film was successfully fabricated. • A preferable ratio of Cu:In:S close to 1:1:2 was approached. • The SPV response as high as 6 mV was achieved. - Abstract: High-quality CuInS{sub 2} (CIS) thin films have been fabricated by sulfurization of electrodeposited copper–indium bilayer. A novel bell-like wave modulated square wave (BWMSW) electrodeposition technique is employed for the deposition of copper thin film. Three independent parameters (current or potential, frequency, duty cycle) are available for the BWMSW electrodeposition, which is different from the traditional electrodeposition technique with only one adjustable parameter (current or potential). The influences of deposition parameters such as frequency, duty cycle and the concentration of complexing agent are investigated. Benefited from the high quality copper film obtained by the BWMSW technique, the indium film is electrodeposited successfully on the copper layer to form a compact copper–indium alloy bilayer. After sulfurized at 600 °C for 60 min, the phase pure CIS film is obtained with better crystallinity. The structures, morphologies and optoelectronic properties of the CIS film are also characterized.

36 MATERIALS SCIENCE↗

A Finite Difference Analysis of the Effect of Graphene Additions on the Electrical Conductivity of Polycrystalline Copper

A finite-difference method was used to explore the effect of graphene on the bulk electrical conductivity of copper-graphene composites. In this capacity, grain orientation information from pure copper and copper-graphene composites were used to generate synthetic 3D microstructures. The electrical conductivity of these microstructures were calculated using the finite difference method assuming different average grain sizes. From these calculations, we demonstrate that when high-conductivity grain boundaries are present within the microstructure arising from the presence of graphene, an increase in the bulk electrical conductivity is observed. On the other hand, the difference in textures between copper and copper-graphene composites may not account for a significant difference in bulk electrical conductivity. In comparison, the copper grain size has a considerably larger effect on electrical conductivity as previously anticipated. This is one of the first demonstrations of a physical basis for enhanced conductivity composites and presents pathways for further investigations on the effects of composite microstructural features, material interfaces and graphene content on electrical performance.

Frazier, William E.↗

Stabilization of Oxidized Copper Nanoclusters in Confined Spaces

Copper is an important industrial catalyst. The ability to manipulate the oxidation state of copper clusters in a controlled way is critical to understanding structure–reactivity relations of copper catalysts at the molecular level. Experimentally, cupric oxide surfaces or even small domains can only be stabilized at elevated temperatures and in the presence of oxygen, as copper can be easily reduced under reaction conditions. Herein bilayer silica films grown on a metallic substrate are used to trap diluted copper oxide clusters. By combining in situ experiments with first principles calculations, it is found that the confined space created by the silica film leads to an increase in the energy barrier for Cu diffusion. Dispersed copper atoms trapped by the silica film can be easily oxidized by surface oxygen chemisorbed on the metallic substrate, which results in the formation and stabilization of Cu 2+ cations.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Antibacterial Copper–Hydroxyapatite Composite Coatings via Electrochemical Synthesis

Antibacterial copper-hydroxyapatite (Cu-HA) composite coatings on titanium were synthesized using a novel process consisting of two consecutive electrochemical reactions. In the first stage, HA nanocrystals were grown on titanium using cathodic electrolytic synthesis. The HA-coated titanium was then used as the cathode in a second reaction stage to electrochemically reduce Cu 2+ ions in solution to metallic Cu nanoparticles. Reaction conditions were found that result in nano-scale Cu particles growing on the surface of the HA crystals. The two-stage synthesis allows facile control of copper content in the HA coatings. Antibacterial activity was measured by culturing Escherichia coli (Gram-negative) and Staphylococcus aureus (Gram-positive) in the presence of coatings having varying copper content. The coatings displayed copper concentration-dependent antibacterial activity against both types of bacteria, likely due to the slow release of copper ions from the coatings. Lastly, the observation of antibacterial activity from a relatively low loading of copper on the bioactive HA support suggests that multifunctional implant coatings can be developed to supplement or supplant prophylactic antibiotics used in implant surgery that are responsible for creating resistant bacteria strains.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Poly-Amide Modified Copper Foam Electrodes for Enhanced Electrochemical Reduction of Carbon Dioxide

A strategy to modulate the electrocatalytic activity of copper toward CO 2 reduction involving adsorption of acrylamide, acrylic acid, and allylamine polymers is presented. Modification of electrodeposited copper foam with poly(acrylamide) leads to a significant enhancement in faradaic efficiency for ethylene from 13% (unmodified foam) to 26% at -0.96 V vs RHE, whereas methane yield is unaffected. Effects from crystalline phase distribution and copper oxide phases are ruled out as the source of enhancement through XPS and in situ XRD analysis. DFT calculations reveal that poly(acrylamide) adsorbs on the copper surface via the oxygen atom on the carbonyl groups and enhances ethylene formation by (i) charge donation to the copper surface that activates CO for dimerization, (ii) chemical stabilization of the CO dimer (a key intermediate for C 2 products) by hydrogen-bond interactions with the -NH 2 group, and (iii) facilitating the adsorption of CO molecules near the polymer, increasing local surface coverage. Poly(acrylamide) with copper acts as a multipoint binding catalytic system where the interplay between activation and stabilization of intermediates results in enhanced selectivity toward ethylene formation. Finally, modification with poly(acrylic acid) which has a similar structure to poly(acrylamide) also shows some enhancement in activity but is unstable, whereas poly(allylamine) completely suppresses CO 2 reduction in favor of the hydrogen evolution reaction.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Highly selective plasma-activated copper catalysts for carbon dioxide reduction to ethylene

There is an urgent need to develop technologies that use renewable energy to convert waste products such as carbon dioxide into hydrocarbon fuels. Carbon dioxide can be electrochemically reduced to hydrocarbons over copper catalysts, although higher efficiency is required. We have developed oxidized copper catalysts displaying lower overpotentials for carbon dioxide electroreduction and record selectivity towards ethylene (60%) through facile and tunable plasma treatments. Herein we provide insight into the improved performance of these catalysts by combining electrochemical measurements with microscopic and spectroscopic characterization techniques. Operando X-ray absorption spectroscopy and cross-sectional scanning transmission electron microscopy show that copper oxides are surprisingly resistant to reduction and copper + species remain on the surface during the reaction. Furthermore, our results demonstrate that the roughness of oxide-derived copper catalysts plays only a partial role in determining the catalytic performance, while the presence of copper + is key for lowering the onset potential and enhancing ethylene selectivity.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

X-ray absorption spectroscopy of lithium insertion and de-insertion in copper birnessite nanoparticle electrodes

The combination of ex situ X-ray diffraction (XRD) and X-ray absorption spectroscopy (XAS) measurements on 2D layered copper birnessite cathode materials for lithium ion battery applications provides detailed insight into both bulk-crystalline and localized atomic structural changes resulting from electrochemically driven lithium insertion and de-insertion. Copper birnessite electrodes that had been galvanostatically discharged and charged were measured with XRD to determine the accompanying long-range crystalline structure changes, while Mn and Cu K-edge XAS measurements provided a detailed view of the Mn and Cu oxidation state changes along with variations of the local neighboring atom environments around the Mn and Cu centers. While not detectable with XRD spectra, through XAS measurements it was determined that the copper ions (Cu 2+ ) are reduced to form amorphous nano-sized Cu metal, and can be oxidized back to Cu 2+ . In this work, the reversible nature of the interconversion provides a rationale to the enhanced discharge capacity of copper birnessite relative to the analogous copper-free birnessite materials. The manganese oxide octahedra comprising the 2D layers in the original copper birnessite crystal structure disperse during lithium insertion, and revert back close to their original orientation after lithium de-insertion. During electrochemical oxidation or reduction the layered birnessite structure does not collapse, even though significant local disordering around Mn and Cu centers is directly observed.

25 ENERGY STORAGE↗

Multiphase separation of copper nanowires

Here, this communication reports a new method to purify copper nanowires with nearly 100% yield from undesired copper nanoparticle side-products formed during batch processes of copper nanowire synthesis. Also, this simple separation method can yield large quantities of long, uniform, high-purity copper nanowires to meet the requirements of nanoelectronics applications as well as provide an avenue for purifying copper nanowires in the industrial scale synthesis of copper nanowires, a key step for commercialization and application of nanowires.

36 MATERIALS SCIENCE↗

Enhanced electrical conductivity in graphene–copper multilayer composite

For many years, researchers have been trying to make a material more conductive than silver by incorporating carbon nanotubes or graphene into copper to form a composite material. However, after a decade-long effort, only a few groups reported successful results, raising concerns about the feasibility of this composite approach. Here, we report our effort to validate the multilayer graphene–copper composite approach for improving electrical conductivity. We demonstrate that, with an estimated 0.008 vol. % graphene addition, copper’s electrical conductivity was improved to 104.2% of International Annealed Copper Standard (IACS) at room temperature. If the copper substrate used to make the multilayer composite is discounted using the parallel resistance model, the conductivity is calculated to be 185% IACS. This result could be further improved if the thickness of the copper layers can be further reduced.

36 MATERIALS SCIENCE↗

SU-F-I-76: Fluoroscopic X-Ray Beam Profiles for Spectra Incorporating Copper Filtration

Purpose: The purpose of this investigation is to characterize and quantify X-ray beam profiles for fluoroscopic x-ray beam spectra incorporating spectral (copper) filtration. Methods: A PTW (Freiburg, Germany) type 60016 silicon diode detector and PTW MP3 water tank were used to measure X-ray beam profiles for 60, 80, 100 and 120 kVp x-ray beams at five different copper filtration thicknesses ranging from 0–0.9 mm at 22 and 42 cm fields of view and depths of 1, 5, and 10 cm in both the anode-cathode axis (inplane) and cross-plane directions. All measurements were acquired on a Siemens (Erlangen, Germany) Artis ZeeGo fluoroscope inverted from the typical orientation providing an x-ray beam originating from above the water surface with the water level set at 60 cm from the focal spot. Results: X-ray beam profiles for beam spectra without copper filtration compared well to previously published data by Fetterly et al. [Med Phys, 28, 205 (2001)]. Our data collection benefited from the geometric orientation of the fluoroscope, providing a beam perpendicular to the tank water surface, rather than through a thin side wall as did the previously mentioned study. Profiles for beams with copper filtration were obtained which have not been previously investigated and published. Beam profiles in the anode-cathode axis near the surface and at lower x-ray energy exhibited substantial heel effect, which became less pronounced at greater depth. At higher energy with copper filtration in the beam, the dose falloff out-of-field became less pronounced, as would be anticipated given higher scatter photon energy. Conclusion: The x-ray beam profile data for the fluoroscopic x-ray beams incorporating copper filtration are intended for use as reference data for estimating doses to organs or soft tissue, including fetal dose, involving similar beam qualities or for comparison with mathematical models.

60 APPLIED LIFE SCIENCES↗

Techniques for energetic ion assisted in-situ coating of long, small diameter, beam pipes with compacted thick crystalline copper film

High wall resistivity can cause heating and instabilities in accelerators. Electron clouds in accelerators limit machine performance through associated dynamical instabilities and/or vacuum pressure increases. Coating accelerator vacuum tubes with compacted thick crystalline copper will mitigate those problems and can enhance luminosity. Develop compact ion assisted deposition (IAD) devices by incorporating ion bombardment in a robotic cylindrical magnetron sputtering device configured for small radial dimension tubes for in-situ coating of long, small diameter tubes with defect free thick films copper. Selected an ion assisted plasma deposition technique for in-situ coating of long, small diameter tubes. Set up a cryogenic resonator for measuring conductivity of deposited copper at cryogenic temperature to optimize the deposition technique; preliminary design of phase II full-scale device. Coating of existing accelerator vacuum tubes with compacted thick crystalline copper is a very cost effective way to mitigate significant problems in accelerators trying to increase luminosity. IAD results in superior quality film deposition, which due to inefficiencies, is presently restricted to high value items. Advancing to industry forefront more cost effective IAD, will improve tools, ball bearings & other lower value industrial products, thus reducing waste as well as improving industrial accelerators and electron guns, impacting companies who utilize accelerators. Develop improved inexpensive plasma deposition for copper coating accelerator tubes with compacted thick crystalline copper. Although there are commercial applications, initial project focus is to facilitate cost-effective luminosity increase in RHIC at BNL as well as other machines.

43 PARTICLE ACCELERATORS↗

Effects on LDEF exposed copper film and bulk

Two forms of copper were exposed to the Long Duration Exposure Facility (LDEF) Mission 1 environment: a copper film, initially 74.2 plus or minus 1.1 nm thick sputter coated on a fused silica flat and a bulk piece of oxygen-free, high conductivity (OFHC) copper. The optical density of the copper film changed from 1.33 to 0.70 where exposed, and the film thickness increased to 106.7 plus or minus 0.5 nm where exposed. The exposed area appears purple by reflection and green by transmission for the thin film and maroon color for the bulk copper piece. The exposed areas increased in thickness, but only increase in the thickness of the thin film sample could be readily measured. The increase in film thickness is consistent with the density changes occurring during conversion of copper to an oxide. However, we have not been able to confirm appreciable conversion to an oxide by x-ray diffraction studies. We have not yet subjected the sample to e-beams or more abusive investigations out of concern that the film might be modified.

Peters, Palmer N.↗

Effects on LDEF exposed copper film and bulk

Two forms of copper were exposed to the Long Duration Exposure Facility (LDEF) Mission 1 environment: a copper film initially 74.2 plus or minus 1.1 nm thick sputter coated on a fused silical flat and a bulk piece of oxygen free, high conductivity (OFHC) copper. The optical density of the copper film changed from 1.33 to 0.70 where exposed and the film thickness increased to 106.7 plus or minus 0.5 nm where exposed. The exposed area appears purple by reflection and green by transmission for the thin film and maroon color for the bulk copper piece. The exposed areas increased in thickness, but only increase in the thickness of thin film samples could be readily measured. The increase in film thickness is consistent with the density changes occurring during conversion of copper to an oxide. However, we have not been able to confirm appreciable conversion to an oxide by x ray diffraction studies. We have not yet subjected the sample to e-beams or more abusive conditions out of concern that the film might be modified.

Peters, Palmer N.↗

Excimer laser produced plasmas in copper wire targets and water droplets

Elastically scattered incident radiation (ESIR) from a copper wire target illuminated by a KrF laser pulse at lambda = 248 nm shows a dinstinct two-peak structure which is dependent on the incident energy. The time required to reach the critical electron density (n(sub c) approximately = 1.8 x 10(exp 22) electrons/cu cm) is estimated at 11 ns based on experimental results. Detailed ESIR characteristics for water have been reported previously by the authors. Initiation of the broadband emission for copper plasma begins at 6.5 +/- 1.45 ns after the arrival of the laser pulse. However, the broadband emission occurs at 11 +/- 0.36 ns for water. For a diatomic substance such as water, the electron energy rapidly dissipates due to dissociation of water molecules, which is absent in a monatomic species such as copper. When the energy falls below the excitation energy of the lowest electron state for water, it becomes a subexcitation electron. Lifetimes of the subexcited electrons to the vibrational states are estimated to be of the order of 10(exp -9) s. In addition, the ionization potential of copper (440-530 nm) is approximately 6 eV, which is about two times smaller than the 13 eV ionization potential reported for water. The higher ionization potential contributes to the longer observed delay time for plasma formation in water. After initiation, a longer time is required for copper plasma to reach its peak value. This time delay in reaching the maximum intensity is attributed to the energy loss during the interband transition in copper.

Song, Kyo-Dong↗

Characteristics of Pool Boiling on Graphite-Copper Composite Surfaces

Nucleate pool boiling performance of different liquids on graphite-copper composite (Gr-Cu) surfaces has been experimentally studied and modeled. Both highly wetting fluids, such as freon-113 and pentane, and a moderately wetting fluid (water) were tested on the Gr-Cu surfaces with different graphite-fiber volume fractions to reveal the enhancement effects of the composite surfaces on the nucleate pool boiling. Results of the experiments show that the graphite-fiber volume fraction has an optimum value. The Gr-Cu composite surface with 25 percent graphite-fiber volume (f=0.25) has a maximum enhancement effect on the nucleate boiling heat transfer comparing to the pure copper surface. For the highly wetting fluid, the nucleate boiling heat transfer is generally enhanced on the Gr- Cu composite surfaces by 3 to 6 times shown. In the low heat flux region, the enhancement is over 6 times, but in the high heat flux region, the enhancement is reduced to about 40%. For the moderately wetting fluid (water), stronger enhancement of nucleate boiling heat transfer is achieved on the composite surface. It shown the experimental results in which one observes the nucleate boiling heat transfer enhancement of 5 to 10 times in the low heat flux region and an enhancement of 3 to 5 times in the high heat flux region. Photographs of bubble departure during the initial stage of nucleate boiling indicate that the bubbles detached from the composite surface are much smaller in diameter than those detached from the pure copper surface. Typical photographs are presented.It shows that the bubbles departed from the composite surface have diameters of only O(0.1) mm, while those departed from the pure copper surface have diameters of O(1) mm. It is also found that the bubbles depart from the composite surface at a much higher frequency, thus forming vapor columns. These two phenomena combined with high thermal conductivity of the graphite fiber are considered the mechanisms for such a significant augmentation in nucleate boiling heat transfer on the composite surfaces. A physical model is developed to describe the phenomenon of bubble departure from the composite surface: The preferred site of bubble nucleation is the fiber tip because of higher tip temperature than the surrounding copper base and poor wettability of the graphite tip compared with that of the base material (copper). The high evaporation rate near the contact line produces the vapor cutback due to the vapor recoil pushing the three-phase line outwards from the fiber tip, and so a neck of the bubble is formed near the bubble bottom. Evaporation and surface tension accelerate the necking process and finally result in the bubble departure while a new small bubble is formed at the tip when the surface tension pushes the three-phase line back to the tip. The process is schematically shown. The proposed model is based on and confirmed by experimental results.

Zhang, Nengli↗

Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

Rolin, T. D.↗

Method and composition for reducing nitrates, nitrites, and/or hydroxylamine in water using a homogeneous reduced copper tetra-substituted fluorinated pinacolate ligand catalyst complex

A method for reducing nitrates, nitrites, and/or hydroxylamine in water using a homogeneous reduced copper tetra-substituted fluorinated pinacolate ligand catalyst complex. The method includes dissolving a copper(II) tetra-substituted fluorinated pinacolate ligand pre-catalyst complex in water having an excess amount of nitrates, nitrites, and/or hydroxylamine therein. The dissolved copper(II) tetra-substituted fluorinated pinacolate ligand pre-catalyst complex in the water is subjected to electrochemical reduction to form a homogeneous reduced copper tetra-substituted fluorinated pinacolate ligand catalyst complex. The homogeneous reduced copper tetra-substituted fluorinated pinacolate ligand catalyst complex reduces the nitrates, nitrites, and/or hydroxylamine in the water to compounds with nitrogen in a lower oxidation state with the homogeneous reduced copper tetra-substituted fluorinated pinacolate ligand catalyst complex.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗