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At least 379 records · Page 21

Factors Limiting Li+ Charge Transfer Kinetics in Li-ion Batteries

Understanding the factors limiting Li+ charge transfer kinetics in Li-ion batteries is essential in improving the rate performance, especially at lower temperatures. The Li+ charge transfer process involved in the lithium intercalation of graphite anode includes the step of de-solvation of the solvated Li+ in the liquid electrolyte and the step of transport of Li+ in the preformed solid electrolyte interphase (SEI) on electrodes until the Li+ accepts an electron at the electrode and becomes a Li in the electrode. Whether the de-solvation process or the Li+ transport through the SEI is a limiting step depends on the nature of the interphases at the electrode and electrolyte interfaces. Several examples involving the electrode materials such as graphite, lithium titanate (LTO), lithium iron phosphate (LFP), lithium nickel cobalt aluminum oxide (NCA) and solid Li+ conductor such as lithium lanthanum titanate or Li-Al-Ti-phosphate are reviewed and discussed to clarify the conditions at which either the de-solvation or the transport of Li+ in SEI is dominating and how the electrolyte components affect the activation energy of Li+ charge transfer kinetics. How the electrolyte additives impact the Li+ charge transfer kinetics at both the anode and the cathode has been examined at the same time in 3-electrode full cells. The resulting impact on Li+ charge transfer resistance, Rct, and activation energy, Ea, at both electrodes are reported and discussed.

Delp, Samuel A.↗

Space processing of chalcogenide glasses

Chalcogenide glasses are discussed as good infrared transmitters, possessing the strength, corrosion resistance, and scale-up potential necessary for large 10.6-micron windows. The disadvantage of earth-produced chalcogenide glasses is shown to be an infrared absorption coefficient which is unacceptably high relative to alkali halides. This coefficient is traced to optical nonhomogeneities resulting from environmental and container contamination. Space processing is considered as a means of improving the infrared transmission quality of chalcogenides and of eliminating the following problems: optical inhomogeneities caused by thermal currents and density fluctuation in the l-g earth environment; contamination from the earth-melting crucible by oxygen and other elements deleterious to infrared transmission; and, heterogeneous nucleation at the earth-melting crucible-glass interface.

Larsen, D. C.↗

Low resistance silver contacts to indium phosphide - Electrical and metallurgical considerations

The electrical and metallurgical behavior of the Ag-InP contact system has been investigated. Specific contact resistivity (Rc) values in the low 10 exp -6 Ohm sq cm range are readily achieved on n-InP (Si: 1.7 x 10 exp 18/cu cm) after sintering at 400 C for several minutes. The low Rc values, however, are shown to be accompanied by dissolution of InP into the metallization, resulting in device degradation. An analysis of the sinter-induced metallurgical interactions shows this system to be similar to the well-characterized Au-InP system, albeit with fundamental differences. The similarities include the dissociative diffusion of In, the reaction-suppressing effect of SiO2 capping, and especially, the formation of a phosphide layer at the metal-InP interface. The low post-sinter Rc values in the Ag-InP system may be due to the presence of a AgP2 layer at the metal-InP interface; low values of Rc can be achieved without incurring device degrading metallurgical interactions by introducing a thin AgP2 layer between the InP and the current carrying metallization.

Weizer, Victor G.↗

Effects Of Environmental And Operational Stresses On RF MEMS Switch Technologies For Space Applications

Micro Electro Mechanical Systems (MEMS) have been heralded for their ability to provide tremendous advantages in electronic systems through increased electrical performance, reduced power consumption, and higher levels of device integration with a reduction of board real estate. RF MEMS switch technology offers advantages such as low insertion loss (0.1- 0.5 dB), wide bandwidth (1 GHz-100 GHz), and compatibility with many different process technologies (quartz, high resistivity Si, GaAs) which can replace the use of traditional electronic switches, such as GaAs FETS and PIN Diodes, in microwave systems for low signal power (x < 500 mW) applications. Although the electrical characteristics of RF MEMS switches far surpass any existing technologies, the unknown reliability, due to the lack of information concerning failure modes and mechanisms inherent to MEMS devices, create an obstacle to insertion of MEMS technology into high reliability applications. All MEMS devices are sensitive to moisture and contaminants, issues easily resolved by hermetic or near-hermetic packaging. Two well-known failure modes of RF MEMS switches are charging in the dielectric layer of capacitive membrane switches and contact interface stiction of metal-metal switches. Determining the integrity of MEMS devices when subjected to the shock, vibration, temperature extremes, and radiation of the space environment is necessary to facilitate integration into space systems. This paper will explore the effects of different environmental stresses, operational life cycling, temperature, mechanical shock, and vibration on the first commercially available RF MEMS switches to identify relevant failure modes and mechanisms inherent to these device and packaging schemes for space applications. This paper will also describe RF MEMS Switch technology under development at NASA GSFC.

Jah, Muzar↗

Microstructural Development of Directionally Solidified Hg(1-x)Zn(x)Se Alloys

Hg(1-x)Zn(x)Se alloys have been studied as an alternative to HgCdTe for the detection of electromagnetic radiation, because the shorter ZnSe and HgSe bonds were predicted to improve lattice stability. Previous studies showed that optical properties were stable with time and that the microhardness was higher than for HgTe based alloys. However, for this material to be commercially viable, compositional variations must be reduced, and the distribution of defects induced by the growth process must be understood. The basic structural properties of bulk materials were characterized, and dislocation etch pit densities were measured to determine whether the addition of Zn to the HgSe lattice reduced the potential for dislocation formation. Hg(0.9)Zn(0.1)Se alloys were directionally solidified using a modified Bridgman-Stockbarger method and in an applied magnetic field. Radial compositional variations were greatly reduced when solidification occurred in an applied magnetic field. The combination of a convex liquid-solid interface shape and a method for reduced wetting produced boules that were a single crystal after reaching full diameter. Observed surface features indicated ampoule wetting could be eliminated using a graphite getter. Microstructural characteristics were greatly improved over HgCdTe alloys, In six boules, a total of only one twin was observed, and no inclusions were found. A method for polishing and producing dislocation etch pits was developed for these alloys, revealing dislocation etch pit densities one to two orders of magnitude less than HgTe based alloys. A kink in the thermal profile during processing of one boule generated more dislocations than did lattice mismatch due to compositional variations. The results of this investigation indicate this alloy has improved microstructural properties and resistance to dislocation formation compared with similar II-VI alloys, and should be further investigated for the detection of electromagnetic radiation.

Cobb, S. D.↗

A Library of Rad Hard Mixed-Voltage/Mixed-Signal Building Blocks for Integration of Avionics Systems for Deep Space

To build the sensor intensive system-on-a-chip for the next generation spacecrafts for deep space, Center for Integration of Space Microsystems at JPL (CISM) takes advantage of the lower power rating and inherent radiation resistance of Silicon on Insulator technology (SOI). We are developing a suite of mixed-voltage and mixed-signal building blocks in Honeywell's SOI process that can enable the rapid integration of the next generation avionics systems with lower power rating, higher reliability, longer life, and enhanced radiation tolerance for spacecrafts such as the Europa Orbiter and Europa Lander. The mixed-voltage building blocks are predominantly for design of adaptive power management systems. Their design centers around an LDMOS structure that is being developed by Honeywell, Boeing Corp, and the University of Idaho. The mixed-signal building blocks are designed to meet the low power, extreme radiation requirement of deep space applications. These building blocks are predominantly used to interface analog sensors to the digital CPU of the next generation avionics system on a chip. Additional information is contained in the original extended abstract.

Mojarradi, M. M.↗

Fiber-Reinforced Reactive Nano-Epoxy Composites

An ultra-high-molecular-weight polyethylene/ matrix interface based on the fabrication of a reactive nano-epoxy matrix with lower surface energy has been improved. Enhanced mechanical properties versus pure epoxy on a three-point bend test include: strength (25 percent), modulus (20 percent), and toughness (30 percent). Increased thermal properties include higher Tg (glass transition temperature) and stable CTE (coefficient of thermal expansion). Improved processability for manufacturing composites includes faster wetting rates on macro-fiber surfaces, lower viscosity, better resin infusion rates, and improved rheological properties. Improved interfacial adhesion properties with Spectra fibers by pullout tests include initial debonding force of 35 percent, a maximum pullout force of 25 percent, and energy to debond at 65 percent. Improved mechanical properties of Spectra fiber composites (tensile) aging resistance properties include hygrothermal effects. With this innovation, high-performance composites have been created, including carbon fibers/nano-epoxy, glass fibers/nano-epoxy, aramid fibers/ nano-epoxy, and ultra-high-molecularweight polyethylene fiber (UHMWPE).

Zhong, Wei-Hong↗

Parabolic Flight Investigation for Advanced Exercise Concept Hardware Hybrid Ultimate Lifting Kit (HULK)

Long-duration space flight poses many hazards to the health of the crew. Among those hazards is the physiological deconditioning of the musculoskeletal and cardiovascular systems due to prolonged exposure to microgravity. To combat this erosion of physical condition space flight may take on the crew, the Human Research Program (HRP) is charged with developing Advanced Exercise Concepts to maintain astronaut health and fitness during long-term missions, while keeping device mass, power, and volume to a minimum. The goal of this effort is to preserve the physical capability of the crew to perform mission critical tasks in transit and during planetary surface operations. The HULK is a pneumatic-based exercise system, which provides both resistive and aerobic modes to protect against human deconditioning in microgravity. Its design targeted the International Space Station (ISS) Advanced Resistive Exercise Device (ARED) high level performance characteristics and provides up to 600 foot pounds resitive loading with the capability to allow for eccentric to concentric (E:C) ratios of higher than 1:1 through a DC motor assist component. The device's rowing mode allows for high cadence aerobic activity. The HULK parabolic flight campaign, conducted through the NASA Flight Opportunities Program at Ellington Field, resulted in the creation of device specific data sets including low fidelity motion capture, accelerometry and both inline and ground reaction forces. These data provide a critical link in understanding how to vibration isolate the device in both ISS and space transit applications. Secondarily, the study of human exercise and associated body kinematics in microgravity allows for more complete understanding of human to machine interface designs to allow for maximum functionality of the device in microgravity.

countermeasures↗

Structural characterization of high temperature composites

Glass, ceramic, and carbon matrix composite materials have emerged in recent years with potential properties and temperature resistance which make them attractive for high temperature applications such as gas turbine engines. At the outset of this study, only flexural tests were available to evaluate brittle matrix composites at temperatures in the 600 to 1000 C range. The results are described of an ongoing effort to develop appropriate tensile, compression, and shear test methods for high temperature use. A tensile test for unidirectional composites was developed and used to evaluate the properties and behavior of ceramic fiber reinforced glass and glass-ceramic matrix composites in air at temperatures up to 1000 C. The results indicate generally efficient fiber reinforcement and tolerance to matrix cracking similar to polymer matrix composites. Limiting properties in these materials may be an inherently very low transverse strain to failure, and high temperature embrittlement due to fiber/matrix interface oxidation.

Mandell, J. F.↗

Analysis of Carbon Nanotube Metal-Semiconductor Diode Device

We study recently reported drain current Id-drain voltage Vd characteristics of a carbon nanotube metal semiconductor diode device with the gate voltage Vg applied to modulate the carrier density in the nanotube. The diode was kink-shaped at the metal-semiconductor interface. It was shown that (1) larger negative Vg blocked Id more effectively in the negative Vd region, resulting in the rectifying Id-Vd characteristics, and that (2) positive Vg allowed Id in the both Vd polarities, resulting in the non-rectifying characteristics. The negative Vd was the Schottky reverse direction, judging from the negligible Id behavior for a wide region of -4 V less than Vd less than 0 V, with Vg = -4 V. Such negative Vg would attract positive charges from the metallic electrodes (charge reservoir) to the nanotube and lower the nanotube Fermi energy (EF). With larger negative Vg, the experiment showed that the Schottky forward direction (Vd greater than 0) had a smaller turn-on voltage and the Schottky reverse direction (Vd less than 0) was more resistant to the tunneling breakdown. Therefore, the majority carriers in the transport would be electrons since they can see a lower tunneling barrier (shallower built-in potential) in the forward direction when EF is lowered, and a thicker tunneling barrier (Schottky barrier) in the reverse direction due to the reduction in the electron density when EF is lowered.

Yamada, Toshishige↗

The Death of Airmanship: The Urgent Need to Understand Pilot Skills and Knowledge

Aviation awards a special name—airmanship—for the quality of being highly competent in foundational piloting skills, which seem to comprise primarily judgment, decision making, stick-and-rudder skills, and a bit of intuition. The term, which has a mystical quality, has historically resisted analysis; airmanship is acquired solely through experience. The graying of the Boomers and the extreme turbulence of the last few years in commercial aviation have led to a significant loss of those pilots who started out in simpler, round-dial airplanes and made a tortured transition to glass. Those pilots were comfortable disengaging the autopilot at any time, and more importantly, they continued to stay mentally engaged with flight and systems management even as automation continued to encroach on traditional pilot roles. As an industry, we need to prepare for the loss of these pilots by understanding the elements of airmanship and finding a way to replace the competency. The goal is to eliminate “airmanship” by understanding it...by demystifying it. Human factors/cognitive engineering offers tools and methods to develop a system interface that supports skilled performance from the human/technology team. In this presentation, I will talk about my efforts to understand the elements of skilled performance so that they can be trained, or supported by the interface in a seamless manner Specific topics will include the limits of SOP, monitoring for flight path management, alerting non-normals, and autoflight/mode confusion.

pilot skills↗

Murine Host-gut Microbiota Interactions are Modulated During Spaceflight

The rodent habitat on the International Space Station has provided critical insight into the impact of spaceflight on mammalian physiology. These effects include dysfunction of carbohydrate, steroid and lipid metabolism, and immune response, as well as induction of symptoms characteristic of liver disease, insulin resistance, osteopenia and myopathy, which are anticipated to intensify over long-duration spaceflight. Although these physiological responses can involve the microbiome, the host-microorganism interactions during spaceflight are still largely unknown. NASA GeneLab curates a wide range of space research data and the current work harnesses GeneLab multi’omic data from recent Rodent Research studies to explore changes to gut microbiota during spaceflight and their associations with host physiology when compared to ground controls. Using a hybrid analysis of DNA barcoding and whole genome shotgun data, an array of bacteria, fungi and nematodes could be identified at species level, and significant differences in relative abundances associated with spaceflight. Functional prediction based on differential abundance of species and metagenome gene inventories as well as metatranscriptomic gene expression at the host-gut microbiome interface implicate microbiota interactions could contribute to spaceflight pathology. Harnessing carefully curated publicly available data, such as from Genelab, to generate multi‘omic space science discoveries can help decipher the complex host-microbiome interactions that influence both health on Earth and the feasibility of long-duration spaceflight.

Microbiome↗

High-temperature, flexible, thermal barrier seal

This device seals the sliding interfaces between structural panels that are roughly perpendicular to each other or whose edges are butted against one another. The nonuniformity of the gap between the panels requires significant flexibility along the seal length. The seal is mounted in a rectangular groove in a movable structural panel. A plurality of particles or balls is densely packed in an outer sheathing. The balls are laterally preloaded to maintain sealing contact with the adjacent wall using a pressurized linear bellows. Distortions in the adjacent panel are accommodated by rearrangement of the particles within the outer sheathing. Leakage through the seal is minimized by densely compacting the internal particles and by maintaining positive preload along the back side of the seal. The braid architecture of the outer sheathing is selected to minimize leakage through the seal and to resist mechanical abrasion.

Sirocky, Paul J.↗

A very low resistance, non-sintered contact system for use on indium phosphide concentrator/shallow junction solar cells

An investigation is made into the possibility of providing low resistance contacts to shallow junction InP solar cells which do not require sintering and which do not cause device degradation even when subjected to extended annealing at elevated temperatures. We show that the addition of In to Au contacts in amounts that exceed the solid solubility limit lowers the as-fabricated (unsintered) contact resistivity (R sub c) to the 10(exp -5) ohm cm(exp 2) range. We next consider the contact system Au/Au2P3, which has been shown to exhibit as-fabricated R sub c values in the 10(exp -6) ohm cm(exp 2) range, but which fails quickly when heated. We show that the substitution of a refractory metal (W, Ta) for Au preserves the low R sub c values while preventing the destructive reactions that would normally take place in this system at high temperatures. We show, finally, that R sub c values in the 10(exp -7) ohm cm(exp 2) range can be achieved without sintering by combining the effects of In or Ga additions to Au contacts with the effects of introducing a thin Au2P3 layer at the metal-InP interface.

Weizer, Victor G.↗

A very low resistance, non-sintered contact system for use on indium phosphide concentrator/shallow junction solar cells

An investigation is made into the possibility of providing low resistance contacts to shallow junction InP solar cells which do not require sintering and which do not cause device degradation even when subjected to extended annealing at elevated temperatures. We show that the addition of In to Au contacts in amounts that exceed the solid solubility limit lowers the as-fabricated (unsintered) contact resistivity (R sub c) to the 10(exp -5) ohm cm(exp 2) range. We next consider the contact system Au/Au2P3 which has been shown to exhibit as-fabricated R sub c values in the 10(exp -6) ohm cm(exp 2) range, but which fails quickly when heated. We show that the substitution of a refractory metal (W, Ta) for Au preserves the low R sub c values while preventing the destructive reactions that would normally take place in this system at high temperatures. We show, finally, that R sub c values in the 10(exp -7) ohm cm(exp 2) range can be achieved without sintering by combining the effects of In or Ga additions to Au contacts with the effects of introducing a thin Au2P3 layer at the metal-InP interface.

Weizer, Victor G.↗

Novel Processing, Testing and Characterization of Copper/Carbon Nanotube (Cu/CNT) Yarn Composite Conductor

Sustainable electrified aircraft propulsion (EAP) is likely to lead to an increase in the electrical wiring contained within a single aircraft. Since the electrical resistance and mass of copper (Cu) conductors are associated with power losses, it is desirable to design high-conductivity lightweight conductor materials, thus reducing the mass of components like motor windings, low-voltage signal cables, and transmission cables for data and power to improve the overall energy efficiency. This paper describes a unique framework for manufacturing metalized carbon nanotube (CNT) composite conductors, measuring their electrical conductivity and strength, and modeling the overall conductivity and current sharing within such composites. Tensile testing was conducted on the processed composite conductor cables with the use of acoustic emission and electrical resistivity to determine stress-dependent-failure mechanisms while monitoring the electrical conductivity. The average of measured electrical conductivities of annealed Cu/CNT samples from batch 5 was greater than theoretical predictions by 9.8 percent and was also greater than the conductivity of pure annealed Cu by 4.8 percent and had comparable ultimate tensile strengths. Additionally, those Cu/CNT samples provide a 13.5% weight saving over current state of the art copper wires. Theories explaining improved intrinsic conductivity are discussed.

Metalized CNT↗

Icing Formation Strains on Airfoil Skin

Aircraft icing has long presented a safety hazard to the aerospace industry. One problem inherent to aircraft icing is predicting the adhesive properties of the ice-aircraft interface; values commonly reported span multiple orders of magnitude, making shedding prediction and surface evaluation difficult. An effort has been undertaken at the NASA Glenn Research Center to understand the cause of the scatter in the data. Geometry dependencies, variation in testing procedures, and residual stresses in ice samples have previously been identified as significant contributors to the problem. Residual stresses were singled out for this study, which investigated the strains at the leading edge of a Common Research Model (CRM) wind tunnel model in the NASA Glenn Icing Research Tunnel. Sprays were conducted at a particle size median volumetric diameter (MVD) of 20 µm, with liquid water contents (LWC) spanning from 0.4 to 3.0 g/m3. Total temperatures were varied between 0 and -25 °C, and test section velocity between 51 and 118 m/s. The leading edge was instrumented with custom strain gages, resistance temperature detectors (RTDs), optical fibers, and a pressure mat. Results indicate Δ strains, which were the difference between recorded strains and those predicted from isotropic thermal expansion of aluminum, below -400 µε with consistent patterns of strain across a wide variety of tunnel conditions. Isotropic, linear elastic finite element analysis (FEA) was conducted by varying the temperature of simplified airfoil and ice geometries, producing similar strains to those observed in testing. This allowed induced stresses to be predicted. Predicted stresses were above the expected tensile strength for ice, and suggest a source for previously observed cracking in tunnel ice.

Ice Adhesion↗

High temperature ceramic interface study

Monolithic SiC and Si3N4 are susceptible to contact stress damage at static and sliding interfaces. Transformation-toughened zirconia (TTZ) was evaluated under sliding contact conditions to determine if the higher material fracture toughness would reduce the susceptibility to contact stress damage. Contact stress tests were conducted on four commercially available TTZ materials at normal loads ranging from 0.455 to 22.7 kg (1 to 50 pounds) at temperatures ranging from room temperature to 1204C (2200 F). Static and dynamic friction were measured as a function of temperature. Flexural strength measurements after these tests determined that the contact stress exposure did not reduce the strength of TTZ at contact loads of 0.455, 4.55, and 11.3 kg (1, 10, and 25 pounds). Prior testing with the lower toughness SiC and Si3N4 materials resulted in a substantial strength reduction at loads of only 4.55 and 11.3 kg (10 and 25 pounds). An increase in material toughness appears to improve ceramic material resistance to contact stress damage. Baseline material flexure strength was established and the stress rupture capability of TTZ was evaluated. Stress rupture tests determined that TTZ materials are susceptible to deformation due to creep and that aging of TTZ materials at elevated temperatures results in a reduction of material strength.

Lindberg, L. J.↗