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At least 379 records · Page 21

Weaves as an Interconnection Fabric for ASIM's and Nanosatellites

Many of the micromachines under consideration require computer support, indeed, one of the appeals of this technology is the ability to intermix mechanical, optical, analog, and digital devices on the same substrate. The amount of computer power is rarely an issue, the sticking point is the complexity of the software required to make effective use of these devices. Micromachines are the nano-technologist's equivalent of 'golden screws'. In other words, they will be piece parts in larger assemblages. For example, a nano-satellite may be composed of stacked silicon wafers where each wafer contains hundreds to thousands of micromachines, digital controllers, general purpose computers, memories, and high-speed bus interconnects. Comparatively few of these devices will be custom designed, most will be stock parts selected from libraries and catalogs. The novelty will lie in the interconnections. For example, a digital accelerometer may be a component part in an adaptive suspension, a monitoring element embedded in the wrapper of a package, or a portion of the smart skin of a launch vehicle. In each case, this device must inter-operate with other devices and probes for the purposes of command, control, and communication. We propose a software technology called 'weaves' that will permit large collections of micromachines and their attendant computers to freely intercommunicate while preserving modularity, transparency, and flexibility. Weaves are composed of networks of communicating software components. The network, and the components comprising it, may be changed even while the software, and the devices it controls, are executing. This unusual degree of software plasticity permits micromachines to dynamically adapt the software to changing conditions and allows system engineers to rapidly and inexpensively develop special purpose software by assembling stock software components in custom configurations.

Gorlick, Michael M.↗

Vacuum microelectronics for beam power and rectennas

Vacuum Microelectronic devices can be described as vacuum transistors or micro-miniature vacuum tubes, as one chooses. The fundamental reason behind this new technology is the very large current densities available from field emitters, namely as high as 10(8) A/sq cm. Array current densities as high as 1000 A/sq cm have been measured. Total electron transit times from source to drain for 1 micron feature size devices have been predicted to be about 150fs. This very short transit time implies the possibility of submillimeter wave transmitters and rectennas in devices which can operate with reasonably high voltages and which are small in size and are lightweight. In addition, they are expected to be extremely radiation hard and very temperature insensitive. That is, they are expected to have radiation hardness characteristics similar to vacuum tubes, and both the high temperature and low temperature limits should be determined by the package. That is, there should be no practical intrinsic temperature or carrier freezeout problems for devices based on metals or composites. But the technology is difficult to implement at the present time because it is based on 300 to 500 angstrom radius field emitters which must be relatively uniform. There is also the need to understand the non-equilibrium transport physics in the near-surface regions of the field emitters.

Gray, Henry F.↗

Physics and applications of quantum dot lasers for silicon photonics

Abstract Photonic integrated circuits (PICs) have enabled numerous high performance, energy efficient, and compact technologies for optical communications, sensing, and metrology. One of the biggest challenges in scaling PICs comes from the parasitic reflections that feed light back into the laser source. These reflections increase noise and may cause laser destabilization. To avoid parasitic reflections, expensive and bulky optical isolators have been placed between the laser and the rest of the PIC leading to large increases in device footprint for on-chip integration schemes and significant increases in packaging complexity and cost for lasers co-packaged with passive PICs. This review article reports new findings on epitaxial quantum dot lasers on silicon and studies both theoretically and experimentally the connection between the material properties and the ultra-low reflection sensitivity that is achieved. Our results show that such quantum dot lasers on silicon exhibit much lower linewidth enhancement factors than any quantum well lasers. Together with the large damping factor, we show that the quantum dot gain medium is fundamentally dependent on dot uniformity, but through careful optimization, even epitaxial lasers on silicon can operate without an optical isolator, which is of paramount importance for the future high-speed silicon photonic systems.

36 MATERIALS SCIENCE↗

Development for application of parylene coatings

A practical method of applying a parylene (paraxylene) coating to hybrid microcircuit devices was developed for the prevention of circuit malfunctions existing prior to package sealing or formed upon exposure to the service environment. It was found that paralene and an associated primer (if used) had generally little or no adverse effect on the active and passive elements of typical hybrid microcircuits. Exceptions were related to high frequency circuitry, low resistivity thick film resistors, and highly sensitive PIN diodes. Advantages of the use of the coating included increased dielectric strength and increased interconnection bond strength. Coating service life in nitrogen or nitrogen with low levels of oxygen as a contaminant is shown to be in excess of 1000 hours at 150 C and can be projected to be in excess of 5000 hours at 125 C.

Oberin, F. W.↗

Detection And Mapping (DAM) package. Volume 1: General procedure

The author has identified the following significant results. The DAM package is an integrated set of manual procedures, computer programs, and graphic devices designed for efficient production of precisely registered and formatted maps from digital LANDSAT multispectral scanner data. The software can be readily implemented on any Univac 1100 series computer with standard peripheral equipment. This version of the software includes predefined spectral limits for use in classifying and mapping surface water.

Schlosser, E. H.↗

Detection And Mapping (DAM) package. Volume 4A: Software System Manual, part 1

The package is an integrated set of manual procedures, computer programs, and graphic devices designed for efficient production of precisely registered and formatted maps from digital LANDSAT multispectral scanner (MSS) data. The software can be readily implemented on any Univac 1100 series computer with standard peripheral equipment. This version of the software includes predefined spectral limits for use in classifying and mapping surface water for LANDSAT-1, LANDSAT-2, and LANDSAT-3. Tape formats supported include X, AM, and PM.

Schlosser, E. H.↗

Hybrid Fiber-Optic/CCD Chip

Low noise and linearity of charge-coupled devices (CCD's) combined with optical waveguide components in hybrid, integrated chip package. Concept used to measure laser flux in fiber-gyro application using sensing fibers that range from several to several tens of kilometers in length. Potential applications include optical delay measurement and linear detector of light flux emanating from fiber-optic waveguides.

Goss, W. C.↗

Development of the sonic pump levitator

The process and mechanism involved in producing glass microballoons (GMBs) of acceptable quality for laser triggered inertial fusion through use of glass jet levitation and manipulation are considered. The gas jet levitation device, called sonic pumps, provides positioning by timely and appropriate application of gas mementum from one or more of six sonic pumps which are arranged orthogonally in opposed pairs about the levitation region and are activated by an electrooptical, computer controlled, feedback system. The levitation device was fabricated and its associated control systems were assembled into a package and tested in reduced gravity flight regime of the NASA KC-135 aircraft.

Dunn, S. A.↗

Remote sensing technologies for Space Missions in the second half of the nineties' decade

The remote sensing research and technology to be used in the development of future NASA missions are discussed, with consideration given to earth sciences, planetary sciences, solar physics, and astrophysics. The remote sensing missions planned in the four application areas, their payload packages, and the particular instruments that will make up these packages are described. The advanced technologies to be used include systems and devices that address the detection of radiation in the radio, microwave, millimeter wave, submillimeter wave, IR, visible, UV, X-ray, and gamma-ray parts of the spectrum, including supporting technologies, such as optics, liquid cryogen transfer systems, and 'smart' sensors.

Sokoloski, M. M.↗

A design concept for an MMIC microstrip phased array

A conceptual design for a microstrip phased array with monolithic microwave integrated circuit (MMIC) amplitude and phase controls is described. The MMIC devices used are 20 GHz variable power amplifiers and variable phase shifters recently developed by NASA contractors for applications in future Ka band advanced satellite communication antenna systems. The proposed design concept is for a general NxN element array of rectangular lattice geometry. Subarray excitation is incorporated in the MMIC phased array design to reduce the complexity of the beam forming network and the number of MMIC components required. The proposed design concept takes into consideration the RF characteristics and actual phyical dimensions of the MMIC devices. Also, solutions to spatial constraints and interconnections associated with currently available packaging designs are discussed. Finally, the design of the microstrip radiating elements and their radiation characteristics are examined.

Lee, R. Q.↗

A Miniature Palladium-Iron Thermometer for Temperatures Down to 0.05 K

Magnetic thermometers are appealing at temperatures below about 0.1 Kelvin, because the avoid the noise self-heating problems associated with resistive thermometers. In practical, metallic dilute electronic thermometers add the advantages of chemical stability, high thermal conductivity, and easy in heat sinking work we describe a palladium-iron thermometer which was designed to be small and conveniently packaged and optimized for use at temperatures down to 0.05 Kelvin. The device showed Curie-Weiss behavior above about 0.06 Kelvin, and we achieve 41 nK/ square root of z temperature resolution at a temperature of 49 mK. We describe the design and operation of this thermometers and present the test results.

Tuttle, Jim↗

Mission Benefits Analysis of Logistics Reduction Technologies

Future space exploration missions will need to use less logistical supplies if humans are to live for longer periods away from our home planet. Anything that can be done to reduce initial mass and volume of supplies or reuse or recycle items that have been launched will be very valuable. Reuse and recycling also reduce the trash burden and associated nuisances, such as smell, but require good systems engineering and operations integration to reap the greatest benefits. A systems analysis was conducted to quantify the mass and volume savings of four different technologies currently under development by NASA fs Advanced Exploration Systems (AES) Logistics Reduction and Repurposing project. Advanced clothing systems lead to savings by direct mass reduction and increased wear duration. Reuse of logistical items, such as packaging, for a second purpose allows fewer items to be launched. A device known as a heat melt compactor drastically reduces the volume of trash, recovers water and produces a stable tile that can be used instead of launching additional radiation protection. The fourth technology, called trash ]to ]supply ]gas, can benefit a mission by supplying fuel such as methane to the propulsion system. This systems engineering work will help improve logistics planning and overall mission architectures by determining the most effective use, and reuse, of all resources.

Ewert, Michael K.↗

Mission Benefits Analysis of Logistics Reduction Technologies

Future space exploration missions will need to use less logistical supplies if humans are to live for longer periods away from our home planet. Anything that can be done to reduce initial mass and volume of supplies or reuse or recycle items that have been launched will be very valuable. Reuse and recycling also reduce the trash burden and associated nuisances, such as smell, but require good systems engineering and operations integration to reap the greatest benefits. A systems analysis was conducted to quantify the mass and volume savings of four different technologies currently under development by NASA s Advanced Exploration Systems (AES) Logistics Reduction and Repurposing project. Advanced clothing systems lead to savings by direct mass reduction and increased wear duration. Reuse of logistical items, such as packaging, for a second purpose allows fewer items to be launched. A device known as a heat melt compactor drastically reduces the volume of trash, recovers water and produces a stable tile that can be used instead of launching additional radiation protection. The fourth technology, called trash-to-gas, can benefit a mission by supplying fuel such as methane to the propulsion system. This systems engineering work will help improve logistics planning and overall mission architectures by determining the most effective use, and reuse, of all resources.

Ewert, Michael K.↗

Testing methods and techniques: Testing electrical and electronic devices: A compilation

The methods, techniques, and devices used in testing various electrical and electronic apparatus are presented. The items described range from semiconductor package leak detectors to automatic circuit analyzer and antenna simulators for system checkout. In many cases the approaches can result in considerable cost savings and improved quality control. The testing of various electronic components, assemblies, and systems; the testing of various electrical devices; and the testing of cables and connectors are explained.

Source record↗

The NASA Electronic Parts and Packaging (NEPP) Program: Overview and the New Tenets for Cost Conscious Mission Assurance on Electrical, Electronic, and Electromechanical (EEE) Parts

The NEPP Program focuses on the reliability aspects of electronic devices (integrated circuits such as a processor in a computer). There are three principal aspects of this reliability: 1) Lifetime, inherent failure and design issues related to the EEE parts technology and packaging; 2) Effects of space radiation and the space environment on these technologies, and; 3) Creation and maintenance of the assurance support infrastructure required for mission success. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment, and to ensure that appropriate EEE parts research is performed to meet NASA mission assurance needs. NEPPs FY15 goals are to represent the NASA voice to the greater aerospace EEE parts community including supporting anti-counterfeit and trust, provide relevant guidance to cost-effective missions, aid insertion of advanced (and commercial) technologies, resolve unexpected parts issues, ensure access to appropriate radiation test facilities, and collaborate as widely as possible with external entities. In accordance with the changing mission profiles throughout NASA, the NEPP Program has developed a balanced portfolio of efforts to provide agency-wide assurance for not only traditional spacecraft developments, but also those in-line with the new philosophies emerging worldwide. In this presentation, we shall present an overview of this program and considerations for EEE parts assurance as applied to cost conscious missions.

space radiation↗

Implementation of interconnect simulation tools in spice

Accurate computer simulation of high speed digital computer circuits and communication circuits requires a multimode approach to simulate both the devices and the interconnects between devices. Classical circuit analysis algorithms (lumped parameter) are needed for circuit devices and the network formed by the interconnected devices. The interconnects, however, have to be modeled as transmission lines which incorporate electromagnetic field analysis. An approach to writing a multimode simulator is to take an existing software package which performs either lumped parameter analysis or field analysis and add the missing type of analysis routines to the package. In this work a traditionally lumped parameter simulator, SPICE, is modified so that it will perform lossy transmission line analysis using a different model approach. Modifying SPICE3E2 or any other large software package is not a trivial task. An understanding of the programming conventions used, simulation software, and simulation algorithms is required. This thesis was written to clarify the procedure for installing a device into SPICE3E2. The installation of three devices is documented and the installations of the first two provide a foundation for installation of the lossy line which is the third device. The details of discussions are specific to SPICE, but the concepts will be helpful when performing installations into other circuit analysis packages.

Satsangi, H.↗

Miniature Trace Gas Detector Based on Microfabricated Optical Resonators

While a variety of techniques exist to monitor trace gases, methods relying on absorption of laser light are the most commonly used in terrestrial applications. Cavity-enhanced absorption techniques typically use high-reflectivity mirrors to form a resonant cavity, inside of which a sample gas can be analyzed. The effective absorption length is augmented by the cavity's high quality factor, or Q, because the light reflects many times between the mirrors. The sensitivity of such mirror-based sensors scales with size, generally making them somewhat bulky in volume. Also, specialized coatings for the high-reflectivity mirrors have limited bandwidth (typically just a few nanometers), and the delicate mirror surfaces can easily be degraded by dust or chemical films. As a highly sensitive and compact alternative, JPL is developing a novel trace gas sensor based on a monolithic optical resonator structure that has been modified such that a gas sample can be directly injected into the cavity. This device concept combines ultra-high Q optical whispering gallery mode resonators (WGMR) with microfabrication technology used in the semiconductor industry. For direct access to the optical mode inside a resonator, material can be precisely milled from its perimeter, creating an open gap within the WGMR. Within this open notch, the full optical mode of the resonator can be accessed. While this modification may limit the obtainable Q, calculations show that the reduction is not significant enough to outweigh its utility for trace gas detection. The notch can be milled from the high- Q crystalline WGMR with a focused ion beam (FIB) instrument with resolution much finer than an optical wavelength, thereby minimizing scattering losses and preserving the optical quality. Initial experimental demonstrations have shown that these opened cavities still support high-Q whispering gallery modes. This technology could provide ultrasensitive detection of a variety of molecular species in an extremely compact and robust package. With this type of modified WGMR, one can inject a gas sample into the open gap, allowing highly sensitive trace molecule detection within a roughly 1-cm volume. Other critical components of the instrument, such as the detector and a semiconductor laser, could be directly packaged with the resonator so as to not significantly increase the size of the device. Besides its low mass, volume, and power consumption, the monolithic design makes these resonators intrinsically robust devices, capable of handling significant temperature excursions, without moving parts to wear out or delicate coatings that can be easily damaged. A sensor could integrate with microfluidics technology for a chip-scale device. It could be mounted to the end of a deployable arm, or inserted into a borehole. Also, a network of individual sensors could be dispersed to monitor conditions over a wide region

Aveline, David C.↗