Bending of sandwich plates allowing for temperature stresses
Linear equations for longitudinal-tranverse bending of nonsymmetrical sandwich plates with rigid filler, allowing for thermal stresses
THERMAL STRESS↗
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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Modeling brittle fracture due to anisotropic thermal expansion in polycrystalline materials
Here, this work investigated brittle fracture of polycrystalline materials due to thermal stresses arising from anisotropic thermal expansion. We used phase-field fracture simulations with the properties of alpha-uranium (α-U) and assumed a linear elastic mechanical response. Three-dimensional simulations were used to predict fracture for various conditions and crystallographic textures. We found that fracture was more pronounced during cooling than during heating because the anisotropy increased with temperature. We also found that the total crack surface area increased with increasing average misorientation, while the net shape change of the material decreased with increasing misorientation. Two-dimensional simulations in which one crystallographic coefficient of thermal expansion (CTE) was set to zero indicated that the expansion behavior in the crystallographic direction with the smallest CTE was the primary cause of fracture.
11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗
Ferroelastic Hysteresis in Thin Films of Methylammonium Lead Iodide
Mechanical strain can modify the structural and electronic properties of methylammonium lead iodide MAPbI 3 . The consequences of ferroelastic hysteresis, which involves the retention of structural memory upon cycles of deformation, are reported for polycrystalline thin films of MAPbI 3 . Repeatedly bent films were examined using grazing incidence wide-angle X-ray scattering (GIWAXS) to quantitatively characterize the strains and proportions of twin domains. Approximate locations for the coercive stress and saturation on the ferroelastic stress–strain curve are identified, and changes to the stress–strain curve with cyclic strain are characterized. Notably, an external stress source, such as thermal stress from the substrate or a roll-to-roll printing setup, must apply at least |50| MPa to modify the proportions of different twins. The presence of specific twin domains is found to correlate to previously reported strain and defect heterogeneity in MAPbI 3 films. Domains from differently strained twin sets interact with each other. Long-term stability testing reveals that the domain walls are highly immobile over extended periods. Nucleation of new domain walls occurs for specific mechanical strains and correlates closely with degradation. Furthermore, these results help to explain the behavior of ion migration, degradation rate, and photoluminescence in thin films under compressive and tensile strain.
Defects↗
Forecasting the Decay of Hybrid Perovskite Performance Using Optical Transmittance or Reflected Dark-Field Imaging
The practicality and economic viability of hybrid perovskite solar cells hinge on their operational lifetime, and methods for forecasting the performance of perovskites under different operational stresses are urgently needed. Here, we explore the evolution of material-level optoelectronic properties as MAPbI 3 degrades and discover universal behaviors where the carrier diffusion length (L D ) decays before quasi-Fermi-level splitting (ΔE F ), regardless of the specific stress protocol (oxygen, humidity, thermal stress, or a combination). We employ a machine learning greedy feature selection model that uses initially measured properties to predict the time it takes L D to decrease to 85% of its initial value with a prediction accuracy of 12.8%. This model reveals a strong correlation between the initial rate of transmittance change and the time until loss of transport. We translate this material-level finding to photovoltaic device-level forecasting by demonstrating that the rate of change of transmittance is equivalent to the rate of change of the spatial standard deviation of dark-field image intensity (i.e., scattered light intensity) collected in reflection mode (and thus applicable to devices with opaque contacts). Furthermore, this work demonstrates that transmittance and scattering methods are highly effective for accelerated material (and device) stability evaluation and forecasting.
14 SOLAR ENERGY↗
A Novel Approach for Bounding the Stress Experienced by the Core of Utility-Scale Printed Circuit Heat Exchangers Under Thermohydraulic Loads
Printed circuit heat exchangers (PCHEs) have rapidly gained popularity since being introduced nearly three decades ago, and they are currently widely deployed in the petrochemical and aviation industry. Their compactness, thermohydraulic efficiency, inherent suitability for high temperature/pressure fluids containment, and demonstrated durability are some of the reasons the nuclear industry is seeking to adopt this technology as well. However, the relatively strict nuclear-related regulatory design code, especially when classified as critical to the safety of the reactors, is posing challenges to adopting the technology. From stress analysis point of view, one undesirable feature of PCHEs is their geometrical complexity, which is implied by their multilength-scale features. As a result, a full-scale model of a utility-scale exchanger cannot simply be solved on a computer because meshing such components results in a vast number of degrees-of-freedom. Here, this work seeks to address the challenge of stress analyses to PCHEs by presenting a method to simplify the geometry of PCHE designs. The models proposed by this work can be practically analyzed on a standard computer and provide a path for implementing ASME design rules. The analyses presented herein are divided into five separate investigations. Each is carried out to incrementally simplify the analyzed model by addressing features such as the shapes of the flow passages, the complex distribution of stress in large components, the three-dimensionality of the stress and strain, the thermal stresses caused by thermohydraulic operation observed experimentally and more.
42 ENGINEERING↗
Time required for an adequate thermal-vacuum test of flight model spacecraft.
Time requirements at various thermal stress levels for thermal-vacuum tests of flight model spacecraft
Timmins, A. R.↗
Thermal and stress analysis of an Attached Inflatable Decelerator /AID/ deployed in the Mars and Earth atmospheres
Trajectory, thermodynamic, and stress analyses of spacecraft inflatable decelerators in Mars and Earth atmospheres
Burgess, J. L.↗
Engineering design, stress and thermal analysis, and documentation for SATS program
An in-depth analysis and mechanical design of the solar array stowage and deployment arrangements for use in Small Applications Technology Satellite spacecraft is presented. Alternate approaches for the major elements of work are developed and evaluated. Elements include array stowage and deployment arrangements, the spacecraft and array behavior in the spacecraft despin mode, and the design of the main hinge and segment hinge assemblies. Feasibility calculations are performed and the preferred approach is identified.
Source record↗
Investigation of laser holographic interferometric techniques for structure inspection
The application of laser holographic interferometric techniques for nondestructive inspection of material structures commonly used in aerospace works is investigated. Two types of structures, composite plate and solid fuel rocket engine motor casing, were examined. In conducting the experiments, both CW HeNe gas lasers and Q-switched ruby lasers were used as light sources for holographic recording setups. Different stressing schemes were investigated as to their effectiveness in generating maximum deformation at regions of structural weakness such as flaws and disbonds. Experimental results on stressing schemes such as thermal stressing, pressurized stressing, transducer excitation, and mechanical impact are presented and evaluated.
Chu, W. P.↗
Thermal movement of the regolith
High-frequency seismic events observed at the Apollo landing sites indicate that the regolith moves in response to diurnal variations of thermal stresses. While these events (thermal moonquakes) are observed by each of the Passive Seismic Experiment stations, the location of their sources was not possible until they were observed by the Lunar Surface Profiling Experiment (LSPE) array at the Apollo 17 site. Comparison of source locations with topographic features near the LSPE array indicate that thermal moonquakes are associated to some degree with large rocks and to a larger degree with craters. They are not associated with man-made disturbances of the lunar surface. It is suggested that thermal moonquakes are the seismic expression of a phenomenon that is actively degrading slopes on the lunar surface.
Duennebier, F.↗
Effects of moisture, residual thermal curing stresses and mechanical load on the damage development in quasi-isotropic laminates
Classical laminate theory and a finite element model were used to predict stress states prior to the first formation of damage in laminates fabricated from T/300/5208. Crack patterns characteristic of the laminate in a wet or dry condition were also predicted using a shear lag model. Development of edge damage was recorded and observed during the test by transferring an image of the damage from the edge surface on to a thin acetate sheet such that the damage imprinted could be immediately viewed on a microfiche card reader. Moisture was shown to significantly alter the interior and edge dry stress states due to swelling and a reduction of elastic properties and to reduce the transverse strength in 90 deg plies. A model was developed in order to predict changes in first ply failure laminate loads due to differences in stacking sequence together with a wet or dry environmental condition.
Kriz, R. D.↗
Effects of moisture, residual thermal curing stresses, and mechanical load on the damage development in quasi-isotropic laminates
This investigation demonstrates how moisture absorbed in (0/+ or - 45/90)s and (0/90/+ or - 45)s graphite epoxy laminates significantly alters the stress state and chronology of damage development along the laminate edge during static tension and tension-tension cyclic loading. Emphasis is placed on using reasonable approximations for wet and dry elastic properties, including out-of-plane properties (nu sub 23 and G sub 23), since these properties are required by finite element and shear lag models to predict the stress state at the laminate edge. Moisture was observed to alter the dry edge stress state in the 90-deg plies of the (0/+ or - 45/90)s laminate such that delaminations occurred at a lower load and transverse cracks occurred at a higher load. A model was developed which predicted the differences in loads required to initiate damage in the 90-deg plies of the two laminates in the wet and dry conditions. Although moisture can alter the chronology of damage development, the damage state in each laminate observed prior to fracture appeared to be independent of moisture content.
Kriz, R. D.↗
Thermally induced stresses in cross-ply composite tubes
An approximate solution for determining stresses in cross-ply composite tubes subjected to a circumferential temperature gradient is presented. The solution is based on the principle of complementary virtual work (PCVW) in conjunction with a Ritz approximation on the stress field and accounts for the temperature dependence of material properties. The PCVW method is compared with a planar elasticity solution using temperature-independent material properties and a Navier approach. The net effect of including temperature-dependent material properties is that the peak absolute values of the stresses are reduced. The dependence of the stresses on the circumferential location is also reduced in comparison with the case of temperature-independent properties.
Hyer, M. W.↗
The effects of uneven fiber spacing on thermal residual stresses in a unidirectional SCS-6Ti-15-3 laminate
High residual stresses develop in SCS-6/Ti-15-3 composites during cooldown from the fabrication temperature; these residual stresses can effect the mechanical and physical properties of the composite. Discrete fiber-matrix finite element models were used to study the residual stresses due to the temperature change during the fabrication process, including the effects of uneven fiber spacing, the free surface, and increased fiber volume fractions. To accurately model the effects of the free surface, it is only necessary to model one fiber through the thickness. Below the first ply, the analysis predicts stress distributions that are identical to the infinite array predictions. For uneven fiber space less then 0.042 mm in an interior ply, the maximum hoop stress was predicted to occur between fibers within a ply and to increase as the fiber spacing decreased. The maximum hoop stress correlated well with the observed radial cracking between fibers. For the case of touching fibers, the analysis predicted tensile radial stresses at the fiber-matrix debonding during the fabrication cooldown. Identical trends were predicted for uneven fiber spacing in surface plies with slightly greater values of maximum stresses. The analysis predicted matrix yielding to occur upon cooldown when the edge-to-edge fiber spacing was less than or equal to 0.022 mm. The stress distributions predicted for increasing fiber volume fractions were similar to those predicted for decreasing the fiber spacing for two adjacent fibers within a ply.
Bigelow, C. A.↗
Silicon Holder For Molecular-Beam Epitaxy
Simple assembly of silicon wafers holds silicon-based charge-coupled device (CCD) during postprocessing in which silicon deposited by molecular-beam epitaxy. Attains temperatures similar to CCD, so hotspots suppressed. Coefficients of thermal expansion of holder and CCD equal, so thermal stresses caused by differential thermal expansion and contraction do not develop. Holder readily fabricated, by standard silicon processing techniques, to accommodate various CCD geometries. Silicon does not contaminate CCD or molecular-beam-epitaxy vacuum chamber.
Hoenk, Michael E.↗
The effects of uneven fiber spacing on thermal residual stresses in a unidirectional SCS-6/Ti-15-3 laminate
High residual stresses develop in SCS-6/Ti-15-3 composites during cooldown from the fabrication temperature; these residual stresses can effect the mechanical and physical properties of the composite. Discrete fiber-matrix finite element models were used to study the residual stresses due to the temperature change during the fabrication process, including the effects of uneven fiber spacing, the free surface, and increased fiber volume fractions. To accurately model the effects of the free surface, it is only necessary to model one fiber through the thickness. Below the first ply, the analysis predicts stress distributions that are identical to the infinite array predictions. For uneven fiber space less than 0.042 mm in an interior ply, the maximum hoop stress was predicted to occur between fibers within a ply and to increase as the fiber spacing decreased. The maximum hoop stress correlated well with the observed radial cracking between fibers. For the case of touching fibers, the analysis predicted tensile radial stresses at the fiber-matrix debonding during the fabrication cooldown. Identical trends were predicted for uneven fiber spacing in surface plies with slightly greater values of maximum stresses. The analysis predicted matrix yielding to occur upon cooldown when the edge-to-edge fiber spacing was less than or equal to 0.022 mm. The stress distributions preidcted for increasing fiber volume fractions were similar to those predicted for decreasing the fiber spacing for two adjacent fibers within a ply.
Bigelow, Catherine A.↗
The problem of thermal-expansion stresses in reinforced plastics
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RESINS, SYNTHETIC↗
Surface Micromachined Silicon Carbide Accelerometers for Gas Turbine Applications
A finite-element analysis of possible silicon carbide (SIC) folded-beam, lateral-resonating accelerometers is presented. Results include stiffness coefficients, acceleration sensitivities, resonant frequency versus temperature, and proof-mass displacements due to centripetal acceleration of a blade-mounted sensor. The surface micromachined devices, which are similar to the Analog Devices Inc., (Norwood, MA) air-bag crash detector, are etched from 2-pm thick, 3C-SiC films grown at 1600 K using atmospheric pressure chemical vapor deposition (APCVD). The substrate is a 500 gm-thick, (100) silicon wafer. Polysilicon or silicon dioxide is used as a sacrificial layer. The finite element analysis includes temperature-dependent properties, shape change due to volume expansion, and thermal stress caused by differential thermal expansion of the materials. The finite-element results are compared to experimental results for a SiC device of similar, but not identical, geometry. Along with changes in mechanical design, blade-mounted sensors would require on-chip circuitry to cancel displacements due to centripetal acceleration and improve sensitivity and bandwidth. These findings may result in better accelerometer designs for this application.
DeAnna, Russell G.↗