Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “Printed Circuit Boards”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 379 records · Page 21

Estimation, Minimization, and Validation of Commutation Loop Inductance for a 135-kW SiC EV Traction Inverter

With growing interests in low inductance SiC based power module packaging, it is vital to focus on system level design aspects to facilitate easy integration of the modules and reap system level benefits. To effectively utilize the low inductance modules, busbar and interconnects should also be designed with low stray inductances. A wholistic investigation of the flux path and flux cancellations in the module-busbar assembly which as differentially coupled series inductors is thus mandatory for a system level design. This work presents a busbar design which can be adopted to effectively integrate the CREE’s low inductance 1.2 kV/1.7 kV SiC power modules. The paper also proposes a novel measurement technique to measure the inductance of the modulebusbar assembly as a whole rather than deducing it from individual components. The inductance of the overall commutation loop of the inverter which encompasses the SiC power module, interconnects and PCB busbar have been estimated using finite element analysis (FEA). Furthermore, insights gained from FEA provided the guidelines to decide on the placement of the decoupling capacitors in the busbar to minimize the overall commutation loop inductance from 12.8 nH to 7.4 nH which resulted in significant reduction in the device voltage overshoot. The simulation results have been validated through measurements using an impedance analyzer with less than 5% difference between extracted loop inductance from FEA and measurements. The bus bar design study and the measurement technique discussed in this paper, can be easily extended to other power module packages. Finally, the 135 kW inverter has been compared to a similar highpower inverter utilizing a laminated busbar to highlight the performance of the former.

42 ENGINEERING↗

High-Temperature Wireless Sensor Platform Powered by Energy Scavenging

This paper reports on the development of key components required for a self-powered oscillator unit designed to wirelessly transmit its signal under full insertion in high-temperature (HT) harsh-environments (HE), such as those present in power plants and industrial settings (metallurgic, oil extraction, molding, and aerospace). The oscillator employed a silicon carbide (SiC) power transistor and HT passive components on a screen-printed alumina circuit board capable of operation beyond 300 °C. The HT oscillator circuit was powered solely by in-situ energy scavenging thermoelectric generator (TEG) modules using passive cooling, eliminating the need for an external power supply or active cooling. In addition, a silicon-based external booster circuit was used to achieve the required TEG voltage regulation to test the TEG-powered HT oscillator circuit. The TEG-powered oscillator circuit was tested inside a non-metallic furnace from room temperature to over 300 °C for transmission of a wireless signal, which was detected outside the furnace at 11 ft (3.4 m). Such a wireless transmitting system powered only by in-situ TEGs, with no requirement for external power or active cooling, is very attractive for flexible, mobile stand-alone control and sensor units targeted for operation in HT HE conditions found in power plants and industrial settings.

20 FOSSIL-FUELED POWER PLANTS↗

TVC actuator model

A prototype Space Shuttle Main Engine (SSME) Thrust Vector Control (TVC) Actuator analog model was successfully completed. The prototype, mounted on five printed circuit (PC) boards, was delivered to NASA, checked out and tested using a modular replacement technique on an analog computer. In all cases, the prototype model performed within the recording techniques of the analog computer which is well within the tolerances of the specifications.

Baslock, R. W.↗

Bubble memory module

Design, fabrication and test of partially populated prototype recorder using 100 kilobit serial chips is described. Electrical interface, operating modes, and mechanical design of several module configurations are discussed. Fabrication and test of the module demonstrated the practicality of multiplexing resulting in lower power, weight, and volume. This effort resulted in the completion of a module consisting of a fully engineered printed circuit storage board populated with 5 of 8 possible cells and a wire wrapped electronics board. Interface of the module is 16 bits parallel at a maximum of 1.33 megabits per second data rate on either of two interface buses.

Bohning, O. D.↗

Low-Dielectric-Constant Polyimide Fibers

In experiments performed at NASA Langley Research Center, low-dielectric-constant polyimide fibers produced by use of resin extrusion. These fibers also have high thermal stability and good tensile properties. Useful in industrial and aerospace applications in which fibers required to have dielectric constants less than 3, high thermal stability, and tensile properties in range of those of standard textile fibers. Potential applications include use in printed circuit-boards and in aircraft composites.

Dorogy, William E., Jr.↗

SpaceHab 1 maintenance experiment

The SpaceHab 1 flight on STS-57 served as a test platform for evaluation of two space station payloads. The first payload evaluated a space station maintenance concept using a sweep signal generator and a 48-channel logic analyzer to perform fault detection and isolation. Crew procedures files, test setup diagram files, and software to configure the test equipment were created on the ground and uplinked on the astronauts' voice communication circuit to perform tests in flight. In order to use these files, the portable computer was operated in a multi-window configuration. The test data transmitted to the ground allowing the ground staff to identify the cause of the fault and provide the crew with the repair procedures and diagrams. The crew successfully repaired the system under test. The second payload investigated hand soldering and de-soldering of standard components on printed circuit (PC) boards in zero gravity. It also used a new type of intra-vehicular foot restraints which uses the neutral body posture in zero-g to provide retention of the crew without their conscious attention.

Bohannon, Jackie W.↗

Embedded Resistors and Capacitors in Organic and Inorganic Substrates

Embedded resistors and capacitors were purchased from two technology; organic PWB and inorganic low temperature co-fire ceramic (LTCC). Small groups of each substrate were exposed to four environmental tests and several characterization tests to evaluate their performance and reliability. Even though all passive components maintained electrical performance throughout environmental testing, differences between the two technologies were observed. Environmental testing was taken beyond manufacturers' reported testing, but general not taken to failure. When possible, data was quantitatively compared to manufacturer's data.

printed circuit board (PCB)↗

Analysis of a Dynamic Flexed Flat Cable Harness

A dynamic flex test was performed on a spacecraft instrument harness composed of multiple individual flex cables, with each flex cable containing multiple copper traces. The purpose of the test was to demonstrate the capability of the harness to survive the number of expected flex cycles during the planned mission with appropriate margin. However, during testing, increased trace resistances and open circuits were observed beginning at approximately 10% of the total number of planned flex cycles. This paper discusses the various proximate causes that contributed to increased and open resistance in the flex cables and the subsequent redesign, manufacturing, reliability, and quality-related changes that were instituted. An analysis process, including failure analysis, non-destructive evaluation, digital imaging correlation, and parametric modeling, will also be discussed. The paper will cover the development of a robust dynamic flex harness design and include recommendations to extend flex harness life; make changes to the flex harness life test; and improve flex cable manufacturing, quality, and reliability.

Flexible PCB↗

Analysis of a Dynamic Flexed Flat Cable Harness

A dynamic flex test was performed on a spacecraft instrument harness composed of multiple individual flex cables, with each flex cable containing multiple copper traces. The purpose of the test was to demonstrate the capability of the harness to survive the number of expected flex cycles during the planned mission with appropriate margin. However, during testing, increased trace resistances and open circuits were observed beginning at approximately 10% of the total number of planned flex cycles. This paper discusses the various proximate causes that contributed to increased and open resistance in the flex cables and the subsequent redesign, manufacturing, reliability, and quality-related changes that were instituted. An analysis process, including failure analysis, non-destructive evaluation, digital imaging correlation, and parametric modeling, will also be discussed. The paper will cover the development of a robust dynamic flex harness design and include recommendations to extend flex harness life; make changes to the flex harness life test; and improve flex cable manufacturing, quality, and reliability.

Flexible PCB↗

CADAT Printed-Wiring-Board Designer

CADAT printed-wiring-board system (PWB) designs printed-circuit and hybrid-circuit boards. It is comprised of four programs: preprocessor, placement program, organizer program, and the router. Component placement and interconnection paths are optimized.

Brinkerhoff, C. D.↗

Packaging Of Control Circuits In A Robot Arm

Packaging system houses and connects control circuitry mounted on circuit boards within shoulder, upper section, and lower section of seven-degree-of-freedom robot arm. Has modular design that incorporates surface-mount technology, multilayer circuit boards, large-scale integrated circuits, and multi-layer flat cables between sections for compactness. Three sections of robot arm contain circuit modules in form of stardardized circuit boards. Each module contains two printed-circuit cards, one of each face.

Kast, William↗

Electronic Packaging Techniques

A characteristic of aerospace system design is that equipment size and weight must always be kept to a minimum, even in small components such as electronic packages. The dictates of spacecraft design have spawned a number of high-density packaging techniques, among them methods of connecting circuits in printed wiring boards by processes called stitchbond welding and parallel gap welding. These processes help designers compress more components into less space; they also afford weight savings and lower production costs.

Source record↗