Frequency-resolved Raman for transient thermal probing and thermal diffusivity measurement
Steady state Raman has been widely used for temperature probing and thermal conductivity/conductance measurement in combination with temperature coefficient calibration. In this work, a new transient Raman thermal probing technique: frequency-resolved Raman (FR-Raman) is developed for probing the transient thermal response of materials and measuring their thermal diffusivity. The FR-Raman uses an amplitude modulated square-wave laser for simultaneous material heating and Raman excitation. The evolution profile of Raman properties: intensity, Raman wavenumber, and emission, against frequency are measured experimentally and reconstructed theoretically. They are used for fitting to determine the thermal diffusivity of the material under test. A Si cantilever is used to investigate the capacity of this new technique. The cantilever’s thermal diffusivity is determined as 9.57 × 10 -5 m 2 /s, 11.00 × 10 -5 m 2 /s and 9.02 × 10 -5 m 2 /s by fitting the Raman intensity, wavenumber and emission. The deviation from the reference value is largely attributed to thermal stress-induced material deflection and Raman drift, which could be significantly suppressed by using a higher sensitivity Raman spectrometer with lower laser energy. As a result, the FR-Raman provides a novel way for transient thermal characterization of materials with a ?m spatial resolution.