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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Measuring and correlating the thermal conductivity and ultrasonic transmission of seven hot-brazed-bonded copper plates established a relationship between heat transfer and ultrasonic transmission properties of the bonds. This relationship permits the prediction of heat transfer characteristics from ultrasonic transmission tests.
Fabrication method produces stable and reliable metallic systems for interconnections, contact pads, and bonded leads in silicon planar integrated circuits. The method is based on substrate isolation of the interconnection metal from the contact pad and bonded wire.
Embedment of resistive heating elements in a cordwood module used for packaging electronic components, facilitates separation of the adhesive bond between the module, and metal heat sink and the potting material without damaging the components. Electrical power applied to the elements causes breakdown of bonding material.
Bonding of large area silicon crystals to heat sinks, and determination of stresses between bonded materials
Simple bond charge model for vibrations in covalent crystals /diamond/, noting dispersion curves and microscopic dielectric bond charge model
Gun facilitates adhesive bonding of thermoplastic-backed studs to smooth, hard surfaces. Such studs can be used for mounting loads where defacement with drilled holes cannot be tolerated. These studs can be easily removed by softening the plastic bonding with heat from the gun.
Epoxy resin-coated polyimide plastic is used for bonding materials with different thermal coefficients in applications requiring precision mounting, especially where vibrations, temperature extremes, and low pressures are encountered. Low vapor pressure of the bonding material precludes outgassing problems.
Systematic plan determines vibration responses and modes of honeycomb composites, correlates vibrational responses of composite specimens varying in strength of cohesive bond, determines effects of thickness variation of the face sheet over the frequency range, optimizes the characteristics of the excitation transducer, and measures bond strength.
Primer ensures effective bonding integrity of polyurethane adhesives on metal surfaces at temperatures ranging from minus 423 degrees to plus 120 degrees F. It provides greater metal surface protection and bond strengths over this temperature range than could be attained with other adhesive systems.
Bonding techniques, stress analysis, and bond properties for large-area silicon wafers
Modification of process for fabricating transistors, which comprises a metallization-pattern design for emitter and base areas together with a double bonding configuration for each emitter and base-bonding lead, improves uniformity of carrier injection in transistors and of reducing lead inductances at base-emitter terminals.
Anodic bonding of glass coverslips to photodiodes and photovoltaic devices eliminates the need for adhesive. The process requires relatively low temperatures /less than 560 degrees C/ and the metals and glass remain solid throughout the bonding process.
Bonding of flat metal surfaces utilizes low temperature melting intermediate material, pulse heating, and pressure application to produce strong, electrically conductive bond resistant to melting at temperatures well above melting point of intermediate material. Little or no intermediate material remains at the interface.
Analysis of bond stress in viscoelastic case bonded solid propellant rocket assembly during thermal shock
Thermal probe using infrared-transparent optical fiber attached to tip of collet with resin to prevent movement during bonding is used to accurately measure temperature during wire bonding on semiconductors for use in large scale integrated circuits.
The design, testing, and fabrication of the support truss structure for the propulsion system of the Mariner 9 spacecraft are described. Support is provided by an 8.9-kg (19.5-lbm) truss assembly consisting of beryllium tubes adhesively bonded to magnesium end fittings. Beryllium was selected for the tubular struts in the truss because of its exceptionally high stiffness-to-weight ratio. Adhesive bonding, rather than riveting, was utilized to join the struts to the end fittings because of the low toughness (high notch sensitivity) of beryllium. Magnesium, used in the end fittings, resulted in a 50% weight saving over aluminum since geometric factors in the fitting design resulted in low stress areas where magnesium's lower density is a benefit.
Reinforced FEP Teflon composite material is bonded to a metal substrate by applying a thin layer of copper on the metal surface and disposing irregularly shaped copper particles on the coated surface. The reinforced Teflon is then assembled in contact with the particles, and the assembly is heated under pressure at an elevated temperature below the melting point of the Teflon. A diffusion bond stronger than the reinforced Teflon component is produced, thus enabling the fabrication of self-lubricating bodies with relatively high strength.
A friction and wear life study was conducted on the use of a polyimide (PI) varnish as a binder for the solid lubricant, graphite fluoride (CF(1.1))N. Also studied were the lubricating properties of PI thin films with no solid lubricant additives. For comparison, similar experiments on PI-bonded MoS2 and burnished films of MoS2 or (CF(li))N were conducted. The best results were obtained with the PI-bonded (CF(1.1))N films. The polyimide thin films (with no solid lubricant additives) did not lubricate well at 25 C; however, when heated to 100 C, low friction and long wear lives were obtained.