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At least 361 records · Page 20

Thermal stress analysis of space shuttle orbiter wing skin panel and thermal protection system

Preflight thermal stress analysis of the space shuttle orbiter wing skin panel and the thermal protection system (TPS) was performed. The heated skin panel analyzed was rectangular in shape and contained a small square cool region at its center. The wing skin immediately outside the cool region was found to be close to the state of elastic instability in the chordwise direction based on the conservative temperature distribution. The wing skin was found to be quite stable in the spanwise direction. The potential wing skin thermal instability was not severe enough to tear apart the strain isolation pad (SIP) layer. Also, the preflight thermal stress analysis was performed on the TPS tile under the most severe temperature gradient during the simulated reentry heating. The tensile thermal stress induced in the TPS tile was found to be much lower than the tensile strength of the TPS material. The thermal bending of the TPS tile was not severe enough to cause tearing of the SIP layer.

Ko, William L.↗

Prediction of the thermal environment and thermal response of simple panels exposed to radiant heat

A method of predicting the radiant heat flux distribution produced by a bank of tubular quartz heaters was applied to a radiant system consisting of a single unreflected lamp irradiating a flat metallic incident surface. In this manner, the method was experimentally verified for various radiant system parameter settings and used as a source of input for a finite element thermal analysis. Two finite element thermal analyses were applied to a thermal system consisting of a thin metallic panel exposed to radiant surface heating. A two-dimensional steady-state finite element thermal analysis algorithm, based on Galerkin's Method of Weighted Residuals (GFE), was formulated specifically for this problem and was used in comparison to the thermal analyzers of the Engineering Analysis Language (EAL). Both analyses allow conduction, convection, and radiation boundary conditions. Differences in the respective finite element formulation are discussed in terms of their accuracy and resulting comparison discrepancies. The thermal analyses are shown to perform well for the comparisons presented here with some important precautions about the various boundary condition models. A description of the experiment, corresponding analytical modeling, and resulting comparisons are presented.

Turner, Travis L.↗

Role of the interfacial thermal barrier in the effective thermal diffusivity/conductivity of SiC-fiber-reinforced reaction-bonded silicon nitride

Experimental thermal diffusivity data transverse to the fiber direction for composites composed of a reaction bonded silicon nitride matrix reinforced with uniaxially aligned carbon-coated silicon carbide fibers indicate the existence of a significant thermal barrier at the matrix-fiber interface. Calculations of the interfacial thermal conductances indicate that at 300 C and 1-atm N2, more than 90 percent of the heat conduction across the interface occurs by gaseous conduction. Good agreement is obtained between thermal conductance values for the oxidized composite at 1 atm calculated from the thermal conductivity of the N2 gas and those inferred from the data for the effective composite thermal conductivity.

Bhatt, Hemanshu↗

Thermal conductivity and thermal expansion of graphite fiber/copper matrix composites

The high specific conductivity of graphite fiber/copper matrix (Gr/Cu) composites offers great potential for high heat flux structures operating at elevated temperatures. To determine the feasibility of applying Gr/Cu composites to high heat flux structures, composite plates were fabricated using unidirectional and cross-plied pitch-based P100 graphite fibers in a pure copper matrix. Thermal conductivity of the composites was measured from room temperature to 1073 K, and thermal expansion was measured from room temperature to 1050 K. The longitudinal thermal conductivity, parallel to the fiber direction, was comparable to pure copper. The transverse thermal conductivity, normal to the fiber direction, was less than that of pure copper and decreased with increasing fiber content. The longitudinal thermal expansion decreased with increasing fiber content. The transverse thermal expansion was greater than pure copper and nearly independent of fiber content.

Ellis, David L.↗

Thermal certification tests of Orbiter Thermal Protection System tiles coated with KSC coating slurries

Thermal tests of Orbiter thermal protection system (TPS) tiles, which were coated with borosilicate glass slurries fabricated at Kennedy Space Center (KSC), were performed in the Radiant Heat Test Facility and the Atmospheric Reentry Materials & Structures Evaluation Facility at Johnson Space Center to verify tile coating integrity after exposure to multiple entry simulation cycles in both radiant and convective heating environments. Eight high temperature reusable surface insulation (HRSI) tiles and six low temperature reusable surface insulation (LRSI) tiles were subjected to 25 cycles of radiant heat at peaked surface temperatures of 2300 F and 1200 F, respectively. For the LRSI tiles, an additional cycle at peaked surface temperature of 2100 F was performed. There was no coating crack on any of the HRSI specimens. However, there were eight small coating cracks (less than 2 inches long) on two of the six LRSI tiles on the 26th cycle. There was practically no change on the surface reflectivity, physical dimensions, or weight of any of the test specimens. There was no observable thermal-chemical degradation of the coating either. For the convective heat test, eight HRSI tiles were tested for five cycles at a surface temperature of 2300 F. There was no thermal-induced coating crack on any of the test specimens, almost no change on the surface reflectivity, and no observable thermal-chemical degradation with an exception of minor slumping of the coating under painted TPS identification numbers. The tests demonstrated that KSC's TPS slurries and coating processes meet the Orbiter's thermal specification requirements.

Milhoan, James D.↗

Thermal conductivity and thermal expansion of graphite fiber-reinforced copper matrix composites

The high specific conductivity of graphite fiber/copper matrix (Gr/Cu) composites offers great potential for high heat flux structures operating at elevated temperatures. To determine the feasibility of applying Gr/Cu composites to high heat flux structures, composite plates were fabricated using unidirectional and cross-plied pitch-based P100 graphite fibers in a pure copper matrix. Thermal conductivity of the composites was measured from room temperature to 1073 K, and thermal expansion was measured from room temperature to 1050 K. The longitudinal thermal conductivity, parallel to the fiber direction, was comparable to pure copper. The transverse thermal conductivity, normal to the fiber direction, was less than that of pure copper and decreased with increasing fiber content. The longitudinal thermal expansion decreased with increasing fiber content. The transverse thermal expansion was greater than pure copper and nearly independent of fiber content.

Ellis, David L.↗

Thermal Conductivity of EB-PVD Thermal Barrier Coatings Evaluated by a Steady-State Laser Heat Flux Technique

The thermal conductivity of electron beam-physical vapor deposited (EB-PVD) Zr02-8wt%Y2O3 thermal barrier coatings was determined by a steady-state heat flux laser technique. Thermal conductivity change kinetics of the EB-PVD ceramic coatings were also obtained in real time, at high temperatures, under the laser high heat flux, long term test conditions. The thermal conductivity increase due to micro-pore sintering and the decrease due to coating micro-delaminations in the EB-PVD coatings were evaluated for grooved and non-grooved EB-PVD coating systems under isothermal and thermal cycling conditions. The coating failure modes under the high heat flux test conditions were also investigated. The test technique provides a viable means for obtaining coating thermal conductivity data for use in design, development, and life prediction for engine applications.

Zhu, Dongming↗

Thermal Conductivity and Sintering Behavior of Advanced Thermal Barrier Coatings

Advanced thermal barrier coatings, having significantly reduced long-term thermal conductivities, are being developed using an approach that emphasizes real-time monitoring of thermal conductivity under conditions that are engine-like in terms of temperatures and heat fluxes. This is in contrast to the traditional approach where coatings are initially optimized in terms of furnace and burner rig durability with subsequent measurement in the as-processed or furnace-sintered condition. The present work establishes a laser high-heat-flux test as the basis for evaluating advanced plasma-sprayed and physical vapor-deposited thermal barrier coatings under the NASA Ultra Efficient Engine Technology (UEET) Program. The candidate coating materials for this program are novel thermal barrier coatings that are found to have significantly reduced thermal conductivities due to an oxide-defect-cluster design. Critical issues for designing advanced low conductivity coatings with improved coating durability are also discussed.

Zhu, Dongming↗

Cyclic Failure Mechanisms of Thermal and Environmental Barrier Coating Systems Under Thermal Gradient Test Conditions

Plasma-sprayed ZrO2-8wt%Y2O3 and mullite+BSAS/Si multilayer thermal and environmental barrier coating (TBC-EBC) systems on SiC/SiC ceramic matrix composite (CMC) substrates were thermally cyclic tested under high thermal gradients using a laser high-heat-flux rig in conjunction with furnace exposure in water-vapor environments. Coating sintering and interface damage were assessed by monitoring the real-time thermal conductivity changes during the laser heat-flux tests and by examining the microstructural changes after exposure. Sintering kinetics of the coating systems were also independently characterized using a dilatometer. It was found that the coating failure involved both the time-temperature dependent sintering and the cycle frequency dependent cyclic fatigue processes. The water vapor environments not only facilitated the initial coating conductivity increases due to enhanced sintering and interface reaction, but also promoted later conductivity reductions due to the accelerated coating cracking and delamination. The failure mechanisms of the coating systems are also discussed based on the cyclic test results and are correlated to the sintering and thermal stress behavior under the thermal gradient test conditions.

Zhu, Dongming↗

Characterizing Thermal Properties of Melting Te Semiconductor: Thermal Diffusivity Measurements and Simulation

Tellurium is an element for many II-VI and I-III-VI(sub 2) compounds that are useful materials for fabricating many devices. In the melt growth techniques, the thermal properties of the molten phase are important parameter for controlling growth process to improve semiconducting crystal quality. In this study, thermal diffusivity of molten tellurium has been measured by a laser flash method in the temperature range from 500 C to 900 C. A pulsed laser with 1064 nm wavelength is focused on one side of the measured sample. The thermal diffusivity can be estimated from the temperature transient at the other side of the sample. A numerical simulation based on the thermal transport process has been also performed. By numerically fitting the experimental results, both the thermal conductivity and heat capacity can be derived. A relaxation phenomenon, which shows a slow drift of the measured thermal conductivity toward the equilibrium value after cooling of the sample, was observed for the first time. The error analysis and the comparison of the results to published data measured by other techniques will be discussed.

Zhu, Shen↗

Characterizing Thermal Properties of Melting Te Semiconductor: Thermal Diffusivity Measurements and Simulation

Tellurium is an element for many II-VI and I-III-VI(sub 2) compounds that are useful materials for fabricating many devises. In the melt growth techniques, the thermal properties of the molten phase are important parameter for controlling growth process to improve semiconducting crystal quality. In this study, thermal diffusivity of molten tellurium has been measured by a laser flash method in the temperature range from 500 C to 900 C. A pulsed laser with 1064 nm wavelength is focused on one side of the measured sample. The thermal diffusivity can be estimated from the temperature transient at the other side of the sample. A numerical simulation based on the thermal transport process has been also performed. By numerically fitting the experimental results, both the thermal conductivity and heat capacity can be derived. A relaxation phenomenon, which shows a slow drift of the measured thermal conductivity toward the equilibrium value after cooling of the sample, was observed for the first time. The error analysis and the comparison of the results to published data measured by other techniques will be discussed in the presentation.

Zhu, Shen↗

Thermal Cycling of Thermal Control Paints on Carbon-Carbon and Carbon-Polyimide Composites

Carbon-carbon composites and carbon-polyimide composites are being considered for space radiator applications owing to their light weight and high thermal conductivity. For those radiator applications where sunlight will impinge on the surface, it will be necessary to apply a white thermal control paint to minimize solar absorptance and enhance infrared emittance. Several currently available white thermal control paints were applied to candidate carbon-carbon and carbon-polyimide composites and were subjected to vacuum thermal cycling in the range of -100 C to +277 C. The optical properties of solar absorptance and infrared emittance were evaluated before and after thermal cycling. In addition, adhesion of the paints was evaluated utilizing a tape test. The test matrix included three composites: resin-derived carbon-carbon and vapor infiltrated carbon-carbon, both reinforced with pitch-based P-120 graphite fibers, and a polyimide composite reinforced with T-650 carbon fibers, and three commercially available white thermal control paints: AZ-93, Z-93-C55, and YB-71P.

Jaworske, Donald A.↗

Human Thermal Model Evaluation Using the JSC Human Thermal Database

The human thermal database developed at the Johnson Space Center (JSC) is used to evaluate a set of widely used human thermal models. This database will facilitate a more accurate evaluation of human thermoregulatory response using in a variety of situations, including those situations that might otherwise prove too dangerous for actual testing--such as extreme hot or cold splashdown conditions. This set includes the Wissler human thermal model, a model that has been widely used to predict the human thermoregulatory response to a variety of cold and hot environments. These models are statistically compared to the current database, which contains experiments of human subjects primarily in air from a literature survey ranging between 1953 and 2004 and from a suited experiment recently performed by the authors, for a quantitative study of relative strength and predictive quality of the models. Human thermal modeling has considerable long term utility to human space flight. Such models provide a tool to predict crew survivability in support of vehicle design and to evaluate crew response in untested environments. It is to the benefit of any such model not only to collect relevant experimental data to correlate it against, but also to maintain an experimental standard or benchmark for future development in a readily and rapidly searchable and software accessible format. The Human thermal database project is intended to do just so; to collect relevant data from literature and experimentation and to store the data in a database structure for immediate and future use as a benchmark to judge human thermal models against, in identifying model strengths and weakness, to support model development and improve correlation, and to statistically quantify a model s predictive quality.

Cognata, T.↗

Human Thermal Model Evaluation Using the JSC Human Thermal Database

Human thermal modeling has considerable long term utility to human space flight. Such models provide a tool to predict crew survivability in support of vehicle design and to evaluate crew response in untested space environments. It is to the benefit of any such model not only to collect relevant experimental data to correlate it against, but also to maintain an experimental standard or benchmark for future development in a readily and rapidly searchable and software accessible format. The Human thermal database project is intended to do just so; to collect relevant data from literature and experimentation and to store the data in a database structure for immediate and future use as a benchmark to judge human thermal models against, in identifying model strengths and weakness, to support model development and improve correlation, and to statistically quantify a model s predictive quality. The human thermal database developed at the Johnson Space Center (JSC) is intended to evaluate a set of widely used human thermal models. This set includes the Wissler human thermal model, a model that has been widely used to predict the human thermoregulatory response to a variety of cold and hot environments. These models are statistically compared to the current database, which contains experiments of human subjects primarily in air from a literature survey ranging between 1953 and 2004 and from a suited experiment recently performed by the authors, for a quantitative study of relative strength and predictive quality of the models.

Bue, Grant↗

Loop Heat Pipe with Thermal Control Valve as a Variable Thermal Link

Future lunar landers and rovers will require variable thermal links that allow for heat rejection during the lunar daytime and passively prevent heat rejection during the lunar night. During the lunar day, the thermal management system must reject the waste heat from the electronics and batteries to maintain them below the maximum acceptable temperature. During the lunar night, the heat rejection system must either be shut down or significant amounts of guard heat must be added to keep the electronics and batteries above the minimum acceptable temperature. Since guard heater power is unfavorable because it adds to system size and complexity, a variable thermal link is preferred to limit heat removal from the electronics and batteries during the long lunar night. Conventional loop heat pipes (LHPs) can provide the required variable thermal conductance, but they still consume electrical power to shut down the heat transfer. This innovation adds a thermal control valve (TCV) and a bypass line to a conventional LHP that proportionally allows vapor to flow back into the compensation chamber of the LHP. The addition of this valve can achieve completely passive thermal control of the LHP, eliminating the need for guard heaters and complex controls.

Hartenstine, John↗

Composite Stiffened Panels: Part I - Stiffness, Thermal Expansion, and Thermal Bending Formulation for Finite Element Analysis

A method is presented for formulating stiffness terms and thermal coefficients of fiber-reinforced composite, stiffened panels for input to finite element analysis (FEA). The method is robust enough to handle panels with general cross sectional shapes, including those which are unsymmetric and/or unbalanced. New thermal coefficients are introduced to quantify panel response from through-the-thickness temperature gradients. Equations are defined for stiffness, thermal expansion, and thermal bending that consider the full complement of membrane, bending, membrane-bending coupling, and transverse shear behavior. A technique of implementing this capability with a single plane of shell finite elements using the MSC/NASTRAN(TradeMark) FEA program is revealed. Finally, an example of a composite, hat-stiffened panel is included to demonstrate errors that occur when an unsymmetric panel is symmetrically formulated as traditionally done. These erroneous values and the correct ones produced from the presented method are listed for the panel's stiffness matrices, thermal expansion and bending vectors, and the forces and moments that are thermally induced from in-plane and through-the-thickness temperature gradients.

Craig S Collier↗

Correleation of the SAGE III on ISS Thermal Models in Thermal Desktop

The Stratospheric Aerosol and Gas Experiment III (SAGE III) instrument is the fifth in a series of instruments developed for monitoring aerosols and gaseous constituents in the stratosphere and troposphere. SAGE III was launched on February 19, 2017 and mounted to the International Space Station (ISS) to begin its three-year mission. A detailed thermal model of the SAGE III payload, which consists of multiple subsystems, has been developed in Thermal Desktop (TD). Correlation of the thermal model is important since the payload will be expected to survive a three-year mission on ISS under varying thermal environments. Three major thermal vacuum (TVAC) tests were completed during the development of the SAGE III Instrument Payload (IP); two subsystem-level tests and a payload-level test. Additionally, a characterization TVAC test was performed in order to verify performance of a system of heater plates that was designed to allow the IP to achieve the required temperatures during payload-level testing; model correlation was performed for this test configuration as well as those including the SAGE III flight hardware. This document presents the methods that were used to correlate the SAGE III models to TVAC at the subsystem and IP level, including the approach for modeling the parts of the payload in the thermal chamber, generating pre-test predictions, and making adjustments to the model to align predictions with temperatures observed during testing. Model correlation quality will be presented and discussed, and lessons learned during the correlation process will be shared.

Amundsen, Ruth M.↗

Thermophysical Properties of Cold and Vacuum Plasma Sprayed Cu-Cr-X Alloys, NiAl and NiCrAlY Coatings: Electrical and Thermal Conductivity, Thermal Diffusivity, and Total Hemispherical Emissivity - Part 1

This two-part paper reports the thermophysical properties of several cold and vacuum plasma sprayed monolithic Cu and Ni-based alloy coatings. Part I presents the electrical and thermal conductivity, thermal diffusivity, and total hemispherical emissivity data while Part II reports the specific heat capacity data for these coatings. Metallic copper alloys, stoichiometric NiAl and NiCrAlY coatings were fabricated by either the cold sprayed or the vacuum plasma spray deposition processes for thermal property measurements between 77 and 1223 K. The temperature dependencies of the thermal conductivities, thermal diffusivities, electrical conductivities and total hemispherical emissivities of these cold and vacuum sprayed monolithic coatings are reported in this paper. The electrical and thermal conductivity data correlate reasonably well for Cu-8%Cr-1%Al, Cu-23%Cr-5%Al and NiAl in accordance with the Wiedemann-Franz (WF) law although a better fit is obtained using the Smith-Palmer relationship. The Lorentz numbers determined from the WF law are close to the theoretical value.

Raj, S. V.↗