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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 361 records · Page 20
All sourcesNASA NTRSDOE OSTI
NASA NTRSDate not supplied

Reliability-Based Damage Tolerance Framework for Achieving Highly Reusable Launch Systems

The United States Space Force and NASA are exploring approaches that enable rapid launch response via highly reusable launch systems. One hindrance to achieving high reusability is the inability to meet damage tolerance requirements. To this end, a framework for applying reliability-based damage tolerance to space structures is presented. The reliability-based approach employs probabilistic distributions of key input variables such as material properties, geometry, loads, inspection probability, and defect characteristics to predict hardware reliability for the planned mission life. The probabilistic variables needed to perform the reliability assessments are defined and recommendations on how to collect the required data are provided. Several example problems illustrate the implementation and execution of this approach.

Leland Shimizu↗
NASA NTRS2024

Fault Diagnosis of Power Components with Reliability Assessment in Extraterrestrial Microgrids

This research investigates the possible failures caused by aging and other environmental and external factors that could significantly impact the performance of extraterrestrial power systems. Additionally, it presents a reliability assessment model for the space microgrid based on fault tree analysis (FTA). The reliability assessment model developed in this paper represents a tool that can be used by engineers to harden the system design for operational and economic benefits. To improve the reliability of the system, this work provides a broad review of the different fault detection and diagnosis (FDD) algorithms used for power microgrids and space applications. Using data sets from the Habitat Simulator developed through the NASA-funded Resilient Extraterrestrial Habitat Institute, this paper compares the applicability and accuracy of the different FDD methods. The primary FDD approach proposed and assessed in this work is based on the Markov reliability model. It predicts and detects future faults in the space microgrids by using past data samples and categorizing them into different classes. Data-driven-based models such as artificial neural networks are also investigated, tested, and evaluated using simulation data sets. According to the simulation results and the broad FDD algorithm comparison, this study provides the crew or maintenance engineers with a clear methodology to detect and localize power system failures.

Leila Chebbo↗
NASA NTRS1962

Design Reliability Measurement and Evaluation

Reliability measurement by data collection and evaluation is considered. Parameters are defined and restrictions established. Reliability estimation of sub-systems and parts as a preliminary to system estimation is reviewed, and rules are established. Confidence levels of sub-systems and parts versus combined system are analyzed. Estimation planning is discussed. Tests planned for accept-reject reliability decision are very briefly considered.

RELIABILITY↗
NASA NTRS1994

Software analysis handbook: Software complexity analysis and software reliability estimation and prediction

This handbook documents the three software analysis processes the Space Station Software Analysis team uses to assess space station software, including their backgrounds, theories, tools, and analysis procedures. Potential applications of these analysis results are also presented. The first section describes how software complexity analysis provides quantitative information on code, such as code structure and risk areas, throughout the software life cycle. Software complexity analysis allows an analyst to understand the software structure, identify critical software components, assess risk areas within a software system, identify testing deficiencies, and recommend program improvements. Performing this type of analysis during the early design phases of software development can positively affect the process, and may prevent later, much larger, difficulties. The second section describes how software reliability estimation and prediction analysis, or software reliability, provides a quantitative means to measure the probability of failure-free operation of a computer program, and describes the two tools used by JSC to determine failure rates and design tradeoffs between reliability, costs, performance, and schedule.

Computer systems design↗
NASA NTRS2005

Design for ASIC reliability for low-temperature applications

In this paper, we present a methodology to design for reliability for low temperature applications without requiring process improvement. The developed hot carrier aging lifetime projection model takes into account both the transistor substrate current profile and temperature profile to determine the minimum transistor size needed in order to meet reliability requirements. The methodology is applicable for automotive, military, and space applications, where there can be varying temperature ranges. A case study utilizing this methodology is given to design for reliability into a custom application-specific integrated circuit (ASIC) for a Mars exploration mission.

reliability↗
NASA NTRS2006

Design Parameters Influencing Reliability of CCGA Assembly: A Sensitivity Analysis

Area Array microelectronic packages with small pitch and large I/O counts are now widely used in microelectronics packaging. The impact of various package design and materials/process parameters on reliability has been studied through extensive literature review. Reliability of Ceramic Column Grid Array (CCGA) package assemblies has been evaluated using JPL thermal cycle test results (-50(deg)/75(deg)C, -55(deg)/100(deg)C, and -55(deg)/125(deg)C), as well as those reported by other investigators. A sensitivity analysis has been performed using the literature da to study the impact of design parameters and global/local stress conditions on assembly reliability. The applicability of various life-prediction models for CCGA design has been investigated by comparing model's predictions with the experimental thermal cycling data. Finite Element Method (FEM) analysis has been conducted to assess the state of the stress/strain in CCGA assembly under different thermal cycling, and to explain the different failure modes and locations observed in JPL test assemblies.

reliability↗
NASA NTRS2004

Qualification and Reliability for MEMS and IC Packages

Advanced IC electronic packages are moving toward miniaturization from two key different approaches, front and back-end processes, each with their own challenges. Successful use of more of the back-end process front-end, e.g. microelectromechanical systems (MEMS) Wafer Level Package (WLP), enable reducing size and cost. Use of direct flip chip die is the most efficient approach if and when the issues of know good die and board/assembly are resolved. Wafer level package solve the issue of known good die by enabling package test, but it has its own limitation, e.g., the I/O limitation, additional cost, and reliability. From the back-end approach, system-in-a-package (SIAP/SIP) development is a response to an increasing demand for package and die integration of different functions into one unit to reduce size and cost and improve functionality. MEMS add another challenging dimension to electronic packaging since they include moving mechanical elements. Conventional qualification and reliability need to be modified and expanded in most cases in order to detect new unknown failures. This paper will review four standards that already released or being developed that specifically address the issues on qualification and reliability of assembled packages. Exposures to thermal cycles, monotonic bend test, mechanical shock and drop are covered in these specifications. Finally, mechanical and thermal cycle qualification data generated for MEMS accelerometer will be presented. The MEMS was an element of an inertial measurement unit (IMU) qualified for NASA Mars Exploration Rovers (MERs), Spirit and Opportunity that successfully is currently roaring the Martian surface

inertial measurement unit↗
NASA NTRS2004

A Statistical Approach to Characterizing the Reliability of Systems Utilizing HBT Devices

This paper presents a statistical approach to characterizing the reliability of systems with HBT devices. The proposed approach utilizes the statistical reliability information of the HBT individual devices, along with the analysis on the critical paths of the system, to provide more accurate and more comprehensive reliability information about the HBT systems compared to the conventional worst-case method.

hetero bipolar transistors (HBTs)↗
NASA NTRS2011

Reliability of Sn/Pb and Lead-Free (SnAgCu) Solders of Surface Mounted Miniaturized Passive Components for Extreme Temperature (-185 C to +125 C) Space Missions

Surface mount electronic package test boards have been assembled using tin/lead (Sn/Pb) and lead-free (Pb-free or SnAgCu or SAC305) solders. The soldered surface mount packages include ball grid arrays (BGA), flat packs, various sizes of passive chip components, etc. They have been optically inspected after assembly and subsequently subjected to extreme temperature thermal cycling to assess their reliability or future deep space, long-term, extreme temperature environmental missions. In this study, the employed temperature range (-185oC to +125oC) covers military specifications (-55oC to +100oC), extreme old Martian (-120oC to +115oC), asteroid Nereus (-180oC to +25oC) and JUNO (-150oC to +120oC) environments. The boards were inspected at room temperature and at various intervals as a function of extreme temperature thermal cycling and bake duration. Electrical resistance measurements made at room temperature are reported and the tests to date have shown some change in resistance as a function of extreme temperature thermal cycling and some showed increase in resistance. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work will be carried out to understand the reliability of packages under extreme temperature applications (-185oC to +125oC) via continuously monitoring the daisy chain resistance for BGA, Flat-packs, lead less chip packages, etc. This paper will describe the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead and lead-free solder alloys under extreme temperature environments.

extreme temperatures,↗
NASA NTRS2015

A Vision for Spaceflight Reliability: NASA's Objectives Based Strategy

In defining the direction for a new Reliability and Maintainability standard, OSMA has extracted the essential objectives that our programs need, to undertake a reliable mission. These objectives have been structured to lead mission planning through construction of an objective hierarchy, which defines the critical approaches for achieving high reliability and maintainability (R M). Creating a hierarchy, as a basis for assurance implementation, is a proven approach; yet, it holds the opportunity to enable new directions, as NASA moves forward in tackling the challenges of space exploration.

Strategy↗
NASA NTRS2015

Spaceflight Reliability: An Objectives-Based Strategy

In defining the direction for a new Reliability and Maintainability standard, OSMA has extracted the essential objectives that our programs need, to undertake a reliable mission. These objectives have been structured to lead mission planning through construction of an objective hierarchy, which defines the critical approaches for achieving high reliability and maintainability (R M). Creating a hierarchy, as a basis for assurance implementation, is a proven approach; yet, it holds the opportunity to enable new directions, as NASA moves forward in tackling the challenges of space exploration.

Reliability and Maintainability↗
NASA NTRS2016

Verification of Triple Modular Redundancy Insertion for Reliable and Trusted Systems

If a system is required to be protected using triple modular redundancy (TMR), improper insertion can jeopardize the reliability and security of the system. Due to the complexity of the verification process and the complexity of digital designs, there are currently no available techniques that can provide complete and reliable confirmation of TMR insertion. We propose a method for TMR insertion verification that satisfies the process for reliable and trusted systems.

Verification↗
NASA NTRS2017

Challenges Regarding IP Core Functional Reliability

For many years, intellectual property (IP) cores have been incorporated into field programmable gate array (FPGA) and application specific integrated circuit (ASIC) design flows. However, the usage of large complex IP cores were limited within products that required a high level of reliability. This is no longer the case. IP core insertion has become mainstream including their use in highly reliable products. Due to limited visibility and control, challenges exist when using IP cores and subsequently compromise product reliability. We discuss challenges and suggest potential solutions to critical application IP insertion.

IP cores↗
NASA NTRS2019

Inclusion of Radiation Environment Variability for Reliability Estimates for SiC Power MOSFETs

Variability of the solar energetic particle environment is investigated for single-event-burnout reliability of silicon-carbide power metal-oxide-semiconductor field effect transistors. A probabilistic assessment of failure evaluates the benefits of de-rating voltage, shielding, and mission length. The Prediction of Solar particle Yields for Characterizing Integrating Circuits code is used to calculate a cumulative density function for the fluence of the environment. The lethal ion method is then used to determine what proportion of the environment will cause single-event-burnout. The operating voltage determines the lowest linear-energy-transfer particle that will cause single-event-burnout and that should be included in the environment distribution. The shielding and mission length also determine the final environment distribution of the mission fluence. Through calculating the reliability for different operating voltages, shielding, and mission length for a specific device, it is shown that shielding thickness and operating voltage have a large effect on reliability and can be traded off during the design.

Heavy ion↗
NASA NTRSDate not supplied

The Reliability Function

Mathematically, reliability is the probability of success. First, we will present the calculus needed to comprehend basic probability theory. Second, we will introduce The Reliability Function and its basic properties. Last, we will demonstrate The Reliability Function in a notional fatigue life example.

Reliability↗
NASA NTRS2024

Considerations for Qualifying Reliable Eddy Current Array Technique for Detection of Backwall Cracks

A reliable nondestructive evaluation (NDE) technique provides minimum 90% probability of detection(POD) with 95% confidence for detection of cracklike flaws of a qualified size. In this case, the flaws are on backside of material. Eddy current array (ECA) probe or a single sensor eddy current probe in c-scanning mode is used for the flaw detection. Here, two geometries are considered for the test specimens. The two geometries are, a flat plate, and tube or pipe. The probe is assumed to be on outer diameter (OD)surface and the flaw is assumed to be at the inner diameter (ID) surface for tube inspection. The flaw and probe are on opposite side of wall thickness for inspection of plate material. The application may be used for acreage inspection or just for inspection of butt weld and heat affected zone (HAZ) in a tube, cylinder, or plate. The proposed approach is based on developing an instrument standardization or calibration procedure. Decision threshold of inspection procedure is determined using empirical qualification and noise data. The work explores essential parameters that are required to meet certain conditions to ensure reliable flaw detection. Physics-based simulation of eddy current array flaw detection is used to understand effect of essential parameters on signal response (amplitude and phase),and therefore flaw detectability. Simulation data is used to justify choice of calibration reference standard requirements and the qualification approach. An ECA technique qualification model is provided. The paper gives brief description of tasks to be completed for qualifying ECA technique for reliable detection of cracklike flaws.

Eddy current array inspection, nondestructive eval↗
NASA NTRSDate not supplied

Proposed Reliability-Based Damage Tolerance Guidelines for Space Systems

Deterministic damage tolerance guidelines for highly reusable and efficiently designed launch systems can be challenging to meet and result in overly conservative assessments for tightly controlled manufacturing processes. Deterministic approaches may be unconservative when the structure is workmanship sensitive and there is a wide spread in fracture properties. Reliability-based damage tolerance assessments targeting a component reliability over the service life commensurate to mission risk posture is a promising alternative. Low production rates, short fleets, and lack of standards or guidance has slowed down widespread adoption of this method. Guidance for the robust application of reliability-based damage tolerance for space systems are proposed. These guidelines cover the treatment of uncertainty in damage tolerance analysis, the collection of data to develop probabilistic distributions, uncertainty propagation methods, and types of hardware.

Reliability-Based Damage Tolerance↗