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NASA NTRS2005

Microelectromechanical Systems Actuator Based Reconfigurable Printed Antenna

A polarization reconfigurable patch antenna is disclosed. The antenna includes a feed element, a patch antenna element electrically connected to the feed element, and at least one microelectromechanical systems (MEMS) actuator, with a partial connection to the patch antenna element along an edge of the patch antenna element. The polarization of the antenna can be switched between circular polarization and linear polarization through action of the at least one MEMS actuator.

Simons, Rainee N.↗

NASA NTRS2004

Eccentric loading of microtensile specimens

Ceramic materials have a lower density than most metals and are capable of performing at extremely high temperatures. The utility of these materials is obvious; however, the fracture strength of brittle materials is not easily predicted and often varies greatly. Characteristically, brittle materials lack ductility and do not yield as other materials. Ceramics materials are naturally populated with microscopic cracks due to fabrication techniques. Upon application of a load, stress concentration occurs at the root of these cracks and fracture will eventually occur at some not easily predicted strength. In order to use ceramics in any application some design methodology must exist from which a component can be placed into service. This design methodology is CARES/LIFE (Ceramics Analysis and Reliability Evaluation of Structures) which has been developed and refined at NASA over the last several decades. The CARES/LIFE computer program predicts the probability of failure of a ceramic component over its service life. CARES combines finite element results from a commercial FE (finite element) package such as ANSYS and experimental results to compute the abovementioned probability of failure. Over the course of several tests CARES has had great success in predicting the life of various ceramic components and has been used throughout industry. The latest challenge is to verify that CARES is valid for MEMS (Micro-Electro Mechanical Systems). To investigate a series of microtensile specimens were fractured in the laboratory. From this data, material parameters were determined and used to predict a distribution of strength for other specimens that exhibit a known stress concentration. If the prediction matches the experimental results then these parameters can be applied to a desired component outside of the laboratory. During testing nearly half of the tensile Specimens fractured at a location that was not expected and hence not captured in the FE model. It has been my duty to investigate the nature of this phenomenon in hopes of finding a better correlation between theory and empirical results. To investigate I built complete FE models of all of the tensile specimens using ANSYS. It is suspected that some misalignment naturally occurs during testing and thus additional bending stresses are present in the specimens. I modeled this eccentric loading and ran several FE trials using ANSYS/PDS (a probabilistic design system in ANSYS). My objective this summer has been familiarize myself with the CARES/LIFE program in hopes of using it in conjunction with ANSYS to help verify that CARES is applicable to MEMS-scale (greater that 1 micron, less than 1 millimeter) components.

Trapp, Mark A.↗

NASA NTRS1999

Liquid Bipropellant Microrocket Concept Under Development

Fundamental research into the feasibility of microrockets for primary propulsion and attitude control for far-term micro/integrated spacecraft is being performed. These rockets would be fabricated using microelectrical and mechanical systems (MEMS) technology. The enabling technology is being developed at the Massachusetts Institute of Technology (MIT). The NASA/MIT program leverages a very large Army Research Office and Defense Advanced Research Projects Agency (DARPA) program for the development of microturbine technology. The microrocket motor is complete with regenerative cooling, turbopumps, and control valves etched onto the same chip. They would be fabricated in large numbers in parallel using semiconductor manufacturing techniques. The technology may lead to the development of microsatellites as fully integrated MEMS devices that could be mass produced at a fraction of the cost of current satellites.

Schneider, Steven J.↗

NASA NTRS2005

Mass Spectrometry for Planetary Probes: Past, Present and Future

Atmospheric entry probes present a unique opportunity for performing quantitative analysis of extra-terrestrial atmospheres in cases where remote sensing alone may not be sufficient and measurements with balloons or aircraft is not practical. An entry probe can provide a complete vertical profile of atmospheric parameters including chemical composition, which cannot be obtained with most other techniques. There are, however, unique challenges associated with building instruments for an entry probe, as compared to orbiters, landers, or rovers. Conditions during atmospheric entry are extreme, there are inherent time constraints due to the short duration of the experiment, and the instrument experiences rapid environmental changes in temperature and pressure as it descends. In addition, there are resource limitations, i.e. mass, power, size and bandwidth. Finally, the demands on the instrument design are determined in large part by conditions (pressure, temperature, composition) unique to the particular body under study, and as a result there is no one-size-fits-all instrument for an atmospheric probe. Many of these requirements can be more easily met by miniaturizing the probe instrument. Our experience building mass spectrometers for atmospheric entry probes leads us to believe that the time is right for a fundamental change in the way spaceflight mass spectrometers are built. The emergence over the past twenty years of Micro-electro- mechanical Systems (MEMS), utilizing lithographic semiconductor fabrication techniques to produce instrument systems in miniature, holds great promise for application to spaceflight mass spectrometry. A highly miniaturized, high performance and low-power mass spectrometer would be an enormous benefit to future entry probe missions, allowing, for example, parallel measurements (e.g., multiple simultaneous gas chromatographic analyses and direct atmospheric leaks.) Such an instrument would also enable mass spectrometry on board small multiple entry probes. In the development of a MEMS Mass Spectrometer, the challenge facing us is to move beyond the proof-of-concept, where research dollars tend to focus, and carry out the detailed work of developing a high performance mass spectrometer system on a chip which meets the unique technical requirements for an atmospheric entry probe described above.

Niemann, Hasso B.↗

NASA NTRS2001

Sensor Development for Active Flow Control

Presented are the developmental efforts for MEMS sensors for a closed-loop active flow control in a low-speed wind tunnel evaluation. The MEMS sensors are designed in-house and fabricated out of house, and the shear sensors are a thermal type that are collocated with temperature and pressure sensors on a flexible polyimide sheet, which conforms to surfaces of a simple curvature. A total of 6 sensors are located within a 1.5 by 3 mm area as a cluster with each sensor being 300 pm square. The thickness of this sensor cluster is 75 pm. Outputs from the shear sensors have been compared with respect to those of the Preston tube for evaluation of the sensors on a flat plate. Pressure sensors are the absolute type and have recorded pressure measurements within 0.05 percent of the tunnel ESP pressure sensor readings. The sensors and signal conditioning electronics have been tested on both a flat plate and a ramp in Langley s 15-Inch Low-Turbulence Tunnel. The system configuration and control PC is configured with LabView, where calibration constants are stored for desired compensation and correction. The preliminary test results are presented within.

Kahng, Seun K.↗

NASA NTRS2003

Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

Chen, Liang-Yu↗

NASA NTRS2006

Deep Reactive Ion Etching (DRIE) of High Aspect Ratio SiC Microstructures using a Time-Multiplexed Etch-Passivate Process

High aspect ratio silicon carbide (SiC) microstructures are needed for microengines and other harsh environment micro-electro-mechanical systems (MEMS). Previously, deep reactive ion etching (DRIE) of low aspect ratio (AR less than or = 1) deep (greater than 100 micron) trenches in SiC has been reported. However, existing DRIE processes for SiC are not well-suited for definition of high aspect ratio features because such simple etch-only processes provide insufficient control over sidewall roughness and slope. Therefore, we have investigated the use of a time-multiplexed etch-passivate (TMEP) process, which alternates etching with polymer passivation of the etch sidewalls. An optimized TMEP process was used to etch high aspect ratio (AR greater than 5) deep (less than 100 micron) trenches in 6H-SiC. Power MEMS structures (micro turbine blades) in 6H-SiC were also fabricated.

Evans, Laura J.↗

NASA NTRS2006

The Primordial Anisotropy Polarization Pathfinder Array (PAPPA): Instrument Overview and Status

PAPPA is a balloon-based experiment designed to measure the polarization of the Cosmic Microwave Background using candidate technology for an eventual Inflation Probe mission. It will survey a 20 x 20 degree patch of sky with 1 degree angular resolution covering 3 passbands centered at 100,200 and 300 GHz. Detection will be accomplished via antenna-coupled transition edge sensors (TESs) with SQUID-based readouts. In the eventual flight package, band defining filters and MEMS-based polarization modulators will be incorporated into the superconducting microstrip transmission lines that terminate in resistors that are thermally coupled to the TESs. The MEMS switches will allow on-chip polarization modulation that is faster than significant detector gain variations. The initial configuration will incorporate a simplified focal plane augmented by quasioptical polarization modulation. We describe the overall instrument design and present a summary of the current progress.

Chuss, David↗

NASA NTRS2007

Applications of ANSYS/Multiphysics at NASA/Goddard Space Flight Center

This viewgraph presentation reviews some of the uses that the ANSYS/Multiphysics system is used for at the NASA Goddard Space Flight Center. Some of the uses of the ANSYS system is used for is MEMS Structural Analysis of Micro-mirror Array for the James Web Space Telescope (JWST), Micro-shutter Array for JWST, MEMS FP Tunable Filter, AstroE2 Micro-calorimeter. Various views of these projects are shown in this presentation.

Loughlin, Jim↗

NASA NTRS2007

Multiple internal seal right micro-electro-mechanical system vacuum package

A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum package that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.

Hayworth, Ken J.↗

NASA NTRS2008

Multiple internal seal ring micro-electro-mechanical system vacuum packaging method

A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum packaging method that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.

Hayworth, Ken J.↗

NASA NTRS2008

Wearable Wireless Telemetry System for Implantable BioMEMS Sensors

Telemetry systems of a type that have been proposed for the monitoring of physiological functions in humans would include the following subsystems: Surgically implanted or ingested units that would comprise combinations of microelectromechanical systems (MEMS)- based sensors [bioMEMS sensors] and passive radio-frequency (RF) readout circuits that would include miniature loop antennas. Compact radio transceiver units integrated into external garments for wirelessly powering and interrogating the implanted or ingested units. The basic principles of operation of these systems are the same as those of the bioMEMS-sensor-unit/external-RFpowering- and-interrogating-unit systems described in "Printed Multi-Turn Loop Antennas for Biotelemetry" (LEW-17879-1) NASA Tech Briefs, Vol. 31, No. 6 (June 2007), page 48, and in the immediately preceding article, "Hand-Held Units for Short-Range Wireless Biotelemetry" (LEW-17483-1). The differences between what is reported here and what was reported in the cited prior articles lie in proposed design features and a proposed mode of operation. In a specific system of the type now proposed, the sensor unit would comprise mainly a capacitive MEMS pressure sensor located in the annular region of a loop antenna (more specifically, a square spiral inductor/ antenna), all fabricated as an integral unit on a high-resistivity silicon chip. The capacitor electrodes, the spiral inductor/antenna, and the conductor lines interconnecting them would all be made of gold. The dimensions of the sensor unit have been estimated to be about 110.4 mm. The external garment-mounted powering/ interrogating unit would include a multi-turn loop antenna and signal-processing circuits. During operation, this external unit would be positioned in proximity to the implanted or ingested unit to provide for near-field, inductive coupling between the loop antennas, which we have as the primary and secondary windings of an electrical transformer.

Simons, Rainee N.↗

NASA NTRS2009

GPS/MEMS IMU/Microprocessor Board for Navigation

A miniaturized instrumentation package comprising a (1) Global Positioning System (GPS) receiver, (2) an inertial measurement unit (IMU) consisting largely of surface-micromachined sensors of the microelectromechanical systems (MEMS) type, and (3) a microprocessor, all residing on a single circuit board, is part of the navigation system of a compact robotic spacecraft intended to be released from a larger spacecraft [e.g., the International Space Station (ISS)] for exterior visual inspection of the larger spacecraft. Variants of the package may also be useful in terrestrial collision-detection and -avoidance applications. The navigation solution obtained by integrating the IMU outputs is fed back to a correlator in the GPS receiver to aid in tracking GPS signals. The raw GPS and IMU data are blended in a Kalman filter to obtain an optimal navigation solution, which can be supplemented by range and velocity data obtained by use of (l) a stereoscopic pair of electronic cameras aboard the robotic spacecraft and/or (2) a laser dynamic range imager aboard the ISS. The novelty of the package lies mostly in those aspects of the design of the MEMS IMU that pertain to controlling mechanical resonances and stabilizing scale factors and biases.

Gender, Thomas K.↗

NASA NTRS2009

Alignment Jig for the Precise Measurement of THz Radiation

Javadi, Hamid H.↗

NASA NTRS2009

Radio Relays Improve Wireless Products

Signal Hill, California-based XCOM Wireless Inc. developed radio frequency micromachine (RF MEMS) relays with a Phase II Small Business Innovation Research (SBIR) contract through NASA?s Jet Propulsion Laboratory. In order to improve satellite communication systems, XCOM produced wireless RF MEMS relays and tunable capacitors that use metal-to-metal contact and have the potential to outperform most semiconductor technologies while using less power. These relays are used in high-frequency test equipment and instrumentation, where increased speed can mean significant cost savings. Applications now also include mainstream wireless applications and greatly improved tactical radios.

Source record↗

NASA NTRS2010

Wavefront Correction for Large, Flexible Antenna Reflector

A wavefront-correction system has been proposed as part of an outer-space radio communication system that would include a large, somewhat flexible main reflector antenna, a smaller subreflector antenna, and a small array feed at the focal plane of these two reflector antennas. Part of the wavefront-correction system would reside in the subreflector, which would be a planar patch-element reflectarray antenna in which the phase shifts of the patch antenna elements would be controlled via microelectromechanical systems (MEMS) radio -frequency (RF) switches. The system would include the following sensing-and-computing subsystems: a) An optical photogrammetric subsystem built around two cameras would estimate geometric distortions of the main reflector; b) A second subsystem would estimate wavefront distortions from amplitudes and phases of signals received by the array feed elements; and c) A third subsystem, built around small probes on the subreflector plane, would estimate wavefront distortions from differences among phases of signals received by the probes. The distortion estimates from the three subsystems would be processed to generate control signals to be fed to the MEMS RF switches to correct for the distortions, thereby enabling collimation and aiming of the received or transmitted radio beam to the required precision.

Imbriale, William A.↗

NASA NTRS2010

Instrument for Analysis of Greenland's Glacier Mills

A new instrument is used to study the inner workings of Greenland s glacier mills by riding the currents inside a glacier s moulin. The West Greenland Moulin Explorer instrument was deployed into a tubular shaft to autonomously record temperature, pressure, 3D acceleration, and location. It is built with a slightly positive buoyancy in order to assist in recovery. The unit is made up of several components. A 3-axis MEMS (microelectromechanical systems) accelerometer with 0.001-g resolution forms the base of the unit. A pressure transducer is added that is capable of withstanding 500 psi (=3.4 MPa), and surviving down to -40 C. An Iridium modem sends out data every 10 minutes. The location is traced by a GPS (Global Positioning System) unit. This GPS unit is also used for recovery after the mission. Power is provided by a high-capacity lithium thionyl chloride D-sized battery. The accelerometer is housed inside a cylindrical, foot-long (=30 cm) polyvinyl chloride (PVC) shell sealed at each end with acrylic. The pressure transducer is attached to one of these lids and a MEMS accelerometer to the other, recording 100 samples per second per axis.

Behar, Alberto E.↗

NASA NTRS2010

A Two-Axis Direct Fluid Shear Stress Sensor

This innovation is a miniature or micro sized semiconductor sensor design that provides two axis direct non-intrusive measurement of skin friction or wall shear stress in fluid flow. The sensor is fabricated by micro-electro-mechanical system (MEMS) technology, enabling small size and low cost reproductions. The sensors have been fabricated by utilizing MEMS fabrication processes to bond a sensing element wafer to a fluid coupling wafer. This layering technique provides for an out of plane dimension that is on the same order of length as the inplane dimensions. The sensor design has the following characteristics: a shear force collecting plate with dimensions that can be tailored to various application specific requirements such as spatial resolution, temporal resolution and shear force range and resolution. This plate is located coplanar to both the sensor body and flow boundary, and is connected to a dual axis gimbal structure by a connecting column or lever arm. The dual axis gimbal structure has torsional hinges with embedded piezoresistive torsional strain gauges which provide a voltage output that is correlated to the applied shear stress (and excitation current) on force collection plate that is located on the flow boundary surface (hence the transduction method). This combination of design elements create a force concentration and resolution structure that enables the generation of a large stress on the strain gauge from the small shear stress on the flow boundary wall. This design as well as the use of back side electrical contacts establishes a non-intrusive method to quantitatively measure the shear force vector on aerodynamic bodies.

Adcock, Edward E.↗