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At least 361 records · Page 20

Open magnetic fields in active regions

Soft X-ray images and magnetograms of several active regions and coronal holes are examined which support the interpretation that some of the dark X-ray gaps seen between interconnecting loops and inner cores of active regions are foot points of open field lines inside the active regions. Characteristics of the investigated dark gaps are summarized. All the active regions with dark X-ray gaps at the proper place and with the correct polarity predicted by global potential extrapolation of photospheric magnetic fields are shown to be old active regions, indicating that field opening is accomplished only in a late phase of active-region development. It is noted that some of the observed dark gaps probably have nothing in common with open fields, but are either due to the decreased temperature in low-lying portions of interconnecting loops or are the roots of higher and less dense or cooler loops.

Svestka, Z.↗

The driving force for magnetospheric convection

Viscously driven magnetospheric models, as well as a model involving interconnection between the geomagnetic field and the magnetic field in the solar wind, have been proposed to describe the driving force for magnetospheric convection. Lack of a satisfactory theory for the interconnection in the latter model and, in the case of the viscous interaction models, inadequacies in predicting the quantity of the driving force, make these two classes of models less than successful. Accordingly, a mechanically driven magnetospheric model is proposed: solar wind plasma enters the magnetosphere around the neutral points, covers the inner surface of the magnetopause and subsequently expands, driving convection as it escapes from the open tail.

Johnson, F. S.↗

Phase Two of the Array Automated Assembly Task for the Low Cost Solar Array Project

Various top contact metal systems were studied. Only Ti Pd Cu approaches baseline (Ti Pd Ag) quality, but this system shows a lack of long term stability. Aluminum back surface field structures were fabricated and thicknesses of p superscript + material of up to 7.0 microns were achieved with open circuit voltages of 0.59V. A general purpose ultrasonic welder was purchased and tests using various metal foils are under way. During fabrication of the demonstration module, several cells became cracked. Due to redundancy of interconnections, the module was not open circuited but the efficiency was reduced to 8.8%. The broken cell was interconnected with a strap across the back and the efficiency was increased to 11.5%. A cost analysis was made and the results indicate a selling price of $0.56/watt peak (in 1986 with 1975 dollars).

Campbell, R. B.↗

NASCAP modelling of high-voltage power system interactions with space charged-particle environments

A simple space power system operating in geosynchronous orbit was analyzed. This system consisted of two solar array wings and a central body. Each solar array wing was considered to be divided into three regions operating at 2000 volts. The center body was considered to be an electrical ground with the array voltages both positive and negative relative to ground. The system was analyzed for both a normal environment and a moderate geomagnetic substorm environment. Initial results indicate a high probability of arcing at the interconnects on the negative operating voltage wing. The dielectric strength of the substrate may be exceeded giving rise to breakdown in the bulk of the material. The geomagnetic substorm did not seem to increase the electrical gradients at the interconnects on the negative operating voltage wing but did increase the gradients on the positive operating voltage wing which could result in increased coupling current losses.

Stevens, N. J.↗

High temperature - low mass solar blanket

Interconnect materials and designs for use with ultrathin silicon solar cells are discussed, as well as the results of an investigation of the applicability of parallel-gap resistance welding for interconnecting these cells. Data relating contact pull strength and cell electrical degradation to variations in welding parameters such as time, voltage and pressure are presented. Methods for bonding ultrathin cells to flexible substances and for bonding thin (75 micrometers) covers to these cells are described. Also, factors influencing fabrication yield and approaches for increasing yield are discussed. The results of vacuum thermal cycling and thermal soak tests on prototype ultrathin cell test coupons and one solar module blanket are presented.

Mesch, H. G.↗

On decentralized control of large-scale systems

A scheme is presented for decentralized control of large-scale linear systems which are composed of a number of interconnected subsystems. By ignoring the interconnections, local feedback controls are chosen to optimize each decoupled subsystem. Conditions are provided to establish compatibility of the individual local controllers and achieve stability of the overall system. Besides computational simplifications, the scheme is attractive because of its structural features and the fact that it produces a robust decentralized regulator for large dynamic systems, which can tolerate a wide range of nonlinearities and perturbations among the subsystems.

Siljak, D. D.↗

The use of hybrid integrated circuit techniques in biotelemetry applications

A review is presented of some features of hybrid integrated circuits that make their use advantageous in miniature biotelemetry applications. The various techniques for fabricating resistors, capacitors and interconnections by both thin film and thick film technology are discussed. The use of chip capacitors, resistors, and especially standard IC chips on substrates with fired-on interconnection patterns is emphasized. The review is designed primarily to acquaint biotelemetry users and designers with an overview of this fabrication technique so that they can better communicate their needs with an understanding of its limitations and advantages to facilities specializing in hybrid construction.

Fryer, T. B.↗

High temperature, low mass solar blanket development

This paper presents methods of incorporating ultrathin silicon solar cells into photovoltaic blankets for space applications. This type of cell has the highest power-to-mass ratio and best performance under space radiation of any silicon solar cell. Interconnect materials and designs, and the results of the investigation of the applicability of parallel-gap resistance welding for interconnecting ultrathin cells are discussed. Data relating contact pull strength and cell electrical degradation to welding parameters such as time, voltage, and pressure are presented. Methods for bonding ultrathin cells to flexible substrates and for bonding thin covers to these cells are described, and the results of vacuum thermal cycling and thermal soak tests on prototype ultrathin cell test coupons are included.

Mesch, H. G.↗

CADAT place-and-routine in two dimensions

CADAT place-and-route-in-two dimensions program (PR2D) is standard-cell automatic-layout program for generating large-scale-integrated/metal-oxidesemiconductor (LSI/MOS) arrays. PR2D translates logic designer's cell interconnection requirements into physically-defined MOS chip. PR2D reads input data, searches pin data file for data on each pattern type, generates placement of patterns, and interconnects patterns. As output, it generates artwork for layouts.

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Fiber-optic rotation sensor technology

A concept for an all-waveguide fiber-optic rotation sensor is discussed, and the results of preliminary tests of key elements are described. A single channel waveguide coupler design provides the functions of an optical switch, a 3-dB beam splitter, a phase retarder, and a signal modulator, all of which may be formed on the same chip and interconnected by channel single-mode waveguides. Preliminary test results for the waveguide coupler and for a rotation sensor without the coupler are presented. Signal processing, polarization control, and interconnection of the waveguide components are discussed.

Goss, W. C.↗

Automated Solar-Array Assembly

Large arrays are rapidly assembled from individual solar cells by automated production line developed for NASA's Jet Propulsion Laboratory. Apparatus positions cells within array, attaches interconnection tabs, applies solder flux, and solders interconnections. Cells are placed in either straight or staggered configurations and may be connected either in series or in parallel. Are attached at rate of one every 5 seconds.

Soffa, A.↗

Automated solar module assembly line

The solar module assembly machine which Kulicke and Soffa delivered under this contract is a cell tabbing and stringing machine, and capable of handling a variety of cells and assembling strings up to 4 feet long which then can be placed into a module array up to 2 feet by 4 feet in a series of parallel arrangement, and in a straight or interdigitated array format. The machine cycle is 5 seconds per solar cell. This machine is primarily adapted to 3 inch diameter round cells with two tabs between cells. Pulsed heat is used as the bond technique for solar cell interconnects. The solar module assembly machine unloads solar cells from a cassette, automatically orients them, applies flux and solders interconnect ribbons onto the cells. It then inverts the tabbed cells, connects them into cell strings, and delivers them into a module array format using a track mounted vacuum lance, from which they are taken to test and cleaning benches prior to final encapsulation into finished solar modules. Throughout the machine the solar cell is handled very carefully, and any contact with the collector side of the cell is avoided or minimized.

Bycer, M.↗

Evaluation of advanced microelectronic fluxless solder-bump contacts for hybrid microcircuits

Technology for interconnecting monolithic integrated circuit chips with other components is investigated. The advantages and disadvantages of the current flip-chip approach as compared to other interconnection methods are outlined. A fluxless solder-bump contact technology is evaluated. Multiple solder-bump contacts were formed on silicon integrated circuit chips. The solder-bumps, comprised of a rigid nickel under layer and a compliant solder overlayer, were electroformed onto gold device pads with the aid of thick dry film photomasks. Different solder alloys and the use of conductive epoxy for bonding were explored. Fluxless solder-bump bond quality and reliability were evaluated by measuring the effects of centrifuge, thermal cycling, and high temperature storage on bond visual characteristics, bond electrical continuity, and bond shear tests. The applicability and suitability of this technology for hybrid microelectronic packaging is discussed.

Mandal, R. P.↗

Spacecraft automatic umbilical system

An umbilical system design is described that incorporates all the features specified for a power system to payload interconnect capability. A proof-of-concept prototype of the umbilical system was built to determine experimentally the suitability of the threading characteristics of the ram mechanism and to verify freedom from cross threading. It is concluded that Berthing systems that utilize remote manipulator systems (RMS) can be simplified by using RMS targets, closed circuit TV cameras, tie into the RMS control system, and grapple-fixture and end-effector-like capture and secure mechanisms. To effect a remotely controlled umbilical interconnect in proximity with a manned spacecraft and to provide for extravehicular activity backup and maintenance capabilities, 18 different mechanisms are found to be necessary. The weight impact of proving for maintenance capability in a large multiple connector umbilical system was found to be in the order of +60 percent.

Goldin, R. W.↗

Low cost solar array project production process and equipment task: A Module Experimental Process System Development Unit (MEPSDU)

Several major modifications were made to the design presented at the PDR. The frame was deleted in favor of a "frameless" design which will provide a substantially improved cell packing factor. Potential shaded cell damage resulting from operation into a short circuit can be eliminated by a change in the cell series/parallel electrical interconnect configuration. The baseline process sequence defined for the MEPSON was refined and equipment design and specification work was completed. SAMICS cost analysis work accelerated, format A's were prepared and computer simulations completed. Design work on the automated cell interconnect station was focused on bond technique selection experiments.

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Distributed parameter system coupled ARMA expansion identification and adaptive parallel IIR filtering - A unified problem statement

A novel interconnection of distributed parameter system (DPS) identification and adaptive filtering is presented, which culminates in a common statement of coupled autoregressive, moving-average expansion or parallel infinite impulse response configuration adaptive parameterization. The common restricted complexity filter objectives are seen as similar to the reduced-order requirements of the DPS expansion description. The interconnection presents the possibility of an exchange of problem formulations and solution approaches not yet easily addressed in the common finite dimensional lumped-parameter system context. It is concluded that the shared problems raised are nevertheless many and difficult.

Johnson, C. R., Jr.↗

Architecture for VLSI design of Reed-Solomon encoders

The logic structure of a universal VLSI chip called the symbol-slice Reed-Solomon (RS) encoder chip is discussed. An RS encoder can be constructed by cascading and properly interconnecting a group of such VLSI chips. As a design example, it is shown that a (255,223) RD encoder requiring around 40 discrete CMOS ICs may be replaced by an RS encoder consisting of four identical interconnected VLSI RS encoder chips. Besides the size advantage, the VLSI RS encoder also has the potential advantages of requiring less power and having a higher reliability.

Liu, K. Y.↗

Silicon dendritic web material

The development of a low cost and reliable contact system for solar cells and the fabrication of several solar cell modules using ultrasonic bonding for the interconnection of cells and ethylene vinyl acetate as the potting material for module encapsulation are examined. The cells in the modules were made from dendritic web silicon. To reduce cost, the electroplated layer of silver was replaced with an electroplated layer of copper. The modules that were fabricated used the evaporated Ti, Pd, Ag and electroplated Cu (TiPdAg/Cu) system. Adherence of Ni to Si is improved if a nickel silicide can be formed by heat treatment. The effectiveness of Ni as a diffusion barrier to Cu and the ease with which nickel silicide is formed is discussed. The fabrication of three modules using dendritic web silicon and employing ultrasonic bonding for interconnecting calls and ethylene vinyl acetate as the potting material is examined.

Meier, D. L.↗