Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “image sensor”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 361 records · Page 20

Skipper-in-CMOS: Nondestructive Readout With Subelectron Noise Performance for Pixel Detectors

The Skipper-in-CMOS image sensor integrates the nondestructive readout capability of skipper charge coupled devices (Skipper-CCDs) with the high conversion gain of a pinned photodiode (PPD) in a CMOS imaging process while taking advantage of in-pixel signal processing. This allows both single photon counting as well as high frame rate readout through highly parallel processing. The first results obtained from a ${15} \times {15}~\mu $ m2 pixel cell of a Skipper-in-CMOS sensor fabricated in Tower Semiconductor’s commercial 180-nm CMOS image sensor process are presented. Measurements confirm the expected reduction of the readout noise with the number of samples down to deep subelectron noise of $0.15\text {e}^ - $ , demonstrating the charge transfer operation from the PPD and the single photon counting operation when the sensor is exposed to light. This article also discusses new testing strategies employed for its operation and characterization.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

The Next Generation of Lightning Mapping

With the removal of the Lightning Imaging Sensor from the International Space Station, a gap has opened in lightning observation from low-Earth orbit. The CubeSpark mission concept aims to fill this role using a constellation of satellites with radio frequency (RF) sensors and bi-spectral optical imagers to observe lightning flashes more completely and with better resolution than is currently possible from space. In this study, we assess the feasibility of multiple methods of not only mapping lightning locations, but also inferring 3D flash and charge structures. This is done primarily by simulating lightning emissions in the very high frequency (VHF) band, modeling their propagation to orbital sensors, and reconstructing their locations using time-of-arrival (TOA) minimization algorithms. Constellation shape, number, and atmospheric conditions are varied in order to quantify the three main sources of geolocation error: geometric, ionospheric, and instrumental effects. The promising results presented here demonstrate 3D resolution better than 1-2 km in many cases, enabling new applications in meteorology and climate sciences.

CubeSpark↗

A 24-Channel Digitizer With a JESD204B-Compliant Serial Interface for High-Speed Detectors

In this report a 24-channel application-specific integrated circuit (ASIC) for the readout of high-speed CMOS active pixel sensors for charged particle detection is presented. The chip comprises 24 preamplifiers, 24 distinct 12-bit, 25 MSPS Pipelined analog-to-digital converters (ADCs) with self-calibration, an internal phase-locked loop (PLL), and a 3 Gbps serial interface that conforms to the JESD204B standard. To simplify interfacing with a variety of sensors, the ASIC also includes an automatic offset calibration loop. The high level of integration of the ASIC reduces overall system cost and area, and exploiting the signal characteristics of the image sensor allows the ADC to be optimized for reduced power dissipation. The use of an integrated serializer and an industry standard protocol simplifies integration of the ASIC into a complete camera system. The ASIC, called the High-Speed Image Preprocessor Targeted for Electron Readout, or HIPSTER, with a die area of 64.26 mm 2 , is packaged in a 480-ball grid array (BGA) and is fabricated in 180-nm CMOS technology. HIPSTER achieves typical differential nonlinearity (DNL) < 0.55 LSB, input-referred thermal noise of $114.5 μV-rms, and a bit error rate (BER) of better than 10-14. The power dissipation is 98 mW/channel.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

High-throughput terahertz imaging: progress and challenges

Abstract Many exciting terahertz imaging applications, such as non-destructive evaluation, biomedical diagnosis, and security screening, have been historically limited in practical usage due to the raster-scanning requirement of imaging systems, which impose very low imaging speeds. However, recent advancements in terahertz imaging systems have greatly increased the imaging throughput and brought the promising potential of terahertz radiation from research laboratories closer to real-world applications. Here, we review the development of terahertz imaging technologies from both hardware and computational imaging perspectives. We introduce and compare different types of hardware enabling frequency-domain and time-domain imaging using various thermal, photon, and field image sensor arrays. We discuss how different imaging hardware and computational imaging algorithms provide opportunities for capturing time-of-flight, spectroscopic, phase, and intensity image data at high throughputs. Furthermore, the new prospects and challenges for the development of future high-throughput terahertz imaging systems are briefly introduced.

36 MATERIALS SCIENCE↗

Collation of earth resources data collected by ERIM airborne sensors

Earth resources imagery from nine years of data collection with developmental airborne sensors is cataloged for reference. The imaging sensors include single and multiband line scanners and side-looking radars. The operating wavelengths of the sensors include ultraviolet, visible and infrared band scanners, and X- and L-band radar. Imagery from all bands (radar and scanner) were collected at some sites and many sites had repeated coverage. The multiband scanner data was radiometrically calibrated. Illustrations show how the data can be used in earth resource investigations. References are made to published reports which have made use of the data in completed investigations. Data collection sponsors are identified and a procedure described for gaining access to the data.

Hasell, P. G., Jr.↗

Multidisciplinary study on Wyoming test sites

The author has identified the following significant results. Ten EREP data passes over the Wyoming test site provided excellent S190A and S190B coverage and some useful S192 imagery. These data were employed in an evaluation of the EREP imaging sensors in several earth resources applications. Boysen Reservoir and Hyattsville were test areas for band to band comparison of the S190 and S192 sensors and for evaluation of the image data for geologic mapping. Contrast measurements were made from the S192 image data for typical sequence of sedimentary rocks. Histograms compiled from these measurements show that near infrared S192 bands provide the greatest amount of contrast between geologic units. Comparison was also made between LANDSAT imagery and S190B and aerial photography for regional land use mapping. The S190B photography was found far superior to the color composite LANDSAT imagery and was almost as effective as the 1:120,000 scale aerial photography. A map of linear elements prepared from LANDSAT and EREP imagery of the southwestern Bighorn Mountains provided an important aid in defining the relationship between fracture and ground water movement through the Madison aquifer.

Houston, R. S.↗

High-density Schottky barrier IRCCD sensors for remote sensing applications

It is pointed out that the ambitious goals envisaged for the next generation of space-borne sensors challenge the state-of-the-art in solid-state imaging technology. Studies are being conducted with the aim to provide focal plane array technology suitable for use in future Multispectral Linear Array (MLA) earth resource instruments. An important new technology for IR-image sensors involves the use of monolithic Schottky barrier infrared charge-coupled device arrays. This technology is suitable for earth sensing applications in which moderate quantum efficiency and intermediate operating temperatures are required. This IR sensor can be fabricated by using standard integrated circuit (IC) processing techniques, and it is possible to employ commercial IC grade silicon. For this reason, it is feasible to construct Schottky barrier area and line arrays with large numbers of elements and high-density designs. A Pd2Si Schottky barrier sensor for multispectral imaging in the 1 to 3.5 micron band is under development.

Elabd, H.↗

Hierarchical classification in high dimensional numerous class cases

As progress in new sensor technology continues, increasingly high resolution imaging sensors are being developed. These sensors give more detailed and complex data for each picture element and greatly increase the dimensionality of data over past systems. Three methods for designing a decision tree classifier are discussed: a top down approach, a bottom up approach, and a hybrid approach. Three feature extraction techniques are implemented. Canonical and extended canonical techniques are mainly dependent upon the mean difference between two classes. An autocorrelation technique is dependent upon the correlation differences. The mathematical relationship between sample size, dimensionality, and risk value is derived.

Kim, Byungyong↗

Active weld control

Through the two phases of this contract, sensors for welding applications and parameter extraction algorithms have been developed. These sensors form the foundation of a weld control system which can provide action weld control through the monitoring of the weld pool and keyhole in a VPPA welding process. Systems of this type offer the potential of quality enhancement and cost reduction (minimization of rework on faulty welds) for high-integrity welding applications. Sensors for preweld and postweld inspection, weld pool monitoring, keyhole/weld wire entry monitoring, and seam tracking were developed. Algorithms for signal extraction were also developed and analyzed to determine their application to an adaptive weld control system. The following sections discuss findings for each of the three sensors developed under this contract: (1) weld profiling sensor; (2) weld pool sensor; and (3) stereo seam tracker/keyhole imaging sensor. Hardened versions of these sensors were designed and built under this contract. A control system, described later, was developed on a multiprocessing/multitasking operating system for maximum power and flexibility. Documentation for sensor mechanical and electrical design is also included as appendices in this report.

Powell, Bradley W.↗

Mechanisms test bed math model modification and simulation support

This report summarizes the work performed under contract NAS8-38771 in support of the Marshall Space Flight Center Six Degree of Freedom Motion Facility and Flight Robotics Laboratory. The contract activities included the development of the two flexible body and Remote Manipulator System simulations, Dynamic Overhead Target Simulator control system and operating software, Global Positioning System simulation, and Manipulator Coupled Spacecraft Controls Testbed. Technical support was also provided for the Lightning Imaging Sensor and Solar X-Ray Imaging programs. The cover sheets and introductory sections for the documentation written under this contract are provided as an appendix.

Gilchrist, Andrea C.↗

A Comparison between Lightning Activity and Passive Microwave Measurements

A recent examination of data from the Lightning Imaging Sensor (LIS) and the TRMM Microwave Imager (TMI) suggests that storm with the highest frequency of lightning also possess the most pronounced microwave scattering signatures at 37 and 85 GHz. This study demonstrates a clear dependence between lightning and the passive microwave measurements, and accentuates how direct the relationship really is between cloud ice and lightning activity. In addition, the relationship between the quantity of ice content and the frequency of lightning (not just the presence of lightning) , is consistent throughout the seasons in a variety of regimes. Scatter plots will be presented which show the storm-averaged brightness temperatures as a function of the lightning density of the storms (L/Area) . In the 85 GHz and 37 GHz scatter plots, the brightness temperature is presented in the form Tb = k1 x log10(L/Area) + k2, where the slope of the regression, k1, is 58 for the 85 GHz relationship and 30.7 for the 37 GHz relationship. The regression for both these fits showed a correlation of 0.76 (r2 = 0.58), which is quite promising considering the simple procedure used to make the comparisons, which have not yet even been corrected for the view angle differences between the instruments, or the polarization corrections in the microwave imager.

Kevin, Driscoll T.↗

Underestimation of Deep Convective Cloud Tops by Thermal Imagery

The most common method of ascertaining cloud heights from space is from thermal brightness temperatures. Deep cumulus clouds of high water content are expected to radiate as black bodies. Here, cloud tops are estimated from several sensors: GOES-8, the Moderate Resolution Imaging Spectroradiometer (MODIS), the Moderate resolution Imaging Sensor (MISR), and the Goddard Cloud Physics Lidar (CPL), all collected during the CRYSTAL Florida Area Cirrus Experiment (CRYSTAL-FACE). Thermally derived cloud tops are consistently approx. 1km too low compared with independent measurements, no matter how thick the clouds are, even when the finite optical extinctions near cloud top and in thin overlying cirrus are taken into account. The bias appears to get worse for the tallest clouds. Cloud material is often present 2 km or more above the apparent cloud top. This mysterious discrepancy appears to be satellite-independent.

Sherwood, Steven C.↗

Towards Qualification and Certification of Laser Powder Bed Fusion Ti-6Al-4V with In-Situ Process Monitoring and Automated Defect Detection

Qualification and certification of laser powder bed fusion (LPBF) parts are two challenges that must be answered to ensure suitability for critical applications. In-situ monitoring using high frame rate thermal and conventional optical imaging sensors is applied to the LPBF build process. Currently, the large volume of data from such sensors becomes untenable for manual inspection in production environments. This presentation serves to address this in-situ monitoring deficiency in two ways. First, a framework for managing data streams from LPBF process monitoring sensors is described. Second, two candidate image analysis techniques are presented: one is a set of heuristics that are easily interpretable, and the other is an uninterpretable convolutional neural network. These strategies are compared in terms of performance, computational expense, and speed. These methodologies represent platforms for connecting processing conditions to process modeling efforts aligned with the qualification and certification mission for LPBF Ti-6Al-4V components.

Qualification↗

Monte Carlo Modeling and Design of Photon Energy Attenuation Layers for >10× Quantum Yield Enhancement in Si-Based Hard X-ray Detectors

High-energy (>20 keV) X-ray photon detection at high quantum yield, high spatial resolution, and short response time has long been an important area of study in physics. Scintillation is a prevalent method but limited in various ways. Directly detecting high-energy X-ray photons has been a challenge to this day, mainly due to low photon-to-photoelectron conversion efficiencies. Commercially available state-of-the-art Si direct detection products such as the Si charge-coupled device (CCD) are inefficient for >10 keV photons. Here, we present Monte Carlo simulation results and analyses to introduce a highly effective yet simple high-energy X-ray detection concept with significantly enhanced photon-to-electron conversion efficiencies composed of two layers: a top high-Z photon energy attenuation layer (PAL) and a bottom Si detector. We use the principle of photon energy down conversion, where high-energy X-ray photon energies are attenuated down to ≤10 keV via inelastic scattering suitable for efficient photoelectric absorption by Si. Our Monte Carlo simulation results demonstrate that a 10–30× increase in quantum yield can be achieved using PbTe PAL on Si, potentially advancing high-resolution, high-efficiency X-ray detection using PAL-enhanced Si CMOS image sensors.

47 OTHER INSTRUMENTATION↗

Wavefront Compensation Segmented Mirror Sensing and Control

The primary mirror of very large submillimeter-wave telescopes will necessarily be segmented into many separate mirror panels. These panels must be continuously co-phased to keep the telescope wavefront error less than a small fraction of a wavelength, to ten microns RMS (root mean square) or less. This performance must be maintained continuously across the full aperture of the telescope, in all pointing conditions, and in a variable thermal environment. A wavefront compensation segmented mirror sensing and control system, consisting of optical edge sensors, Wavefront Compensation Estimator/Controller Soft ware, and segment position actuators is proposed. Optical edge sensors are placed two per each segment-to-segment edge to continuously measure changes in segment state. Segment position actuators (three per segment) are used to move the panels. A computer control system uses the edge sensor measurements to estimate the state of all of the segments and to predict the wavefront error; segment actuator commands are computed that minimize the wavefront error. Translational or rotational motions of one segment relative to the other cause lateral displacement of the light beam, which is measured by the imaging sensor. For high accuracy, the collimator uses a shaped mask, such as one or more slits, so that the light beam forms a pattern on the sensor that permits sensing accuracy of better than 0.1 micron in two axes: in the z or local surface normal direction, and in the y direction parallel to the mirror surface and perpendicular to the beam direction. Using a co-aligned pair of sensors, with the location of the detector and collimated light source interchanged, four degrees of freedom can be sensed: transverse x and y displacements, as well as two bending angles (pitch and yaw). In this approach, each optical edge sensor head has a collimator and an imager, placing one sensor head on each side of a segment gap, with two parallel light beams crossing the gap. Two sets of optical edge sensors are used per segment-to-segment edge, separated by a finite distance along the segment edge, for four optical heads, each with an imager and a collimator. By orienting the beam direction of one edge sensor pair to be +45 away from the segment edge direction, and the other sensor pair to be oriented -45 away from the segment edge direction, all six degrees of freedom of relative motion between the segments can be measured with some redundancy. The software resides in a computer that receives each of the optical edge sensor signals, as well as telescope pointing commands. It feeds back the edge sensor signals to keep the primary mirror figure within specification. It uses a feed-forward control to compensate for global effects such as decollimation of the primary and secondary mirrors due to gravity sag as the telescope pointing changes to track science objects. Three segment position actuators will be provided per segment to enable controlled motions in the piston, tip, and tilt degrees of freedom. These actuators are driven by the software, providing the optical changes needed to keep the telescope phased.

Redding, David C.↗

Radar E-O image fusion

The fusion of radar and electro-optic (E-O) sensor images presents unique challenges. The two sensors measure different properties of the real three-dimensional (3-D) world. Forming the sensor outputs into a common format does not mask these differences. In this paper, the conditions under which fusion of the two sensor signals is possible are explored. The program currently planned to investigate this problem is briefly discussed.

Oneil, William F.↗

Anti-distortion bioinspired camera with an inhomogeneous photo-pixel array

The bioinspired camera, comprising a single lens and a curved image sensor—a photodiode array on a curved surface—, was born of flexible electronics. Its economical build lends itself well to space-constrained machine vision applications. The curved sensor, much akin to the retina, helps image focusing, but the curvature also creates a problem of image distortion, which can undermine machine vision tasks such as object recognition. Here we report an anti-distortion single-lens camera, where 4096 silicon photodiodes arrayed on a curved surface in a nonuniform pattern assimilated to the distorting optics are the key to anti-distortion engineering. That is, the photo-pixel distribution pattern itself is warped in the same manner as images are warped, which correctively reverses distortion. Acquired images feature no appreciable distortion across a 120° horizontal view, as confirmed by their neural-network recognition accuracies. This distortion correction via photo-pixel array reconfiguration is a form of in-sensor computing.

77 NANOSCIENCE AND NANOTECHNOLOGY↗