Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “copper”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 361 records · Page 20
All sourcesNASA NTRSDOE OSTI
DOE OSTI2019

Characteristics and Processing of Hydrogen-Treated Copper Powders for EB-PBF Additive Manufacturing

The fabrication of high purity copper using additive manufacturing has proven difficult because of oxidation of the powder feedstock. Here, we present work on the hydrogen heat treatment of copper powders for electron beam powder bed fusion (EB-PBF), in order to enable the fabrication of high purity copper components for applications such as accelerator components and vacuum electronic devices. Copper powder with varying initial oxygen contents were hydrogen heat-treated and characterized for their chemistry, morphology, and microstructure. Higher initial oxygen content powders were found to not only reduce surface oxides, but also reduce oxides along the grain boundaries and form trapped H 2 O vapor inside the particles. The trapped H 2 O vapor was verified by thermogravimetric analysis (TGA) and residual gas analysis (RGA) while melting. The mechanism of the H 2 O vapor escaping the particles was determined by in-situ SEM heated stage experiments, where the particles were observed to crack along the grain boundaries. To determine the effect of the EB-PBF processing on the H 2 O vapor, the thermal simulation and the validation of single melt track width wafers were conducted along with melting single layer discs for chemistry analysis. A high speed video of the EB-PBF melting was performed in order to determine the effect of the trapped H 2 O vapor on the melt pool. Finally, solid samples were fabricated from hydrogen-treated copper powder, where the final oxygen content measured ~50 wt. ppm, with a minimal residue hydrogen content, indicating the complete removal of trapped H 2 O vapor from the solid parts.

36 MATERIALS SCIENCE↗
DOE OSTI2022

Crystalline phase transitions and water-soluble complexes of copper(Ⅰ) 2-hydroxyethanethiolate

We report the coordination polymer copper(I) 2-hydroxyethanethiolate, (CuSCH 2 CH 2 OH) n , though insoluble in all common solvents, dissolved readily in basic aqueous solutions of the thiolate anion (HOCH 2 CH 2 S – ) of 2-mercaptoethanol to form a single species: the tetranuclear cluster [Cu 4 (μ-SCH 2 CH 2 OH) 6 ] 2– . From this solution were grown X-ray quality single crystals of copper(I) 2-hydroxyethanethiolate. This compound underwent a hitherto unknown crystal phase transition at ca. 6 °C, from point group P2 1 2 1 2 1 to Pna2 1 , with noticeable changes in the geometry of the Cu-S layer and in the orientation of the alkylthiolate side chains. When the bulky base tetrabutylammonium hydroxide was employed in the aqueous thiolate solution used to dissolve (CuSCH 2 CH 2 OH) n , the water-soluble polynuclear copper(I) complex bis(tetrabutylammonium) hexakis(μ-2-hydroxyethanethiolato) tetracuprate(I), [(C 4 H 9 ) 4 N] 2 [Cu 4 (μ-SCH 2 CH 2 OH) 6 ], could be isolated as X-ray quality crystals. Structural characterization of this complex revealed a tetrahedral arrangement of copper(I) centers with thiolates bridging the edges of the tetrahedra. On standing, this complex degraded to a larger polynuclear Cu(I) sulfide cluster.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2024

Significantly Promoting the Thermal Conductivity and Machinability of Negative Thermal Expansion Alloy via In Situ Precipitation of Copper Networks

Rapid advancements in electronic devices yield an urgent demand for high-performance electronic packaging materials with high thermal conductivity, low thermal expansion, and great mechanical properties. However, it is a great challenge for current design philosophies to fulfill all the requirements simultaneously. Here, an effective strategy is proposed for significantly promoting the thermal conductivity and machinability of negative thermal expansion alloy (Zr,Nb)Fe 2 through eutectic precipitation of copper networks. The eutectic dual-phase alloy exhibits an isotropic chips-matched thermal expansion coefficient and a thermal conductivity enhancement exceeding 200% compared with (Zr,Nb)Fe 2 , along with an ultimate compressive strength of 550 MPa. The addition of copper reorganizes the composition of (Zr,Nb)Fe 2 , which smooths the magnetic transition and shifts it toward higher temperature, resulting in linear low thermal expansion in a wide temperature range. The highly fine eutectic copper lamellae construct high thermal conductivity networks within (Zr,Nb)Fe 2 , serving as highways for heat transfer electrons and phonons. The in situ forming of eutectic copper lamellae also facilitates the mechanical properties by enhancing interfacial bonding and bearing additional stress after yielding of (Zr,Nb)Fe 2 . This work provides a novel strategy for promoting thermal conductivity and mechanical properties of negative thermal expansion alloys via eutectic precipitation of copper networks.

36 MATERIALS SCIENCE↗
DOE OSTI2018

Early Stage Detection of Stress Due to Copper on Maize (Zea mays L.) by Laser-Induced Fluorescence and Infrared Spectroscopy

Laser-induced fluorescence (LIF) and attenuated total reflectance Fourier transform infrared (ATR-FTIR) spectroscopy has been applied for the nondestructive, label free, and rapid analyses of the impact of copper (25, 50, and 75 μM) on maize seedlings at an early stage before the changes appear visually on the plant. The LIF measurement has been used to detect the signs of stress in the photosynthetic pigment. The integrated areal intensity and increasing fluorescence intensity ratios indicate decrease in the photosynthetic pigments in the leaves of maize plants stressed with copper. The ATR-FTIR technique has been utilized to estimate the changes arising in the cell wall polysaccharides, amino acid, secondary structure of protein and lipid content of the leaves of control and copper-treated maize seedlings. The second derivative and curve fitting analyses have been applied for the enhancement of the spectral variations and quantitative estimation of the changes arising in the biochemical profile. The result shows an increase in the pectin, lignin, amino acid, and protein content and reduction in the amount of cellulose and lipid in the leaves of maize seedlings due to the treatment of copper. This study indicates the toxic response of copper by hampering the growth and reduction in the photosynthetic pigments and biochemical content of the maize seedlings. This study also demonstrates the feasibility of the spectroscopic techniques (LIF and ATRFTIR) as a rapid, label free, and nondestructive probe for the assessment of stress and monitoring of crops.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2017

Anti-Prostate Cancer Activity of 8-Hydroxyquinoline-2-Carboxaldehyde–Thiosemicarbazide Copper Complexes by Fluorescent Microscopic Imaging

Copper 8-hydroxyquinoline-2-carboxaldehyde–thiosemicarbazide (CuHQTS) and copper 8-hydroxyquinoline-2-carboxaldehyde–4,4-dimethyl-3-thiosemicarbazide (CuHQDMTS) are two copper thiosemicarbazone complexes with potent anticancer activity on cisplatin-resistant neuroblastoma cells. This study aimed to evaluate anti-prostate cancer activity of these two copper complexes in vitro. Both CuHQTS and CuHQDMTS inhibited proliferation of prostate cancer cells and showed cytotoxicity on prostate cancer cells carrying green fluorescent protein (GFP) by fluorescent microscopic imaging. The findings of this study demonstrated anti-prostate cancer activity of CuHQTS and CuHQDMTS and suggested that GFP-carrying prostate cancer cells might be used for testing anticancer activity of copper complexes by fluorescent microscopic imaging.

60 APPLIED LIFE SCIENCES↗
DOE OSTI2019

Surface Self-nanocrystallization in Copper Electroforming

The coarse columnar grain layer generated on top of electroforming deposits leads to low surface strength and poor global performance of deposits. Here, we introduce a particle abrasive-induced surface self-nanocrystallization process, which is a part of the electroforming process rather than involving complex poststeps using special equipment. It can generate a thickness-controllable surface nanocrystalline layer on top of copper deposits for performance enhancement. In this study, surface nanocrystalline layers of 10, 20, 50 and 120 μm were fabricated on top of 500-μm-thick copper deposits. The tensile strength of copper deposits increases from 234 to 246, 330, 383 and 421 MPa, with a corresponding decrease in elongation from 26 to 25, 24, 15 and 6%, respectively. The moderately thick surface nanocrystalline layer makes the copper deposits exhibit good comprehensive mechanical properties. In addition, the surface self-nanocrystallization also makes the copper deposits show a better corrosion resistance in a neutral aqueous 0.1 M NaCl solution. This study aims to promote a convenient, controllable and reliable surface self-nanocrystallization process in electroforming for improving the global performance of deposits.

36 MATERIALS SCIENCE↗
DOE OSTI2019

Effect of MgCl{sub 2} on the Corrosion Behavior of Copper Under Periodic Wet/Dry Cycle Condition

The corrosion behaviors of copper under periodic wet/dry cycle conditions were investigated. The characteristics of the corrosion product formed on copper were analyzed by x-ray diffraction, scanning electron microscopy, energy-dispersive spectroscopy, and in situ electrochemical impedance spectroscopy. Weight loss results showed that the corrosion of copper under an MgCl{sub 2} deposition condition was more severe than that under NaCl. The main corrosion products formed on the tested sample under NaCl deposition condition consisted of Cu{sub 2}Cl(OH){sub 3} and Cu{sub 2}O, while those under the MgCl{sub 2} deposition condition consisted of Cu{sub 2}Cl(OH){sub 3} and Mg{sub 2}(OH){sub 3}Cl·4H{sub 2}O. In the case of the NaCl deposition condition, a two-layered structure formed during the corrosion process. However, the corrosion product layer formed on copper under the MgCl{sub 2} deposition condition had an extremely loose structure. The effect of MgCl{sub 2} on the corrosion mechanism of copper is discussed.

36 MATERIALS SCIENCE↗
DOE OSTI2017

Laser-Assisted Reduction of Highly Conductive Circuits Based on Copper Nitrate for Flexible Printed Sensors

Stretchable electronic sensing devices are defining the path toward wearable electronics. High-performance flexible strain sensors attached on clothing or human skin are required for potential applications in the entertainment, health monitoring, and medical care sectors. In this work, conducting copper electrodes were fabricated on polydimethylsiloxane as sensitive stretchable microsensors by integrating laser direct writing and transfer printing approaches. The copper electrode was reduced from copper salt using laser writing rather than the general approach of printing with pre-synthesized copper or copper oxide nanoparticles. An electrical resistivity of 96 μΩ cm was achieved on 40-μm-thick Cu electrodes on flexible substrates. The motion sensing functionality successfully demonstrated a high sensitivity and mechanical robustness. Furthermore, this in situ fabrication method leads to a path toward electronic devices on flexible substrates.

42 ENGINEERING↗
DOE OSTI2021

Dynamic Strength of Copper at High Pressures Using Pressure Shear Plate Experiments

Measurement of strength at high pressures is critical to understanding the behavior of materials subjected to extreme loading conditions. Recent developments have extended the pressure shear plate impact (PSPI) technique to the high-pressure regime. Such experiments provide a unique opportunity to extract the complete stress-strain behavior of materials at relatively high pressures. The modified technique includes a new fiber-optic heterodyne transverse velocity interferometer system and new analysis methods to account for the inelastic response of the anvil plates. In this study, PSPI experiments are conducted on oxygen-free high conductivity (OFHC) copper at pressures ranging from 10 to 43 GPa and at strain rates of ~10 5 s -1 . Complete stress-strain curves of copper are obtained using a hybrid methodology that relies on numerical simulations and particle velocity records gathered in these experiments. Experiments are conducted at similar pressures and strain rates using two types of anvils that undergo different levels of plastic strains: tool steel and tungsten carbide, to check the robustness of the hybrid method. The behavior of copper at these high pressures and strain rates is compared with previous literature data, and the effect of pressure and strain rate on the strength behavior of copper are discussed. Here, it was observed that the rate of change in yield strength change in pressure was 2.5 times the rate of change of shear modulus with pressure. The strength models that predict the response of copper at these extreme conditions are also examined and validated.

36 MATERIALS SCIENCE↗
DOE OSTI2023

Physical structure of constitutional isomers influences antiproliferation activity of thiosemicarbazone-alkylthiocarbamate copper complexes

A series of hybrid thiosemicarbazone-alkylthiocarbamate copper complexes with similar electronic environments but distinct physical structures have been prepared, characterized, and evaluated for antiproliferation activity. The complexes include the constitutional isomers (1-phenylpropane-1-imine-(O-ethylthiocarbamato)-2-one-(N-methylthiosemicarbazonato))copper(II) (CuL 1 ) and (1-phenylpropane-1-one-(N-methylthiosemicarbazonato)-2-imine-(O-ethylthiocarbamato))copper(II) (CuL 2 ) along with (1-propane-1-imine-(O-ethylthiocarbamato)-2-one-(N-methylthiosemicarbazonato))copper(II) (CuL 3 ). Complexes CuL 1 and CuL 2 differ in the positions of the pendent thiosemicarbazone (TSC) and alkylthiocarbamate (ATC) moieties on the 1-phenylpropane backbone. Complex CuL 3 employs a propane backbone with the TSC in the 2-position as in CuL 1 . The isomer pair CuL 1 and CuL 2 have equivalent electronic environments with indistinguishable Cu II/I potentials (E 1/2 = -0.86 V vs. ferrocenium/ferrocene) and electron paramagnetic resonance (EPR) spectra (g ∥ = 2.26, g ⊥ = 2.08). The electronic structure of CuL 3 has a similar E 1/2 of -0.84 V and identical EPR parameters to CuL 1, 2 . Single crystal X-ray diffraction studies confirm a consistent donor environment with no substantial variation in the Cusingle bondN or Cusingle bondS bond distances and angles between the complexes. The antiproliferation activities of the CuL 1–3 were evaluated against the lung adenocarcinoma cell line (A549) and nonmalignant lung fibroblast cell line (IMR-90) using the MTT assay. CuL 1 had the highest A549 activity ( A549 EC 50 = 0.065 μM) and selectivity ( IMR-90 EC 50 / A549 EC 50 = 20). The constitutional isomer CuL 2 displayed decreased A549 activity (0.18 μM) and selectivity (10.6). The complex CuL 3 displayed activity (0.009 μM) similar to CuL 1 but with a lack of selectivity (1.0). Cellular copper loading determined by ICP-MS was consistent with the activity and selectivity trends. The complexes CuL 1–3 did not induce reactive oxygen species (ROS) generation.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2021

A preliminary investigation into the electrodeposition and synthesis of radiopure Copper–Chromium alloys for rare-event physics detector systems

Current investigations into neutrinoless double beta decay and the direct detection of dark matter require increasingly sensitive detector systems that demand ultra-low background materials. These requirements have previously been attained using ultra-radiopure electroformed (EF) copper. However, pure copper possesses high ductility and relatively low strength, which necessitates the need for large amounts of material and extra care during fabrication to help minimize galling and mechanical failure. Furthermore, we investigate an alloying alternative to pure EF copper by examining low wt% copper chrome (Cu–Cr) solid solution alloys, with inquiries into alloy hardness, strength, and radiopurity. Alloyed Cu–Cr layered samples are shown to exhibit significantly increased hardness compared to EF copper, for example showing a 50% increase in exhibited hardness using less than 1% Cr by weight, with limited negative impact to the material’s radiopurity.

Background↗
DOE OSTI2014

Leaching behavior of copper from waste printed circuit boards with Brønsted acidic ionic liquid

Highlights: • A Brønsted acidic ILs was used to leach Cu from WPCBs for the first time. • The particle size of WPCBs has significant influence on Cu leaching rate. • Cu leaching rate was higher than 99% under the optimum leaching conditions. • The leaching process can be modeled with shrinking core model, and the E{sub a} was 25.36 kJ/mol. - Abstract: In this work, a Brønsted acidic ionic liquid, 1-butyl-3-methyl-imidazolium hydrogen sulfate ([bmim]HSO{sub 4}), was used to leach copper from waste printed circuit boards (WPCBs, mounted with electronic components) for the first time, and the leaching behavior of copper was discussed in detail. The results showed that after the pre-treatment, the metal distributions were different with the particle size: Cu, Zn and Al increased with the increasing particle size; while Ni, Sn and Pb were in the contrary. And the particle size has significant influence on copper leaching rate. Copper leaching rate was higher than 99%, almost 100%, when 1 g WPCBs powder was leached under the optimum conditions: particle size of 0.1–0.25 mm, 25 mL 80% (v/v) ionic liquid, 10 mL 30% hydrogen peroxide, solid/liquid ratio of 1/25, 70 °C and 2 h. Copper leaching by [bmim]HSO{sub 4} can be modeled with the shrinking core model, controlled by diffusion through a solid product layer, and the kinetic apparent activation energy has been calculated to be 25.36 kJ/mol.

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗
DOE OSTI2017

Cytochrome b561, copper, β-cleaved amyloid precursor protein and niemann-pick C1 protein are involved in ascorbate-induced release and membrane penetration of heparan sulfate from endosomal S-nitrosylated glypican-1

Ascorbate-induced release of heparan sulfate from S-nitrosylated heparan sulfate proteoglycan glypican-1 takes place in endosomes. Heparan sulfate penetrates the membrane and is transported to the nucleus. This process is dependent on copper and on expression and processing of the amyloid precursor protein. It remains unclear how exogenously supplied ascorbate can generate HS-anMan in endosomes and how passage through the membrane is facilitated. Here we have examined wild-type, Alzheimer Tg2576 and amyloid precursor protein (-/-) mouse fibroblasts and human fetal and Niemann-Pick C1 fibroblasts by using deconvolution immunofluorescence microscopy, siRNA technology and [S{sup 35}]sulfate-labeling, vesicle isolation and gel chromatography. We found that ascorbate-induced release of heparan sulfate was dependent on expression of endosomal cytochrome b561. Formation and nuclear transport of heparan sulfate was suppressed by inhibition of β-processing of the amyloid precursor protein and formation was restored by copper (I) ions. Membrane penetration was not dependent on amyloid beta channel formation. Inhibition of endosomal exit resulted in accumulation of heparan sulfate in vesicles that exposed the C-terminal of the amyloid precursor protein externally. Endosome-to-nucleus transport was also dependent on expression of the Niemann-Pick C1 protein. We propose that ascorbate is taken up from the medium and is oxidized by cytochrome b561 which, in turn, reduces copper (II) to copper (I) present in the N-terminal, β-cleaved domain of the amyloid precursor protein. Re-oxidation of copper (I) is coupled to reductive, deaminative release of heparan sulfate from glypican-1. Passage through the membrane may be facilitated by the C-terminal, β-cleaved fragment of the amyloid precursor protein and the Niemann-Pick C1 protein. - Highlights: • Cytochrome b561 is a mediator of ascorbate-induced release of heparan sulfate from glypican-1 in endosomes. • Beta-cleavage of the amyloid precursor protein is required for release and membrane penetration of heparan sulfate. • The Niemann-Pick C1 protein is involved in membrane penetration.

60 APPLIED LIFE SCIENCES↗
DOE OSTI2016

The CopC Family: Structural and Bioinformatic Insights into a Diverse Group of Periplasmic Copper Binding Proteins

The CopC proteins are periplasmic copper binding proteins believed to play a role in bacterial copper homeostasis. Previous studies have focused on CopCs that are part of seven-protein Cop or Pco systems involved in copper resistance. These canonical CopCs contain distinct Cu(I) and Cu(II) binding sites. Mounting evidence suggests that CopCs are more widely distributed, often present only with the CopD inner membrane protein, frequently as a fusion protein, and that the CopC and CopD proteins together function in the uptake of copper to the cytoplasm. In the methanotroph Methylosinus trichosporium OB3b, genes encoding a CopCD pair are located adjacent to the particulate methane monooxygenase (pMMO) operon. The CopC from this organism (Mst-CopC) was expressed, purified, and structurally characterized. The 1.46 Å resolution crystal structure of Mst-CopC reveals a single Cu(II) binding site with coordination somewhat different from that in canonical CopCs, and the absence of a Cu(I) binding site. Furthermore, extensive bioinformatic analyses indicate that the majority of CopCs in fact contain only a Cu(II) site, with just 10% of sequences corresponding to the canonical two-site CopC. Accordingly, a new classification scheme for CopCs was developed, and detailed analyses of the sequences and their genomic neighborhoods reveal new proteins potentially involved in copper homeostasis, providing a framework for expanded models of CopCD function.

59 BASIC BIOLOGICAL SCIENCES↗
DOE OSTI2023

ATCUN-like Copper Site in βB2-Crystallin Plays a Protective Role in Cataract-Associated Aggregation

Cataract is the leading cause of blindness worldwide, and it is caused by crystallin damage and aggregation. Senile cataractous lenses have relatively high levels of metals, while some metal ions can directly induce the aggregation of human γ-crystallins. Here, for this work, we evaluated the impact of divalent metal ions in the aggregation of human βB2-crystallin, one of the most abundant crystallins in the lens. Turbidity assays showed that Pb 2+ , Hg 2+ , Cu 2+ , and Zn 2+ ions induce the aggregation of βB2-crystallin. Metal-induced aggregation is partially reverted by a chelating agent, indicating the formation of metal-bridged species. Our study focused on the mechanism of copper-induced aggregation of βB2-crystallin, finding that it involves metal-bridging, disulfide-bridging, and loss of protein stability. Circular dichroism and electron paramagnetic resonance (EPR) revealed the presence of at least three Cu 2+ binding sites in βB2-crystallin, one of them with spectroscopic features typical for Cu 2+ bound to an amino-terminal copper and nickel (ATCUN) binding motif, which is found in Cu transport proteins. The ATCUN-like Cu binding site is located at the unstructured N-terminus of βB2-crystallin, and it could be modeled by a peptide with the first six residues in the protein sequence (NH 2 -ASDHQF-). Isothermal titration calorimetry indicates a nanomolar Cu 2+ binding affinity for the ATCUN-like site. An N-truncated form of βB2-crystallin is more susceptible to Cu-induced aggregation and is less thermally stable, indicating a protective role for the ATCUN-like site. EPR and X-ray absorption spectroscopy studies reveal the presence of a copper redox active site in βB2-crystallin that is associated with metal-induced aggregation and formation of disulfide-bridged oligomers. Our study demonstrates metal-induced aggregation of βB2-crystallin and the presence of putative copper binding sites in the protein. Whether the copper-transport ATCUN-like site in βB2-crystallin plays a functional/protective role or constitutes a vestige from its evolution as a lens structural protein remains to be elucidated.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2014

Transport properties of zigzag graphene nanoribbon decorated with copper clusters

Using non-equilibrium green function with density functional theory, the present study investigates the transport properties of decorated zigzag graphene nanoribbon with a copper cluster. We have represented the decoration of zigzag graphene nanoribbon with single copper atom and cluster containing two and three copper atoms. In all the cases, copper atoms tend to occupy the edge state. In addition, we have shown that copper can alter the current-voltage characteristic of zigzag graphene nanoribbon and create new fluctuations and negative differential resistance. These alternations are made due to discontinuity in the combination of orbitals along the graphene nanoribbon. Decoration alters these discontinuities and creates more visible fluctuations. However, in low bias voltages, the changes are similar in all the cases. The study demonstrates that in the decorated zigzag graphene nanoribbon, the edge states are the main states for transporting electron from one electrode to another.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
DOE OSTI2015

Nanocarbon-copper thin film as transparent electrode

Researchers seeking to enhance the properties of metals have long pursued incorporating carbon in the metallic host lattice in order to combine the strongly bonded electrons in the metal lattice that yield high ampacity and the free electrons available in carbon nanostructures that give rise to high conductivity. The incorporation of carbon nanostructures into the copper lattice has the potential to improve the current density of copper to meet the ever-increasing demands of nanoelectronic devices. We report on the structure and properties of carbon incorporated in concentrations up to 5 wt. % (∼22 at. %) into the crystal structure of copper. Carbon nanoparticles of 5 nm–200 nm in diameter in an interconnecting carbon matrix are formed within the bulk Cu samples. The carbon does not phase separate after subsequent melting and re-solidification despite the absence of a predicted solid solution at such concentrations in the C-Cu binary phase diagram. This material, so-called, Cu covetic, makes deposition of Cu films containing carbon with similar microstructure to the metal possible. Copper covetic films exhibit greater transparency, higher conductivity, and resistance to oxidation than pure copper films of the same thickness, making them a suitable choice for transparent conductors.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
DOE OSTI2016

Gold-Copper alloy “nano-dumplings” with tunable compositions and plasmonic properties

The unique yet tunable optical properties of plasmonic metal nanoparticles have made them attractive targets for a wide range of applications including nanophotonics, molecular sensing, catalysis etc. Such diverse applications that require precisely stable / reproducible plasmonic properties depend sensitively on the particle morphology ie. the shape, size and constituents. Herein, we systematically study the size / shape controlled synthesis of gold-copper “dumpling” shaped alloy nanoparticles by simultaneous reduction of gold and copper salts in the PVP-methanol solute-solvent system, by effectively utilizing the efficient but mild reduction as well as capping abilities of Poly (N-vinylpyrrolidone). Introduction of copper salts not only yielded the alloy nanoparticles, but also slowed down the growth process to maintain high mono-dispersity of the new shapes evolved. Copper and gold has different lattice constants (0.361 and 0.408 nm respectively) and hence doping/addition/replacement of copper atoms to gold FCC unit cell introduces strain into the lattice which is key parameter to the shape evolution in anisotropic nanoparticles. Synthesized alloy nanoparticles were characterized by UV-visible absorption spectroscopy, XRD and TEM imaging.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗