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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRS2010

Comparison of Analysis, Simulation, and Measurement of Wire-to-Wire Crosstalk

In this investigation, we compare crosstalk analysis, simulation, and measurement results for electrically short configurations. Methods include hand calculations, PSPICE simulations, Microstripes transient field solver, and empirical measurement. In total, four representative physical configurations are examined, including a single wire over a ground plane, a twisted pair over a ground plane, generator plus receptor wires inside a cylindrical conduit, and a single receptor wire inside a cylindrical conduit. Part 1 addresses the first two cases, and Part 2 addresses the final two. Agreement between the analysis, simulation, and test data is shown to be very good.

Bradley, Arthur T.↗
NASA NTRS2010

Comparison of Analysis, Simulation, and Measurement of Wire-to-Wire Crosstalk

In this investigation, we compare crosstalk analysis, simulation, and measurement results for electrically short configurations. Methods include hand calculations, PSPICE simulations, Microstripes transient field solver, and empirical measurement. In total, four representative physical configurations are examined, including a single wire over a ground plane, a twisted pair over a ground plane, generator plus receptor wires inside a cylindrical conduit, and a single receptor wire inside a cylindrical conduit. Part 1 addresses the first two cases, and Part 2 addresses the final two. Agreement between the analysis methods and test data is shown to be very good.

Bradley, Arthur T.↗
DOE OSTI2022

Resistance of The Flex-Wire Windings

In this paper, an analysis of the flexible printed circuit board (FPCB) windings is performed. A one-dimensional model of the flex-wire winding is introduced and an equation for the FPCB ac winding resistance is derived. Experimental verification of derived equations is performed, i.e., impedance and power loss measurements.

Wojda, Rafal↗
NASA NTRS1983

Two-Wire to Four-Wire Audio Converter

Simple circuit provides interface between normally incompatible voicecommunication lines. Circuit maintains 40 dB of isolation between input and output halves of four-wire line permitting two-wire line to be connected. Balancing potentiometer, Rg, adjusts gain of IC2 to null feed through from input to output. Adjustment is done on workbench just after assembly.

Talley, G. L., Jr↗
NASA NTRS1994

NASA wiring program: Survey of NASA experiences in wiring system safety

The objective of this program is to address safety and reliability issues of complete wiring systems. The plans for carrying out the objective include the following: determine the wiring system design factors; investigate circuit protection technologies; and address manufacturing and maintenance procedures.

Stavnes, Mark W.↗
DOE OSTI2024

Residual stress accumulation in large-scale Ti-6Al-4V wire-arc additive manufacturing

Large-scale additive manufacturing (AM) is of interest in the manufacturing industry to produce components of dimensions on the order of hundreds of millimeters to meters in scale. Wire-arc AM (WAAM) of Ti-6Al-4V (Ti64) is an attractive technique for large-scale AM in the aerospace industry, give the high strength-to-weight ratio of the material and high deposition rate of the process. However, due to the large scale, significant distortion and residual stresses are developed in the material during deposition and cooling, potentially leading to part failure. WAAM of a prototypical large-scale Ti64 machine tool component is studied in this work via finite element analysis (FEA). Element activation/deactivation technique is employed to simulate deposition and the resulting distortion and residual stress (RS) predictions are analyzed to evaluate the possibility of crack formation. Significant distortion (∼10 mm) and RS (>1300 MPa) is predicted, suggesting the formation of cracks and possible crack propagation into the build region. Incorporation of fillets significantly reduces RS concentration regions, thus reducing the possibility of part failure. Material deposition sequence also affects the RS pattern in the build.

Mathews, Ritin↗
NASA NTRS1983

Constant-temperature hot-wire anemometer practice in supersonic flows. I - The normal wire

The performance of a constant-temperature normal hot-wire in a supersonic flow is critically examined. It is shown that this instrument is inherently unsuitable for measuring turbulent temperature correlations because of the highly nonlinear response to temperature fluctuations, particularly at low overheat ratios. The instrument is therefore limited to measurements of mean and fluctuating mass-flow rates. Suitable calibration procedures, as well as the limits on spatial and temporal resolution are discussed, and corrections for mean stagnation temperature changes are suggested.

Smits, A. J.↗
NASA NTRS1992

Frequency response in short thermocouple wires

Theoretical expressions are derived for the steady state frequency response of a thermocouple wire. In particular, the effects of axial heat conduction are demonstrated for a nonuniform wire with unequal material properties and wire diameters across the junction. The amplitude ratio at low frequency omega approaches 0 agrees with the results of Scadron and Warshawsky (1952) for a steady state temperature distribution. Moreover, the frequency response for a nonuniform wire in the limit of infinite length l approaches infinity is shown to reduce to a simple expression that is analogous to the classic first order solution for a thermocouple wire with uniform properties. Theoretical expressions are also derived for the steady state frequency response of a supported thermocouple wire. In particular, the effects of axial heat conduction are demonstrated for both a supported one material wire and a two material wire with unequal material properties across the junction. For the case of a one material supported wire, an exact solution is derived which compares favorably with an approximate expression that only matches temperatures at the support junction. Moreover, for the case of a two material supported wire, an analytical expression is derived that closely correlates numerical results. Experimental measurements are made for the steady state frequency response of a supported thermocouple wire. In particular, the effects of axial heat conduction are demonstrated for both a supported one material wire (type K) and a two material wire (type T) with unequal material properties across the junction. The data for the amplitude ratio and phase angle are correlated to within 10 pct. with the theoretical predictions of Forney and Fralick (1991). This is accomplished by choosing a natural frequency omega sub n for the wire data to correlate the first order response at large gas temperature frequencies. It is found that a large bead size, however, will increase the amplitude ratio at low frequencies but decrease the natural frequency of the wire. The phase angle data are also distorted for imperfect junctions.

Forney, L. J.↗
DOE OSTI2021

A simple numerical method for evaluating heat dissipation from curved wires with periodic applied heating

In many situations, the dual-purpose heater/thermometer wires used in the three-omega method – one of the most precise and sensitive techniques for measuring the thermal conductivity of thin films and interfaces – must include bends and curves to avoid obstructions on the surface of a sample. Although the three-omega analysis assumes that the heating wire is infinitely long and straight, recent experimental work has demonstrated that in some cases curved-wire geometries can be used without introducing detectable systematic error. We describe a general numerical method that can be used to calculate the temperature of three-omega heating wires with arbitrary wire geometries. Furthermore, this method provides experimentalists with a simple quantitative procedure for calculating how large the systematic error caused by a particular wire asymmetry will be. We show calculations of two useful cases: a straight wire with a single bend of arbitrary angle and a wire that forms a circle. We find that the amplitude of the in-phase temperature oscillations near a wire that forms a circle differs from the prediction using the analytic straight-line source solution by <12%, provided that the thermal penetration depth is less than ten times the radius of curvature of the wire path. The in-phase temperature amplitude 1.5 wire widths away from a 90° bend in a wire is within 11% of the straight-line source prediction for all penetration depths greater than the wire width. Our calculations indicate that the straight-line source solution breaks down significantly when the wire bend angle is less than 45°.

77 NANOSCIENCE AND NANOTECHNOLOGY↗
DOE OSTI2023

Plasma flows during the ablation stage of an over-massed pulsed-power-driven exploding planar wire array

We characterize the plasma flows generated during the ablation stage of an over-massed exploding planar wire array, fielded on the COBRA pulsed-power facility (1 MA peak current, 250 ns rise time). The planar wire array is designed to provide a driving magnetic field (80–100 T) and current per wire distribution (about 60 kA), similar to that in a 10 MA cylindrical exploding wire array fielded on the Z machine. Over-massing the arrays enables continuous plasma ablation over the duration of the experiment without implosion. The requirement to over-mass on the Z machine necessitates wires with diameters of 75–100μm, which are thicker than wires usually fielded on wire array experiments. To test ablation with thicker wires, we perform a parametric study by varying the initial wire diameter between 33 and 100 μm. The largest wire diameter (100 μm) array exhibits early closure of the cathode-wire gap, while the gap remains open over the duration of the experiment for wire diameters between 33 and 75 μm. Laser plasma interferometry and time-gated extreme-ultraviolet (XUV) imaging are used to probe the plasma flows ablating from the wires. The plasma flows from the wires converge to generate a pinch, which appears as a fast-moving (V≈100kms−1) column of increased plasma density (n¯e≈2×1018cm−3) and strong XUV emission. Finally, we compare the results with three-dimensional resistive-magnetohydrodynamic (MHD) simulations performed using the code GORGON, the results of which reproduce the dynamics of the experiment reasonably well.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗
NASA NTRSDate not supplied

Heat Transfer Analysis in Wire Bundles for Aerospace Vehicles

Design of wiring for aerospace vehicles relies on an understanding of "ampacity" which refers to the current carrying capacity of wires, either, individually or in wire bundles. Designers rely on standards to derate allowable current flow to prevent exceedance of wire temperature limits due to resistive heat dissipation within the wires or wire bundles. These standards often add considerable margin and are based on empirical data. Commercial providers are taking an aggressive approach to wire sizing which challenges the conventional wisdom of the established standards. Thermal modelling of wire bundles may offer significant mass reduction in a system if the technique can be generalized to produce reliable temperature predictions for arbitrary bundle configurations. Thermal analysis has been applied to the problem of wire bundles wherein any or all of the wires within the bundle may carry current. Wire bundles present analytical challenges because the heat transfer path from conductors internal to the bundle is tortuous, relying on internal radiation and thermal interface conductance to move the heat from within the bundle to the external jacket where it can be carried away by convective and radiative heat transfer. The problem is further complicated by the dependence of wire electrical resistivity on temperature. Reduced heat transfer out of the bundle leads to higher conductor temperatures and, hence, increased resistive heat dissipation. Development of a generalized wire bundle thermal model is presented and compared with test data. The steady state heat balance for a single wire is derived and extended to the bundle configuration. The generalized model includes the effects of temperature varying resistance, internal radiation and thermal interface conductance, external radiation and temperature varying convective relief from the free surface. The sensitivity of the response to uncertainties in key model parameters is explored using Monte Carlo analysis.

S L Rickman↗
NASA NTRS2015

Body of Knowledge (BOK) for Copper Wire Bonds

Copper wire bonds have replaced gold wire bonds in the majority of commercial semiconductor devices for the latest technology nodes. Although economics has been the driving mechanism to lower semiconductor packaging costs for a savings of about 20% by replacing gold wire bonds with copper, copper also has materials property advantages over gold. When compared to gold, copper has approximately: 25% lower electrical resistivity, 30% higher thermal conductivity, 75% higher tensile strength and 45% higher modulus of elasticity. Copper wire bonds on aluminum bond pads are also more mechanically robust over time and elevated temperature due to the slower intermetallic formation rate - approximately 1/100th that of the gold to aluminum intermetallic formation rate. However, there are significant tradeoffs with copper wire bonding - copper has twice the hardness of gold which results in a narrower bonding manufacturing process window and requires that the semiconductor companies design more mechanically rigid bonding pads to prevent cratering to both the bond pad and underlying chip structure. Furthermore, copper is significantly more prone to corrosion issues. The semiconductor packaging industry has responded to this corrosion concern by creating a palladium coated copper bonding wire, which is more corrosion resistant than pure copper bonding wire. Also, the selection of the device molding compound is critical because use of environmentally friendly green compounds can result in internal CTE (Coefficient of Thermal Expansion) mismatches with the copper wire bonds that can eventually lead to device failures during thermal cycling. Despite the difficult problems associated with the changeover to copper bonding wire, there are billions of copper wire bonded devices delivered annually to customers. It is noteworthy that Texas Instruments announced in October of 2014 that they are shipping microcircuits containing copper wire bonds for safety critical automotive applications. An evaluation of copper wire bond technology for applicability to spaceflight hardware may be warranted along with concurrently compiling a comprehensive understanding of the failure mechanisms involved with copper wire bonded semiconductor devices.

Body of Knowledge (BOK)↗
NASA NTRS2004

Calibration, Data Acquisition, and Post Analysis of Turbulent Fluid Flow in a Calibration Jet Using Hot-wire Anemometry

The Turbine Branch concentrates on the following areas: Computational Fluid Dynamics (CFD), and implementing experimental procedures to obtain physical modeling data. Hot-wire Anemometry is a valuable tool for obtaining physical modeling data. Hot-wire Anemometry is likely to remain the principal research tool for most turbulent air/gas flow studies. The Hot-wire anemometer consists of a fine wire heated by electric current. When placed in a fluid stream, the hot-wire loses heat to the fluid by forced convection. In forced convection, energy transfer is due to molecular motion imposed by an extraneous force moving fluid parcels. When the hot-wire is in "equilibrium", the rate of heat input to the wire is equal to the rate of heat loss at the wire ends. The equality between heat input and heat loss is the basis for King s equation, which relates the electrical parameters of the hot-wire to the flow parameters of the fluid. Hot-wire anemometry is based on convective heat transfer from a heated wire element placed in a fluid flow. Any change in the fluid flow condition that affects the heat transfer from the heated element will be detected virtually instantaneously by a constant-temperature Hot-wire anemometry system. The system implemented for this research is the IFA 300. The system is a fully-integrated, thermal anemometer-based system that measures mean and fluctuating velocity components in air, water, and other fluids. It also measures turbulence and makes localized temperature measurements. A constant-temperature anemometer is a bridge and amplifier circuit that controls a tiny wire at constant temperature. As a fluid flow passes over the heated sensor, the amplifier senses the bridge off-balance and adjusts the voltage to the top of the bridge, keeping the bridge in balance. The voltage on top of the bridge can then be related to the velocity of the flow. The bridge voltage is sensitive to temperature as well as velocity and so the built-in thermocouple circuit can be attached to a thermocouple that can measure the fluid temperature. Additional information is included in the original extended abstract.

Moreno, Michelle↗
NASA NTRS2005

In Situ Electrochemical Deposition of Microscopic Wires

A method of fabrication of wires having micron and submicron dimensions is built around electrochemical deposition of the wires in their final positions between electrodes in integrated circuits or other devices in which the wires are to be used. Heretofore, nanowires have been fabricated by a variety of techniques characterized by low degrees of controllability and low throughput rates, and it has been necessary to align and electrically connect the wires in their final positions by use of sophisticated equipment in expensive and tedious post-growth assembly processes. The present method is more economical, offers higher yields, enables control of wire widths, and eliminates the need for post-growth assembly. The wires fabricated by this method could be used as simple electrical conductors or as transducers in sensors. Depending upon electrodeposition conditions and the compositions of the electroplating solutions in specific applications, the wires could be made of metals, alloys, metal oxides, semiconductors, or electrically conductive polymers. In this method, one uses fabrication processes that are standard in the semiconductor industry. These include cleaning, dry etching, low-pressure chemical vapor deposition, lithography, dielectric deposition, electron-beam lithography, and metallization processes as well as the electrochemical deposition process used to form the wires. In a typical case of fabrication of a circuit that includes electrodes between which microscopic wires are to be formed on a silicon substrate, the fabrication processes follow a standard sequence until just before the fabrication of the microscopic wires. Then, by use of a thermal SiO-deposition technique, the electrodes and the substrate surface areas in the gaps between them are covered with SiO. Next, the SiO is electron-beam patterned, then reactive-ion etched to form channels having specified widths (typically about 1 m or less) that define the widths of the wires to be formed. Drops of an electroplating solution are placed on the substrate in the regions containing the channels thus formed, then the wires are electrodeposited from the solution onto the exposed portions of the electrodes and into the channels. The electrodeposition is a room-temperature, atmospheric-pressure process. The figure shows an example of palladium wires that were electrodeposited into 1-mm-wide channels between gold electrodes.

Yun, Minhee↗
NASA NTRS1995

Evaluation of Pd-Cr Wires for Strain Gage Application

A newly developed alloy, palladium-13 weight percent chromium (Pd13Cr), was identified by United Technologies Research Center under a NASA contract to be the best material for high temperature strain gage applications. An electrical resistance strain gage that can provide accurate static strain measurement to a temperature higher than that of a commercially available gage is urgently needed in aerospace and aeronautics research. A strain gage made of a 25.4 micron (1 mil) diameter Pd13Cr wire has been recently demonstrated to be usable for static strain measurements to 800 C. This compares to the 400 C temperature limit of the commercially available strain gages. The performance of the Pd-Cr gage, however, strongly depends on the quality of the Pd13Cr wire. Four batches of Pd-Cr wires purchased from three different manufacturers were therefore evaluated to determine the best source of the wire for strain gage applications. The three suppliers were Precious Metal Institute in China, Sigmund Cohn Co., and G & S Titanium, Inc. in the United States. Two batches of wires obtained from Previous Metal Institute in 1987 and 1992, respectively are referred to herein as China87 and China92 wires. The mechanical, chemical and electrical properties of these wires, both as-received and after high temperature exposures at 800 C for 50 hours were analyzed. The elastic modulus and the failure strength of the wires were evaluated using a tensile test machine equipped with a laser speckle strain measurement system. The chemical and microstructural properties of the wires were inspected using a plasma atomic emission spectrometer and a scanning electron microscope (SEM) equipped with an energy dispersive X-ray spectroscope (EDS). The electrical stability and repeatability of the wires were determined by measuring the electrical resistance of the wires during three thermal cycles to 1000 C and a ten-hour soak at 1000 C. As a result of this study, the wire which has the highest strength, the least impurities content, the best oxidation resistance and the best electrical stability will be selected for upcoming strain gage applications.

Lei, Jih-Fen↗
NASA NTRS2002

Investigating the Use of Ultrasonic Guided Waves for Aging Wire Insulation Assessment

Aging wiring has become a critical issue to DoD, NASA, FAA, and Industry. The problem is that insulation on environmentally aged wire becomes brittle and cracks. This exposes the underlying conductive wire to the potential for short circuits and fire. The difficulty is that techniques to monitor aging wire problems focus on applying electrical sensing techniques that are not very sensitive to the wire insulation. Thus, the development of methods to quantify and monitor aging wire insulation is highly warranted. Measurement of wire insulation stiffness by ultrasonic guided waves is being examined. Initial laboratory tests were performed on a simple model consisting of a solid cylinder and then a solid cylinder with a polymer coating. Experimental measurements showed that the lowest order axisymmetric mode may be sensitive to stiffness changes in the wire insulation. To test this theory, mil-spec wire samples MIL-W-81381, MIL-W-22759/34, and MIL-W-22759/87 (typically found in aircraft) were heat-damaged in an oven, in a range of heating conditions. The samples were 12, 16, and 20 gauge and the heat-damage introduced material changes in the wire-insulation that made the originally flexible insulation brittle and darker in color. Axisymmetric mode phase velocity increased for the samples that were exposed to heat for longer duration. For example, the phase velocity in the 20-gauge MIL-W-22759/34 wire changed from a baseline value of 2790m/s to 3280m/s and 3530m/s for one-hour exposures to 3490C and 3990C, respectively. Although the heat-damage conditions are not the same as environmental aging, we believe that with further development and refinements, the ultrasonic guided waves can be used to inspect wire-insulation for detrimental environmental aging conditions.

Anastasi, Robert F.↗