Feasibility Demonstration of a Thermal Switch for Dual Temperature IR Focal Plane Cooling
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focal plane cryogenic radiator cryocooler thermal ↗
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Control of internal and external short circuits in lithium batteries using a composite thermal switch
A composite material has been developed, consisting of a blend of metal and fluorocarbon particles, which behaves as an electronic conductor at room temperature and which abruptly becomes an insulator at a predetermined temperature. This switching behavior results from the difference in thermal expansion coefficients between the conductive and non-conductive portions of the composite. This material was applied as a thin film between the carbon cathode in Li/SOCl2 cells, and the metallic cathode current collector. Using test articles incorporating this feature it was shown that lithium cells externally heated or internally heated during a short circuit lost rate capability and the ability to overheat well below the melting point of lithium (180 C). Thus, during an internal or external cell short circuit, the potential for thermal runaway involving reactions of molten lithium is avoided.
Mcdonald, Robert C.↗
Thermal Switch for Satellite Temperature Control
An active radiator tile (ART) thermal valve has been fabricated using silicon micromachining. Intended for orbital satellite heat control applications, the operational principal of the ART is to control heat flow between two thermally isolated surfaces by bring the surfaces into intimate mechanical contact using electrostatic actuation. Prototype devices have been tested in a vacuum and demonstrate thermal actuation voltages as low as 40 volts, very good thermal insulation in the OFF state, and a large increase in radiative heat flow in the ON state. Thin, anodized aluminum was developed as a coating for high infrared emissivity and high solar reflectance.
Ziad, H.↗
High Temperature Gas-Gap Thermal Switch
Device set to allow heat to flow across gap (switch "on") or decrease rate of transfer of heat to relatively low value (switch "off"). Operates at temperatures in approximate range of 100 to 1,500 degree C. Central cylindrical object thermally connected to (or disconnected from) environment by filling gap between inner and outer sleeves of switch (or evacuating gap) to increase (or decrease) thermal conduction across gap.
Bard, Steven↗
Automatic thermal switch accelerates cooling-down of cryogenic system
Automatic switch uses short stainless steel tube with copper heat sinks to accelerate helium gas cooling and provides good thermal conductivity and good thermal insulation.
Wiebe, E. R.↗
Parameter extraction for a SPICE model of an hTron superconducting thermal switch
Efficiently simulating large circuits is crucial to the development of superconducting nanowire-based electronics. However, current simulation tools for this technology are not adapted to the scaling of circuit size and complexity. We focus on the multilayered heater-nanocryotron (hTron), a promising superconducting nanowire-based switch used in applications such as superconducting nanowire single-photon detector readout. Previously, the hTron was modeled using traditional finite-element methods, which fall short in simulating systems at a larger scale. An empirical-based method would be better adapted to this task, enhancing both simulation speed and agreement with experimental data. In this work, we perform switching current and activation delay measurements on 17 hTron devices. We then develop a method for extracting physical fitting parameters used to characterize the devices. We build a SPICE behavioral model that reproduces the static and transient device behavior using these parameters, and validate it by comparing its performance to a model developed in prior work, showing an improvement in simulation time by several orders of magnitude. Furthermore, our model provides circuit designers with a tool to help understand the hTron’s behavior during all design stages, thus enabling broader use of the hTron across various new areas of application.
Caloritronics↗
Oscillating Thermal Switch
Proposed heat switch transfers heat from source to sink in regular cycles. Self-sustaining; actuated by transferred heat, contains no moving parts, and needs no external heaters or electronic circuitry to synchronize heat-transfer periods or control heat-transfer rates. Intended for use in gas-sorption refrigerator.
Petrick, S. Walter↗
Automatic thermal control switches
Two automatic, flexible connection thermal control switches have been designed and tested in a thermal vacuum facility and in the Get Away Special (GAS) container flown on the third Shuttle flight. The switches are complementary in that one switch passes heat when the plate on which it is mounted exceeds some selected temperature and the other switch will pass heat only when the mounting plate temperature is below the selected value. Both switches are driven and controlled by phase-change capsule motors and require no other power source or thermal sensors.
Wing, L. D.↗
Non-volatile, solid state bistable electrical switch
A bistable switching element is made of a material whose electrical resistance reversibly decreases in response to intercalation by positive ions. Flow of positive ions between the bistable switching element and a positive ion source is controlled by means of an electrical potential applied across a thermal switching element. The material of the thermal switching element generates heat in response to electrical current flow therethrough, which in turn causes the material to undergo a thermal phase transition from a high electrical resistance state to a low electrical resistance state as the temperature increases above a predetermined value. Application of the electrical potential in one direction renders the thermal switching element conductive to pass electron current out of the ion source. This causes positive ions to flow from the source into the bistable switching element and intercalate the same to produce a non-volatile, low resistance logic state. Application of the electrical potential in the opposite direction causes reverse current flow which de-intercalates the bistable logic switching element and produces a high resistance logic state.
Williams, Roger M.↗
Design and analysis of a cryogenic variable conductance axial grooved heat pipe
An investigation to adapt axial grooved designs to the gammit of heat pipe thermal control techniques, with particular emphasis on those suited for cryogenic applications was conducted. In addition to considering both active and passive gas control, diode designs utilizing liquid or gas blockage, or a liquid trap, are evaluated. The use of the liquid trap as a secondary heat pipe for forward mode operation during diode shutdown is also studied. This latter function is basically that of a thermal switch. Finally, a system capable of hybrid functions consisting of gas-controlled variable conductance and liquid trap diode shutdown or thermal switching is defined.
Source record↗
Automatic thermal control switches
Previously cited in issue 24, p. 3750, Accession no. A82-48067
Wing, L. D.↗
Pushing the Envelope-Moving Dynamic Building Envelope Thermal Energy Storage Systems Mainstream: Preprint
Buildings contribute to nearly 40% of the U.S. national energy consumption and a significant portion of CO2 emissions. More importantly, disadvantaged communities are disproportionately affected by energy burden and thermal discomfort in their homes. This paper will discuss two novel DOE's BTO supported thermal energy storage (TES) integrated dynamic building envelope technologies, their ability to harvest ambient energy, and improve energy efficiency by reducing HVAC loads and peak electricity demand while enhancing energy and thermal resilience in buildings. The paper will also discuss the recent advancements that have made these systems more affordable and easier to integrate into new and existing buildings. The first solution is a thermally anisotropic building envelope (TABE) system that can redirect ambient thermal energy (heat or coolness) from diurnal outdoor conditions, solar irradiance, and night sky radiation from the envelope to a hydronic loop. The redirected thermal energy can be stored in a TABE-integrated thermal energy storage system and use the stored energy to offset HVAC energy use and peak demand. The second solution is an innovative plug-and-play thermal switch in the form of insertable plugs integrated with a phase change material (PCM). The plug can vary its thermal resistance based on the indoor and outdoor conditions, thus allowing preferential directional heat flow, and enhancing utilization of free ambient cooling and heating to charge/discharge the PCM, much like a solid-state economizer. While the fist solution can be actively controlled, the second solution is passive, requiring no external power, and work solely based on the ambient temperature.
anisotropic envelope↗
Development and Testing of the CRYOTSU Flight Experiment
This paper describes the development and ground testing of the CRYOTSU thermal management flight experiment. CRYOTSU incorporates three cryogenic temperature experiments and one ambient temperature experiment into a Hitchhiker (HH) Get Away Special (GAS) Canister that is currently scheduled to fly on STS-95 in October 1998. The cryogenic experiments consist of a nitrogen triple-point cryogenic thermal storage unit (CTSU), a nitrogen cryogenic capillary pumped loop (CCPL), and a hydrogen gas-gap cryogenic thermal switch (CTSW). The ambient experiment is a carbon-fiber core, paraffin-filled thermal storage unit. Test results of integrated flight canister testing are provided herein for the CTSU and CCPL experiments. Pre-integration laboratory test results are provided for the CTSW. Design information and test results for the ambient experiment are not included.
Bugby, David C.↗
Development and Testing of the CRYOTSU Flight Experiment
This paper describes the development and ground testing of the CRYOTSU thermal management flight experiment. CRYOTSU incorporates three cryogenic temperature experiments and one ambient temperature experiment into a Hitchhiker (HH) Get Away Special (GAS) Canister that is currently scheduled to fly on STS-95 in October 1998. The cryogenic experiments consist of a nitrogen triple-point cryogenic thermal storage unit (CTSU), a nitrogen cryogenic capillary pumped loop (CCPL) and a hydrogen gas-gap cryogenic thermal switch (CTSW). The ambient experiment is a carbon-fiber core, paraffin-filled thermal storage unit. Test results of integrated flight canister testing are provided herein for the CTSU and CCPL experiments. Pre-integration laboratory test results are provided for the CTSW. Design information and test results for the ambient experiment are not included.
Bugby, David C.↗
Soft, thermally conductive material
Silicon rubber filled with high percentage of silver-plated copper microspheres provides soft, thermally conductive seat for thermal switch. Material also could be used in thin sheet form to prevent corrosion between dissimilar metals while maintaining good thermal communication. It could be used as thermal gasketing.
Anderson, A. J.↗
Development of cryogenic thermal control heat pipes
The development of thermal control heat pipes that are applicable to the low temperature to cryogenic range was investigated. A previous effort demonstrated that stainless steel axially grooved tubing which met performance requirements could be fabricated. Three heat pipe designs utilizing stainless steel axially grooved tubing were fabricated and tested. One is a liquid trap diode heat pipe which conforms to the configuration and performance requirements of the Heat Pipe Experiment Package (HEPP). The HEPP is scheduled for flight aboard the Long Duration Flight Exposure Facility (LDEF). Another is a thermal switch heat pipe which is designed to permit energy transfer at the cooler of the two identical legs. The third thermal component is a hybrid variable conductance heat pipe (VCHP). The design incorporates both a conventional VCHP system and a liquid trap diode. The design, fabrication and thermal testing of these heat pipes is described. The demonstrated heat pipe behavior including start-up, forward mode transport, recovery after evaporator dry-out, diode performance and variable conductance control are discussed.
Source record↗
Thermal and Mechanical Microspacecraft Technologies for X-2000 Future Deliveries
Thermal and mechanical technologies are an important part of the X-2000 Future Delivery (X-2000 FD) microspacecraft. A wide range of future space missions are expected to utilize the technologies and the architecture developed by the X-2000 FD. These technologies, besides being small in physical size, make the tiny spacecraft robust and flexible. The X2000 FD architecture is designed to be highly reliable and suitable for a wide range of missions such as planetary landers/orbiters/flybys, earth orbiters, cometary flybys/landers/sample returns, etc. One of the key ideas used in the development of these technologies and architecture is that several functions be in included in each of the thermal and mechanical elements. One of the thermal architecture being explored for the X-2000 FD microspacecraft is integrated thermal energy management of the complete spacecraft using a fluid loop. The robustness and the simplicity of the loop and the flexibility with which it can be integrated in the spacecraft have made it attractive for applications to X-2000 FD. Some of the thermal technologies to be developed as a part of this architecture are passive and active cooling loops, electrically variable emittance surfaces, miniature thermal switches, and specific high density electronic cooling technologies. In the mechanical area, multifunction architecture for the structural elements will be developed. The multifunction aspect is expected to substantially reduce the mass and volume of the spacecraft. Some of the technologies that will be developed are composite material panels incorporating electronics, cabling, and thermal elements in them. The paper to be presented at the 1999 conference, will describe the progress made so far in the microspacecraft thermal and mechanical technologies and approaches for the X2000 Future Deliveries microspacecraft.
Birur, Gaj↗
Thermal and Mechanical Microspacecraft Technologies for Deep Space Systems Program X2000 Future Deliveries
Thermal and mechanical technologies are an important part of the Deep Space Systems Technology (DSST) Program X2000 Future Deliveries (FD) microspacecraft. A wide range of future space missions are expected to utilize the technologies and the architecture developed by DSST FD. These technologies, besides being small in physical size, make the tiny spacecraft robust and flexible. The DSST FD architecture is designed to be highly reliable and suitable for a wide range of missions such as planetary landers/orbiters/flybys, earth orbiters, cometary flybys/landers/sample returns, etc. Two of the key ideas used in the development of thermal and mechanical technologies and architectures are: 1) to include several of the thermal and mechanical functions in any given single spacecraft element and 2) the architecture be modular so that it can easily be adapted to any of the future missions. One of the thermal architectures being explored for the DSST FD microspacecraft is the integrated thermal energy management of the complete spacecraft using a fluid loop. The robustness and the simplicity of the loop and the flexibility with which it can be integrated in the spacecraft have made it attractive for applications to DSST FD. Some of the thermal technologies to be developed as a part of this architecture are passive and active cooling loops, electrically variable emittance surfaces, miniature thermal switches, and specific high density electronic cooling technologies. In the mechanical area, multifunction architecture for the structural elements will be developed. The multifunction aspect is expected to substantially reduce the mass and volume of the spacecraft. Some of the technologies that will be developed are composite material panels incorporating electronics, cabling, and thermal elements in them. The paper describes the current state of the technologies and progress to be made in the thermal and mechanical technologies and approaches for the DSST Future Deliveries microspacecraft.
Birur, Gajanana C.↗