Results for “submodule” — Page 2

DOE OSTI2017

Imbalance Mechanism and Balanced Control of Capacitor Voltage for a Hybrid Modular Multilevel Converter

Due to different charging and discharging characteristics of full-bridge submodules and half-bridge submodules in hybrid modular multilevel converters (MMC), capacitor voltage imbalance will occur under boosted ac voltage or reduced dc voltage conditions. To address this issue, the mechanism of capacitor voltage imbalance is carefully studied, with three main factors-modulation index, power angle, and hybridization ratio-summarized and their effect on capacitor voltage imbalance analyzed. Further, a control strategy based on fundamental frequency reactive circulating current injection is proposed to keep the capacitor voltage balanced in the hybrid MMC. The amplitude and phase angle of the injected circulating current are calculated and their influence on the energy fluctuation in the submodules' capacitors and the semiconductors' current stress is explored. Lastly, experimental results under boosted ac voltage and reduced dc voltage conditions demonstrate the feasibility and validity of the proposed scheme.

42 ENGINEERING↗

DOE OSTI2021

Hardware Design of Medium Voltage SiC-Based Modular Multilevel Converters for Grid-Tied Applications

This paper presents a design of a 10 kV silicon carbide (SiC) MOSFET based modular multilevel converter (MMC). The MMC functions as the interconnection between a 24 kV dc bus and a 13. SkV distribution grid. This paper focuses on the hardware design of the MMC and its submodules. The gate driver, auxiliary power supply and bus bur in submodules are major components that need to meet high dv/dt immunity and high insulation voltage requirements. The gate driver achieves over 200 kV/us common mode transient immunity (CMTI). Its associated auxiliary power supply is based on an on-board transformer with over 30 kV insulation capability and 1.4 pF barrier capacitance. The busbar achieves less than 11 kV/cm electric field in the air to avoid partial discharges. Validation tests of the MMC submodule were performed by double pulse tests at 5 kV and buck converter tests at3 kV, 52A (peak). Reliable operations were achieved in validation tests.

auxiliary power supply↗

DOE OSTI2021

Quantum Computer-Aided Design: Digital Quantum Simulation of Quantum Processors

With the increasing size of quantum processors, submodules that constitute the processor hardware will become too large to accurately simulate on a classical computer. Therefore, one would soon have to fabricate and test each new design primitive and parameter choice in time-consuming coordination between design, fabrication, and experimental validation. Here we show how one can design and test the performance of next-generation quantum hardware—by using existing quantum computers. Focusing on superconducting transmon processors as a prominent hardware platform, we compute the static and dynamic properties of individual and coupled transmons. We show how the energy spectra of transmons can be obtained by variational hybrid quantum-classical algorithms that are well suited for near-term noisy quantum computers. In addition, single- and two-qubit gate simulations are demonstrated via Suzuki-Trotter decomposition. Our methods pave a promising way towards designing candidate quantum processors when the demands of calculating submodule properties exceed the capabilities of classical computing resources.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

DOE OSTI2023

Active Fault Current Limiting Control for Half-Bridge MMC in HVDC Systems

DC faults of MMC can result in a significantly large fault current due to the discharge of submodule capacitors. The fault current not only risks damaging the MMC but also demands a considerable breaking capacity from the dc circuit breaker (DCCBs). This paper introduces two novel active fault current limiting methods (AFCLs), namely virtual impedance-based and energy control-based AFCL. The first method utilizes circulating current feedforward, which introduces a virtual arm impedance to suppress the rate of rise of the fault current. Meanwhile, the second method relies on the control of the internally stored energy of the MMC to automatically minimize the number of submodules that discharge during a dc-side fault. Therefore, both the dc-side current and the MMC arm current can be effectively suppressed after the occurrence of the fault. The proposed methods do not require fault detection and their response is proportional to the rate of rise in the fault current. Simulation case studies are presented to demonstrate the proposed methods.

active current limiting control↗

DOE OSTI2019

DC Impedance Model of MMC Considering Capacitor Voltage and Circulating Current Dynamics

The modular multilevel converter (MMC) is regarded as a competitive choice for future dc grids at high and medium voltage levels. To study the dc grid stability, a few MMC dc impedance models have been proposed, but their accuracy is limited by the assumption of ideal submodule voltage or neglecting the circulating current control. In this paper, a more accurate MMC dc impedance model is developed considering both the submodule capacitor voltage and circulating current dynamics. Simulation and experiment results indicate that the developed model matches with the actual MMC better than state-of-art models and can predict the dc system stability correctly.

Kong, Le↗

DOE OSTI2017

Fundamental-Frequency Reactive Circulating Current Injection for Capacitor Voltage Balancing in Hybrid-MMC HVDC Systems During Riding Through PTG Faults

Here, this article presents a comprehensive analysis and a novel solution for the discharge problem on the half-bridge submodules' (HBSMs') capacitors in the hybrid modular multilevel converter (MMC)-based high-voltage direct current transmission systems under a long-term (e.g., several minutes or longer) pole-to-ground fault condition. The mechanism of this issue is analyzed, and then a solution based on fundamental-frequency reactive circulating current (FFRCC) injection is proposed. The influence of FFRCC injection is analyzed in terms of the fluctuated arm capacitor energy and the current stress of semiconductors. Moreover, an enhanced arm voltage modulation method based on HBSMs and full-bridge submodules coordinate control is proposed to accelerate the capacitor voltage balance of HBSMs. Finally, the performance of the proposed control strategy is verified by the simulation results.

24 POWER TRANSMISSION AND DISTRIBUTION↗

DOE OSTI2020

Multi-Scale Thermal Analysis for Design of SiC-Based Medium Voltage Motor Drive: Preprint

This paper describes a multi-scale thermal analysis approach for the design of an air-cooled 1.7-kV SiC MOSFET-based medium-voltage variable-speed motor drive. The National Renewable Energy Laboratory supported the project objectives by providing thermal management design support to the project partner The Ohio State University (OSU). The scope of the models and limited resources required efficient and flexible thermal models to be developed. Two modeling techniques are described that significantly reduced model run time and enabled more complex models to be run faster while retaining needed accuracy. The first technique uses the effectiveness-NTU method to extract convection boundary conditions from a computational fluid dynamics (CFD) model that can be applied to a fast-running finite element analysis model. The second is a porous media technique that enables system-level CFD simulations that incorporate effects from heat exchangers (e.g., pin fin heat sinks) that run in a fraction of the time required for fully resolved CFD simulations. The multi-scale approach to the thermal analysis enabled fast and accurate simulation for the converter design ranging from the die level up to the full system with 36 submodules. The modeling results were validated against experimental data from system tests performed by OSU.

DIRECT ENERGY CONVERSION↗

DOE OSTI2019

Integrated Electric Drive with HV 2 Modular Electric Machine and SiC Based Power Converters (Final Report)

An innovative high performance, high speed electric drive is designed, fabricated and tested. The drive is based on the modular multilevel converter (MMC) topology and is synthesized using power electronic building blocks (submodules) that utilize the newest generation of silicon-carbide (SiC) semiconductors. Power modules from two suppliers are investigated, characterized and the one showing better performance selected. A prototype MMC submodule is designed, built and tested in the lab. Simultaneously, control hardware and software are implemented and tested using real-time simulators. After verification of each of the subsystems, all subsystems are integrated to form a DC/AC converter-based drive. Multiple configurations are assembled and tested, and operation in variable voltages and frequencies, up to 4,160 V (line-to-line, rms), 140 A (rms) and 0-1,000 Hz is achieved. The efficiency of the drive system accomplished in the project is higher than 99.2% and the volume is 70% smaller than that of state-of-the art drives made using conventional technologies.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

DOE OSTI2023

Code Coverage Status of ARC Code-DIF3D

The Argonne Reactor Code (ARC) software system supports users in their fast reactor design goals by providing neutronic, thermal-hydraulic, and structural analysis capabilities. DIF3D plays a pivotal role in the ARC system as the primary homogenized assembly neutronic calculation methodology for fast reactor problems. Over its 40 years history, ARC software usage with DIF3D has been applied to numerous fast and thermal spectrum reactor analysis projects with good to excellent comparison against experiments. With continued improvement of computation resources, many of the geometry modeling capabilities in DIF3D that were primarily used in low order schemes are not really needed anymore. Today, the diffusion and transport capabilities of DIF3D-VARIANT are primarily used in the reactor design process with some scattered usage of DIF3D-FD and DIF3D-Nodal. In recent work, the DIF3D software verification was completed for DIF3D-FD and DIF3D-VARIANT on the geometry options used in the Versatile Test Reactor project. While we can be confident that these capabilities of DIF3D are well used and thus trusted, it does not demonstrate that all possible input options of DIF3D are actually working, but just those that were tested as part of VTR are and that they are correct. Thus, the purpose of the present work is to identify a set of test problems for DIF3D and assess the code coverage of DIF3D for those test problems. The goal is to document what parts of the existing DIF3D code are touched by the set of test problems and which are not. Because the verification work done on DIF3D-VARIANT and DIF3D-FD was focused on the most common uses of DIF3D for fast reactor analysis, the code coverage assessment of those capabilities is the highest priority. This will ensure that nothing is being missed by the existing verification test problems that DIF3D relies upon. The DIF3D-Nodal capability will also be inspected for code coverage as part of this work to further ensure that regular regression testing of DIF3D will trap any likely errors the end user might experience with the DIF3D software. The code coverage analysis of DIF3D was performed with the Code Coverage Tool of the Intel Fortran compiler which requires modifications to the compilation of DIF3D. The detailed coverage tables are given for each submodule of DIF3D separately, and for the submodules which are primarily developed for DIF3D, most of the source files could be at least partially touched. Most of the uncovered parts/files could be easily ignored, because they are either for error message and debugging output or obviously not needed by DIF3D. Out of the entire source codes of DIF3D, only a few uncovered modules deserve further investigation.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗

DOE OSTI2025

Code Coverage Status of the ARC Code DIF3D

The Argonne Reactor Code (ARC) software system supports users in their fast reactor design goals by providing neutronic, thermal-hydraulic, and structural analysis capabilities. DIF3D plays a pivotal role in the ARC system as the primary homogenized assembly neutronic calculation methodology for fast reactor problems. Over its 40 years history, ARC software usage with DIF3D has been applied to numerous fast and thermal spectrum reactor analysis projects with good to excellent comparison against experiments. With continued improvement of computation resources, many of the geometry modeling capabilities in DIF3D that were primarily used in low order schemes are not really needed anymore. Today, the diffusion and transport capabilities of DIF3D-VARIANT are primarily used in the reactor design process with some scattered usage of DIF3D-FD and DIF3D-Nodal. In recent work, the DIF3D software verification was completed for DIF3D-FD and DIF3D-VARIANT on the geometry options used in the Versatile Test Reactor project. While we can be confident that these capabilities of DIF3D are well used and thus trusted, it does not demonstrate that all possible input options of DIF3D are actually working, but just those that were tested as part of VTR are and that they are correct. Thus, the purpose of the present work is to identify a set of test problems for DIF3D and assess the code coverage of DIF3D for those test problems. The goal is to document what parts of the existing DIF3D code are touched by the set of test problems and which are not. Because the verification work done on DIF3D-VARIANT and DIF3D-FD was focused on the most common uses of DIF3D for fast reactor analysis, the code coverage assessment of those capabilities is the highest priority. This will ensure that nothing is being missed by the existing verification test problems that DIF3D relies upon. The DIF3D-Nodal capability will also be inspected for code coverage as part of this work to further ensure that regular regression testing of DIF3D will trap any likely errors the end user might experience with the DIF3D software. The code coverage analysis of DIF3D was performed with the Code Coverage Tool of the Intel Fortran compiler which requires modifications to the compilation of DIF3D. The detailed coverage tables are given for each submodule of DIF3D separately, and for the submodules which are primarily developed for DIF3D, most of the source files could be at least partially touched. Most of the uncovered parts/files could be easily ignored, because they are either for error message and debugging output or obviously not needed by DIF3D. Out of the entire source codes of DIF3D, only a few uncovered modules deserve further investigation.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗

DOE OSTI2018

Mitigation of Hot-Spots in Photovoltaic Systems Using Distributed Power Electronics

In the presence of partial shading and other mismatch factors, bypass diodes may not offer complete elimination of excessive power dissipation due to cell reverse biasing, commonly referred to as hot-spotting in photovoltaic (PV) systems. As a result, PV systems may experience higher failure rates and accelerated ageing. In this paper, a cell-level simulation model is used to assess occurrence of hot-spotting events in a representative residential rooftop system scenario featuring a moderate shading environment. The approach is further used to examine how well distributed power electronics converters mitigate the effects of partial shading and other sources of mismatch by preventing activation of bypass diodes and thereby reducing the chances of heavy power dissipation and hot-spotting in mismatched cells. The simulation results confirm that the occurrence of heavy power dissipation is reduced in all distributed power electronics architectures, and that submodule-level converters offer nearly 100% mitigation of hot-spotting. In addition, the paper further elaborates on the possibility of hot-spot-induced permanent damage, predicting a lifetime energy loss above 15%. In conclusion, this energy loss is fully recoverable with submodule-level power converters that mitigate hot-spotting and prevent the damage.

14 SOLAR ENERGY↗

DOE OSTI2019

System and method for monitoring atomic absorption during a surface modification process

A processing system monitors and/or controls a surface modification process occurring on a substrate within a processing chamber. An optical processing module having a light emission submodule to output a generated light signal and an optical detection submodule to detect a resultant light signal, is connected via fiber optic cables to light illuminating and light receiving components located within the chamber. A processor determines an amount of atomic absorption by an atomic element encountered by a probing beam passing between the illuminating and receiving components, based on the intensity of the generated light signal, the intensity of the received light signal and optionally the spontaneous emission of the atomic element in the absence of illumination by a probing beam. Based on the determined amount, the system derives a plurality of parameters of the modified substrate, their spatial and temporal uniformity, and information about process conditions in the processing chamber.

Atanasoff, George↗

DOE OSTI2018

Hardware Design of a 1.7 kV SiC MOSFET Based MMC for Medium Voltage Motor Drives

Abstract—This paper presents the hardware design of a 7 kV dc bus,1 MVA, 0-1,000 Hz, 1.7 kV SiC MOSFET based medium voltage variable speed drive (MVVSD)1. The system is based on a 7-level three-phase modular multilevel converter (MMC). The full in-depth design, development, and testing of this prototype are provided, including MMC submodule development, arm inductor design, control hardware realization, system integration and thermal analysis. Finally, experimental results demonstrate the excellent performance of the 1.7 kV SiC MOSFET based submodule and the 1 MW, 7 kV MVVSD as a unity in various operation modes

SiC MOSFET, Modular Multilevel Converter, Medium V↗

DOE OSTI2021

System and method for monitoring atomic absorption during a surface modification process

A processing system monitors and/or controls a surface modification process occurring on a substrate within a processing chamber. An optical processing module having a light emission submodule to output a generated light signal and an optical detection submodule to detect a resultant light signal, is connected via fiber optic cables to light illuminating and light receiving components located within the chamber. A processor determines an amount of atomic absorption by an atomic element encountered by a probing beam passing between the illuminating and receiving components, based on the intensity of the generated light signal, the intensity of the received light signal and optionally the spontaneous emission of the atomic element in the absence of illumination by a probing beam. Based on the determined amount, the system derives a plurality of parameters of the modified substrate, their spatial and temporal uniformity, and information about process conditions in the processing chamber.

Atanasoff, George↗

DOE OSTI2024

A Fully Decentralized Modulation Scheme for Modular Multilevel Converters

As the number of submodules rapidly increase, control architecture of Modular Multilevel Converters (MMCs) is transforming from centralized to distributed in order to address the challenges of tremendous computational burden and massive wiring. In this digest, we propose a modulation scheme for the MMCs with distributed controls, where each submodule is able to handle both controls and modulation in a decentralized manner. It enables the distributed controllers to synchronize in terms of fast-switching pulse width modulation (PWM). Aiming at this key technical challenge, this research develops a physics-informed PWM control strategy of mirroring the spontaneous synchronization feature of coupled oscillator’s behavior at switching frequency. Thanks to less reliance on wirings and communications, the proposed approach has the potential of i) improving reliability of MMC systems, and ii) reducing cost and space requirements for MMCs. The proposed approach has been preliminarily verified through a simulation tool for power electronics systems.

Lu, Minghui [BATTELLE (PACIFIC NW LAB)]↗

DOE OSTI2017

Impact of distributed power electronics on the lifetime and reliability of PV systems: Impact of distributed power electronics

Here, this paper quantifies the impact of distributed power electronics in photovoltaic (PV) systems in terms of end-of-life energy-capture performance and reliability. The analysis is based on simulations of PV installations over system lifetime at various degradation rates. It is shown how module-level or submodule-level power converters can mitigate variations in cell degradation over time, effectively increasing the system lifespan by 5-10 years compared with the nominal 25-year lifetime. An important aspect typically overlooked when characterizing such improvements is the reliability of distributed power electronics, as power converter failures may not only diminish energy yield improvements but also adversely affect the overall system operation. Failure models are developed, and power electronics reliability is taken into account in this work, in order to provide a more comprehensive view of the opportunities and limitations offered by distributed power electronics in PV systems. Lastly, it is shown how a differential power-processing approach achieves the best mismatch mitigation performance and the least susceptibility to converter faults.

14 SOLAR ENERGY↗

DOE OSTI2019

The Unsteady Aerodynamics Module For FAST8

The new modularization framework of FAST v.8 (Jonkman 2013) was accompanied by a complete overhaul of the aerodynamics routines. AeroDyn is an aerodynamics module comprised of four submodels: rotor wake/induction, blade airfoil aerodynamics, tower influence on the blade nodes, and tower drag. Throughout the software overhaul, several improvements to the original theoretical treatments were achieved, including more accurate skewed-wake and unsteady airfoil aerodynamics, and the possibility of modeling highly flexible and curved blades. Under asymmetric conditions, such as wind shear, yawed, and tilted flow, the individual blade elements undergo variations in angle of attack that lead to unsteady aerodynamics phenomena, which can no longer be captured through the static airfoil lift and drag look-up tables. This document covers the main theory and the organization of the modularization framework of the new unsteady aerodynamics submodule (UAM)1, which includes unsteady aerodynamics under attached flow conditions and dynamic stall. The UAM can be called by either blade element momentum theory (only interface discussed in this report), or other future wake models (e.g., dynamic blade element momentum theory, or generalized dynamic wake).

17 WIND ENERGY↗

DOE OSTI2020

Drivers for the cracking of multilayer polyamide‐based backsheets in field photovoltaic modules: In‐depth degradation mapping analysis

Abstract There is a lack of understanding on the root cause of cracking of photovoltaic (PV) backsheets due to the challenge of multilayer characterization and the complicated failure modes at the submodule level. In this work, the in‐depth degradation mapping of field‐exposed polyamide‐based (PA‐based) PV module backsheets was studied, with the major focus on the identification of underlying drivers for the through cracking (in between the solar cells). PV modules were retrieved from five different locations, comprising a variety of climates, including humid subtropical, hot‐summer Mediterranean, tropical savanna climate, and hot arid. A suite of microscale cross‐sectional characterizations, including chemical changes, fluorescence intensity, and modulus as a function of distance from the air surface of the backsheet, was performed. Results showed more advanced signs of degradation of the inner layer than the outer layer in the cracking region. Increases in the modulus were identified as the major indicator for the cracking. Moreover, a rudimentary test by immersion in acetic acid, which forms during photodegradation of the ethylene‐vinyl acetate copolymer (EVA) encapsulant, showed the first‐time direct evidence that acetic acid can largely accelerate the chemical degradation and facilitate the cracking of PA inner layer. This study suggests that the field cracking of PA‐based backsheet can be attributed to the combined effects of chemical degradation and physical reorganization (chemi‐crystallization) under cyclic thermomechanical stresses. Therefore, it is important to consider effects of local microclimates and interlayer infection to understand the heterogeneous nature of backsheet failures.

Lyu, Yadong↗