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At least 37 records · Page 2

Structure-Property Relationships of Bismaleimides

The purpose of this research was to control and systematically vary the network topology of bismaleimides through cure temperature and chemistry (addition of various coreactants) and subsequently attempt to determine structure-mechanical property relationships. Characterization of the bismaleimide structures by dielectric, rheological, and thermal analyses, and density measurements was subsequently correlated with mechanical properties such as modulus, yield strength, fracture energy, and stress relaxation. The model material used in this investigation was 4,4'-BismaleiMidodIphenyl methane (BMI). BMI was coreacted with either 4,4'-Methylene Dianiline (MDA), o,o'-diallyl bisphenol A (DABA) from Ciba Geigy, or Diamino Diphenyl Sulfone (DDS). Three cure paths were employed: a low- temperature cure of 140 C where chain extension should predominate, a high-temperature cure of 220 C where both chain extension and crosslinking should occur simultaneously, and a low-temperature (140 C) cure followed immediately by a high-temperature (220 C) cure where the chain extension reaction or amine addition precedes BMI homopolymerization or crosslinking. Samples of cured and postcured PMR-15 were also tested to determine the effects of postcuring on the mechanical properties. The low-temperature cure condition of BMI/MDA exhibited the highest modulus values for a given mole fraction of BMI with the modulus decreasing with decreasing concentration of BMI. The higher elastic modulus is the result of steric hindrance by unreacted BMI molecules in the glassy state. The moduli values for the high- and low/high-temperature cure conditions of BMI/MDA decreased as the amount of diamine increased. All the moduli values mimic the yield strength and density trends. For the high-temperature cure condition, the room- temperature modulus remained constant with decreasing mole fraction of BMT for the BMI/DABA and BMI/DDS systems. Postcuring PMR-15 increases the modulus over that of the cured material even though density values of cured and postcured PMR were essentially the same. Preliminary results of a continuous and intermittent stress relaxation experiment for BMI:MDA in a 2:1 molar ratio indicate that crosslinking is occurring when the sample is in the undeformed state. Computer simulation of properties such as density, glass transition temperature, and modulus for the low- temperature cure conditions of BMI/MDA and BMI/DABA were completed. The computer modeling was used to help further understand and confirm the structure characterization results. The simulations correctly predicted the trends of these properties versus mole fraction BMI and were extended to other BMI/diamine systems.

Tenteris-Noebe, Anita D.↗

Recent developments in polyimide adhesives at NASA-Langley Research Center

Adhesive development is directed towards elevated temperature applications (200-300 C). Because of thermal stability considerations, the most attractive adhesives for this temperature range are linear and addition polyimides. The linear polymide adhesive research encompassed basic structure-property relationships, solvent studies and formulations to meet various requirements. The most recent research in linear polyimide systems was in the development of thermoplastic systems in an effort to eliminate the undesirable evolution of water classically associated with the cure going through an amide-acid intermediate step in the cure process. Addition polyimide adhesive research was undertaken in order to avoid water evolution during cure. Basic structure-property relationships for these materials led to an adhesive which was used extensively for high temperature adhesive needs. Since addition systems are of a highly crosslinked nature, they are not as resistant to impact as their linear counterparts. In order to overcome this problem, research was done in the area of elastomer-toughening these polymers.

St.clair, T. L.↗

Thermally stable macromolecules.

Man-made polymers are compared with certain naturally occurring polymers which have long been used at elevated temperatures. The pyrolysis of model compounds is discussed together with aspects of thermogravimetric analysis, torsional braid analysis, and questions of chemical and radiation stability. Some structure-property relationships are examined, giving attention to asbestos, mica, graphite, and diamond. Questions of bond strengths are investigated along with the stability of ladder polymers and some fundamental concepts in the synthesis of aromatic and heteroaromatic polymers. The substances considered include aromatic single-strand polymers, heteroaromatic polymers, polymers obtained by addition polymerizations, and nonhydrogen-containing polymers. Future trends are also explored.

Pezdirtz, G. F.↗

Survey of inorganic polymers

A literature search was carried out in order to identify inorganic, metallo-organic, and hybrid inorganic-organic polymers that could serve as potential matrix resins for advanced composites. The five most promising candidates were critically reviewed and recommendations were made for the achievement of their potential in terms of performance and cost. These generic polymer classes comprise: (1) Poly(arylsil sesquioxanes); (2) Poly(silyl arylene siloxanes); (3) Poly(silarylenes); (4) Poly(silicon-linked ferrocenes); and (5) Poly(organo phosphazenes). No single candidate currently possesses the necessary combination of physicomechanical properties, thermal stability, processability, and favorable economics. The first three classes exhibit the best thermal performance. On the other hand, poly (organo phosphazenes), the most extensively studied polymer class, exhibit the best combination of structure-property control, processability, and favorable economics.

Gerber, A. H.↗

Polymer research at NASA Langley Research Center

Polymer synthesis programs involve the development of Novel thermoplastics, pseudothermoplastics, and thermosets. These systems are prepared to elucidate structure-property relationships involving thermal capabilities, toughness, processability and environmental stability. Easily processable polyimides, solvent-resistant polysulfones and polyphenylquinoxalines, and tougher high and intermediate temperature polymers were developed. Characterization efforts included high pressure liquid chromatography methodology, the development of toughness tests for fiber reinforced composites, a study of electrical properties of metal ion filled polyimides, and a study of the mutagenicity of aromatic diamines. Also the mechanism of cure/degradation of experimental polymers was studied by rheology, mechanical behavior, separation techniques and spectroscopy. The degradative crosslinking of alkyl-containing polyimides, the separation and identification of crosslinked phenylquinoxalines, the rheological behavior of hot-melt polyimides, and the elucidation of the cure of norbornene endcapped imides were also studied.

Terry L. St. Clair↗

Electrical conduction in polymer dielectrics

The use of polymer dielectrics with moderate resistivities could reduce or eliminate problems associated with spacecraft charging. The processes responsible for conduction and the properties of electroactive polymers are reviewed, and correlations drawn between molecular structure and electrical conductivity. These structure-property relationships led to the development of several new electroactive polymer compositions and the identification of several systems that have the requisite thermal, mechanical, environmental and electrical properties for use in spacecraft.

Cotts, D. B.↗

Optically transparent/colorless polyimides

Several series of linear aromatic polyimide films have been synthesized and characterized with the objective of obtaining maximum optical transparency. Two approaches have been used as part of this structure-property relationship study. The first approach is to vary the molecular structure so as to separate chromophoric centers and reduce electronic interactions between polymer chains to lower the intensity of color in the resulting polymer films. A second and concurrent approach is to perform polymerizations with highly purified monomers. Glass transition temperatures of thermally cured polyimide films are obtained by thermomechanical analysis and thermal decomposition temperatures are determined by thermogravimetric analysis. Transmittance UV-visible spectra of the polyimide films are compared to that of a commercial polyimide film. Fully imidized films are tested for solubility in common organic solvents. The more transparent films prepared in this study are evaluated for use on second-surface mirror thermal control coating systems. Lightly colored to colorless films are characterized by UV-visible spectroscopy before and after exposure to 300 equivalent solar hours UV irradiation and varying doses of 1 MeV electron irradiation. The effects of monomer purity, casting solvent and cure atmosphere on polyimide film transparency are also investigated.

Stclair, A. K.↗

Soluble aromatic polyimides for film and coating applications

Linear all-aromatic polyimides have been synthesized and characterized which show much potential as films and coatings for electronic applications. Structure-property relations with regard to methods for obtaining solubility of fully imidized polymers will be discussed. Methods used to obtain solubility include variation of polymer molecular structure, variation of isomerism of the diamine monomer, modification of cure time/temperature and atmosphere. Other properties of soluble polyimides will be presented which include glass transition temperatures, thermooxidative stabilities, UV-visible spectra, and refractive indices.

St.clair, Anne K.↗

Activities of the Center for the Space Processing of Engineering Materials

Topics addressed include: containerless processing and purification; directional and rapid solidification; high temperature alloys; oxidation resistant niobium alloys; metallic bonding; effects of solidification mode on structure-property relationships; and dispersion strengthened metal alloys. Each of the projects is reported by company association and follow according to alphabetical order of the company names.

Source record↗

Adhesive evaluation of new polyimides

During the past 10 to 15 years, the Materials Division at NASA Langley Research Center (LaRC) has developed several novel high temperature polyimide adhesives for anticipated needs of the aerospace industry. These developments have resulted from fundamental studies of structure-property relationships in polyimides. Recent research at LaRC has involved the synthesis and evaluation of copolyimides which incorporate both flexibilizing bridging groups and meta-linked benzene rings. The purpose was to develop systems based on low cost, readily available monomers. Two of these copolyimides evaluated as adhesives for bonding titanium alloy, Ti(6Al-4V), are identified as LARC-STPI and STPI-LARC-2. Lap shear strength (LSS) measurements were used to determine the strength and durability of the adhesive materials. LSS results are presented for LARC-TPI and LARC-STPI lap shear specimens thermally exposed in air at 232 C for up to 5000 hrs. LARC-TPI was shown to perform better than the copolymer LARC-STPI which exhibited poor thermooxidative performance possibly due to the amines used which would tend to oxidize easier than the benzophenone system in LARC-TPI.

Stclair, Terry L.↗

Soluble aromatic polyimides for film and coating applications

Linear all-aromatic polyimides have been synthesized and characterized which show much potential as films and coatings for electronic applications. Structure-property relations with regard to methods for obtaining solubility of fully imidized polymers will be discussed. Methods used to obtain solubility include variation of polymer molecular structure, variation of isomerism of the diamine monomer, modification of cure time/temperature and atmosphere. Other properties of soluble polyimides will be presented which include glass transition temperatures, thermooxidative stabilities, UV-visible spectra, and refractive indices.

St.clair, Anne K.↗

Isomeric oxydiphthalic anhydride polyimides

Much of the polyimide research at Langley Research Center has focused on isomeric modification of the diamine component; polyimides having considerably improved processability and adhesion have resulted. The present structure-property study was designed to investigate how isomeric attachment of the three oxydiphthalic anhydride (ODPA) polyimides affects their properties. Each dianhydride, 3,4,3',4'-oxydiphthalic anhydride (4,4'-OPDA,I), 2,3,2',3'-oxydiphthalic anhydride (3,3'-ODPA,II), and 2,3,3',4'-oxydiphthalic anhydride (3,4'-OPDA,III), was reacted with p-phenylenediamine, 4,4'-oxydianiline, 3,3'-diaminodiphenylsulfone, 3,3'-diaminobenzophenone, and 4,4'-bis(3-aminophenoxy)benzophenone in DMAc. The inherent viscosities of the resulting poly(amic acids) were determined. Thermally imidized films were studied for their creasability and solubility, as well as by differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and wide angle X-ray scattering (WAXS). A comparison of these properties will be made.

Gerber, Margaret K.↗

Low dielectric thermoplastic polyimide resin

NASA-Langley studies of polymer structure-property relationships have led to the development of a method for the reduction of dielectric constants in polyimides through chemical alterations of polymer backbone composition to reduce chain-chain electronic interactions, as well as through the incorporation of fluorine atoms into the polymer molecular structure. Still-greater dielectric constant reductions are obtainable by means of a physical incorporation of diamic acid additives into these low-dielectric polyimide systems; the resulting thermoplastic resins are applicable to polymer matrices for composite structural materials.

Stoakley, D. M.↗

Microstructural characterization of thin polymer films using Langley low energy positron flux generator

We have developed a highly efficient scheme for generating high fluxes of slow positrons. These positrons have been successfully used to measure lifetimes in thin test films. The lifetime data have been used to develop two structure-property models for the test films. The first model relates the free volume cell size to the molecular weight of the polymer repeat unit. The second model relates the free volume fraction to the dielectric constant of the polymer film.

Singh, Jag. J.↗

The Effects of Fiber Surface Modification and Thermal Aging on Composite Toughness and Its Measurement

A detailed experimental study was conducted to establish the structure-property relationships between elevated temperature aging and fiber-matrix bonding, Mode 2 interlaminar fracture toughness, and failure modes of carbon fiber/PMR-15 composites. The fiber-matrix adhesion was varied by using carbon fibers with different surface treatments. Short beam shear tests were used to quantify the interfacial shear strength afforded by the use of the different fiber surface treatments. The results of the short beam shear tests showed that, for times up to 1000 hr, the aging process caused no changes in the bulk of the three composite materials that would degrade the shear properties of the material. Comparisons between the interlaminar shear strengths (ILSS) measured by the short beam shear tests and the GIIC test results, as measured by the ENF test, indicated that the differences in the surface treatments significantly affected the fracture properties while the effect of the aging process was probably limited to changes at the starter crack tip. The fracture properties changed due to a shift in the fracture from an interfacial failure to a failure within the matrix when the fiber was changed from AU-4 to AS-4 or AS-4G. There appears to be an effect of the fiber/matrix bonding on the thermo-oxidative stability of the composites that were tested. The low bonding afforded by the AU 1 fiber resulted in weight losses about twice those experienced by the AS 1 reinforced composites, the ones with the best TOS.

Bowles, Kenneth J.↗

A Method for Characterizing Thermoset Polyimides

Thermoset polyimides have great potential for successfully meeting tough stress and temperature challenges in the advanced aircraft development program. However, studies of structure-property relationships in these materials have not been very successful so far. Positron lifetime spectroscopy (PLS) has been used to investigate free volumes and associated parameters in a series of variable, segmental molecular weight samples. The free volume correlates well with the molecular weight M(sub c), the cross-link density v, and the coefficient of thermal expansion (CTE) of these materials. Currently, no other techniques are available for direct measurement of these parameters, particularly for polymers in solid phase. Experimental results and their interpretations are presented.

Ranganathaiah, C.↗

Effect of Temperature and Deformation Rate on the Tensile Mechanical Properties of Polyimide Films

In order to study the structure-property relationships of different processed oriented polyimide films, the mechanical properties will be identified by using tensile tester Instron 4505 and structural information such as the 3-dimensional birefringence molecular symmetry axis and 3-dimensional refractive indices will be determined by using wave guide coupling techniques. The monoaxial drawing techniques utilized in this research are very useful for improving the tensile mechanical properties of aromatic polyimide films. In order to obtain high modulus/high strength polyimide films the following two techniques have been employed, cold drawing in which polyimide films are drawn at room temperature at different cross head speeds and hot drawing in which polyimide films are drawn at different temperatures and cross head speeds. In the hot drawing process the polyimide films are drawn at different temperatures until the glass transition temperature (Tg) is reached by using the environmental chamber. All of the mechanical and optical property parameters will be identified for each sample processed by both cold and hot drawing techniques.

Moghazy, Samir F.↗