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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
NASA NTRS2001

Space Food Systems Laboratory

The Space Food Systems Laboratory (SFSL) is a multipurpose laboratory responsible for space food and package research and development. It is located on-site at Johnson Space Center in Building 17. The facility supports the development of flight food, menus, packaging and food related hardware for Shuttle, International Space Station, and Advanced Life Support food systems. All foods used to support NASA ground tests and/or missions must meet the highest standards before they are 'accepted' for use on actual space flights. The foods are evaluated for nutritional content, sensory acceptability, safety, storage and shelf life, and suitability for use in micro-gravity. The food packaging is also tested to determine its functionality and suitability for use in space. Food Scientist, Registered Dieticians, Packaging Engineers, Food Systems Engineers, and Technicians staff the Space Food Systems Laboratory.

Perchonok, Michele↗
NASA NTRS2010

Environmental Stress Testing of the Single Sample Cylinder: A Proven Consensus Standard for Internal Gas Analysis (IGA) or Residual Gas Analysis (RGA)

In August 2008, Schuessler Consulting was contracted by NASA GSFC in support of the NASA Electronic Parts and Packaging (NEPP) program to perform two separate studies on moisture laden air in a stainless steel cylinder that had been designed to become a consensus standard for Test Method 1018. This Test Method was originally released for hybrids under Mil. Std. 883 but was quickly utilized on other microelectronic devices under the auspice of Mil. Std. 750. The cylinder had subsequently been fabricated for the 750 community. It was back-filled with moist air and subsequently analyzed over a period of time under a previous NASA contract. It had been shown that moisture in the 4000 - 5000 ppm range could be analyzed rather precisely with a mass spectrometer, commonly referred to as a Residual Gas Analyzer (RGA). The scope of this study was to ascertain if the composition and precision varied as a function of thermal shock at sub-zero temperatures and whether there was consensus when the standard was submitted to other RGA units. It was demonstrated and published that the consensus standard would yield precise RGA data for moisture within +/- 1% when optimized for a given RGA unit. It has been subsequently shown in this study at Oneida Research Services, that sub-zero storage did not affect that precision when a well-defined protocol for the analysis was followed. The consensus standard was taken to a second facility for analysis where it was found that moisture adsorption on the transfer lines caused precision to drop to +/- 12%. The Single Sample Cylinder (SSC) is a one liter stainless steel cylinder with associated sampling valves and has considerable weight and volume. But this considerable size allows for approximately 300 gas samples of the same composition to be delivered to any RGA unit. Lastly, a smaller cylinder, approximately 75 cc, of a second consensus standard was fabricated and tested with a different mix of fixed gases where moisture was kept in the 100 ppm range. This second standard has the potential of providing 30 gaseous samples and can be readily shipped to any analytical facility that desires to generate comparison RGA data. A series of comparison residual gas analyses was performed at the Honeywell Federal Manufacturing & Technologies facility in the National Nuclear Facility Administration s plant in Kansas City to complete this project. It was shown that improvements in the precision of a given RGA unit can be done by controlling the cycle time for each analysis and increasing analysis temperatures to minimize moisture adsorption. It was also found that a "one time event" in the subzero storage of the large SSC did not effect the units ability to continuously supply precise samples of the same chemistry, however the "event" caused a permanent +8% shift in the reported value of the moisture content. Lastly, a set of SSC RGA results was plotted on a common graph with DSCC "correlation study" RGA data. The result demonstrates the ability of the SSC to remove many of the individual variances that single, individual samples introduce. The consensus standards are now in storage at Oneida Research Services, one of the DSCC certified houses that does RGA to Military Standards, where they await future studies. The analytical data and the operational parameters of the instruments used are provided in the following discussion. Limitations and suggested means for improvement of both precision and accuracy are provided.

Schuessler, Philipp WH↗
NASA NTRS1978

Large scale static tests of a tilt-nacelle V/STOL propulsion/attitude control system

The concept of a combined V/STOL propulsion and aircraft attitude control system was subjected to large scale engine tests. The tilt nacelle/attitude control vane package consisted of the T55 powered Hamilton Standard Q-Fan demonstrator. Vane forces, moments, thermal and acoustic characteristics as well as the effects on propulsion system performance were measured under conditions simulating hover in and out of ground effect.

Source record↗
NASA NTRS1998

Chip Scale Package Implementation Challenges

The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. In the process of building the Consortium CSP test vehicles, many challenges were identified regarding various aspects of technology implementation. This paper will present our experience in the areas of technology implementation challenges, including design and building both standard and microvia boards, and assembly of two types of test vehicles. We also discuss the most current package isothermal aging to 2,000 hours at 100 C and 125 C and thermal cycling test results to 1,700 cycles in the range of -30 to 100 C.

Ghaffarian, Reza↗
NASA NTRS1978

Design, development, fabrication and delivery of register and multiplexer units

Several approaches for implementing the register and multiplexer unit into two CMOS monolithic chip types were evaluated. The CMOS standard cell array technique was selected and implemented. Using this design automation technology, two LSI CMOS arrays were designed, fabricated, packaged, and tested for proper static, functional, and dynamic operation. One of the chip types, multiplexer register type 1, is fabricated on a 0.143 x 0.123 inch chip. It uses nine standard cell types for a total of 54 standard cells. This involves more than 350 transistors and has the functional equivalent of 111 gates. The second chip, multiplexer register type 2, is housed on a 0.12 x 0.12 inch die. It uses 13 standard cell types, for a total of 42 standard cells. It contains more than 300 transistors, the functional equivalent of 112 gates. All of the hermetically sealed units were initially screened for proper functional operation. The static leakage and the dynamic leakage were measured. Dynamic measurements were made and recorded. At 10 V, 14 megabit shifting rates were measured on multiplexer register type 1. At 5 V these units shifted data at a 6.6 MHz rate. The units were designed to operate over the 3 to 15 V operating range and over a temperature range of -55 to 125 C.

Feller, A.↗
NASA NTRS2001

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Chen, Liang-Yu↗
NASA NTRS1979

Results of the 1978 NASA/JPL balloon flight solar cell calibration program

The 1978 scheduled solar cell calibration balloon flight was successfully completed. Thirty six modules were carried to an altitude of above 36 kilometers. Recovery of telemetry and flight packages was without incident. These calibrated standard cells are used as reference standards in simulator testing of cells and arrays with similar spectral response characteristics. The factors affecting the spectral transmission of the atmosphere at various altitudes are summarized.

Seaman, C. H.↗
NASA NTRS1993

Attitude sensor package

This paper describes the design, construction, testing, and successful flight of the Attitude Sensor Package. The payload was assembled on a standard HITCHHIKER experiment mounting plate, and made extensive use of the carrier's power and data handling capabilities. The side mounted HITCHHIKER version was chosen, since this configuration provided the best viewing conditions for the instruments. The combustion was successfully flown on board Space Shuttle Columbia (STS-52), in October 1992. The payload was one of the 14 experiments of the In-Orbit Technology Demonstration Program (Phase 1) of the European Space Agency.

Aceti, R.↗
NASA NTRS2008

Are Current SEE Test Procedures Adequate for Modern Devices and Electronics Technologies?

Believe it or not, this has been a simplistic look at starting a checklist for SEE testing. Given a memory that has 68 operating modes, when a SEU occurs that changes the mode, just how do you determine what's going on? Laser and microbeam tests can help, but not easily for modern packaged devices. Expanding this approach to other more complex devices such as ADCs or processors as well as analog devices should be considered. The recommendation is to use the existing text standards as the starting point. Just make your own checklist for the device/technology/issues being considered. At HEART 2007, we presented some of the burgeoning challenges associated with single event effect(SEE) testing of modern commercial memories: a) Package, device complexity, test fixture, and data analysis issues were discussed; b) "Complete" SEE Characterization would take 15 years; c) Qualification test costs have a greater than 4 times increase over the last decade. In this talk, we continue to explore the roles of technology with an emphasis on the existing SEE Test Procedures and some of the concerns related to modern devices. The primary objective of the briefing is to provide some overarching guidance concerning the many considerations involved in the formulation of a SEE test plan provided in a " Checklist" format.we note that there is no such thing as a complete check list and that the best approach is to develop a flexible test plan that takes into account the device type and functions, the device technology, circuit and package design, and, of course, test facility and beam characteristics.

LaBel, Kenneth A.↗
NASA NTRS1986

An evaluation of the documented requirements of the SSP UIL and a review of commercial software packages for the development and testing of UIL prototypes

A review was conducted of software packages currently on the market which might be integrated with the interface language and aid in reaching the objectives of customization, standardization, transparency, reliability, maintainability, language substitutions, expandability, portability, and flexibility. Recommendations are given for best choices in hardware and software acquisition for inhouse testing of these possible integrations. Software acquisition in the line of tools to aid expert-system development and/or novice program development, artificial intelligent voice technology and touch screen or joystick or mouse utilization as well as networking were recommended. Other recommendations concerned using the language Ada for the user interface language shell because of its high level of standardization, structure, and ability to accept and execute programs written in other programming languages, its DOD ownership and control, and keeping the user interface language simple so that multiples of users will find the commercialization of space within their realm of possibility which is, after all, the purpose of the Space Station.

Gill, Esther Naomi↗
NASA NTRS2021

Standard Materials and Processes Requirements for Spacecraft

This NASA Technical Standard is directed toward materials and processes (M&P) used in the design, fabrication, and testing of space program flight hardware for NASA, including but not limited to crewed, uncrewed, robotic, launch vehicle, lander, in-space and surface systems, and spacecraft program/project hardware elements. All spaceflight hardware is covered by the M&P requirements of this document, including vendor-designed, off-the-shelf, and vendor-furnished items. M&P used in interfacing ground support equipment (GSE), test equipment, hardware processing equipment, hardware packaging, and hardware shipment is covered by the M&P requirements of this NASA Technical Standard only to the extent required to prevent damage to or contamination of spaceflight hardware (see section 4). M&P used in NASA aircraft and aircraft operations are not covered by the M&P requirements of this document.

Materials↗
NASA NTRS1992

Description of a Pressure Measurement Technique for Obtaining Surface Static Pressures of a Radial Turbine

The aerodynamic performance of a solid uncooled version of a cooled radial turbine was evaluated in the Small Engine Components Test Facility Turbine rig at the NASA Lewis Research Center. Specifically, an experiment was conducted to rotor surface static pressures. This was the first time surface static pressures had been measured on a radial turbine at NASA Lewis. These pressures were measured by a modified Rotating Data Package (RDP), a standard product manufactured by Scanivalve, Inc. Described here are the RDP, and the modifications that were made, as well as the checkout, installation, and testing procedures. The data presented are compared to analytical results obtained from NASA's MERIDL TSONIC BLAYER (MTSB) code.

Dicicco, L. Danielle↗
NASA NTRS1992

Description of a pressure measurement technique for obtaining surface static pressures of a radial turbine

The aerodynamic performance of a solid uncooled version of a cooled radial turbine was evaluated in the Small Engine Components Test Facility Turbine rig at the NASA Lewis Research Center. Specifically, an experiment was conducted to rotor surface static pressures. This was the first time surface static pressures had been measured on a radial turbine at NASA Lewis. These pressures were measured by a modified Rotating Data Package (RDP), a standard product manufactured by Scanivalve, Inc. Described here are the RDP, and the modifications that were made, as well as the checkout, installation, and testing procedures. The data presented are compared to analytical results obtained from NASA's MERIDL TSONIC BLAYER (MTSB) code.

Dicicco, L. D.↗
NASA NTRS2004

Qualification and Reliability for MEMS and IC Packages

Advanced IC electronic packages are moving toward miniaturization from two key different approaches, front and back-end processes, each with their own challenges. Successful use of more of the back-end process front-end, e.g. microelectromechanical systems (MEMS) Wafer Level Package (WLP), enable reducing size and cost. Use of direct flip chip die is the most efficient approach if and when the issues of know good die and board/assembly are resolved. Wafer level package solve the issue of known good die by enabling package test, but it has its own limitation, e.g., the I/O limitation, additional cost, and reliability. From the back-end approach, system-in-a-package (SIAP/SIP) development is a response to an increasing demand for package and die integration of different functions into one unit to reduce size and cost and improve functionality. MEMS add another challenging dimension to electronic packaging since they include moving mechanical elements. Conventional qualification and reliability need to be modified and expanded in most cases in order to detect new unknown failures. This paper will review four standards that already released or being developed that specifically address the issues on qualification and reliability of assembled packages. Exposures to thermal cycles, monotonic bend test, mechanical shock and drop are covered in these specifications. Finally, mechanical and thermal cycle qualification data generated for MEMS accelerometer will be presented. The MEMS was an element of an inertial measurement unit (IMU) qualified for NASA Mars Exploration Rovers (MERs), Spirit and Opportunity that successfully is currently roaring the Martian surface

inertial measurement unit↗
NASA NTRS1979

Power Extension Package (PEP) system definition extension, orbital service module systems analysis study. Volume 4: PEP functional specification

The functional, performance, design, and test requirements for the Orbiter power extension package and its associated ground support equipment are defined. Both government and nongovernment standards and specifications are cited for the following subsystems: electrical power, structural/mechanical, avionics, and thermal control. Quality control assurance provisions and preparation for delivery are also discussed.

Source record↗
NASA NTRS2013

Characterizing the Performance of the Wheel Electrostatic Spectrometer

A Wheel Electrostatic Spectrometer has been developed as a surveying tool to be incorporated into a Martian rover design. Electrostatic sensors with various protruding cover insulators are embedded into a prototype rover wheel. When these insulators come into contact with a surface, a charge develops on the cover insulator through tribocharging. A charge spectrum is created by analyzing the accumulated charge on each of the dissimilar cover insulators. This charge spectrum can be used to determine differences in Martian regolith properties. In this study, we analyzed the repeatability of the measurements for this sensor package and found that the sensor repeatability lies within one standard deviation of the noise in the signal. In addition, we tested the need for neutralizing the surface charge on the cover insulators and discovered a need to discharge the sensor cover insulators after each revolution. Future work includes an electronics redesign to reduce noise and a Martian pressure static elimination tool that can be used to neutralize the charge on the sensor cover insulators after each wheel revolution.

Johansen, M. R.↗
NASA NTRS1983

The Integrated Sensor System Data Enhancement Package

The purpose of the Integrated Sensor System (ISS) Data Enhancement Package (DEP) is to improve the accuracies of the data obtained from the inflight tests performed on aircraft. The DEP is a microprocessor-based, flight-qualified electronics package that assimilates data from a Ring Laser Gyro (RGL) system, a standard NASA air data package, and other inputs. The DEP then processes these inputs in real-time to obtain optimal estimates of the aircraft velocity, attitude, and altitude. These estimates can be passed to the flight crew, downlinked, and/or stored on a mass storage medium. The DEP is now being built for the NASA Dryden Flight Research Center. Completion is anticipated in early 1984. A primary use of the ISS/DEP will be for the collection of quality data for the estimation of aircraft aerodynamic coefficients, including stability derivatives, using system identification methods. Initial anticipated applications will be on the AV-8B, F-14, and X-29 test aircraft.

Trankle, T. L.↗
NASA NTRS1975

Study for application of a sounding rocket experiment to spacelab/shuttle mission

An inexpensive adaptation of rocket-size packages to Spacelab/Shuttle use was studied. A two-flight project extending over two years was baselined, requiring 80 man-months of effort. It was concluded that testing should be held to a minimum since rocket packages seem to be able to tolerate shuttle vibration and noise levels. A standard, flexible control and data collection language such as FORTH should be used rather than a computation language such as FORTRAN in order to hold programming costs to a minimum.

Code, A. D.↗