The Interplay of Surface Mount Solder Joint Quality and Reliability of Low Volume SMAs
Spacecraft electronics as used in the NASA community, including the Jet Propulsion Laboratory.
Low Volume SMAs↗
SEARCH · Engineering Papers
Results for “solder joint reliability”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Strain-Controlled High-Cycle Fatigue of Aged Solder Joints for High-Reliability Environments
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Fowler, Hannah Nicole [Sandia National Laboratorie↗
NEPP Studies on the Reliability of Flip Chip Solder Joints and 2.5D Packaging
No abstract provided
Measmer, Rich↗
Testing of printed circuit board solder joints by optical correlation
An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.
Espy, P. N.↗
Chip Scale Package and Assembly Joint Reliability
The popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size.
CSP Solder joint Reliability Thermal aging chip Sc↗
Lead free and lead reliability for advanced electronic assemblies
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lead free Pb free solder joint reliability thermal↗
CSP Assembly Reliability Challenges
This paper will compare three different CSP concepts as well as their assembly reliability.
Wiring Board) microvia↗
CSP Assembly Reliability and Effects of Underfill and Double-Sided Population
The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
chip scale package CSP solder joint reliability un↗
CSP Assembly Reliability: Commercial and Harsh Environments
The JPL-led CSP Consortium of enterprises representing government agencies and private companies has jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
chip scale package CSP Solder Joint Reliability Th↗
SM Package Miniaturization Trends and Assembly Reliability Challenges
Different aspects of advanced surface mount package technology have been investigated. Three key areas included the assembly reliability of conventional Surface Mount (SM), Ball Grid Arrays (BGAs), and Chip Scale Packages (CSPs).
solder↗
A Systems Approach for Quality and Reliability of Chip Scale Package Assembly
This paper reviews many factors that affect interconnect reliability of commercial-off-the-shelf (COSTS) chip scale package (CSP) assemblies.
CSP↗
Assembly reliability of CSPs with various chiip sizes by accelerated thermal and mechanical cycling test
A JPL-led chip scale package (CSP) Consortium, composed of team members representing government agencies and private companies, recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
Chip Scale Package CSP thermal cycle fatigue solde↗
Chip Scale Package Implementation Challenges
The JPL-led MicrotypBGA Consortium of enterprises representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
chipscale↗
Assembly Reliability of BGAs and Effects of Board Finish
This paper will present failure characteristics of the assemblies up to 7,000 cycles.
Solder Joint Reliability BGA Ball Grid Array Therm↗
Reliability of CSP assemblies with underfill subjected to 4,000 extreme temperature cycles
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chip scale package CSP area array package microvia↗
Accelerated Thermal Cycling and Failure Mechanisms
This paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies.
BGA CSP CBGA thermal cycle solder joint reliabilit↗
CSP Assembly Reliability
Reviews the many factors that affect interconnect reliability of emerging chip scale package (CSP) assemblies. These include: package type, package build, board design, and assembly variables.
chip scale package CSP solder joint reliability th↗