Sonic Wafering of III-V substrates for High Efficiency Cells: A path to <$0.50/W
This project developed and demonstrated Sonic Lift-off, a novel technology that enables the reuse of expensive semiconductor substrates used to manufacture high-efficiency solar cells. By using sound waves to precisely separate thin layers of material, the process significantly reduces manufacturing costs while maintaining the performance of advanced III–V solar cells. These solar cells are among the most efficient in the world and are used in space, aerospace, and emerging terrestrial applications. The results of this work show that substrate reuse can be achieved without degrading device performance, offering a pathway to more affordable, high-performance solar technologies. This advancement supports U.S. clean energy goals by enabling broader deployment of renewable energy systems and strengthening domestic manufacturing capabilities in advanced photovoltaics.