Innovative Interfacial Engineering for Simultaneous Enhancement in Efficiency, Stability, and Reliability in Perovskite Devices
The overarching objective of this project was to increase significantly the mechanical adhesion toughness of the key interfaces in PSCs, thereby improving the durability and reliability of PSCs and minimodules, while simultaneously enhancing their PCE. This is achieved by incorporating rationally-chosen self-assembled monolayers (SAMs) at key PSC interfaces. Inherently scalable methods for the deposition of MHP light-absorber thin films and SAMs are employed to ensure a viable path towards manufacturability. Furthermore, detailed understanding of mechanisms of PSCs and minimodules degradation, and SAMs-induced mitigation, is provided. As part of the project accomplishments, >60% increase in the adhesion toughness of the key PSC interfaces over their SAMs-free control counterparts was achieved. Also, PCEs >20% and >19% in rigid and flexible, respectively, single-junction PSCs (~1 cm 2 area) were achieved. It was shown that <20% PCE loss in flexible PSCs with SAMs can be achieved after bend testing. It was demonstrated that T80 (80% retention of initial PCE) of >5,000 hours in rigid PSCs (~1 cm2 area) can be achieved. Comprehensive understanding of the degradation mechanisms in PSCs was obtained. These strategies were adopted towards developing minimodules. PCE of >21% was obtained in an 6-cm 2 area minimodule, with T91 of 1,000 hours.