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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRS1973

Preliminary Nuclear Electric Propulsion (NEP) reliability study

A preliminary failure mode, failure effect, and criticality analysis of the major subsystems of nuclear electric propulsion is presented. Simplified reliability block diagrams are also given. A computer program was used to calculate the reliability of the heat rejection subsystem.

Hsieh, T. M.↗
NASA NTRS1974

Photomultiplier tube reliability study for the HEAO program

Results concerning the research on photomultiplier tubes required for the HEAO program are reported. The general specifications are discussed for providing a series of tests for helping the operational reliability of its application, and for permitting comparison of performance of similar types, from various manufacturers.

Richardson, C.↗
NASA NTRS1981

Reliability study of refractory gate gallium arsenide MESFETS

Refractory gate MESFET's were fabricated as an alternative to aluminum gate devices, which have been found to be unreliable as RF power amplifiers. In order to determine the reliability of the new structures, statistics of failure and information about mechanisms of failure in refractory gate MESFET's are given. Test transistors were stressed under conditions of high temperature and forward gate current to enhance failure. Results of work at 150 C and 275 C are reported.

Yin, J. C. W.↗
NASA NTRS1973

Ferrite logic reliability study

Development and use of digital circuits called all-magnetic logic are reported. In these circuits the magnetic elements and their windings comprise the active circuit devices in the logic portion of a system. The ferrite logic device belongs to the all-magnetic class of logic circuits. The FLO device is novel in that it makes use of a dual or bimaterial ferrite composition in one physical ceramic body. This bimaterial feature, coupled with its potential for relatively high speed operation, makes it attractive for high reliability applications. (Maximum speed of operation approximately 50 kHz.)

Baer, J. A.↗
NASA NTRS2014

Parametric Mass Reliability Study

The International Space Station (ISS) systems are designed based upon having redundant systems with replaceable orbital replacement units (ORUs). These ORUs are designed to be swapped out fairly quickly, but some are very large, and some are made up of many components. When an ORU fails, it is replaced on orbit with a spare; the failed unit is sometimes returned to Earth to be serviced and re-launched. Such a system is not feasible for a 500+ day long-duration mission beyond low Earth orbit. The components that make up these ORUs have mixed reliabilities. Components that make up the most mass-such as computer housings, pump casings, and the silicon board of PCBs-typically are the most reliable. Meanwhile components that tend to fail the earliest-such as seals or gaskets-typically have a small mass. To better understand the problem, my project is to create a parametric model that relates both the mass of ORUs to reliability, as well as the mass of ORU subcomponents to reliability.

Holt, James P.↗
NASA NTRS2016

An Overview Of NASA Automotive Component Reliability Studies

The results of NASAs studies into the appropriateness of using US Automotive electronic parts in NASA spaceflight systems will be presented. The first part of the presentation provides an overview of the United States Automotive Electronics Councils AECQ standardization program, the second part provides a summary of the results of NASAs procurement and testing experiences and other lessons learned along with preliminary test results.

alternate grade electronics↗
NASA NTRS2016

An Overview of NASA Automotive Component Reliability Studies

The results of NASAs studies into the appropriateness of using US Automotive electronic parts in NASA spaceflight systems will be presented. The first part of the presentation provides an overview of the United States Automotive Electronics Councils AECQ standardization program, the second part provides a summary of the results of NASAs procurement and testing experiences and other lessons learned along with preliminary test results.

Automotive electronics↗
NASA NTRS2016

An Overview of NASA Automotive Component Reliability Studies

The results of NASAs studies into the appropriateness of using US Automotive electronic parts in NASA spaceflight systems will be presented. The first part of the presentation provides an overview of the United States Automotive Electronics Councils AECQ standardization program, the second part provides a summary of the results of NASAs procurement and testing experiences and other lessons learned along with preliminary test results.

Automotive electronics↗
NASA NTRS2003

Design and Varactors: Operational Considerations. A Reliability Study for Robust Planar GaAs

Preliminary conclusions include: Limits for reverse currents cannot be set. Based on current data we want to avoid any reverse bias current. We know 1 micro-A is too high. Leakage current gets suppressed when operated at 120K. Migration and verification: a) Reverse Bias Voltage will be limited; b) Health check with I/V curve: 1) Minimal reverse voltage shall be x0.75 of the calculated voltage breakdown Vbr; 2) Degradation of the Reverse Bias voltage at given current will be used as indication of ESD incidents or other Damages (high RF power, heat); 3) Calculation of diodes parameter to verify initial health check result in forward direction. RF output power starts to degrade when diode I/V curve is very strongly degraded only. Experienced on 400GHz doubler and 200GHz doubler

THz frequencies↗
NASA NTRS1996

Chip-on-Board Technology 1996 Year-end Report (Design, Manufacturing, and Reliability Study)

The major impetus for flight qualifying Chip-On-Board (COB) packaging technology is the shift in emphasis for space missions to smaller, better, and cheaper spacecraft and satellites resulting from the NASA New Millenium initiative and similar requirements in DoD-sponsored programs. The most important benefit that can potentially be derived from miniaturizing spacecraft and satellites is the significant cost saving realizable if a smaller launch vehicle may be employed. Besides the program cost saving, there are several other advantages to building COB-based space hardware. First, once a well-controlled process is established, COB can be low cost compared to standard Multi-Chip Module (MCM) technology. This cost competitiveness is regarded as a result of the generally greater availability and lower cost of Known Good Die (KGD). Coupled with the elimination of the first level of packaging (chip package), compact, high-density circuit boards can be realized with Printed Wiring Boards (PWB) that can now be made with ever-decreasing feature size in line width and via hole. Since the COB packaging technique in this study is based mainly on populating bare dice on a suitable multi-layer laminate substrate which is not hermetically sealed, die coating for protection from the environment is required. In recent years, significant improvements have been made in die coating materials which further enhance the appeal of COB. Hysol epoxies, silicone, parylene and silicon nitride are desirable because of their compatible Thermal Coefficient of Expansion (TCE) and good moisture resistant capability. These die coating materials have all been used in the space and other industries with varying degrees of success. COB technology, specifically siliconnitride coated hardware, has been flown by Lockheed on the Polar satellite. In addition, DARPA has invested a substantial amount of resources on MCM and COB-related activities recently. With COB on the verge of becoming a dominant player in DoD programs, DARPA is increasing its support of the availability of KGDs which will help decrease their cost. Aside from the various major developments and trends in the space and defense industries that are favorable to the acceptance and widespread use of'COB packaging technology, implementing COB can be appealing in other aspects. Since the interconnection interface is usually the weak link in a system, the overall circuit or system reliability may actually be improved because of the elimination of a level of interconnect/packaging at the chip. With COB, mixing packaging technologies is possible. Because some devices are only available in commercial plastic packages, populating a multi-layer laminate substrate with both bare dice and plastic-package parts is inevitable. Another attractive feature of COB is that re-workability is possible if die coating is applied only on the die top. This method allows local replacement of individual dice that were found to be defective instead of replacing an entire board. In terms of thermal management, unpackaged devices offer a shorter thermal resistance path than their packaged counterparts thereby improving thermal sinking and heat removal from the parts.

Le, Binh Q.↗
NASA NTRS1977

Reliability study of opto-coupled semiconductor devices and Light Emitting Diodes (LED)

Opto-coupler and light emitting diode (LED) failure mechanisms and associated activation energies were determind from the results of environmental and accelerated lift tests of over 2,400 devices. The evaluation program included LED phototransistor opto-couplers from three sources, LED photoamplifier opto-couplers from a single source, and discrete infrared emitting LEDs from two sources. Environmental tests to evaluate device mechanical integrity included power cycling (10,000 cycles), temperature cycling (500 cycles) and a sequence of monitored shock, monitored vibration and constant acceleration. Multiple temperature operating life tests were conducted at ambient temperatures between 25 C and 200 C. Opto-couplers were operated in both the 'on' and 'off' states during life testing.

Maurer, R. C.↗
NASA NTRS1982

Lamp reliability studies for improved satellite rubidium frequency standard

In response to the premature failure of Rb lamps used in Rb atomic clocks onboard NAVSTAR GPS satellites experimental and theoretical investigations into their failure mechanism were initiated. The primary goal of these studies is the development of an accelerated life test for future GPS lamps. The primary failure mechanism was identified as consumption of the lamp's Rb charge via direct interaction between Rb and the lamp's glass surface. The most effective parameters to accelerate the interaction between the Rb and the glass are felt to be RF excitation power and lamp temperature. Differential scanning calorimetry is used to monitor the consumption of Rb within a lamp as a function of operation time. This technique yielded base line Rb consumption data for GPS lamps operating under normal conditions.

Frueholz, R. P.↗
NASA NTRS1986

A Sensor Failure Simulator for Control System Reliability Studies

A real-time Sensor Failure Simulator (SFS) was designed and assembled for the Advanced Detection, Isolation, and Accommodation (ADIA) program. Various designs were considered. The design chosen features an IBM-PC/XT. The PC is used to drive analog circuitry for simulating sensor failures in real-time. A user defined scenario describes the failure simulation for each of the five incoming sensor signals. Capabilities exist for editing, saving, and retrieving the failure scenarios. The SFS has been tested closed-loop with the Controls Interface and Monitoring (CIM) unit, the ADIA control, and a real-time F100 hybrid simulation. From a productivity viewpoint, the menu driven user interface has proven to be efficient and easy to use. From a real-time viewpoint, the software controlling the simulation loop executes at greater than 100 cycles/sec.

Melcher, K. J.↗
NASA NTRS2000

Development and Application of Tools to Characterize the Oxidative Degradation of AP/HTPB/Al Propellants in a Propellant Reliability Study

The oxidative thermal aging of a crosslinked hydroxyl-terminated polybutadiene (HTPB)/isophorone diisocyanate (IPDI) polyurethane rubber was studied at temperatures between 25 C and 125 C. Changes in tensile elongation, mechanical hardening, polymer network properties, density, O2 permeation, and molecular chain dynamics were investigated as a function of age. The techniques used include solvent swelling, detailed modulus profiling, and NMR relaxation measurements. The Arrhenius methodology, which normally assumes a linear extrapolation of high temperature aging data, is critically evaluated by using extensive data superposition and highly sensitive oxygen consumption measurements. Significant curvature in the Arrhenius diagram of these oxidation rates is observed to be similar to previous results found for other rubber materials that have been evaluated by this technique. Preliminary gel/network properties suggest that crosslinking is the dominant process at higher temperatures. The effect on the oxidation rate of the binder when other constituents found in propellants are present, such as ammonium perchlorate, plasticizer and aluminum powder, is presented.

Celina, Mathew↗