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An improved multiwire proportional counter camera having particular utility in the field of clinical nuclear medicine imaging. The detector utilizes direct coupled, low impedance, high speed delay lines, the segments of which are capacitor-inductor networks. A pile-up rejection test is provided to reject confused events otherwise caused by multiple ionization events occuring during the readout window.
An improved multiwire proportional counter camera having particular utility in the field of clinical nuclear medicine imaging. The detector utilizes direct coupled, low impedance, high speed delay lines, the segments of which are capacitor-inductor networks. A pile-up rejection test is provided to reject confused events otherwise caused by multiple ionization events occurring during the readout window.
A low power X-ray powder diffraction system suitable for remote mineralogical analysis of lunar, planetary, or asteroid soils has been designed. A one Curie Fe-55 source provides a monochromatic X-ray beam of 5.9 keV. Seeman-Bohlin focusing geometry is employed in the camera, allowing peak detection to proceed simultaneously at all angles and obviating the need for moving parts. The detector system is an array of 500-600 proportional counters with a wire-spacing of 1 mm. An electronics unit comprising preamplifier, postamplifier, window discriminators, and storage flip-flops requiring only 3.5 milliwatts has been designed and tested. Total instrument power is less than 5 W.
Construction of device utilizing high-purity carbon is biocompatible as well as hygienic, Design allows for easy connections and disconnections in dark, cleaning and maintenance and less snagging of clothing and other articles by device. Guides and magnetic coupling preclude need for locks, screwing, or latching.
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The significant economic data for the current production multiblade wafering and inner diameter slicing processes were tabulated and compared to data on the experimental and projected multiblade slurry, STC ID diamond coated blade, multiwire slurry and crystal systems fixed abrasive multiwire slicing methods. Cost calculations were performed for current production processes and for 1982 and 1986 projected wafering techniques.
Preliminary designs were made for a multiplane, multiwire position sensitive proportional counter for X-ray use. Anode spacing was 2 mm and cathode spacing 1 mm. Assistance was provided in setting up and operating two multiwire proportional counters, one with 5 mm anode spacing, and the other with 2 mm spacing. Argon-based counter gases were used for preliminary work in assembling a working experimental system to measure xenon fluorescence yields. The design and specification of a high purity gas filling system capable of supplying mixtures of xenon and other gases to proportional counters was also performed. The system is mounted on a cart, is fully operational, and is flexible enough to be easily used as a pumping station for other clean applications. When needed, assistance was given to put into operation various computer-related pieces of equipment.
Adhesive sealing, nickel plating, and multiwire boards evaluated. Based on study involving fully developed hardware, report considers adhesive packaging instead of seam welding, nickel-plated Kovar (commercial Fe/NI/Co alloy) packages instead of gold plates ones, and multiwire circuit boards instead of multilayer boards as alternatives for reducing cost of hardware without reducing reliability.
One of the major cost factors in silicon ingot technology adaptation for terrestrial photovoltaic application is in slicing boules into wafers. The most developed industrial practice is the Internal Diameter (ID) slicing. This method utilizes diamond cutting. The diamond stands up for long periods, hence, the cost of expendable materials is low. However, the ID technology as practiced today has poor material utilization. The Multiblade Slurry (MBS) method has low equipment and labor costs but its expendable material costs are high. Recently Multiwire Slurry (MWS) technology has shown very good material utilization, but its expendable material costs are even higher than MBS. The multiwire Fixed Abrasive Slicing Technique (FAST) still in advanced development stage, combines the low expendable material costs of ID method, the low labor and equipment costs of MBS and high material utilization of MWS.
A low inductance, low characteristic impedance transmission line was designed for a 20 kHz power distribution system. Several different conductor configurations were considered: strip lines, interdigitated metal ribbons, and standard insulated wires in multiwire configurations (circular and rectangular cylindrical arrangements). The final design was a rectangular arrangement of multiple wires of the same gauge with alternating polarities from wire to wire. This offered the lowest inductance per unit length (on the order of several nanohenries/meter) and the lowest characteristic impedance (on the order of one Ohm). Standard multipin connectors with gold-plated elements were recommended with this transmission line, the junction boxes to be internally connected with flat metal ribbons for low inductance, and the line to be constructed in sections of suitable length. Computer programs for the calculation of inductance of multiwire lines and of capacitances of strip lines were developed.
Numerical simulation results of fluid flow and collection efficiency of the Science Engineering Associates Inc. Multi-Element Probe (Multiwire) and Ice Crystal Detector (ICD) are presented. Fluid flow simulations were conducted using NASA's FUN3D while collection efficiency simulations were conducted using NASA's LEWICE3D software and GlennICE software. For both probes, 3D unsteady flow results were time-averaged. Simulations were computed for free steam velocities ranging from 85 to 185 m/s and freestream total pressures of 44.8 and 93.1 kPa. Collection efficiency results were computed for four spherical particle diameter sizes of 5, 20, 50, and 100 µm. GlennICE collection efficiency results for the multiwire were compared with previously published collection efficiency values calculated using LEWICE3D. Numerical collection efficiency results for the Ice Crystal Detector are presented for the first time.
Numerical simulation results of fluid flow and collection efficiency of the Science Engineering Associates Inc. Multi-Element Probe (Multiwire) and Ice Crystal Detector (ICD) are presented. Fluid flow simulations were conducted using NASA's FUN3D while collection efficiency simulations were conducted using NASA's LEWICE3D software and GlennICE software. For both probes, 3D unsteady flow results were time averaged. Simulations were computed for freestream velocities ranging from 85 to 185 m/s and freestream total pressures of 44.8 and 93.1 kPa. Collection efficiency results were computed for four spherical particle diameter sizes of 5, 20, 50, and 100 µm. GlennICE collection efficiency results for the multiwire were compared with previously published collection efficiency values calculated using LEWICE3D. Numerical collection efficiency results for the Ice Crystal Detector are presented for the first time.
This paper describes the hardware and software upgrades, operation, and performance of the high intensity diffractometer for residual stress analysis (HIDRA) instrument, a residual stress mapping neutron diffractometer located at the High Flux Isotope Reactor at Oak Ridge National Laboratory in Oak Ridge Tennessee, USA. Following a major upgrade in 2018, the new instrument has a single 3 He multiwire 2D 30 × 30 cm 2 position sensitive detector, yielding a field of view of 17° 2θ. Further, the increase in the field of view (from 4° 2θ) from the previous model instrument has contributed to the tremendous improvement in the out of plane solid angle such that the 3D count rate could be obtained easily. Accordingly, the hardware, software, Data Acquisition System (DAS), and so on have also been updated. Finally, all these enhanced features of HIDRA have been ably demonstrated by conducting multi directional diffraction measurements in the quenched 750-T74 aluminum, and the evolved and improved strain/stress mappings are presented.
For the PIP-II program, transverse emittance in the Fermilab Booster must remain well controlled at higher bunch intensities. 4-plate beam position monitors (BPMs) have a small but measurable quadrupole moment, making it possible to infer transverse emittance. By compositing many BPMs together, it becomes possible to improve the quality of the quadrupole signal. The Fermilab Booster BPM system has been used to measure these quadrupole moments in the past year and derive emittances from them. Recent benchmarks show that the derived BPM emittances show similar emittance evolution and value to IPM and Multiwire data. This approach can both supplement and complement existing non-intercepting emittance monitors in accelerators.
This project aimed to develop technologies that can potentially enable free-standing thin (<80 μm) wafer in today’s manufacturing lines with high production yield, and thereby reduce capex barriers of silicon photovoltaics cells and modules. One of the major benefits is that thin wafer dramatically reduces the amount of polysilicon required. As a result, it can lead to reduction in the capital expenditures associated with polysilicon refining and wafer fabrication, which together are more than half of the total capital expenditure to manufacture Si PV module. We focused our efforts on developing the tools needed to enable high yield fabrication of wafer, cell, and module with thin silicon wafers. However, as the wafer thickness reduces, the major challenge is that wafer breakage increases significantly. Three technological areas were explored in this project to improve the production yield of the silicon wafer, namely detection of edge cracks via dark-field near-infrared (NIR) scattering; (2) wafer handling using controlled temperature profiles; (3) manufacturable low-stress cell interconnection for multiwire. First, the formation of wafer cracks in submillimeter length is one of the reasons that causes wafer breakages. Crack detection tools are needed to enable us to locate and track the wafer crack during manufacturing, so that we can improve the process to reduce initialization. The state-of-the-art crack detection technique cannot fulfill the need for measuring submillimeter edge cracks detrimental for thin wafers. The prototype developed in this project demonstrates the scanning of microcracks near wafer edges. With a semi-automatic laboratory setup, the submillimeter cracks were reliably detected near the edges in multi-Si wafers. The smallest detectable crack is 200 µm in length in slow scans; and submillimeter cracks are detected in high-throughput scans at the scan speed of >0.5 m/s, which is compatible with the inline detection of a manufacturing line at least 1 sec/wafer. This detection limit is a significant advancement in comparison to the benchmarked industrial tool. Second, wafer handling with the well-controlled temperature profile was thought to be the solution to reduce crack initiation and propagation during the manufacturing. However, without crack detection being widely adopted in production line, we did not find a strong industrial pull toward this technology. We did an initial literature survey and then diverted our efforts to the other tasks. Third, the innovation on low-stress multi-wire interconnection tackles a fundamental problem in the standard interconnection scheme. The standard over-under “zig-zag” interconnection induces a significant amount of stress into the soldering point on the cell whenever PV module is under stress, e.g., thermal cycling, transportation, and installation. Therefore, the interconnection process was re-designed in this project to allow for significant movement between adjacent solar cells, e.g., due to thermal expansion, without building up stresses on the solar cells or solder joints. The new interconnection method with the cross-connect wire also simplifies the tabbing and stringing process by replacing the standard over-under method with an off-cell interconnect from top to bottom. A manual tabbing and stringing tool for this new process was prototyped in the lab to demonstrate the fabrication of this new interconnection design. During the test with brass sheets as our “testing cells”, it was found that the mechanical cycling test only broke the interconnection after more than 50,000 cycles, which is equivalent to more than 130 years of the day-and-night thermal cycles. Lastly, throughout the project, we continuously analyzed the PV market with techno-economic analysis to identify the opportunity for thin Si adoption. Even though the drastic cost reduction has already happened in the past five years, our analysis results indicated that we can still save quite significantly in both manufacturing cost and factory capex, Particularly, in order to grow the PV manufacturing capacity to multi-terawatt level, reducing the thickness of silicon wafer is one of the most effective ways to quickly reduce factory capex, and sustain the high growth rate. The technologies developed in this project are readily available to provide some assistances in tackling the production yield problem.
We present design considerations and challenges for the fast machine learning component of a third-order resonant beam extraction regulation system being commissioned to deliver steady beam rates to the mu2e experiment at Fermilab. Dedicated quadrupoles drive the tune toward the 29/3 resonance each spill, extracting beam at kV multiwire septa. The overall Spill Regulation System consists of (1) a “slow” process using ~100-spill averages to adjust the base quad ramp infrequently, (2) a feedforward harmonic content compensator, and (3) the “fast” ML agent reacting during each ongoing spill with on-the-fly additive corrections to the sum of (1) and (2). We have demonstrated improved beam-rate steadying for a fast ML agent compared to a PID controller using a quasi-physical spill simulation, and demonstrated distillation of that simulation into a predictive surrogate model. Current work includes a data-and-training pipeline to generate data-aware surrogates with real-world dynamics, even as the dynamics shift unpredictably. The surrogates are to act as RL environments against which to train our fast ML control agents before deploying them on FPGA in the live system. Further current efforts focus on modeling and controlling beam loss around the storage ring, understanding additional available hardware inputs to the model, and the interplay of these with beam-steadying performance.
For the PIP-II program, transverse emittance in the Fermilab Booster must remain well controlled at higher bunch intensities. 4-plate beam position monitors (BPMs) have a small but measurable quadrupole moment, making it possible to infer transverse emittance. By compositing many BPMs together, it becomes possible to improve the quality of the quadrupole signal. The Fermilab Booster BPM system has been used to measure these quadrupole moments in the past year and derive emittances from them. Recent benchmarks show that the derived BPM emittances show similar emittance evolution and value to IPM and Multiwire data. This approach can both supplement and complement existing non-intercepting emittance monitors in accelerators.
One-shot, breakaway multiwire cable connector is fabricated by using a number of small-diameter interconnecting wires, each of which, differing incrementally in length, is welded to neighboring pin and cable terminations. This design eliminates frictional binding and provides highly reliable cable interconnections until the connector is disengaged.