Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling
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36 MATERIALS SCIENCE↗
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Results for “material interfaces”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Self-Organization of Plasma-Material Interfaces
The primary goals of the project are a) improve the understanding of transport processes, chemical reactions and plasma-driven self-organization such as stratification and filamentation, formation of anode spots, liquid droplets ejection from cathodes, and plasma electrolysis, b) utilize and share among the project participants computational tools developed by the participants to understand plasma-based surface functionalization and plasma-enabled pattern nucleation in a wide range of scales from nano- to millimeters, and c) use experimental methods and facilities available at the University of Alabama in Huntsville (UAH) and Sandia National Laboratories (SNL) to understand and control plasma processes, reaction pathways and the electric nature of self-organization of the plasma-exposed interface structures.
70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗
Study program for encapsulation materials interface for low cost silicon solar array
An atmospheric corrosion model was developed and verified by five months of corrosion rate and climatology data acquired at the Mead, Nebraska LSA test site. Atmospheric corrosion rate monitors (ACM) show that moisture condensation probability and ionic conduction at the corroding surface or interface are controlling factors in corrosion rate. Protection of the corroding surface by encapsulant was shown by the ACM recordings to be maintained, independent of climatology, over the five months outdoor exposure period. The macroscopic corrosion processes which occur at Mead are shown to be reproduced in the climatology simulator. Controlled experiments with identical moisture and temperature aging cycles show that UV radiation causes corrosion while UV shielding inhibits LSA corrosion.
Kaelble, D. H.↗
Thermal conductance of two interface materials and their applications in space systems
Two polymeric materials, the Cho-Therm 1671 elastomer and the CV-2946 conductive RTV silicone, have been evaluated. Tests were conducted in vacuum and in air, for many clamping pressures, power densities, and as a function of time. Results obtained show that the CV-2946 thermal conductance after 24 hour in vacuum is 0.62 W/sq cm C(4W/sq in C) when clamped with an average pressure of about 350 psi. The maximum conductance of Cho-Therm 1671 is 4.3 W/sq in C at the clamping pressure about 200 psi. After 72 h in vacuum, the conductance reaches a steady 3.4 W/sq in C, independent of clamping pressure. It is concluded that the tightly bolted, torqued fixtures do not buckle or distort and provide an optimum thermal conductance. The fixtures simulating an actual spacecraft configuration suffered severe bowing and separating, which caused considerable degradation of conductance values.
Scialdone, J. J.↗
Performance Testing of Thermal Interface Filler Materials in a Bolted Aluminum Interface Under Thermal/Vacuum Conditions
A thermal interface material is one of the many tools often used as part of the thermal control scheme for space-based applications. Historically, at Marshall Space Flight Center, CHO-THERM 1671 has primarily been used for applications where an interface material was deemed necessary. However, numerous alternatives have come on the market in recent years. It was decided that a number of these materials should be tested against each other to see if there were better performing alternatives. The tests were done strictly to compare the thermal performance of the materials relative to each other under repeatable conditions and do not take into consideration other design issues, such as off-gassing, electrical conduction, isolation, etc. The purpose of this Technical Memorandum is to detail the materials tested, test apparatus, procedures, and results of these tests. The results show that there are a number of better performing alternatives now available.
Glasgow, S. D.↗
Performance Testing of Thermal Interface Filler Materials in a Bolted Aluminum Interface Under Thermal/Vacuum Conditions
A thermal interface material is one of the many tools that are often used as part of the thermal control scheme for space-based applications. These materials are placed between, for example, an avionics box and a cold plate, in order to improve the conduction heat transfer so that proper temperatures can be maintained. Historically at Marshall Space Flight Center, CHO-THERM@ 1671 has primarily been used for applications where an interface material was deemed necessary. However, there have been numerous alternatives come on the market in recent years. It was decided that a number of these materials should be tested against each other to see if there were better performing alternatives. The tests were done strictly to compare the thermal performance of the materials relative to each other under repeatable conditions and they do not take into consideration other design issues such as off-gassing, electrical conduction or isolation, etc. This paper details the materials tested, test apparatus, procedures, and results of these tests.
Glasgow, Shaun↗
Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime
The need for reliable bonded interface materials is critical to realize the performance benefits of wide-bandgap devices in power electronic modules, especially in operating temperatures greater than 150 degrees Celsius. In this paper, we investigate the thermomechanical performance of sintered copper (Cu) as a large-area attachment, bonded between Cu baseplates and active-metal-bonded substrates, under accelerated thermal shock (-40 degrees Celsius to 200 degrees Celsius) conditions. In the fabrication phase of the samples, we used different stencil patterns and found out that the grid and stripe patterns resulted in a better outgassing of the residual organics during the sintering process, thereby ensuring a substantially improved bond quality than a full-area print. The paste consisted of Cu microflakes and we performed sintering using a Budatec SP300 sintering press at 275 degrees Celsius with 15 MPa of bonding pressure for 5 minutes in a nitrogen atmosphere. Under accelerated experiments, we monitored the degradation of the sintered Cu bond in the samples through C-mode scanning acoustic microscope (C-SAM) images. To quantify the defect percentage in C-SAM images, we investigated image denoising techniques to exclude the pattern prints. Finally, we cross-sectioned a sample and obtained digital microscope images, which revealed adhesive fracture as the dominant failure mechanism.
ADVANCED PROPULSION SYSTEMS↗
Conducting the Heat
Heat conduction plays an important role in the efficiency and life span of electronic components. To keep electronic components running efficiently and at a proper temperature, thermal management systems transfer heat generated from the components to thermal surfaces such as heat sinks, heat pipes, radiators, or heat spreaders. Thermal surfaces absorb the heat from the electrical components and dissipate it into the environment, preventing overheating. To ensure the best contact between electrical components and thermal surfaces, thermal interface materials are applied. In addition to having high conductivity, ideal thermal interface materials should be compliant to conform to the components, increasing the surface contact. While many different types of interface materials exist for varying purposes, Energy Science Laboratories, Inc. (ESLI), of San Diego, California, proposed using carbon velvets as thermal interface materials for general aerospace and electronics applications. NASA s Johnson Space Center granted ESLI a Small Business Innovation Research (SBIR) contract to develop thermal interface materials that are lightweight and compliant, and demonstrate high thermal conductance even for nonflat surfaces. Through Phase II SBIR work, ESLI created Vel-Therm for the commercial market. Vel-Therm is a soft, carbon fiber velvet consisting of numerous high thermal conductivity carbon fibers anchored in a thin layer of adhesive. The velvets are fabricated by precision cutting continuous carbon fiber tows and electrostatically flocking the fibers into uncured adhesive, using proprietary techniques.
Source record↗
Characterizing Electrode Materials and Interfaces in Solid-State Batteries
Solid-state batteries (SSBs) could offer improved energy density and safety, but the evolution and degradation of electrode materials and interfaces within SSBs are distinct from conventional batteries with liquid electrolytes and represent a barrier to performance improvement. Over the past decade, a variety of imaging, scattering, and spectroscopic characterization methods has been developed or used for characterizing the unique aspects of materials in SSBs. These characterization efforts have yielded new understanding of the behavior of lithium metal anodes, alloy anodes, composite cathodes, and the interfaces of these various electrode materials with solid-state electrolytes (SSEs). This review provides a comprehensive overview of the characterization methods and strategies applied to SSBs, and it presents the mechanistic understanding of SSB materials and interfaces that has been derived from these methods. This knowledge has been critical for advancing SSB technology and will continue to guide the engineering of materials and interfaces toward practical performance.
25 ENERGY STORAGE↗
Dismai-Bench: benchmarking and designing generative models using disordered materials and interfaces
Dismai-Bench benchmarks generative models on datasets of large disordered materials and interfaces, through direct comparisons between training structures and generated structures.
Yong, Adrian Xiao Bin↗
Molecular Simulations of Ultrafast Radiation Induced Melting at Metal-Semiconductor Interfaces
Understanding radiation induced ultrafast melting at material interfaces is essential in designing robust electronic devices for aviation/space applications and in laser machining. While it is difficult to achieve the spatial and temporal resolution required to quantify the phenomenon experimentally, simulations can provide the detailed mechanisms of the structural changes that happen during phase transition. In this work, we use molecular simulations to study the effect of radiation damage on silicon carbide (SiC) - tungsten (W) interfaces which is of interest in high power electronics. A multi-scale approach is involved wherein the reactions at the interfaces are quantified using ab-initio molecular dynamics (MD) simulations and classical MD simulations are employed to understand the structural and diffusional changes across the material interface. Finally, coarse-grained Lennard-Jones type models are used to study the larger scale mechanisms and structures obtained due to the induced damages. We show that the response of the material to radiation damage depends on factors such as energy of the incident radiation, thermal properties, and molecular structure of the material.
Ravichandran, Ashwin↗
Robust 3D multi-material hydrodynamics using discontinuous Galerkin methods
A high-order discontinuous Galerkin (DG) method is presented for nonequilibrium multi-material (m ≥ 2) flow with sharp interfaces. Material interfaces are reconstructed using the algebraic THINC approach, resulting in a sharp interface resolution. The system assumes stiff velocity relaxation and pressure nonequilibrium. The presented DG method uses Dubiner's orthogonal basis functions on tetrahedral elements. This results in a unique combination of sharp multimaterial interfaces and high-order accurate solutions in smooth single-material regions. A novel shock indicator based on the interface conservation condition is introduced to mark regions with discontinuities. Slope limiting techniques are applied only in these regions so that nonphysical oscillations are eliminated while maintaining high-order accuracy in smooth regions. A local projection is applied on the limited solution to ensure discrete closure law preservation. The effectiveness of this novel limiting strategy is demonstrated for complex three-dimensional multi-material problems, where robustness of the method is critical. The presented numerical problems demonstrate that more accurate and efficient multi-material solutions can be obtained by the DG method, as compared to second-order finite volume methods.
97 MATHEMATICS AND COMPUTING↗
Construction of an Exact Pressure-Equilibrium Scheme for the Five-Equation Two-Phase Flow Model With Thermal Relaxation
Numerical simulation of compressible multiphase flows based on the four-equation (homogeneous relaxation) model is known to suffer from two fundamental difficulties with (a) wave propagation and (b) pressure equilibrium preservation. First, the mixture sound speed exhibits non-monotonic dependency with respect to the volume fraction, which leads to robustness issues in the resolution of shocks and acoustic wave propagation across two-phase regions. This difficulty can be mitigated by solving Allaire’s five-equation model augmented with infinitely fast phasic temperature equilibrium, from which solutions of the four-equation model can be recovered. However, when temperature is non-uniform, this augmented five-equation formulation still fails to preserve pressure equilibrium across material interfaces. In this work, we propose a fully conservative numerical scheme that exactly preserves pressure equilibrium at the discrete level for the augmented five-equation model, for arbitrary initial distributions of temperature and volume fraction. Combined with the monotonic sound speed property of the five-equation formulation, the proposed pressure-equilibrium preserving scheme significantly improves robustness in the presence of strong multiphase interactions, including shock–interface interactions and advection of material interfaces.
ESG↗
Optimum interface properties for metal matrix composites
Due to the thermal expansion coefficient mismatch (CTE) between the fiber and the matrix, high residual sresses exist in metal matrix composite systems upon cool down from processing temperature to room temperature. An interface material can be placed between the fiber and the matrix to reduce the high tensile residual stresses in the matrix. A computer program was written to minimize the residual stress in the matrix subject to the interface material properties. The decision variables are the interface modulus, thickness and thermal expansion coefficient. The properties of the interface material are optimized such that the average distortion energy in the matrix and the interface is minimized. As a result, the only active variable is the thermal expansion coefficient. The optimum modulus of the interface is always the minimum allowable value and the interface thickness is always the maximum allowable value, independent of the fiber/matrix system. The optimum interface thermal expansion coefficient is always between the values of the fiber and the matrix. Using this analysis, a survey of materials was conducted for use as fiber coatings in some specific composite systems.
Ghosn, Louis J.↗
Physics-informed neural networks for heterogeneous poroelastic media
This study presents a novel physics-informed neural network (PINN) framework for modeling poroelasticity in heterogeneous media with material interfaces. The approach introduces a composite neural network (CoNN) where separate neural networks predict displacement and pressure variables for each material. While sharing identical activation functions, these networks are independently trained for all other parameters. To address challenges posed by heterogeneous material interfaces, the CoNN is integrated with the Interface-PINNs (I-PINNs) framework (Sarma et al., Comput. Methods Appl. Mech. Eng. 429: 117135, 2024), allowing different activation functions across material interfaces. Further, this ensures accurate approximation of discontinuous solution fields and gradients. Performance and accuracy of this combined architecture were evaluated against the conventional PINNs approach, a single neural network (SNN) architecture, and the eXtended PINNs (XPINNs) framework through two one-dimensional benchmark examples with discontinuous material properties. The results show that the proposed CoNN with I-PINNs architecture achieves an RMSE that is two orders of magnitude better than the conventional PINNs approach and is at least 40 times faster than the SNN framework. Compared to XPINNs, the proposed method achieves an RMSE at least one order of magnitude better and is 40% faster.
42 ENGINEERING↗
Interface Conductance Under a Real Electronics Box
Electronics Boxes with high heat dissipations use a thermal interface material to increase heat transfer to the radiator in a vacuum/space environment. There are lots of materials to choose from, but for Spacecraft applications, there are more than high heat transfer metrics which must be met. Contamination (both particle generation and outgassing), ease of cutting, and removal are just as important metrics in material selection. However, vendor data of material thermal conductance is usually based on a 1" X 1" piece of material under high uniform pressures. Large Electronics boxes almost never have optimal pressures, as they are bolted along the perimeter and leave gaps in the center regions. In order to characterize the relative thermal conductance for large Electronics boxes, an 8" X 8" plate was fabricated to simulate an electronics box bottom and bolted around the perimeter to a cold plate. Various thermal interface materials were inserted between the box and cold plate, and overall thermal conductance's were calculated. A table was generated which compares the full gamut of thermal interface materials for large boxes, from a dry joint to a wet joint. Materials were placed in order of high to low conductance's, so an engineer can compare the benefit of each material in a real-world scenario.
Thermal Interface Conductance↗
Hierarchical Hybrid Multifunctional Materials through Interface Engineering
This project focuses on the development of stimuli-responsive hybrid multifunctional materials. We place emphasis on the design, synthesis, structural characterization, evaluation of functional properties (electronic, thermal and optical) of several (1-x)Cu 2 Se/(x)WBGS hierarchical bulk composites between Cu 2 Se, a narrow band gap semiconductor (NBGS), with a range of wider band gap semiconductors (WBGS) such as CuMSe 2 (M = Al, Ga, In, Fe, Cr) and Cu 4 TiSe 4 . Cu2Se is a well-studied NBGS with excellent thermoelectric properties (high electrical conductivity, large thermopower, etc.) while CuMSe 2 and Cu 4 TiSe 4 are high performance solar absorber materials (large band gap, large absorption coefficient, etc.). Our primary objectives are (i) to demonstrate the ability to integrate dissimilar functional properties such as large optical absorption coefficient and high electronic conductivity, within (1-x)Cu 2 Se/(x)WBGS composite; and (ii) to establish the correlation between the hierarchical structural entanglement of Cu 2 Se with WBGS (CuMSe 2 or Cu 4 TiSe 4 ) phase, the interactions between native electronic defects within the coexisting phases in the resulting (1-x)Cu 2 Se/(x)WBGS bulk composites , and the impacts on their electronic conductivity, thermal transport and optical properties.
36 MATERIALS SCIENCE↗
Material and Interface Engineering Strategies to Mitigate Decoherence in Superconducting Qubits
While significant strides have been made to increase the coherence time of superconducting qubits, further advancements are essential for realizing scalable quantum computing. Decoherence is often a result of loss and noise stemming from two-level systems and excess quasiparticles, arising due to material defects, fabrication processes, and ambient exposure, particularly at surfaces and interfaces. Our recent efforts to mitigate these decoherence mechanisms have employed a variety of strategies, including low-loss surface encapsulation materials, advanced substrate preparation techniques, modifications to metal film growth, and the development of novel fabrication processes. The structural and chemical properties of materials, surfaces, and interfaces are studied using scanning probe microscopy, electron microscopy, photoelectron spectroscopy, mass spectrometry, and X-ray diffraction, which is correlated to device performance metrics, including superconducting resonator internal quality factor and qubit T1 time. This information is used to identify and understand material sources of loss and their origins in the device fabrication process. Through multi-institution efforts within SQMS we have identified the loss mechanism of interstitial hydrogen in niobium-based devices and shown how standard fabrication processes introduce these hydrides, developing strategies to mitigate their formation.1 Furthermore, we have characterized the metal-substrate interface, including the loss of niobium-silicides formed at that interface, and developed silicon surface treatments that reduce atomic scale roughness and oxygen content at the metal-substrate and Josephson junction interfaces.2-4 By developing the connection between materials properties and the overall performance of superconducting quantum circuitry, we can develop fabrication strategies to mitigate material losses, thus supporting the ongoing efforts to enhance coherence time in superconducting quantum devices. 1. Torres-Castanedo, C. G.*, Goronzy, D. P.*, et al., Adv. Funct. Mater., 2401365 (2024) 2. Lu, X., et al., Phys. Rev. Materials 6, 064402 (2022) 3. Berti, G., Appl. Phys. Lett. 122, 192605 (2023) 4. Kopas, C. J., Goronzy, D. P., et al., arXiv:2408.02863 (2024)
Goronzy, Dominic P.↗