Soldering iron temperature indicator
Thermocouple implanted in metal mass simulates heat transfer characteristics of connection which is to be soldered. Light signals indicate whether temperature is right, too high, or too low.
Baker, C. D.↗
SEARCH · Engineering Papers
Results for “low temperature solder”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Application of thick-film technology to solar cell fabrication
Several uses of thick-film technology in solar cell fabrication are discussed. Wrap-around contacts are obtained by first printing and firing a dielectric over the edge and subsequently applying a low-firing temperature conductor. Interconnection of cells into arrays can be achieved by printing and co-firing thick-film pastes, soldering, or with heat-curing conductive epoxies on low-cost substrates. Despite ongoing research, printed (thick) film vitreous protective coatings do not yet offer sufficient optical uniformity and transparency for use on silicon. Ohmic contacts on n- and p-type silicon are considered.
Field, M. B.↗
Reliability Issues with Polymer and MnO2 Tantalum Capacitors for Space Applications
This presentation gives a comparative analysis of degradation processes, failure modes and mechanisms in MnO2 and polymer technology capacitors. Analyzed conditions include effects of vacuum and radiation, soldering (pop-corning), long-term storage, operation at high temperatures, stability at low and high temperatures, and anomalous transients. Screening and qualification procedures to assure space-grade quality of CPTCs are suggested.
capacitor↗
Reliability Issues with Polymer and MnO2 Tantalum Capacitors for Space Applications
This work gives a comparative analysis of degradation processes, failure modes and mechanisms in MnO2 and polymer technology capacitors. Analyzed conditions include effects of vacuum and radiation, soldering (pop-corning), long-term storage and operation at high temperatures, stability at low and high temperatures, and anomalous transients. Screening and qualification procedures to assure space-grade quality of CPTCs are suggested.
tantalum capacitors↗
Performance and Reliability of Solid Tantalum Capacitors at Cryogenic Conditions
Performance of different types of solid tantalum capacitors was evaluated at room and low temperatures, down to 15 K. The effect of temperature on frequency dependencies of capacitance, effective series resistances (ESR), leakage currents, and breakdown voltages has been investigated and analyzed. To assess thermo-mechanical robustness of the parts, several groups of loose capacitors and those soldered on FR4 boards were subjected to multiple (up to 500) temperature cycles between room temperature and 77 K. Experiments and mathematical modeling have shown that degradation in tantalum capacitors at low temperatures is mostly due to increasing resistance of the manganese cathode layer, resulting in substantial decrease of the roll-off frequency. Absorption currents follow a power law, I approximately t(sup -m), with the exponent m varying from 0.8 to 1.1. These currents do not change significantly at cryogenic conditions and the value of the exponent remains the same down to 15 K. Variations of leakage currents with voltage can be described by Pool-Frenkel and Schottky mechanisms of conductivity, with the Schottky mechanism prevailing at cryogenic conditions. Breakdown voltages of tantalum capacitors increase and the probability of scintillations decreases at cryogenic temperatures. However, breakdown voltages measured during surge current testing decrease at liquid nitrogen (LN) compared to room-temperature conditions. Results of temperature cycling suggest that tantalum capacitors are capable of withstanding multiple exposures to cryogenic conditions, but the probability of failures varies for different part types.
Teverovsky, Alexander↗
Advanced Joining Technology: Simple, Strong, and Secure
The space-age materials that NASA employs in its spacecraft and satellites have different attributes than the building materials that can work for Earthly uses. These materials do not behave like the typical construction materials, and therefore, require new methods for construction. Work done at NASA s Langley Research Center in the realm of active solder joining has led to a new, self-bonding solder that enables high conductivity, as well as the metallic joining of carbon and ceramic materials to a wide range of metals. The original work involved evaluating high- and low-temperature joining technologies for joining carbon composite structures for use in thermal management and reusable launch vehicles. The initial plan for this innovation was to lower the weight of battery packs in satellites. It was a success. NASA scientists found use for this technology in fabricating a thermal management package for battery compartments in the Earth Observing System (EOS) satellites, but it is also being used by the Agency for space radiator panels. Because it is light, simple to use, and economical, NASA will likely find other uses for this solder, just as outside of the Space Agency, this unique bond is finding many practical applications.
Source record↗
Low temperature cofired ceramic substrates and fabrication techniques for the same
A low temperature cofired ceramic substrate comprises a plurality of dielectric layers, at least one inner conductor layer, a plurality of bond pads, and a solder mask. The dielectric layers are formed from ceramic material and placed one on top of another to form a stack. The inner conductor is formed from electrically conductive paste and positioned on an upper surface of at least one inner dielectric layer. The bond pads are positioned on an outer surface of the stack. Each bond pad is formed from a plurality of conductive sublayers of thin film metal stacked one on top of another, with each conductive sublayer being formed from a different metal. The solder mask is positioned on the same outer surface of the stack as the bond pads and includes a plurality of openings, with each opening exposing at least a portion of one of the bond pads.
42 ENGINEERING↗
Unveiling 3D Morphology of Multiscale Micro-Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X-ray Nanotomography
The sintering processing–structure–property relationship of a multiscale silver materials is investigated: microparticles with nanofeatures, particularly on their three-dimensional (3D) morphology. The target application is to replace conventional lead-based solders in advanced electronic manufacturing. Unlike lead-based solders, silver powders are suited to satisfy increasingly demanding mechanical, electrical, and thermal requirements, meanwhile being free of health effect. Sintering the material at a low temperature and without applied pressure are desirable conditions, which results in a preferred use of silver nanoparticles, as nanofeatures have higher driving force to sinter with the decrease in particle size. However, nanosized powders present potential health/environmental effects. To address the trade-off between the benefits and shortcomings of nano-versus microparticles, this work studies a novel multiscale silver paste, namely micron-sized powders with nanosized features. To get quantitative 3D visualization of micro- and nanoscale features, ptychographic X-ray computed nanotomography is applied. The correlations between conditions (thermal aging, pressure, and substrate metallization), mechanical properties, and morphological parameters are established. Finally, using novel 3D X-ray nanoimaging technique, it is demonstrated that one can design multiscale materials while balancing complex demands required in advanced electronics manufacturing and research directions in materials design and characterization.
36 MATERIALS SCIENCE↗
Fabrication of silicon-tipped fiber-optic temperature sensors using aerogel-assisted glass soldering with precise laser heating
We demonstrate the fabrication of fiber-optic Fabry–Perot interferometer (FPI) temperature sensors by bonding a small silicon diaphragm to the tip of an optical fiber using low melting point glass powders heated by a 980 nm laser on an aerogel substrate. The heating laser is delivered to the silicon FPI using an optical fiber, while the silicon temperature is being monitored using a 1550 nm white-light system, providing localized heating with precise temperature control. The use of an aerogel substrate greatly improves the heating efficiency by reducing the thermal loss of the bonding parts to the ambient environment. A desirable temperature for bonding can be achieved with relatively small heating laser power. The bonding process is carried out in an open space at room temperature for convenient optical alignment. The precise temperature control ensures minimum perturbation to the optical alignment and no induced thermal damage to the optical parts during the bonding process. For demonstration, we fabricated a low-finesse and high-finesse silicon FPI sensor and characterized their measurement resolution and temperature capability. The results show that the fabrication method has a good potential for high-precision fabrication of fiber-optic sensors.
Sheng, Qiwen↗
Interdiffusion and Formation of Intermetallic Compounds in High-Temperature Power Electronics Substrate Joints Fabricated by Transient Liquid Phase Bonding
Power electronics packages typically comprise a dielectric substrate bonded to a metal layer and attached to heat sinks using a low-thermal-conductivity solder. These multiple layers increase the effective thermal resistance of the package and are responsible for package failures under cyclic thermal loads. Bonding the aluminum nitride dielectric layer (AlN) directly to a low coefficient of thermal expansion (CTE) aluminum silicon carbide (AlSiC) cold plate using copper-aluminum (Cu-Al) transient liquid phase (TLP) bonding has been shown to improve the mechanical reliability of the power electronic packages while making the package more compact by bringing the cooling solutions closer to the devices. This study aims to characterize the Cu-Al bonds formed during the TLP bonding of AlSiC with three different power electronics substrates: pure aluminum nitride (AlN), aluminum (DBA), and copper (DBC). The material compositions and microstructures of the bonds were analyzed using scanning electron microscopy (SEM), x-ray spectroscopy (EDS), confocal scanning acoustic microscopy (C-SAM), and x-ray diffraction (XRD). ..alpha..-Al solid compound was identified as the dominant phase in AlN-AlSiC and Al-AlSiC, with a notable presence of SiC particles. In contrast, three intermetallic phases - ..theta..-CuAl2, ..eta..-CuAl, and ..gamma..'- Cu9Al4 - were observed in the Cu-AlSiC bond. A computational solid-state diffusion model was developed to predict the intermetallic compounds (IMCs) formed during Cu-Al TLP bonding in each system, which supported the observation that an initial Cu volume fraction of 20 % in the material layers produced a final bond composition of >95 % Al with minimal IMC growth. However, increased Cu concentrations produced higher concentration gradients, leading to increased growth of IMCs, Kirkendall voids, and interstitial cracks.
DIRECT ENERGY CONVERSION↗
Cryogenic Quartz Crystal Microbalance
A radiatively cooled Cryogenic Quartz Crystal Microbalance designed to monitor highly volatile contaminants on the shuttle is described. Measurements are made with two 15-MHz microbalances having removable, optically polished sensors mounted in a radiant cooler. One sensor operates below the freezing point of water and monitors contamination including that of water vapor. The second sensor is heated and monitors the contamination background. It provides a reference from which the density of the water vapor cloud enveloping the shuttle is determined. The design incorporates a low-power dissipation oscillator, heaters for ice removal, and a method for attaching second-surface mirrors to the radiator employing an indium type solder instead of a room temperature vulcanizer.
D Mckeown↗
Demonstrated results of welded and soldered interconnections
Solar cell modules with welded and soldered interconnections were constructed using a flexible substrate material. These modules were thermally cycled between approx. 80 deg C at rates 100 cycles/day to demonstrate survivability under simulated low Earth orbit (LEO) temperature conditions. The modules, cycled in an inert atmosphere, show durability for 36,000 cycles.
Hart, R. E., Jr.↗
Optimization of Structurally Enhanced Solder Transient Liquid Phase Bonding
High temperature packaging technologies are a necessity for high temperature capable devices. SAC305 solder has an operational limit of 174°C imposed by creep effects which aligns well with current junction temperature limits of 175°C. Wide band gap semiconductor materials have the potential to reach junction temperatures of up to 800°C that are not currently attainable with significant reliability. Capitalizing on this potential will requires substrates and attachments that can operate well beyond the current 175°C standard. Silver sintering pastes have received widespread interest as a high temperature attachment alternative. However, the process requires high pressure bonding in an inert environment to achieve acceptable bond quality. Transient liquid phase (TLP) sintering is capable of good bond quality without pressure requirements but suffers from low thermal conductivity and only slightly reduced cost compared to silver sintering. SAC305 solder contains the same constituent materials for TLP as available copper-tin TLP sintering paste. By introducing engineered surface structures into the bond, intermetallic formation can be accelerated producing a bond similar to TLP sintering but in an ambient environment and for reduced cost. While this process has been demonstrated, it has not yet been optimized. Currently bonds are formed using a 75 μm stencil on substrate surface structures 24 μm tall, covering 19% of the bonding area. The process takes about 4 hours not including the formation of surface structures. Here, this study will center on the effects of stencil thickness and coating methods. Samples will be analyzed by scanning acoustic microscopy, die shear testing and cross sectional scanning acoustic microscopy.
42 ENGINEERING↗
Superconducting properties of commercially available solders for low-field applications
Solders with superconducting transitions around 4K are useful in low magnetic field environments for AC current leads or in electrical and mechanical bonds. Accurate knowledge of these solders’ superconducting properties is essential for improving high precision experiments. We have measured the electrical resistance of five commercially-available eutectic or near-eutectic solders: 50%Sn-50%Pb, 60%Sn-40%Pb, 60%Sn-40%Pb-0.3%Sb, 52%In-48%Sn, and 96.5%Sn-3.5%Ag, down to 2.3K and in applied magnetic fields from 0 to 0.1 T . We report critical temperatures T c (B), 90%–10% transition widths ΔT c , and zero-temperature critical fields B c,0 . Our best candidate for low-loss AC current wiring in low fields is 50%Sn-50%Pb, which has a zero-field T c,0 = 7.1K (with ΔT c = 0.6 K), and remained high at T c (0.1 T) = 6.9K (ΔT c = 0.6K ). We also report, for the first time, T c and B c of 60%Sn-40%Pb-0.3%Sb and B c,0 of 96.5%Sn-3.5%Ag. Our T c,0 - 3.31K (ΔT c = 0.08K) for 96.5%Sn-3.5%Ag disagrees with a widely adopted value.
Hickman, C. [North Carolina State University, Rale↗
Intern Designed Modules for Conducting Potential Microgravity Solidification Experiments Aboard the International Space Station
MMaJIC (Microgravity Materials Joining Investigation Chamber) is a modular experiment chamber for performing materials science investigations. MMaJIC was initially designed to provide a controlled and sealed test environment to accommodate a wide variety of soldering and brazing experiments. However, its modular cartridge design is well suited to easily conduct any number and variety of science experiments. SoLIDD (Solid Liquid Interface Directional Device) is an apparatus for conducting directional solidification experiments with low melting temperature alloys. It has capability for varying the sample’s temperature gradient and growth velocity thus ensuring microstructural development under controlled conditions. ICED-T (Interface Control Experiment with Directional Translation) is an apparatus that conducts directional solidification experiments of transparent materials such that direct observation/recording of the advancing solid/liquid interface can be made. Currently, it is a functional breadboard that consists of the components mounted to a surface that allows the sample to be placed in an upright position. Orientation of the experiment (solid on the bottom, liquid on top) is important during testing ground samples to maintain stability. Ultimately, the goal of MMaJIC, SoLIDD and ICED-T is to conduct successful ground tests and then be re-configured for eventual use by aboard the ISS.
McElderry, Justin↗
Improving solar panel durability through novel panel designs and advanced manufacturing equipment
Work in the project was spread across 4 main themes:1) Improved Understanding of Why Cracks Form and Cause Degradation in Solar Cells: We developed a finite element model which correlated well with experimental determined deflection vs load profiles and which predicted stress profiles vs load level and temperature. These profiles helped to guide brace designs and showed the high stress levels seen in the silicon near the interconnect wire locations as the temperature is cooled below -30C, likely forming "invisible" microcracks. Experiments showed how for polymer backsheet modules, a brief exposure to such low temperatures made modules extremely sensitive to propagation of these microcracks at relatively low load levels, and how thicker and softer encapsulant helped to reduce this crack sensitivity. We showed for some modules that most cracks that are seen under loading had their origin at short, hard to see, V-cracks from soldering damage, and how the shunting from cells with high densities of cracks reduces energy delivery more than Pmax. 2) Improved Durability Testing Methods With Respect to Cracked Cells: We lobbied the PV community throughout the project that IEC 61215 was insufficient to probe the sensitivity of module Pmax degradation due to cracks in that in did not have a test leg that included a crack creation step (static loading) followed by a crack opening step (cyclic loading and/or thermal cycling). We published extensively on how pre- existing cracks opened up with cyclic loading. The new IEC TS 63209-1 ED1 test sequence now include our recommendations, and this should lead to improved module designs and reduced risk for investors. We also published recommendations for a new "Cold Climate Test" sequence to probe the sensitivity of modules to degradation from short microcracks formed when modules see temperatures below -30C followed by front side loading. We participated in several USTAG meetings related to cracked cells, EL testing, and mechanical load testing and provided input to the group to improve new standards under consideration. We also showed how the act of performing an EL test can affect the test results due to heating from the injected current. 3) New Module Designs and Related Manufacturing Methods & Equipment: We demonstrated reduced crack sensitivity on encapsulated cell coupons the benefits of building protective compressive stress into the cells by laminating them in a bent state and then allowing the coupon to flatten out after lamination. Our attempts to scale this to the module level with a more manufacturable sequence did not demonstrate the same positive effects, but we hope that others will follow up with other variations on this bent lamination or bent cooling concept to make more durable modules. 4) New Module Mounting Designs: We explored a range of bracing concepts which pressed on the backsheet to slightly bow the glass outward and place cells in a state of protective compressive stress and to reduce the deflection under front side loads. These successfully reduced cell cracking and crack opening, but high static loads permanently deformed cost-effective braces, after which they provided little benefit. We settled on an elegant & effective solution – the RailPad, where lightweight bracing elements are placed between the mounting rail(s) and the backsheet, and the existing strength of the rails is used to prevent module deflection under load. New construction and retrofit designs were made, and test sites were implemented in FL and MA. We applied for RailPad patent protection.
14 SOLAR ENERGY↗
New Alloy for Glass-to-Metal Seals
Coefficient of thermal expansion approximates that of glass more closely. Alloy composed of about 60 percent iron, 40 percent nickel, and traces of six other elements. Developed as replacement for Kovar Fe/Ni/Co alloy in ferrule-and-tube assembly, new alloy has same strength, solderability, and compatibility with fuel as does Kovar. Used in glass-to-metal seals without excessive residual stresses. Potential for other applications in which low thermal expansion important; mechanical measuring devices and precise sliding parts that must function over wide temperature ranges.
Schmuck, A. J.↗
Electrical properties of epoxies and film resistors
The reliability of hybrid microcircuits has been enhanced in recent years by the use of organic adhesives as a replacement for solder and eutectics. The epoxies have been the most effective and widely used material for this application. Methods for measuring the electrical and mechanical properties of epoxies are developed. Data are given for selected conductive adhesives at high and low frequencies. The temperature coefficients of resistance of thick film resistors are presented.
Sergent, J. E.↗