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At least 37 records · Page 2

Long-term prediction test procedure for most ICs, based on linear response theory

Experimentally, thermal annealing is known to be a factor which enables a number of different integrated circuits (IC's) to recover their operating characteristics after suffering radiation damage in the space radiation environment; thus, decreasing and limiting long term cumulative total-dose effects. This annealing is also known to be accelerated at elevated temperatures both during and after irradiation. Linear response theory (LRT) was applied, and a linear response function (LRF) to predict the radiation/annealing response of sensitive parameters of IC's for long term (several months or years) exposure to the space radiation environment were constructed. Compressing the annealing process from several years in orbit to just a few hours or days in the laboratory is achieved by subjecting the IC to elevated temperatures or by increasing the typical spaceflight dose rate by several orders of magnitude for simultaneous radiation/annealing only. The accomplishments are as follows: (1) the test procedure to make predictions of the radiation response was developed; (2) the calculation of the shift in the threshold potential due to the charge distribution in the oxide was written; (3) electron tunneling processes from the bulk Si to the oxide region in an MOS IC were estimated; (4) in order to connect the experimental annealing data to the theoretical model, constants of the model of the basic annealing process were established; (5) experimental data obtained at elevated temperatures were analyzed; (6) time compression and reliability of predictions for the long term region were shown; (7) a method to compress test time and to make predictions of response for the nonlinear region was proposed; and (8) nonlinearity of the LRF with respect to log(t) was calculated theoretically from a model.

Litovchenko, V.↗

Assessing photovoltaic module life from long-term environmental tests

An assessment is made of results obtained by an experimental program having as its aim the identification of critical temperature-humidity bias degradation mechanisms in solar cell modules intended to have an operating lifetime of the order of 20-30 years. These mechanisms are studied in the context of conditions encountered over the course of long term operation in various sites in the U.S. Accelerated tests for the assessment of product lifetime entail the development of a correlation between test and application conditions; this has been accomplished through an analytical procedure for the correlation of time-varying field exposures to constant-stress accelerated environments.

Otth, D. H.↗

500 C Electronic Packaging and Dielectric Materials for High Temperature Applications

High-temperature environment operable sensors and electronics are required for exploring the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high temperature electronics, and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by these high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed. High-temperature environment operable sensors and electronics are required for probing the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and eventual applications of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high electronics and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed.

dielectric performance↗

Long-term storage test of a Syncom solid rocket motor

After 7.5 years of storage at ambient temperature, a solid propellant apogee motor was tested successfully. The performance of the motor did not deteriorate as a result of prolonged storage. Tabular performance data and graphic thrust and pressure variations are given.

Ray, R. L.↗

Long term storage test of titanium material with liquid fluorine propellant

The compatibility of 6AL-4V Ti with propellant grade GF2 and LF2 at 77 K for up to 3 years was investigated. Titanium double coupons, annealed or heat treated, with 16 or 64 RMS finishes, were immersed in F2 in individual Pyrex capsules and stored under LN2 for 29 and 39 months. Pre and post immersion tests were performed on the propellant and coupons. Chemical analysis of the propellant did not reveal any significant changes due to titanium corrosion. Gravimetric, visual, microscopic, and metallurgical examination with pitting analysis did not reveal gross corrosion of the titanium although pitting appears to be greater after 39 months exposure. The increase in pit size and number raises the possibility of unpredictable crack propagation instability. Fracture toughness tests are necessary to define this possibility.

Denson, J. R.↗

Assessing photovoltaic module degradation and lifetime from long term environmental tests

The photovoltaic module failure mechanisms related to temperature, humidity, and electrical bias are analyzed using the data collected over a period of 20 years from various sites in the U.S. The approach is based on measuring the rate dependence of the mechanisms on site stress levels, and then using the rate data to analytically estimate the field life by means of computer models of the site environment. A correlation is established between the accelerated constant-stress testing and the time-varying field exposures. Test results are presented for two failure mechanisms for a module design featuring polyvinyl butyral encapsulant for the temperature range of 85 to 100 C and 85-percent relative humidity.

Otth, D. H.↗

Testing Long-Term Exposure To Vacuum

Facility for studying long-term effects of vacuum on materials described in report. Vacuum storage system maintains specimens at constant temperature and high vacuum. Enables specimens to be removed easily and safely for analysis. Nitrogen storage system maintains specimens at 77 degree F in pure, dry nitrogen gas under gauge pressure of 2 to 4 psi. Enables comparison of control specimens with specimens exposed to vacuum. Instrumentation-and-control system measures and records operating parameters and generates control signals and alarm indications as necessary.

Clark, D. L.↗

Long-term photothermal/humidity testing of photovoltaic module polymer insulations and cover films

The life expectancies of Tedlar and other polymer films considered for use as cover materials in terrestrial photovoltaic (PV) modules were investigated by exposing them for more than 13,000 h on an outdoor test stand and for up to 10,000 h in several accelerated multistress environments. Visual observations and diagnostic analyses of weight and mechanical strength losses were periodically conducted to assess the nature and rate of degradation of mechanical properties and to assess the effects of film thickness and UV stabilizer content. Spectroscopic analyses of pristine and degraded materials linked weight and mechanical property losses to the underlying photothermal/photooxidation chemistry. It is shown that heavy doses of UV stabilizers prolong, while elevated temperatures shorten, the useful life of these materials; humidity plays only a minor role. The most heavily UV-stabilized films are expected to operate usefully in a PV module front-cover application for only five to ten years. The performance of none of the tested films appears consistent with the 20-30 year life goals of the PV industry.

Mon, G.↗

Long-term life testing of Geostationary Operational Environmental Satellite (GOES) encoder lamps

The aging characteristics and lifetimes of tungsten filament encoder lamps were determined as a function of operating voltage and filament material. For pure tungsten and thoria doped (1 pct.) filament lamps, crystal grain growth over the center portion of the filament leads to the ultimate failure of the lamp. The development of notches associated with this grain growth is the cause of lamp burn out. Eventually, one of the notches will 'etch' through the filament, causing it to fail open. For rhenium doped (3 pct.) filament lamps, distortion of the filament leads to the ultimate failure of the lamp. The lifetime of these lamps is about 1 year at an operating voltage of 5.0 volts. The pure tungsten filament lamps have the longest average lifetime, and the thoria doped filament lamps have the shortest at 5.0 volts. The lifetimes of these lamps is about 7 years at an operating voltage of 3.5 volts. Data suggest that the rhenium doped lamps will have the longest average lifetime at 3.5 volts, and the thoria doped will have the shortest. These lifetimes are comparable to the desired lifetimes of 7 years.

Powers, Charles E.↗

Results of the Mission Profile Life Test first test segment - Thruster J1

A series of long term test segments of 30 cm diameter mercury bombardment thrusters is being conducted as the Mission Profile Life Test. The first 4000 hour segment has been completed with the J series thruster, J1. Thruster and power processing units were controlled by computer with software algorithms governing normal functions of startup, throttle, and shutdown as well as automatically handling a variety of off-normal conditions. Thruster operation includes a discussion of the test chronology describing notable events and their significance. Post-test examination provides insight into thruster lifetime. Results are consistent with mission requirements of 15,000 hours at 2A

James, E. L.↗

Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Electronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.

High temperature↗

Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Electronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.

electronic packaging↗

Preliminary results of the mission profile life test of a 30 cm Hg bombardment thruster

Long term tests were performed on a 30 cm Hg bombardment thruster and a power processing unit to determine lifetime characteristics. The thruster performance data and other operational characteristics taken at various times during the test segment are presented and evaluated with the life limiting mechanisms: discharge chamber erosion, deposition and spalling, external erosion, cathode degradation, and propellant isolator leakage. The control algorithms for thruster start up, steady state operation, throttle, detection and correction of off normal conditions, and shutdown are discussed.

Bechtel, R. T.↗

Sample Acquisition and Analytical Chemistry Challenges to Verifying Compliance to Aviators Breathing Oxygen (ABO) Purity Specification

NASA has been developing and testing two different types of oxygen separation systems. One type of oxygen separation system uses pressure swing technology, the other type uses a solid electrolyte electrochemical oxygen separation cell. Both development systems have been subjected to long term testing, and performance testing under a variety of environmental and operational conditions. Testing these two systems revealed that measuring the product purity of oxygen, and determining if an oxygen separation device meets Aviator's Breathing Oxygen (ABO) specifications is a subtle and sometimes difficult analytical chemistry job. Verifying product purity of cryogenically produced oxygen presents a different set of analytical chemistry challenges. This presentation will describe some of the sample acquisition and analytical chemistry challenges presented by verifying oxygen produced by an oxygen separator - and verifying oxygen produced by cryogenic separation processes. The primary contaminant that causes gas samples to fail to meet ABO requirements is water. The maximum amount of water vapor allowed is 7 ppmv. The principal challenge of verifying oxygen produced by an oxygen separator is that it is produced relatively slowly, and at comparatively low temperatures. A short term failure that occurs for just a few minutes in the course of a 1 week run could cause an entire tank to be rejected. Continuous monitoring of oxygen purity and water vapor could identify problems as soon as they occur. Long term oxygen separator tests were instrumented with an oxygen analyzer and with an hygrometer: a GE Moisture Monitor Series 35. This hygrometer uses an aluminum oxide sensor. The user's manual does not report this, but long term exposure to pure oxygen causes the aluminum oxide sensor head to bias dry. Oxygen product that exceeded the 7 ppm specification was improperly accepted, because the sensor had biased. The bias is permanent - exposure to air does not cause the sensor to return to its original response - but the bias can be accounted for by recalibrating the sensor. After this issue was found, continuous measurements of water vapor in the oxygen product were made using an FTIR. The FTIR cell is relatively large, so response time is slow - but moisture measurements were repeatable and accurate. Verifying ABO compliance for oxygen produced by commercial cryogenic processes has a different set of sample acquisition and analytical chemistry challenges. Customers want analytical chemists to conserve as much as possible. Hygrometers are not exposed to hours of continuous flow of oxygen, so they don't bias, but small amounts of contamination in valves can cause a "fail". K bottles are periodically cleaned and recertified - after cleaning residual moisture can cause a "fail". Operators let bottle pressure drop to room pressure, introduce outside air into the bottle, and the subsequent fill will "fail". Outside storage of K‐bottles has allowed enough in‐leakage, so contents will "fail".

Graf, John↗

Preliminary results of the mission profile life test of a 30 cm Hg bombardment thruster

The paper deals with some preliminary results of the Mission Profile Life Test planned to conduct a program of long-term test segments of 30-cm diameter thrusters and power processing units under computer control. Thruster performance data and other operational characteristics taken at various times during a test segment are compared and the results are evaluated in light of the life-timing mechanisms. Thruster control algorithms are also presented. The first test segment completed 2700 hr of a planned 4000 hr test with a J-series 30-cm thruster. The last 1600 hr used a functional model power processing unit (PPU) operated in vacuum. The thruster-PPU was controlled by a computer with software developed to control start-ups, throttling, and variety of off-normal conditions.

Bechtel, R. T.↗