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At least 37 records · Page 2

Scatter in Carbon/Silicon Carbide (C/SiC) Composites Quantified

Carbon-fiber-reinforced silicon carbide matrix (C/SiC) composites processed by chemical vapor infiltration are candidate materials for aerospace thermal structures. Carbon fibers can retain properties at very high temperatures, but they are known to have poor oxidation resistance in adverse, high-temperature environments. Nevertheless, the combination of CVI-SiC matrix with higher stiffness and oxidation resistance, the interfacial coating, and additional surface-seal coating provides the necessary protection to the carbon fibers, and makes the material viable for high-temperature space applications operating under harsh environments. Furthermore, C/SiC composites, like other ceramic matrix composites (CMCs), exhibit graceful non-catastrophic failure because of various inherent energy dissipating mechanisms. The material exhibits nonlinearity in deformation even at very low stress levels. This is the result of the severe matrix microcracking present in the as processed composite because of large differences between the coefficients of thermal expansion of the fiber and the matrix. Utilization of these advanced composites in next generation space vehicles will require innovative structural configurations, updated materials, and refined analyses. Structural safety issues for these vehicles are in direct competition with performance and cost. One would have to quantify the uncertainties associated with the design using formal probabilistic methods. Specifically four fundamental aspects on which analyses are based-- (1) loading conditions, (2) material behavior, (3) geometrical configurations, and (4) structural connections between the composite components and baseline structure--are stochastic in nature. A direct way to formally account for uncertainties is to develop probabilistic structural analysis methods where all participating variables are described by appropriate probability density functions. The present work, however, focuses on analyzing the stochastic material behavior of these advanced composites using formal probabilistic analysis methods. Often, some of the desirable property characteristics that allow composites to offer advantages over conventional structural materials (like tailoring of composite properties) and the complexity are in fact responsible for their greater statistical variability and the requirements for more characterization tests. Composite properties are anisotropic as well, having different properties in different directions. This means that characterization of a property such as stiffness--which will vary greatly depending on the orientation of the fiber relative to the direction of the testing--must be repeated for several different directions and loading conditions. The fabrication process for composites also introduces statistical variations in properties and geometry. A composite part is produced in a number of steps, each of which introduces statistical variability. The matrix is usually produced from a combination of raw materials; and the fiber, which has its own set of properties, is often coated or surface treated, introducing yet another source of variability.

Murthy, Pappu L. N.↗

Challenges and Opportunities in Gen3 Embedded Cooling with High-Quality Microgap Flow

Gen3, Embedded Cooling, promises to revolutionize thermal management of advanced microelectronic systems by eliminating the sequential conductive and interfacial thermal resistances which dominate the present 'remote cooling' paradigm. Single-phase interchip microfluidic flow with high thermal conductivity chips and substrates has been used successfully to cool single transistors dissipating more than 40kW/sq cm, but efficient heat removal from transistor arrays, larger chips, and chip stacks operating at these prodigious heat fluxes would require the use of high vapor fraction (quality), two-phase cooling in intra- and inter-chip microgap channels. The motivation, as well as the challenges and opportunities associated with evaporative embedded cooling in realistic form factors, is the focus of this paper. The paper will begin with a brief review of the history of thermal packaging, reflecting the 70-year 'inward migration' of cooling technology from the computer-room, to the rack, and then to the single chip and multichip module with 'remote' or attached air- and liquid-cooled coldplates. Discussion of the limitations of this approach and recent results from single-phase embedded cooling will follow. This will set the stage for discussion of the development challenges associated with application of this Gen3 thermal management paradigm to commercial semiconductor hardware, including dealing with the effects of channel length, orientation, and manifold-driven centrifugal acceleration on the governing behavior.

microchannel↗

Understanding Thermal Transport in Polymer –Silver Nanowire Composites

Understanding thermal transport across filler-polymer interfaces and filler-filler contacts within polymer composites is of great importance for better thermal design of the composites that are widely used in high-performance heat exchangers, energy storage devices, and flexible electronics. Over the past several decades, considerable progress has been made in improving the thermal conductivity of polymer composites, but several key questions concerning the influence of interfacial thermal resistance, or Kapitza resistance, still remain. Firstly, the thermal properties of these composites are highly dependent on thermal transport through the filler network and its contacts. For metallic nanofillers, the thermal conductivity is often estimated using the Wiedemann-Franz law based on electrical conductivity; however, it remains a question whether the Wiedemann-Franz law still holds at nanoscale contacts. Through investigation of silver nanowires of varying sizes, we were able to demonstrate that the Lorenz number for silver nanowire increases with decreasing nanowire diameter. Examination of the corresponding electrical and thermal conductivities indicate that these changes are due to that the relative contribution of phonons becomes more significant as a result of elastic stiffening. Furthermore, we show that for silver nanowires, the contact thermal resistance is ~8 times lower than that of multi-walled carbon nanotube (MWCNT) of similar diameters. Additionally, through systematic studies of electrospun polymer-silver nanowire composite nanofibers, we investigated the impact of interface morphology on the thermal conductivity enhancement of the composite system and probed the value of the Kapitza resistance for individual polymer-filler interfaces. For polymer nanofibers containing continuous, single silver nanowires, the thermal conductivity increases linearly with increasing volume fraction of silver, which is consistent with the prediction of percolation theory for samples above the percolation limit. By comparing this linear trend to the measured thermal conductivities of composite nanofibers with more complex structures, we were able to determine the resistance associated with any additional polymer-filler boundaries. In doing so we find that the thermal boundary resistance for polyvinylpyrrolidone (PVP)–silver interfaces is significantly lower than that of comparable polymer-MWCNT composite systems.Together our studies provide new insights into thermal transport in polymer nanocomposites and should help facilitate the design of high performance polymeric thermal interface material.

Thermal transport↗

Understanding Thermal Transport in Polymer - Silver Nanowire Composites

Understanding thermal transport across filler-polymer interfaces and filler-filler contacts within polymer composites is of great importance for better thermal design of the composites that are widely used in high-performance heat exchangers, energy storage devices, and flexible electronics. Over the past several decades, considerable progress has been made in improving the thermal conductivity of polymer composites, but several key questions concerning the influence of interfacial thermal resistance, or Kapitza resistance, still remain. Firstly, the thermal properties of these composites are highly dependent on thermal transport through the filler network and its contacts. For metallic nanofillers, the thermal conductivity is often estimated using the Wiedemann-Franz law based on electrical conductivity; however, it remains a question whether the Wiedemann-Franz law still holds at nanoscale contacts. Through investigation of silver nanowires of varying sizes, we were able to demonstrate that the Lorenz number for silver nanowire increases with decreasing nanowire diameter. Examination of the corresponding electrical and thermal conductivities indicate that these changes are due to that the relative contribution of phonons becomes more significant as a result of elastic stiffening. Furthermore, we show that for silver nanowires, the contact thermal resistance is ~8 times lower than that of multi-walled carbon nanotube (MWCNT) of similar diameters. Additionally, through systematic studies of electrospun polymer-silver nanowire composite nanofibers, we investigated the impact of interface morphology on the thermal conductivity enhancement of the composite system and probed the value of the Kapitza resistance for individual polymer-filler interfaces. For polymer nanofibers containing continuous, single silver nanowires, the thermal conductivity increases linearly with increasing volume fraction of silver, which is consistent with the prediction of percolation theory for samples above the percolation limit. By comparing this linear trend to the measured thermal conductivities of composite nanofibers with more complex structures, we were able to determine the resistance associated with any additional polymer-filler boundaries. In doing so we find that the thermal boundary resistance for polyvinylpyrrolidone (PVP)–silver interfaces is significantly lower than that of comparable polymer-MWCNT composite systems. Together our studies provide new insights into thermal transport in polymer nanocomposites and should help facilitate the design of high performance polymeric thermal interface material.

Matthew L. Fitzgerald↗

Development of silicon nitride of improved toughness

The application of reaction sintered Si2N4 energy absorbing surface layers to hot-pressed Si3N4 was investigated. The surface layer was formed by in-place nitridation of silicon powder. It was found that reaction sintered Si3N4 layers of 1 mm thickness, fabricated from either -100, +200, -200, or -325 mesh Si powder and nitrided in 96% N2/4% H2 so that approximately 20-25 vol % unnitrided Si remained in the layer, resulted in a sevenfold increase in ballistic impact resistance of a 0.64 cm thick hot-pressed SI3N4 substrate from RT 1370 C. Both NC-132 SI3N4, with MgO additive, and NCX-34 Si3N4, with Y2O3 additive, were evaluated as substrate material. The finer grain size -200 and -325 mesh nitrided Si layers were for their smoothness and relatively high density. It was found that nitriding in N2/H2 mixtures, rather than pure N2, resulted in a microstructure that did not substantially degrade the strength of the hot-pressed Si3N4 substrate. Thermal cycling tests on the RSSN/HPSN combinations from 200 C to 1370 C for 75 cycles in air did not degrade the impact resistance nor the interfacial bonding, although a large amount of internal silica formation occurred within the RSSN layer. Mach 0.8, 5 hr, hot gas erosion tests showed no surface recession of RSSN layers at 1200 C and slight surface recession at 1370 C.

Brennan, J. J.↗

Secondary Li battery incorporating 12-Crown-4 ether

A rechargeable lithium battery which utilizes a polyethylene oxide (PEO) solid polymeric electrolyte complexed with a lithium salt is disclosed. The conductivity is increased an order of magnitude and interfacial charge transfer resistance is substantially decreased by incorporating a minor amount of 12-Crown-4 ether in the PEO-lithium salt solid electrolyte film. Batteries containing the improved electrolyte permit operation at a lower temperature with improved efficiency.

Nagasubramanian, Ganesan↗

Prediction of Material Properties of Nanostructured Polymer Composites Using Atomistic Simulations

Atomistic models of epoxy polymers were built in order to assess the effect of structure at the nanometer scale on the resulting bulk properties such as elastic modulus and thermal conductivity. Atomistic models of both bulk polymer and carbon nanotube polymer composites were built. For the bulk models, the effect of moisture content and temperature on the resulting elastic constants was calculated. A relatively consistent decrease in modulus was seen with increasing temperature. The dependence of modulus on moisture content was less consistent. This behavior was seen for two different epoxy systems, one containing a difunctional epoxy molecule and the other a tetrafunctional epoxy molecule. Both epoxy structures were crosslinked with diamine curing agents. Multifunctional properties were calculated with the nanocomposite models. Molecular dynamics simulation was used to estimate the interfacial thermal (Kapitza) resistance between the carbon nanotube and the surrounding epoxy matrix. These estimated values were used in a multiscale model in order to predict the thermal conductivity of a nanocomposite as a function of the nanometer scaled molecular structure.

Hinkley, J.A.↗

Sources of Uncertainty in Ultrasonic Phase-Based Assessment of Interfacial Stiffness in Adhesive Joints

Quantitative nondestructive evaluation (NDE) of adhesive joint strength is critical for certifying fastener-free bonded aerospace structures. Unfortunately, available adhesive NDE approaches are only suitable for detecting gross defects and delamination and cannot reliably detect variations in strength in intact bonds. Intact (i.e., nominally defect free) bonds are challenging to inspect because they, by definition, contain no macroscopic defects that would produce a strong NDE signature. Even in the absence of obvious defects, however, bond strength can vary substantially due to factors such as contamination, variations in the adhesive cure processes, and environmental exposure. For ultrasonic bond inspections, the effect of interactions from an imperfect adhesive interface are subtle and may include changes in the frequency content or phase of the ultrasonic signal. The bond condition can be deduced from these subtle changes in the acoustic response using an accompanying physics-based model of adhesive joint interaction. For example, researchers have used the spring network adhesion model of Baik and Thompson [1] to determine the interfacial stiffness of the joint from its ultrasonic response (e.g., [2]). This interfacial stiffness metric describes the bonds resistance to separation between the adhesive and adherent and has shown a strong correlation with joint strength. In this study, interfacial stiffness is assessed using the ultrasonic phase change associated with bond interaction in varying bond conditions. The phase change is measured precisely using a phase-locked-loop instrument over a swept range of frequencies. The phase transition at resonance, where the bond thickness is half the acoustic wavelength, produces a unique signature with which to fit a physics-based model. Interfacial stiffness is determined by minimizing the difference between the theoretical and experimental phase response. Experimental results are presented for glass specimens bonded with aerospace adhesives and a sensitivity analysis is performed to examine the effects of parameters that may be uncertain in the industrial inspection environment – namely bond thickness, adhesive and adherent properties, and porosity. The results are a first step toward an uncertainty quantified version of the measurement technique, show correlation between interfacial stiffness and bond strength, and are another key step toward maturing this approach for use in complex materials and joint geometries. [1] Baik, J.M. and Thompson, R.B., 1984. “Ultrasonic scattering from imperfect interfaces: a quasi-static model”. Journal of Nondestructive Evaluation, 4. [2] Haldren, H.A., Perey, D.F., Yost, W.T., Cramer, K.E., and Gupta, M.C., 2019. “Swept-frequency ultrasonic phase evaluation of adhesive bonding in tri-layer structures”. Journal of the Acoustical Society of America, 145.

Matt Webster↗

Isothermal life prediction of composite lamina using a damage mechanics approach

A method for predicting isothermal plastic fatigue life of a composite lamina is presented in which both fibers and matrix are isotropic materials. In general, the fatigue resistances of the matrix, fibers, and interfacial material must be known in order to predict composite fatigue life. Composite fatigue life is predicted using only the matrix fatigue resistance due to inelasticity micromechanisms. The effect of the fiber orientation on loading direction is accounted for while predicting composite life. The application is currently limited to isothermal cases where the internal thermal stresses that might arise from thermal strain mismatch between fibers and matrix are negligible. The theory is formulated to predict the fatigue life of a composite lamina under either load or strain control. It is applied currently to predict the life of tungsten-copper composite lamina at 260 C under tension-tension load control. The calculated life of the lamina is in good agreement with available composite low cycle fatigue data.

Abuelfoutouh, Nader M.↗

Isothermal life prediction of composite lamina using a damage mechanics approach

A method for predicting isothermal plastic fatigue life of a composite lamina is presented in which both fibers and matrix are isotropic materials. In general, the fatigue resistances of the matrix, fibers, and interfacial material must be known in order to predict composite fatigue life. Composite fatigue life is predicted using only the matrix fatigue resistance due to inelasticity micromechanisms. The effect of the fiber orientation on loading direction is accounted for while predicting composite life. The application is currently limited to isothermal cases where the internal thermal stresses that might arise from thermal strain mismatch between fibers and matrix are negligible. The theory is formulated to predict the fatigue life of a composite lamina under either load or strain control. It is applied currently to predict the life of tungsten-copper composite lamina at 260 C under tension-tension load control. The calculated life of the lamina is in good agreement with available composite low cycle fatigue data.

Abuelfoutouh, Nader Mohamed↗

Glass-Si heterojunction solar cells

Experimental studies and models for In2O3/Si and SnO2/N-Si solar cells are considered for their suitability in terrestrial applications. The silicon is the active material, and the glass serves as the window to solar radiation, an antireflection coating of the Si, and a low resistance contact. Results show that amorphous windows or layers suppress photocurrent. The interfacial SiO2 layer suppresses photocurrent and increases series resistance. Suppression increases with illumination.

Anderson, R. L.↗

Quality optimization of thermally sprayed coatings produced by the JP-5000 (HVOF) gun using mathematical modeling

Currently, thermal barrier coatings (TBC) of gas-turbine blades and similar applications have centered around the use of zirconia as a protective coating for high thermal applications. The advantages of zirconia include low thermal conductivity and good thermal shock resistance. Thermally sprayed tungsten carbide hardface coatings are used for a wide range of applications spanning both the aerospace and other industrial markets. Major aircraft engine manufacturers and repair facilities use hardface coatings for original engine manufacture (OEM), as well as in the overhaul of critical engine components. The principle function of these coatings is to resist severe wear environments for such wear mechanisms as abrasion, adhesion, fretting, and erosion. The (JP-5000) thermal spray gun is the most advanced in the High Velocity Oxygen Fuel (HVOF) systems. Recently, it has received considerable attention because of its relative low cost and its production of quality coatings that challenge the very successful but yet very expensive Vacuum Plasma Spraying (VPS) system. The quality of thermal spray coatings is enhanced as porosity, oxidation, residual stress, and surface roughness are reduced or minimized. Higher densification, interfacial bonding strength, hardness and wear resistance of coating are desirable features for quality improvement.

Tawfik, Hazem↗

Interfacial temperatures and surface heat fluxes during a blade-seal rubbing process

A thermal analysis was made of a blade-seal configuration to determine the effects of thermal contact resistance, blade speed, and thermal properties upon the interfacial temperature. The analysis disclosed that while the thermal properties of the blade or the seal specimen strongly affect the temperatures in their respective parts, the factors which control the overall temperature field are the contact resistance and the heat generated at the interface.

Emery, A. F.↗

Solenoid valve design minimizes vibration and sliding wear problem

Two-way cryogenic solenoid valve resists damage from vibration and metallic interfacial sliding. The new system features a flat-faced armature guided by a flexure disk which eliminates sliding surfaces and is less subject to contamination and wear.

Gillon, W. A., Jr.↗

Effect of Layer-Graded Bond Coats on Edge Stress Concentration and Oxidation Behavior of Thermal Barrier Coatings

Thermal barrier coating (TBC) durability is closely related to design, processing and microstructure of the coating Z, tn systems. Two important issues that must be considered during the design of a thermal barrier coating are thermal expansion and modulus mismatch between the substrate and the ceramic layer, and substrate oxidation. In many cases, both of these issues may be best addressed through the selection of an appropriate bond coat system. In this study, a low thermal expansion and layer-graded bond coat system, that consists of plasma-sprayed FeCoNiCrAl and FeCrAlY coatings, and a high velocity oxyfuel (HVOF) sprayed FeCrAlY coating, is developed to minimize the thermal stresses and provide oxidation resistance. The thermal expansion and oxidation behavior of the coating system are also characterized, and the strain isolation effect of the bond coat system is analyzed using the finite element method (FEM). Experiments and finite element results show that the layer-graded bond coat system possesses lower interfacial stresses. better strain isolation and excellent oxidation resistance. thus significantly improving the coating performance and durability.

Zhu, Dongming↗

Controlled intermittent interfacial bond concept for composite materials

Concept will enhance fracture resistance of high-strength filamentary composite without degrading its tensile strength or elastic modulus. Concept provides more economical composite systems, tailored for specific applications, and composite materials with mechanical properties, such as tensile strength, fracture strain, and fracture toughness, that can be optimized.

Marston, T. U.↗

The metal to metal interface and its effect on adhesion and friction

The paper considers the interface between two bulk metals and the effect of this interface on adhesive bonding, resistance to tangential displacements, friction and the interfacial transport from one surface to another. Using Auger emission spectroscopy, field ion microscopy, and low energy electron diffraction techniques, the influence of surface orientation, lattice registry, crystal lattice structure and defects, metal surface chemistry and alloying on the characteristics of the interface was studied for noble, platinum, transition, and Group 4B metals. With dissimilar metals in contact, epitaxial transfer of the cohesively weaker to the cohesively stronger metal has been observed. Surface chemical activity of the noble and platinum metals is shown to affect interfacial behavior as does a valence bonding in the transition metals, and the degree of metallic nature in the Group 4B elements. Alloying elements, e.g., Si and Fe, can alter interfacial behavior by segregation to the surface of metals or by altering bulk properties such as crystal transformation kinetics.

Buckley, D. H.↗