Autonomous Control Strategies for Interconnected DC Microgrid Applications with Multiple DER Resource Penetration.
Abstract not provided.
Gonzalez-Candelario, Carlos O.↗
SEARCH · Engineering Papers
Results for “interconnection application”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Advanced Interconnect Roadmap For Space Applications
A roadmap giving technology forecasts and recommendations for research direction for advanced electronic interconnection technology for space applications is presented.
interconnection↗
Novel Three-Dimensional Vertical Interconnect Technology for Microwave and RF Applications
In this paper, novel 3D interconnects suitable for applications in microwave and RF integrated circuit technology have been presented. The interconnect fabrication process and design details are presented. In addition, measured and numerically modeled results of the performance of the interconnects have been shown. The results indicate that the proposed technology has tremendous potential applications in integrated circuit technology. C,
Goverdhanam, Kavita↗
Study of interconnect errors, network congestion, and applications characteristics for throttle prediction on a large scale HPC system
Today’s High Performance Computing (HPC) systems contain thousand of nodes which work together to provide performance in the order of petaflops. The performance of these systems depends on various components like processors, memory, and interconnect. Among all, interconnect plays a major role as it glues together all the hardware components in an HPC system. A slow interconnect can impact a scientific application running on multiple processes severely as they rely on fast network messages to communicate and synchronize frequently. Unfortunately, the HPC community lacks a study that explores different interconnect errors, congestion events and applications characteristics on a large-scale HPC system. In our previous work, we process and analyze interconnect data of the Titan supercomputer to develop a thorough understanding of interconnects faults, errors, and congestion events. In this work, we first show how congestion events can impact application performance. We then investigate application characteristics interaction with interconnect errors and network congestion to predict applications encountering congestion with more than 90% accuracy.
97 MATHEMATICS AND COMPUTING↗
Advanced Interconnect Roadmap for Space Applications
This paper presents the NASA electronic parts and packaging program for space applications. The topics include: 1) Forecasts; 2) Technology Challenges; 3) Research Directions; 4) Research Directions for Chip on Board (COB); 5) Research Directions for HDPs: Multichip Modules (MCMs); 6) Research Directions for Microelectromechanical systems (MEMS); 7) Research Directions for Photonics; and 8) Research Directions for Materials. This paper is presented in viewgraph form.
Galbraith, Lissa↗
Flat conductor cable design, manufacture, and installation
Pertinent information for hardware selection, design, manufacture, and quality control necessary for flat conductor cable interconnecting harness application is presented. Comparisons are made between round wire cable and flat conductor cable. The flat conductor cable interconnecting harness systems show major cost, weight, and space savings, plus increased system performance and reliability. The design application section includes electrical characteristics, harness design and development, and a full treatise on EMC considerations. Manufacturing and quality control sections pertain primarily to the developed conductor-contact connector system and special flat conductor cable to round wire cable transitions.
Angele, W.↗
Characterization of Fine-Pitch Interconnects for Long-Lifetime HI Applications
This conference talk discusses optimizing gold-gold and gold-ENIG fine-pitch interconnections for Heterogeneous Integration applications, with a focus on longevity. We first look at electrical data from gold-gold bumps subjected to highly accelerated lifetime testing. Then, we discuss using chemical and physical data as a predictor for ENIG bump flip-chip success.
Humphrey, Nicholas James [Sandia National Laborato↗
Design and implementation of I/O performance prediction scheme on HPC systems through large-scale log analysis
Abstract Large-scale high performance computing (HPC) systems typically consist of many thousands of CPUs and storage units used by hundreds to thousands of users simultaneously. Applications from large numbers of users have diverse characteristics, such as varying computation, communication, memory, and I/O intensity. A good understanding of the performance characteristics of each user application is important for job scheduling and resource provisioning. Among these performance characteristics, I/O performance is becoming increasingly important as data sizes rapidly increase and large-scale applications, such as simulation and model training, are widely adopted. However, predicting I/O performance is difficult because I/O systems are shared among all users and involve many layers of software and hardware stack, including the application, network interconnect, operating system, file system, and storage devices. Furthermore, updates to these layers and changes in system management policy can significantly alter the I/O behavior of applications and the entire system. To improve the prediction of the I/O performance on HPC systems, we propose integrating information from several different system logs and developing a regression-based approach to predict the I/O performance. Our proposed scheme can dynamically select the most relevant features from the log entries using various feature selection algorithms and scoring functions, and can automatically select the regression algorithm with the best accuracy for the prediction task. The evaluation results show that our proposed scheme can predict the write performance with up to 90% prediction accuracy and the read performance with up to 99% prediction accuracy using the real logs from the Cori supercomputer system at NERSC.
97 MATHEMATICS AND COMPUTING↗
InGaAs/InP Monolithic Interconnected Modules (MIM) for Thermophotovoltaic Applications
There has been a traditional trade-off in thermophotovoltaic (TPV) energy conversion development between systems efficiency and power density. This trade-off originates from the use of front surface spectral controls such as selective emitters and various types of filters. A monolithic interconnected module (MIM) structure has been developed which allows for both high power densities and high system efficiencies. The MIM device consists of many individual indium gallium arsenide (InGaAs) devices series -connected on a single semi-insulating indium phosphide (InP) substrate. The MIMs are exposed to the entire emitter output, thereby maximizing output power density. An infrared (IR) reflector placed on the rear surface of the substrate returns the unused portion of the emitter output spectrum back to the emitter for recycling, thereby providing for high system efficiencies. Initial MIM development has focused on a 1 sq cm device consisting of eight series interconnected cells. MIM devices, produced from 0,74 eV InGAAs, have demonstrated V(sub infinity) = 3.23 volts, J(sub sc) = 70 mA/sq cm and a fill factor of 66% under flashlamp testing. Infrared (IR) reflectance measurement (less than 2 microns) of these devices indicate a reflectivity of less than 82%. MIM devices produced from 0.55 eV InGaAs have also been den=monstrated. In addition, conventional p/n InGaAs devices with record efficiencies (11.7% AM1) have been demonstrated.
Wilt, David M.↗
Manipulator interactive design with interconnected flexible elements
This paper describes the development of an analysis tool for the interactive design of control systems for manipulators and similar electro-mechanical systems amenable to representation as structures in a topological chain. The chain consists of a series of elastic bodies subject to small deformations and arbitrary displacements. The bodies are connected by hinges which permit kinematic constraints, control, or relative motion with six degrees of freedom. The equations of motion for the chain configuration are derived via Kane's method, extended for application to interconnected flexible bodies with time-varying boundary conditions. A corresponding set of modal coordinates has been selected. The motion equations are imbedded within a simulation that transforms the vector-dyadic equations into scalar form for numerical integration. The simulation also includes a linear, time-invariant controler specified in transfer function format and a set of sensors and actuators that interface between the structure and controller. The simulation is driven by an interactive set-up program resulting in an easy-to-use analysis tool.
Singh, R. P.↗
Extending OpenSHMEM with Aggregation Support for Improved Message Rate Performance
OpenSHMEM is a highly efficient one-sided communication API that implements the PGAS parallel programming model, and is known for its low latency communication operations that can be mapped efficiently to RDMA capabilities of network interconnects. However, applications that use OpenSHMEM can be sensitive to point-to-point message rates, as many-to-many communication patterns can generate large amounts of small messages which tend to overwhelm network hardware that has predominantly been optimised for bandwidth over message rate. Additionally, many important emerging classes of problems such as data analytics are similarly troublesome for the irregular access patterns they employ. Message aggregation strategies have been proven to significantly enhance network performance, but their implementation often involves complex restructuring of user code, making them unwieldy. This paper shows how to combine the best qualities of message aggregation within the communication model of OpenSHMEM such that applications with small and irregular access patterns can improve network performance while maintaining their algorithmic simplicity. We do this by providing a path to a message aggregation framework called conveyors through a minimally intrusive OpenSHMEM extension introducing aggregation contexts that fit more naturally to the OpenSHMEM atomics, gets, and puts model. We test these extensions using four of the bale 3.0 applications which contain essential many-to-many access patterns to show how they can produce performance improvements of up to 65×.
Welch, Aaron↗
Beam lead technology
Beam lead technology for microcircuit interconnections with applications to metallization, passivation, and bonding
Anderson, K.↗
Panel A report: Standards needed to interconnect ADS pilots for data sharing for catalogues, directories, and dictionaries
User requirements, guidelines, and standards for interconnecting an Applications Data Service (ADS) program for data sharing are discussed. Methods for effective sharing of information (catalogues, directories, and dictionaries) among member installations are addressed. An ADS Directory/Catalog architectural model is also given.
Source record↗
Panel B report: Standards needed to interconnect ADS pilots for data sharing for user interfaces
Requirements for standards and guidelines related to user interfaces for interconnecting an Applications Data Service pilot program are discussed. Key elements considered were: (1) dial up procedures, (2) terminals (minimum, desirable, extended capability), (3) common capabilities, (4) language interfaces (query, command, menu), and (5) display capabilities.
Source record↗
Panel C report: Standards needed for the use of ISO Open Systems Interconnection - basic reference model
The use of an International Standards Organization (ISO) Open Systems Interconnection (OSI) Reference Model and its relevance to interconnecting an Applications Data Service (ADS) pilot program for data sharing is discussed. A top level mapping between the conjectured ADS requirements and identified layers within the OSI Reference Model was performed. It was concluded that the OSI model represents an orderly architecture for the ADS networking planning and that the protocols being developed by the National Bureau of Standards offer the best available implementation approach.
Source record↗
High End Computer Network Testbedding at NASA Goddard Space Flight Center
The Earth & Space Data Computing (ESDC) Division, at the Goddard Space Flight Center, is involved in development and demonstrating various high end computer networking capabilities. The ESDC has several high end super computers. These are used to run: (1) computer simulation of the climate systems; (2) to support the Earth and Space Sciences (ESS) project; (3) to support the Grand Challenge (GC) Science, which is aimed at understanding the turbulent convection and dynamos in stars. GC research occurs in many sites throughout the country, and this research is enabled by, in part, the multiple high performance network interconnections. The application drivers for High End Computer Networking use distributed supercomputing to support virtual reality applications, such as TerraVision, (i.e., three dimensional browser of remotely accessed data), and Cave Automatic Virtual Environments (CAVE). Workstations can access and display data from multiple CAVE's with video servers, which allows for group/project collaborations using a combination of video, data, voice and shared white boarding. The ESDC is also developing and demonstrating the high degree of interoperability between satellite and terrestrial-based networks. To this end, the ESDC is conducting research and evaluations of new computer networking protocols and related technologies which improve the interoperability of satellite and terrestrial networks. The ESDC is also involved in the Security Proof of Concept Keystone (SPOCK) program sponsored by National Security Agency (NSA). The SPOCK activity provides a forum for government users and security technology providers to share information on security requirements, emerging technologies and new product developments. Also, the ESDC is involved in the Trans-Pacific Digital Library Experiment, which aims to demonstrate and evaluate the use of high performance satellite communications and advanced data communications protocols to enable interactive digital library data access between the U. S. Library of Congress, the National Library of Japan and other digital library sites at 155 MegaBytes Per Second. The ESDC participation in this program is the Trans-Pacific access to GLOBE visualizations in real time. ESDC is participating in the Department of Defense's ATDNet with Multiwavelength Optical Network (MONET) a fully switched Wavelength Division Networking testbed. This presentation is in viewgraph format.
Gary, James Patrick↗
Radiation-Tolerant, SpaceWire-Compatible Switching Fabric
Current and future near-Earth and deep space exploration programs and space defense programs require the development of robust intra-spacecraft serial data transfer electronics that must be reconfigurable, fault-tolerant, and have the ability to operate effectively for long periods of time in harsh environmental conditions. Existing data transfer systems based on state-of-the-art serial data transfer protocols or passive backplanes are slow, power-hungry, and poorly reconfigurable. They provide limited expandability and poor tolerance to radiation effects and total ionizing dose (TID) in particular, which presents harmful threats to modern submicron electronics. This novel approach is based on a standard library of differential cells tolerant to TID, and patented, multi-level serial interface architecture that ensures the reliable operation of serial interconnects without application of a data-strobe or other encoding techniques. This proprietary, high-speed differential interface presents a lowpower solution fully compatible with the SpaceWire (SW) protocol. It replaces a dual data-strobe link with two identical independent data channels, thus improving the system s tolerance to harsh environments through additional double redundancy. Each channel incorporates an automatic line integrity control circuitry that delivers error signals in case of broken or shorted lines.
Katzman, Vladimir↗
Broad Frequency LTCC Vertical Interconnect Transition for Multichip Modules and System on Package Applications
Various stripline structures and flip chip interconnect designs for high-speed digital communication systems implemented in low temperature co-fired ceramic (LTCC) substrates are studied in this paper. Specifically, two different transition designs from edge launch 2.4 millimeter connectors to stripline transmission lines embedded in LTCC are discussed. After characterizing the DuPont (sup trademark) 9K7 green tape, different designs are proposed to improve signal integrity for high-speed digital data. The full-wave simulations and experimental data validate the presented designs over a broad frequency band from Direct Current to 50 gigahertz and beyond.
Full-tape-thickness feature; LTCC 9K7 interconnect↗