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NASA NTRSDate not supplied

Process Recipes for Additively Printed Copper Ink Flexible Circuits using Direct Write Methods

In this paper, the process-recipes and process-performance relationships for additive-printing of copper circuits using direct-write methods have been studied. The process has been implemented on the direct write platform. Interest in the use of additive printing methods for the manufacture of micro-circuits has grown immensely in recent times. Direct write methods have been shown to have the ability to create circuits in a limited manner. However, the process recipes and the effect of process parameters on the manufactured properties are not well understood. Copper ink is a good and cost-effective alternative to silver ink but its use has lagged owing to an increased propensity for oxidation. In this paper, photonic curing has been used to sinter copper ink to make the traces conductive. The method flashes high energy light that sinter metal particles instantaneously and the temperature of the substrate remains low. The effect of the different photonic sintering profiles on the mechanical and electrical properties of the printed traces has been studied in this paper.The print process parameters also play an important role in the line width and height that has been studied to print with the desired line profile for the end application. An LC filter circuit is been printed with SMD components been attached using an electrically conductive adhesive (ECA). The manufactured flexible LC filter is been tested for its frequency sweep to compare with the commercially available LC filer with the help of the Bode plot.

Process control↗

NASA NTRS2007

Arrays of Miniature Microphones for Aeroacoustic Testing

A phased-array system comprised of custom-made and commercially available microelectromechanical system (MEMS) silicon microphones and custom ancillary hardware has been developed for use in aeroacoustic testing in hard-walled and acoustically treated wind tunnels. Recent advances in the areas of multi-channel signal processing and beam forming have driven the construction of phased arrays containing ever-greater numbers of microphones. Traditional obstacles to this trend have been posed by (1) the high costs of conventional condenser microphones, associated cabling, and support electronics and (2) the difficulty of mounting conventional microphones in the precise locations required for high-density arrays. The present development overcomes these obstacles. One of the hallmarks of the new system is a series of fabricated platforms on which multiple microphones can be mounted. These mounting platforms, consisting of flexible polyimide circuit-board material (see left side of figure), include all the necessary microphone power and signal interconnects. A single bus line connects all microphones to a common power supply, while the signal lines terminate in one or more data buses on the sides of the circuit board. To minimize cross talk between array channels, ground lines are interposed as shields between all the data bus signal lines. The MEMS microphones are electrically connected to the boards via solder pads that are built into the printed wiring. These flexible circuit boards share many characteristics with their traditional rigid counterparts, but can be manufactured much thinner, as small as 0.1 millimeter, and much lighter with boards weighing as much as 75 percent less than traditional rigid ones. For a typical hard-walled wind-tunnel installation, the flexible printed-circuit board is bonded to the tunnel wall and covered with a face sheet that contains precise cutouts for the microphones. Once the face sheet is mounted, a smooth surface is established over the entire array due to the flush mounting of all microphones (see right side of figure). The face sheet is made from a continuous glass-woven-fabric base impregnated with an epoxy resin binder. This material offers a combination of high mechanical strength and low dielectric loss, making it suitable for withstanding the harsh test section environment present in many wind tunnels, while at the same time protecting the underlying polyimide board. Customized signal-conditioning hardware consisting of line drivers and antialiasing filters are coupled with the array. The line drivers are constructed using low-supply-current, high-gain-bandwidth operational amplifiers designed to transmit the microphone signals several dozen feet from the array to external acquisition hardware. The anti-alias filters consist of individual Chebyshev low-pass filters (one for each microphone channel) housed on small printed-circuit boards mounted on one or more motherboards. The mother/daughter board design results in a modular system, which is easy to debug and service and which enables the filter characteristics to be changed by swapping daughter boards with ones containing different filter parameters. The filter outputs are passed to commercially- available acquisition hardware to digitize and store the conditioned microphone signals. Wind-tunnel testing of the new MEMS microphone polyimide mounting system shows that the array performance is comparable to that of traditional arrays, but with significantly less cost of construction.

Shams, Qamar A.↗

DOE OSTI2022

Flex-PCB Quench Antenna Developments at FNAL

We report flexible printed-circuit-board-based quench antenna arrays have been developed at FNAL since 2017. They proved to be low-noise, low-cost, sensitive, and non-invasive sensors for quench characterization in superconducting magnets, having the potential to extend even to quench detection. Starting with applications of small area sensors of this type, we have explored feasibility for operations at high pressure, and have invested in multi-channel quench antenna arrays covering the complete area of the innermost magnet layer of the conductor. We've also tested and optimized sensor geometry and relative orientations to increase sensitivity and spatial resolution. Beyond developments of warm and cold bore antennas, we've progressed to concepts which attach quench antennas to the conductor surfaces of accelerator magnets. Multiple programs and projects at FNAL and collaborating institutions benefited from this work already and our plans target further extensions of capabilities and applicability of these devices. In this paper we present the logic behind the development steps taken so far, status of our work and direction of near-term research on quench antennas at Fermilab.

43 PARTICLE ACCELERATORS↗

DOE OSTI2025

Exploring the Use of Flexible Circuit Boards to the Increase Power Density of a Rotary Triboelectric Nanogenerator

EExpansion on previous triboelectric nanogenerator (TENG) research that investigated a freestanding rotary TENG. The previous prototype used a single printed circuit board (PCB) stator with exposed copper electrodes and an arcylic rotor with vinyl-cut fluorinated ethylene propylene (FEP) wedges. The second generation prototype again used a PCB stator but used a flexible PCB rotor consisting of alternating polyamide and copper wedges. This prototype was assembled in a stacked configuration, with the intent of increasing current output. Results indicated that the internal resistance of the prototype was decreased, allowing for higher current output. However, degradation of the power output was observed, which led to decay testing of the prototypes. To overcome charge decay, a self-exciting design is suggested as further work.

42 ENGINEERING↗

NASA NTRS2021

Modular Composite Damage Detection System (MCDDS)

The 2020 CIF funded Modular Composite Damage Detection System (MCDDS) aims to advance the technology of damage detection in composites in the areas of thin, flexible damage detection panel construction, encapsulation techniques in composite matrixes, innovative integration and interfacing techniques with flexible embedded sensory panels, repair methods of composite materials, and improved packaging of the MCDDS. Custom thin, flexible polyimide printed circuit boards (PCBs) were designed and procured for fabrication of test specimens. A custom interface PCB was designed and fabricated to monitor the newly developed damage detection test specimens. Test specimens were fabricated using the novel flexible circuitry that were either fully or partially encapsulated. The fully encapsulated specimens were used to demonstrate embedded damage detection concepts and the partially encapsulated specimens were used to demonstrate surface-mounted (laminate) damage detection concepts. The new composite damage detection test specimens were tested and evaluated to determine if the novel damage detection sensory panels could withstand low-cycle threshold fatigue loading per a modified version of American Society for Testing and Materials (ASTM) D 7264 for up to 50 cycles without void formation. The data for multiple sensory panels indicates that the newly fabricated sensory panels are robust and do indeed withstand three-point bend flexural loading for more than 50 cycles. Additionally, testing was performed to determine if damage could be detected in damage detection test specimens subjected to failure using a 3-point bend test per a modified version of ASTM D 7264. Again, multiple sensory panels (both fully and partially encapsulated) showed the ability to detect damage to specimens subjected to failure per a modified version of ASTM D 7264. Additionally, a novel concept for tracking and monitoring of cracking (and potentially delamination) in composites was designed and developed that utilizes painted-on conductors.

Christopher Forney↗

DOE OSTI2022

Flexible Copper Metal Circuits via Desktop Laser Printed Masks

A novel process is demonstrated that produces patterns of electrically conductive copper on a flexible polyimide film substrate using standard desktop laser printed toner and near room temperature aqueous chemistry. The laser toner acts as a mask to selectively block the ion exchange self-metallization (IESM) reduction reaction that forms nanoscale silver or palladium coatings at the polyimide surface. The silver or palladium IESM coating is then used as a catalyst for electroless deposition of copper. Under appropriate conditions, the copper is deposited selectively on top of the catalyst layer. The resulting copper layer has a measured sheet resistance as low as 0.3 Ohms/sq. Electrical isolation was measured between copper traces spaced as close as 300 microns, and high conductivity was measured along traces with widths as low as 200 microns. The minimum pattern size appears to be limited primarily by the resolution of the laser toner pattern, as the IESM metal layer was observed to follow the contours of individual toner particles. Here, the process avoids the use of high temperature, vacuum, and organic solvents and is thus suitable for very low cost prototyping or distributed manufacturing of simple electronic devices.

36 MATERIALS SCIENCE↗

NASA NTRS2008

Polymer Coats Leads on Implantable Medical Device

Langley Research Center s Soluble Imide (LaRC-SI) was discovered by accident. While researching resins and adhesives for advanced composites for high-speed aircraft, Robert Bryant, a Langley engineer, noticed that one of the polymers he was working with did not behave as predicted. After putting the compound through a two-stage controlled chemical reaction, expecting it to precipitate as a powder after the second stage, he was surprised to see that the compound remained soluble. This novel characteristic ended up making this polymer a very significant finding, eventually leading Bryant and his team to win several NASA technology awards, and an "R&D 100" award. The unique feature of this compound is the way that it lends itself to easy processing. Most polyimides (members of a group of remarkably strong and incredibly heat- and chemical-resistant polymers) require complex curing cycles before they are usable. LaRC-SI remains soluble in its final form, so no further chemical processing is required to produce final materials, like thin films and varnishes. Since producing LaRC-SI does not require complex manufacturing techniques, it has been processed into useful forms for a variety of applications, including mechanical parts, magnetic components, ceramics, adhesives, composites, flexible circuits, multilayer printed circuits, and coatings on fiber optics, wires, and metals. Bryant s team was, at the time, heavily involved with the aircraft polymer project and could not afford to further develop the polymer resin. Believing it was worth further exploration, though, he developed a plan for funding development and submitted it to Langley s chief scientist, who endorsed the experimentation. Bryant then left the high-speed civil transport project to develop LaRC-SI. The result is an extremely tough, lightweight thermoplastic that is not only solvent-resistant, but also has the ability to withstand temperature ranges from cryogenic levels to above 200 C. The thermoplastic s unique characteristics lend it to many commercial applications; uses that Bryant believed would ultimately benefit industry and the Nation. "LaRC-SI," he explains, "is a product created in a government laboratory, funded with money from the tax-paying public. What we discovered helps further the economic competitiveness of the United States, and it was our goal to initiate the technology transfer process to ensure that our work benefited the widest range of people." Several NASA centers, including Langley, have explored methods for using LaRC-SI in a number of applications from radiation shielding and as an adhesive to uses involving replacement of conventional rigid circuit boards. In the commercial realm, LaRC-SI can now be found in several commercial products, including the thin-layer composite unimorph ferroelectric driver and sensor (THUNDER) piezoelectric actuator, another "R&D 100" award winner (Spinoff 2005).

Source record↗

NASA NTRSDate not supplied

Process Development for Printing Copper Conductible Ink on Flexible Substrates Using Aerosol Jet Technology

Rise in demand for wearable consumer electronics products has given an impetus to the development of flexible electronics technology encompassing flexible substrates and compatible circuitry. Also, additive manufacturing of flexible electronics is emerging rapidly via several techniques such as Inkjet and Aerosol Jet Printing (AJP). The basic component of all flexible circuits to be printed by these technologies is conductible ink, which is generally silver ink. Few studies exist on the printing of copper conductible ink and not many copper ink formulations are available in the market as that of silver inks. This study aims to develop a process development study for deposition of copper conductible lines on flexible substrates using the aerosol jet printing technology. The process development study includes investigation of photosintering parameters for obtaining desirable electrical resistance and shear load to failure values for the printed line. Different pre-drying techniques such as oven pre-drying and platen pre-drying have been used for improving the electrical and mechanical properties of the conductive traces. Techniques such as optical microscopy and white light interferometry have been used for the characterization of print quality of the conductible lines.

printed electronics↗

DOE OSTI2022

Conductive trace interconnection tape

A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.

Hatch, Stephen McGarry↗

DOE OSTI2023

Conductive trace interconnection tape

Hatch, Stephen McGarry↗

NASA NTRS1976

Printed-circuit solar-cell array

Flexible solar-cell array is made thinner and lighter by placing array on substrate which is a lamination of two sheets of plastic film with etched electrical connector for cells between films.

Currier, R. F.↗

DOE OSTI2022

Conductive Ink with Circular Life Cycle for Printed Electronics

Electronic waste carries energetic costs and an environmental burden rivaling that of plastic waste due to the rarity and toxicity of the heavy-metal components. Recyclable conductive composites are introduced for printed circuits formulated with polycaprolactone (PCL), conductive fillers, and enzyme/protectant nanoclusters. Circuits can be printed with flexibility (breaking strain ≈80%) and conductivity (≈2.1 × 10 4 S m -1 ). These composites are degraded at the end of life by immersion in warm water with programmable latency. Approximately 94% of the functional fillers can be recycled and reused with similar device performance. The printed circuits remain functional and degradable after shelf storage for at least 7 months at room temperature and one month of continuous operation under electrical voltage. Here, the present studies provide composite design toward recyclable and easily disposable printed electronics for applications such as wearable electronics, biosensors, and soft robotics.

36 MATERIALS SCIENCE↗

NASA NTRS1974

Design guidelines for advanced LSI microcircuit packaging using thick film multilayer technology

Ceramic multilayer circuitry results from the sequential build-up of two or more layers of pre-determined conductive interconnections separated by dielectric layers and fired at an elevated temperature to form a solidly fused structure. The resultant ceramic interconnect matrix is used as a base to mount active and passive devices and provide the necessary electrical interconnection to accomplish the desired electrical circuit. Many methods are known for developing multilevel conductor mechanisms such as multilayer printed circuits, welded wire matrices, flexible copper tape conductors, and thin and thick-film ceramic multilayers. Each method can be considered as a specialized field with each possessing its own particular set of benefits and problems. This design guide restricts itself to the art of design, fabrication and assembly of ceramic multilayer circuitry and the reliability of the end product.

Peckinpaugh, C. J.↗

DOE OSTI2025

All 2D Material Printed Diodes and Circuits on Paper for Sustainable Electronics

Sustainable electronics aim to reduce environmental impact by using ecofriendly materials, energy-efficient manufacturing, and recyclable components. However, existing approaches rely on complex, resource-intensive methods, rare metals, or nanomaterials with limited stability as well as plastic substrates, raising sustainability issues. Solution-processed two-dimensional (2D) materials offer a promising alternative: water-based and biocompatible conductive, semiconductive, and insulating 2D material inks can be produced with scalable techniques and are suitable for the fabrication of fully printed devices on low-cost and biodegradable paper substrates. However, 2D material only and fully printed diodes on paper have not yet been reported. Here, we demonstrate fully inkjet-printed 2D material-based diodes on paper using metal-insulator-semiconductor and metal-insulator-metal-semiconductor architectures. Water-based graphene and MoS2 inks, prepared by liquid-phase exfoliation, are used for the metallic and insulating films, while electrochemical exfoliation is used to produce the semiconducting MoS2 ink. The highest forward-to-reverse current ratio obtained is 330 (at ±2 V), while the forward current density is 1 mA/cm2 (at 1 V), making the diode performance comparable to the best solution-processed diodes reported so far. However, in contrast to previous works, fabrication occurs entirely at room temperature and ambient pressure, without using high-pressure sputtering, thermal evaporation, and any precious metal ink. The devices maintain stable performance under bending up to strain of 4% over 10,000 cycles. Finally, the diodes are successfully integrated with other 2D-material based electrical components to realize fully printed RC circuits, differentiators, integrators, and AC-to-DC converters onto paper, hence demonstrating the suitability of our approach for sustainable and disposable integrated circuits.

2D materials↗

DOE OSTI2021

System and method for large-scale PCB production including continuous selective adhesion

A method for the large-scale production of PCBs including a continuous selective adhesion process for creating printed circuit traces providing input to a production line. A roll of printed circuit traces is produced using rolls of flexible substrate, conductive layer, and conductive layer support by applying adhesive between the rolls of flexible substrate and conductive layer, bringing the rolls together, transferring a circuit pattern onto the flexible substrate, curing the adhesive through non-opaque areas of the circuit pattern, and separating the non-bonded areas. The resulting printed circuit traces are applied from the roll to mounts, and circuit components are applied from a roll to the traces as the mounts move along the line. Additional rolls of printed circuit traces and circuit components may be incorporated, and multi-layer PCBs may be produced. As part of the production line, the finished PCBs may be applied to flat or contoured products.

Hatch, Jonathan Douglas↗

NASA NTRS1989

Low-Dielectric Polyimides

New process developed to produce aromatic condensation polyimide films and coatings having dielectric constants in range of 2.4 to 3.2. Materials better electrical insulators than state-of-the-art commercial polyimides. Several low-dielectric-constant polyimides have excellent resistance to moisture. Useful as film and coating materials for both industrial and aerospace applications where high electrical insulation, resistance to moisture, mechanical strength, and thermal stability required. Applicable to production of high-temperature and moisture-resistance adhesives, films, photoresists, and coatings. Electronic applications include printed-circuit boards, both of composite and flexible-film types and potential use in automotive, aerospace, and electronic industries.

St. Clair, Anne K.↗

NASA NTRS1986

Solar array flight experiment

Emerging satellite designs require increasing amounts of electrical power to operate spacecraft instruments and to provide environments suitable for human habitation. In the past, electrical power was generated by covering rigid honeycomb panels with solar cells. This technology results in unacceptable weight and volume penalties when large amounts of power are required. To fill the need for large-area, lightweight solar arrays, a fabrication technique in which solar cells are attached to a copper printed circuit laminated to a plastic sheet was developed. The result is a flexible solar array with one-tenth the stowed volume and one-third the weight of comparably sized rigid arrays. An automated welding process developed to attack the cells to the printed circuit guarantees repeatable welds that are more tolerant of severe environments than conventional soldered connections. To demonstrate the flight readiness of this technology, the Solar Array Flight Experiment (SAFE) was developed and flown on the space shuttle Discovery in September 1984. The tests showed the modes and frequencies of the array to be very close to preflight predictions. Structural damping, however, was higher than anticipated. Electrical performance of the active solar panel was also tested. The flight performance and postflight data evaluation are described.

Source record↗

NASA NTRSDate not supplied

Analysis of a Dynamic Flexed Flat Cable Harness

A dynamic flex test was performed on a spacecraft instrument harness composed of multiple individual flex cables, with each flex cable containing multiple copper traces. The purpose of the test was to demonstrate the capability of the harness to survive the number of expected flex cycles during the planned mission with appropriate margin. However, during testing, increased trace resistances and open circuits were observed beginning at approximately 10% of the total number of planned flex cycles. This paper discusses the various proximate causes that contributed to increased and open resistance in the flex cables and the subsequent redesign, manufacturing, reliability, and quality-related changes that were instituted. An analysis process, including failure analysis, non-destructive evaluation, digital imaging correlation, and parametric modeling, will also be discussed. The paper will cover the development of a robust dynamic flex harness design and include recommendations to extend flex harness life; make changes to the flex harness life test; and improve flex cable manufacturing, quality, and reliability.

Flexible PCB↗