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At least 37 records · Page 2

High-Resolution Laser-Induced Graphene. Flexible Electronics beyond the Visible Limit

Laser-induced graphene (LIG) is a multifunctional graphene foam that is commonly direct-written with an infrared laser into a carbon-based precursor material. Here, a visible 405 nm laser is used to directly convert polyimide into LIG. This enabled the formation of LIG with a spatial resolution of ~12 μm and a thickness of <5 μm. The spatial resolution enabled by the relatively smaller focused spot size of the 405 nm laser represents a >60% reduction in LIG feature sizes reported in prior publications. This process occurs in situ in an SEM chamber, thus allowing direct observation of LIG formation. The reduced size of the LIG features enables the direct-write formation of flexible electronics that are not visible to the unaided eye. A humidity sensor is demonstrated which could detect human breath with a response time of 250 ms. With the growing interest in LIG for flexible electronics and sensors, finer features can greatly expand its utility.

36 MATERIALS SCIENCE↗

Phonon dispersion and quantization tuning of strained carbon nanotubes for flexible electronics

Graphene and carbon nanotubes are materials with large potentials for applications in flexible electronics. Such devices require a high level of sustainable strain and an understanding of the materials electrical properties under strain. Using supercell theory in conjunction with a comprehensive molecular mechanics model, the full band phonon dispersion of carbon nanotubes under uniaxial strain is studied. The results suggest an overall phonon softening and open up the possibility of phonon quantization tuning with uniaxial strain. The change in phonon quantization and the resulting increase in electron-phonon and phonon-phonon scattering rates offer further explanation and theoretical basis to the experimental observation of electrical properties degradation for carbon nanotubes under uniaxial strain.

77 NANOSCIENCE AND NANOTECHNOLOGY↗

Potential up-scaling of inkjet-printed devices for logical circuits in flexible electronics

Inkjet Technology is often mis-believed to be a deposition/patterning technology which is not meant for high fabrication throughput in the field of printed and flexible electronics. In this work, we report on the 1) printing, 2) fabrication yield and 3) characterization of exemplary simple devices e.g. capacitors, organic transistors etc. which are the basic building blocks for logical circuits. For this purpose, printing is performed first with a Proof of concept Inkjet printing system Dimatix Material Printer 2831 (DMP 2831) using 10 pL small print-heads and then with Dimatix Material Printer 3000 (DMP 3000) using 35 pL industrial print-heads (from Fujifilm Dimatix). Printing at DMP 3000 using industrial print-heads (in Sheet-to-sheet) paves the path towards industrialization which can be defined by printing in Roll-to-Roll format using industrial print-heads. This pavement can be termed as 'Bridging Platform'. This transfer to 'Bridging Platform' from 10 pL small print-heads to 35 pL industrial print-heads help the inkjet-printed devices to evolve on the basis of functionality and also in form of up-scaled quantities. The high printed quantities and yield of inkjet-printed devices justify the deposition reliability and potential to print circuits. This reliability is very much desired when it comes to printing of circuits e.g. inverters, ring oscillator and any other planned complex logical circuits which require devices e.g. organic transistors which needs to get connected in different staged levels. Also, the up-scaled inkjet-printed devices are characterized and they reflect a domain under which they can work to their optimal status. This status is much wanted for predicting the real device functionality and integration of them into a planned circuit.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

A pseudo-single-crystalline germanium film for flexible electronics

We demonstrate large-area (∼600 μm), (111)-oriented, and high-crystallinity, i.e., pseudo-single-crystalline, germanium (Ge) films at 275 °C, where the temperature is lower than the softening temperature of a flexible substrate. A modulated gold-induced layer exchange crystallization method with an atomic-layer deposited Al{sub 2}O{sub 3} barrier and amorphous-Ge/Au multilayers is established. From the Raman measurements, we can judge that the crystallinity of the obtained Ge films is higher than those grown by aluminum-induced-crystallization methods. Even on a flexible substrate, the pseudo-single-crystalline Ge films for the circuit with thin-film transistor arrays can be achieved, leading to high-performance flexible electronics based on an inorganic-semiconductor channel.

36 MATERIALS SCIENCE↗

Printable Spacecraft: Flexible Electronic Platforms for NASA Missions

Why printed electronics? Why should NASA use printed electronics to make a spacecraft? Three words provide the answer: universal, impactful, progressive. The technology is universal because the applications it can affect are broad and diverse from simple sensors to fully functional spacecraft. The impact of flexible, printed electronics range from straightforward mass, volume and cost savings all the way to enabling new mission concepts. The benefits of the technology will become progressively larger from what is achievable today so that investments will pay dividends tomorrow, next year and next decade. We started off three years ago asking the question can you build an entire spacecraft out of printed electronics? In other words, can you design and fabricate a fully integrated, electronic system that performs the same end-to-end functions of a spacecraft - take scientific measurements, perform data processing, provide data storage, transmit the data, powers itself, orients and propels itself - all out of thin flexible sheets of printed electronics? This "Printable Spacecraft" pushes the limits of printed flexible electronics performance. So the answer is yes, more or less. In our studies for the NIAC (NASA Innovative Advanced Concepts) program, we have explored this question further, to explain more completely what "more or less" means and to outline what is needed to make the answer a definitive "yes". Despite its appealing "Flat Stanley"-like (a book series by Jeff Brown) qualities, making a Printable Spacecraft is not as easy as flattening the Cassini spacecraft with a bulletin board, as was Stanley Lamchop's fate. But, if NASA invests in the design challenges, the materials challenges, the performance challenges of printed electronics, it might find itself with a spacecraft that can enable as many adventures and advantages as Flat Stanley including putting it in an envelope and mailing it to the planet of your choice. You just have to let your imagination take over. In this report we document the work of the Phase 2 Printable Spacecraft task conducted under the guidance and leadership of the NIAC program. In Phase One of the NIAC task entitled "Printable Spacecraft", we investigated the viability of printed electronics technologies for creating multi-functional spacecraft platforms. Mission concepts and architectures that could be enhanced or enabled with this technology were explored. In Phase 2 we tried to answer the more practical questions such as can you really build a multi-functional printed electronic spacecraft system? If you do, can it survive the space environment? Even if it can, what benefit does a printable system provide over a traditional implementation of a spacecraft?

Materials↗

Magnetic and electric bulge-test instrument for the determination of coupling mechanical properties of functional free-standing films and flexible electronics

For the first time a novel multi-field bulge-test instrument which enables measurements of the biaxial mechanical properties and electro-magnetic-mechanical coupling effect of free-standing films in external magnetic/electric fields was proposed. The oil pressure was designed with two ranges, 0–1 MPa for elastic small deformation and 0–7 MPa for plastic/damage large deformation. A magnetic field that was horizontal and uniform in the film plane was supplied by a hollow cylindrical magnet. The magnitude could be changed from 0 to 10 000 Oe by adjusting the position of the testing film. Meanwhile, an electric field applied on the film was provided by a voltage source (Maximum voltage: 1000 V; Maximum current: 1 A). Various signals related to deformation, mechanical loading, magnetic field, and electric field could be measured simultaneously without mutual interference, which was confirmed by the coincidence of the measured P-H curves for titanium (Ti)/nickel (Ni) specimens with/without external fields. A hardening phenomenon under magnetic/electric fields was observed for Ni and lead zirconate titanate specimens. The multi-field bulge-test instrument will provide a powerful research tool to study the deformation mechanism of functional films and flexible electronics in the coupling field.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Conductive Liquid Metal Vitrimer Composites for Reconfigurable and Recyclable Flexible Electronics

Liquid metal (LM) elastomer composites exhibit excellent functionality for stretchable electronics and wearables, but limited recycling and reuse pathways constrain their sustainable use. Here, to address these challenges amid growing concerns over electronic waste, a conductive LM–vitrimer composite is presented that enables recyclable and reconfigurable electronics. This soft and stretchable composite features uniformly distributed LM inclusions that enhance thermal conductivity by 6.53× and enable the formation of conductive traces with electrical self-healing, while the vitrimer provides structural restoration. The dynamic covalent bonds of the vitrimer matrix are leveraged for both reprocessing the composite and chemically recovering 94% of the LM. This liquid-state filler slightly reduces the vitrimer's stiffness to 2.63 MPa (≈20% lower), while maintaining its high stretchability (>135% strain) and thermal stability. It is further examined how ultrasonicated LM inclusions interact with the vitrimer matrix and demonstrate the composite's self-healing and recyclability through two distinct approaches: 1) thermomechanical reprocessing, which restores fragmented composites under heat and compression for circuit reconfiguration; and 2) chemical recycling, which recovers the embedded LM for reuse in fabricating new composites and redesigned circuitry. With the integration of recyclability and diverse functional capabilities, LM–vitrimer composites emerge as a promising material platform for sustainable, flexible electronics.

Han, Youngshang [Univ. of Washington, Seattle, WA ↗

Dry Printing Pure Copper with High Conductivity and Adhesion for Flexible Electronics

Additive manufacturing of functional devices on various rigid and flexible substrates is rising rapidly due to their design flexibility, rapid manufacturing, and lower cost. Current printing technologies are ink-based and focused on printing silver (Ag) as conductive lines due to its matured ink formulation process, low sintering temperature, ease of printing, and low oxidation rate. However, Ag is the 68th most abundant element on Earth, while copper (Cu) is the 25th, making it much cheaper (>100×) while having a comparable conductivity to Ag. Therefore, printing Cu has become technologically and economically more attractive than Ag. Nevertheless, Cu printing is still a significant challenge in ink-based printing methods due to the higher sintering temperature relative to the glass-transition temperature of most flexible substrates, the higher oxidation rate, the challenging ink formulation process, and ink stability concerns. Here, we demonstrate printing highly conductive Cu on flexible polyimide substrates using a dry printing technique. Cu nanoparticles (~3–30 nm) are generated by on-demand laser ablation of a solid Cu target inside the printer head and under argon background gas. These Cu nanoparticles are then transported through a nozzle and onto the substrate, where they are laser-sintered in real time. The argon gas plays three critical roles in laser plume condensation for nanoparticle generation, transport, and sheath gas to avoid oxidation during sintering. The sintered nanoparticles thus show high electrical conductivity and mechanical stability under static and cyclic tests. Our dry printing technique can potentially revolutionize how electronic devices and sensors are additively manufactured for earth and space applications.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

[100] or [110] aligned, semiconductor-based, large-area, flexible, electronic devices

Novel articles and methods to fabricate the same resulting in flexible, large-area, [100] or [110] textured, semiconductor-based, electronic devices are disclosed. Potential applications of resulting articles are in areas of photovoltaic devices, flat-panel displays, thermophotovoltaic devices, ferroelectric devices, light emitting diode devices, computer hard disc drive devices, magnetoresistance based devices, photoluminescence based devices, non-volatile memory devices, dielectric devices, thermoelectric devices and quantum dot laser devices.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Semiconductor-based, large-area, flexible, electronic devices on {110}<100> oriented substrates

Novel articles and methods to fabricate the same resulting in flexible, oriented, semiconductor-based, electronic devices on {110}<100> textured substrates are disclosed. Potential applications of resulting articles are in areas of photovoltaic devices, flat-panel displays, thermophotovoltaic devices, ferroelectric devices, light emitting diode devices, computer hard disc drive devices, magnetoresistance based devices, photoluminescence based devices, non-volatile memory devices, dielectric devices, thermoelectric devices and quantum dot laser devices.

36 MATERIALS SCIENCE↗

Large-Scale and Galvanic Replacement Free Synthesis of Cu@Ag Core–Shell Nanowires for Flexible Electronics

Copper nanowires (CuNWs) are considered a promising alternative to indium tin oxide (ITO) due to their high transparency, conductivity and low cost. However, the susceptibility to oxidation of copper in ambient conditions largely overshadows their practical applications. Here, a facile adsorption and subsequent heat-treatment method is developed to obtain uniform Cu@Ag core-shell nanowires. Ag-ammonia complex (Ag[(NH2R)2]+) as silver source adsorbs on the surface of CuNWs to form Cu@Ag-ammonia core-shell precursors and then decomposes to pure Ag shell through a simple thermal annealing process under air. The thickness of Ag shell can easily be controlled by adjusting the concentration of Ag-ammonia. The Ag shell perfectly prevents the oxidation of CuNWs, enabling the core-shell nanowires to maintain stability at high temperature (140 °C) and high humidity (85 °C, 85% RH) for at least 500 h. More importantly, transparent conductive films made from our Cu@Ag nanowires hold comparable optical and electrical properties to pure CuNWs. The large-scale and facile strategy demonstrated in this study offers huge potential to further explore the applications of CuNWs in flexible and stretchable electronic and optoelectronic devices.

Zhang, Bowen (ORCID:000000030432745X)↗

Nanometer-Thick Sr 2 IrO 4 Freestanding Films for Flexible Electronics

In this article, we report the structural and optical properties of nanoscale Sr 2 IrO 4 freestanding thin-films fabricated using a water-soluble Sr 3 Al 2 O 6 layer. The coherent lattice structure, phonon modes, two-magnon Raman scattering, and optical absorption spectra of the Sr 2 IrO 4 nanomembrane are analogous to those of the layered iridate epitaxial thin-films and single crystals. Remarkably, the formation of 3-unit-cell-thick SrIrO 3 and interfacial composite layers alleviates the antiphase boundaries at the Sr 2 IrO 4 /Sr 3 Al 2 O 6 interface, resulting in structurally-robust nanomembranes. Our experimental results show that this freestanding thin-film approach of layered oxides can provide techniques for tuning or realizing unprecedented states beyond conventional thin-film methods, suggesting a pathway in achieving flexible layered-oxide electronics.

36 MATERIALS SCIENCE↗

Printable Spacecraft: Flexible Electronic Platforms for NASA Missions

Atmospheric confetti. Inchworm crawlers. Blankets of ground penetrating radar. These are some of the unique mission concepts which could be enabled by a printable spacecraft. Printed electronics technology offers enormous potential to transform the way NASA builds spacecraft. A printed spacecraft's low mass, volume and cost offer dramatic potential impacts to many missions. Network missions could increase from a few discrete measurements to tens of thousands of platforms improving areal density and system reliability. Printed platforms could be added to any prime mission as a low-cost, minimum resource secondary payload to augment the science return. For a small fraction of the mass and cost of a traditional lander, a Europa flagship mission might carry experimental printed surface platforms. An Enceladus Explorer could carry feather-light printed platforms to release into volcanic plumes to measure composition and impact energies. The ability to print circuits directly onto a variety of surfaces, opens the possibility of multi-functional structures and membranes such as "smart" solar sails and balloons. The inherent flexibility of a printed platform allows for in-situ re-configurability for aerodynamic control or mobility. Engineering telemetry of wheel/soil interactions are possible with a conformal printed sensor tape fit around a rover wheel. Environmental time history within a sample return canister could be recorded with a printed sensor array that fits flush to the interior of the canister. Phase One of the NIAC task entitled "Printable Spacecraft" investigated the viability of printed electronics technologies for creating multi-functional spacecraft platforms. Mission concepts and architectures that could be enhanced or enabled with this technology were explored. This final report captures the results and conclusions of the Phase One study. First, the report presents the approach taken in conducting the study and a mapping of results against the proposed Phase One objectives. Then an overview of the general field of printed electronics is provided, including manufacturing approaches, commercial drivers, and the current state of integrated systems. The bulk of the report contains the results and findings of Phase One organized into four sections: a survey of components required for a printable spacecraft, technology roadmaps considerations, science mission and engineering applications, and potential risks and challenges of the technology.

Spacecraft↗

Expeditious, scalable solution growth of metal oxide films by combustion blade coating for flexible electronics

Metal oxide (MO) semiconductor thin films prepared from solution typically require multiple hours of thermal annealing to achieve optimal lattice densification, efficient charge transport, and stable device operation, presenting a major barrier to roll-to-roll manufacturing. Here, we report a highly efficient, cofuel-assisted scalable combustion blade-coating (CBC) process for MO film growth, which involves introducing both a fluorinated fuel and a preannealing step to remove deleterious organic contaminants and promote complete combustion. Ultrafast reaction and metal–oxygen–metal (M-O-M) lattice condensation then occur within 10–60 s at 200–350 °C for representative MO semiconductor [indium oxide (In 2 O 3 ), indium-zinc oxide (IZO), indium-gallium-zinc oxide (IGZO)] and dielectric [aluminum oxide (Al 2 O 3 )] films. Furthermore, wafer-scale CBC fabrication of IGZO-Al 2 O 3 thin-film transistors (TFTs) (60-s annealing) with field-effect mobilities as high as ~25 cm 2 V –1 s –1 and negligible threshold voltage deterioration in a demanding 4,000-s bias stress test are realized. Combined with polymer dielectrics, the CBC-derived IGZO TFTs on polyimide substrates exhibit high flexibility when bent to a 3-mm radius, with performance bending stability over 1,000 cycles.

36 MATERIALS SCIENCE↗

Magnetoelectric polymer nanocomposite for flexible electronics

This paper reports the fabrication and characterization of a new type of magnetoelectric polymer nanocomposite that exhibits excellent ferromagnetism and ferroelectricity simultaneously at room temperature. The multiferroic nanocomposite consists of high aspect ratio ferromagnetic iron nanowires embedded inside a ferroelectric co-polymer poly(vinylindene fluoride-trifluoroethylene), P(VDF-TrFE). The nanocomposite has been fabricated via a simple low temperature spin coating technique. Structural, ferromagnetic, ferroelectric, and magnetoelectric properties of the developed nanocomposite have been characterized. The nanocomposite films showed isotropic magnetic properties due to the random orientation of the iron nanowires inside the film. In addition, the embedded nanowires did not hinder the ferroelectric phase development of the nanocomposite. The developed nanocomposite showed a high magnetoelectric coupling response of 156 mV/cmOe measured at 3.1 kOe DC bias field. This value is among the highest reported magnetoelectric coupling in two phase particulate polymer nanocomposites.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗