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At least 37 records · Page 2

Photosensitive filler minimizes internal stresses in epoxy resins

Photosensitive filler is added to curable epoxy resins to minimize stress from internal shrinkage during curing or polymerization. Cinnamic acid resins and cinnamal ketones may be added in the amount of 1 to 3 percent by weight of the resin mixture.

Dillon, J. N.

Surviving nanoscale interfacial stability in extreme thermal expansion contrast Zn(CN) 2 -epoxy resin matrix composites

Here, we report the remarkable stability at the nanoscale matrix-filler interface in a series of overall low coefficient of thermal expansion (CTE) zinc cyanide (ZC)/epoxy resin composites. These interfaces demonstrate the stability of highly contrasting materials. These composites are designed to optimize the properties of both materials: epoxy resins are valued for their high strength, superb chemical resistance, low dielectric properties, and adhesive abilities. ZC, a model flexible framework, exhibits negative thermal expansion (NTE) behavior and compensates for the epoxy resin’s detrimentally large thermal expansion values. Filled resins minimize the native 65 ppm/°C CTE values to 19 ppm/° C over a wide temperature range while maintaining linearity, yielding composites compatible with typical metal and ceramic substrates’—commonly bonded to the resin— 0–20 ppm/° C CTE values. Additionally, with significant intrinsic differences in the materials, we use wide-angle X-ray diffraction and atomic force microscopy to elucidate thermal movement. The ZC/epoxy interface is surprisingly resilient over 1,000 cycles between -55° C and 75° C, extremes typical to aerospace applications. Further, we show that the resin viscosity remains less than 21 Pa*s at up to 30 vol% ZC, an important consideration for workability. We also discuss settling distribution, glass transition temperature, flexural strength, and longevity. All results point favorably towards practical implementation in low thermal expansion application needs: filling the gap in component design.

42 ENGINEERING

Epoxy-resin patterns speed shell-molding of aluminum parts

Half patterns cast from commercial epoxy resin containing aluminum powder are used for shell-molding of aluminum parts. The half patterns are cast in plastic molds of the original wooden pattern. Ten serviceable sand resin molds are made from each epoxy pattern.

Source record

Regioisomer-Specific Crystallization of Diglycidyl Ether of Bisphenol F Epoxy Resin

Diglycidyl ether of bisphenol F (DGEBF) is a common industrial epoxy resin, desired for its possible replacement of the bisphenol A (BPA) analogue DGEBA due to potential health hazards of BPA. During curing, crystallization of the DGEBF resin can cause inaccurate resin-to-hardener ratios, resulting in incomplete crosslinking; therefore, understanding the crystallization of DGEBF is important for proper industrial control of the material. Here, in this work, we utilized a combination of single-crystal x-ray diffraction, Raman spectroscopy, and 1 H-NMR to investigate the crystallization of DGEBF. We observed crystallization of two DGEBF regioisomers: ortho-ortho’-DGEBF and ortho-para’-DGEBF, and report their crystal structures. Notably, para-para’-DGEBF crystallization is not observed, indicating crystallization of this regioisomer does not occur under ambient conditions. Density functional theory calculations were performed to describe the phonon modes of the ortho-ortho’- and ortho-para’-DGEBF structures, corroborating Raman signatures for the respective isomers. Using a phonon mode analysis, we identify the presence of three specific optical vibrational modes at 631.3, 344.1, and 345.6 cm -1 that are unique to the para monomer. This work offers insights into the crystallization behavior of DGEBF resins under ambient conditions and may inform potential industrial application of this material.

Neu, Jennifer [Oak Ridge National Laboratory (ORNL

Differences in interfacial bond strengths of graphite fiber-epoxy resin composites

The effect of epoxy-size and degree of cure on the interfacial bonding of an epoxy-amine-graphite fiber composite system is examined. The role of the fiber-resin interface in determining the overall mechanical properties of composites is poorly understood. A good interfacial adhesive bond is required to achieve maximum stress transfer to the fibers in composites, but at the same time some form of energy absorbing interfacial interaction is needed to achieve high fracture toughening. The incompatibility of these two processes makes it important to understand the nature and basic factors involved at the fiber-resin interface as stress is applied. The mechanical properties including interlaminar shear values for graphite fiber-resin composites are low compared to glass and boron-resin composites. These differences have been attributed to poor fiber-matrix adhesion. Graphite fibers are commonly subjected to post-treatments including application of organic sizing in order to improve their compatibility with the resin matrix and to protect the fiber tow from damage during processing and lay-up. In such processes, sized graphite fiber tow is impregnated with epoxy resin and then layed-up i nto the appropriate configuration. Following an extended ambient temperature cure, the graphite-resin composite structure is cured at elevated temperature using a programmed temperature sequence to cure and then cool the product.

Needles, H. L.

Epoxy resins produce improved plastic scintillators

Plastic scintillator produced by the substitution of epoxy resins for the commonly used polystyrene is easy to cast, stable at room temperature, and has the desirable properties of a thermoset or cross-linked system. Such scintillators can be immersed directly in strong solvents, an advantage in many chemical and biological experiments.

Markley, F. W.

Kinetic study of polymerization/curing of filament-wound composite epoxy resin systems with aromatic diamines

The kinetics of polymerization/curing of a filament-wound composite epoxy resin consisting of an 80/20 DGEBA/DGEBD blend and an MDA/m-PDA blend (Tonox 60/40) was studied at various temperatures and at amine epoxy ratios between 1.1 and 4.4 by means of Fourier-transform (FT) IR and bulk viscosity measurements. The activation energy for the polymerization/curing reaction using an amine/epoxy ratio of 1.1 was 11.9 kcal/mole, in agreement with a previous value. The FT-IR conversion-time plots were fitted to a kinetic expression containing two rate constants with activation energies of 13.7 and 10.0 kcal/mole. The bulk viscosity followed the Williams et al. (1955) equation, with a Di Benedetto (1965) expression for the glass transition temperature.

Golub, M. A.

Cure of epoxy resins determined by simple tests

Rapid visual and simple quantitative tests indicate the degree of cure of particular epoxy resin binders in prepreg stock. It is possible that these tests may be extended to a number of different epoxy formulations.

Ladaki, M.

Linear and nonlinear mechanical properties of a series of epoxy resins

The linear viscoelastic properties have been measured for a series of bisphenol-A-based epoxy resins cured with the diamine DDS. The linear viscoelastic master curves were constructed via time-temperature superposition of frequency dependent G-prime and G-double-prime isotherms. The G-double-prime master curves exhibited two sub-Tg transitions. Superposition of isotherms in the glass-to-rubber transition (i.e., alpha) and the beta transition at -60 C was achieved by simple horizontal shifts in the log frequency axis; however, in the region between alpha and beta, superposition could not be effected by simple horizontal shifts along the log frequency axis. The different temperature dependency of the alpha and beta relaxation mechanisms causes a complex response of G-double-prime in the so called alpha-prime region. A novel numerical procedure has been developed to extract the complete relaxation spectra and its temperature dependence from the G-prime and G-double-prime isothermal data in the alpha-prime region.

Curliss, D. B.

Tetraglycidyl epoxy resins and graphite fiber composites cured with flexibilized aromatic diamines

Studies were performed to synthesize new ether modified, flexibilized aromatic diamine hardeners for curing epoxy resins. The effect of moisture absorption on the glass transition temperatures of a tetraglycidyl epoxy, MY 720, cured with flexibilized hardeners and a conventional aromatic diamine was studied. Unidirectional composites, using epoxy-sized Celion 6000 graphite fiber as the reinforcement, were fabricated. The room temperature and 300 F mechanical properties of the composites, before and after moisture exposure, were determined. The Mode I interlaminar fracture toughness of the composites was characterized using a double cantilever beam technique to calculate the critical strain energy release rate.

Delvigs, P.

Properties of two composite materials made of toughened epoxy resin and high-strain graphite fiber

Results are presented from an experimental evaluation of IM7/8551-7 and IM6/18081, two new toughened epoxy resin, high strain graphite fiber composite materials. Data include ply-level strengths and moduli, notched tension and compression strengths and compression-after-impact assessments. The measured properties are compared with those of other graphite-epoxy materials.

Dow, Marvin B.

The stability of new transparent polymeric materials: The epoxy trimethoxyboroxine system. Part 1: The preparation, characterization and curing of epoxy resins and their copolymers

The effects of resin composition, curing conditions fillers, and flame retardant additives on the flammability of diglycidyl ether of bisphenol-A (DGEBA) as measured by the oxygen index is examined. The oxygen index of DGEBA cured with various curing agents was between 0.198 to 0.238. Fillers and flame retardant additives can increase the oxygen index dependent on the material and the amount used. Changes in the basic cured resin properties can be anticipated with the addition of noncompatible additives. High flame resistant epoxy resins with good stability and mechanical properties are investigated.

Pearce, E.

Dynamics and mechanism of cavitation erosion on perspex and epoxy resins tested in a rotating disk device

The cavitation erosion behavior including the initiation, dynamics and mechanism of damage process on perspex and epoxy resin specimens tested in a rotating disk device were discussed with respect to exposure time. The inception of erosion always took place at the location nearest to the center of rotation of the disk. Subsequently, as exposure time increased, erosion initiated at other locations as well. Light optical photographs and scanning electron micrographs clearly indicate that most of the material loss appears to occur form the networks of cracks due to their interaction and pits indicate particle debris. The optical degradation (loss of transmittance) on perspex was observed to be more on the rear side than on the front side.

Rao, P. V.

Thermal Expansion and Swelling of Cured Epoxy Resin Used in Graphite/Epoxy Composite

The thermal expansion and swelling of resin material as influenced by variations in temperature during moisture absorption is discussed. Comparison measurements using composites constructed of graphite fibers and each of two epoxy resin matrices are included. Polymer theory relative to these findings is discussed and modifications are proposed.

Adamson, M. J.

Curing agent for polyepoxides and epoxy resins and composites cured therewith

A curing for a polyepoxide is described which contains a divalent aryl radical such as phenylene a tetravalent aryl radical such as a tetravalent benzene radical. An epoxide is cured by admixture with the curing agent. The cured epoxy product retains the usual properties of cured epoxides and, in addition, has a higher char residue after burning, on the order of 45% by weight. The higher char residue is of value in preventing release to the atmosphere of carbon fibers from carbon fiber-epoxy resin composites in the event of burning of the composite.

Serafini, T. T.

Electron Beam Cured Epoxy Resin Composites for High Temperature Applications

Electron beam curing of Polymer Matrix Composites (PMC's) is a nonthermal, nonautoclave curing process that has been demonstrated to be a cost effective and advantageous alternative to conventional thermal curing. Advantages of electron beam curing include: reduced manufacturing costs; significantly reduced curing times; improvements in part quality and performance; reduced environmental and health concerns; and improvement in material handling. In 1994 a Cooperative Research and Development Agreement (CRADA), sponsored by the Department of Energy Defense Programs and 10 industrial partners, was established to advance the electron beam curing of PMC technology. Over the last several years a significant amount of effort within the CRADA has been devoted to the development and optimization of resin systems and PMCs that match the performance of thermal cured composites. This highly successful materials development effort has resulted in a board family of high performance, electron beam curable cationic epoxy resin systems possessing a wide range of excellent processing and property profiles. Hundreds of resin systems, both toughened and untoughened, offering unlimited formulation and processing flexibility have been developed and evaluated in the CRADA program.

Janke, Christopher J.