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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
DOE OSTI2017

Simulation Study on JLEIC High Energy Bunched Electron Cooling

In the Jefferson Lab (JLab) Electron Ion Collider (JLEIC) project the traditional electron cooling technique is used to reduce the ion beam emittance at the booster ring, and to compensate the intrabeam scattering effect and maintain the ion beam emittance during the collision at the collider ring. Different with other electron coolers using DC electron beam, the proposed electron cooler at the JLEIC ion collider ring uses high energy bunched electron beam, provided by an ERL. In this paper, we report the new electron cooling simulation program developed at JLab to fulfil specific simulation requirements of JLEIC and some recent simulation study on how the electron cooling rate will be affected by the bunched electron beam properties, such as the correlation between the longitudinal position and momentum, the bunch size, and the Larmor emittance.

Zhang, He↗
DOE OSTI2016

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

36 MATERIALS SCIENCE↗
DOE OSTI2016

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
DOE OSTI2018

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Chainer, Timothy J.↗
DOE OSTI2024

Collisional simulations of the modulator section in coherent electron cooling

The first section of any coherent electron cooling (CeC) system is the modulator, where the density of the electron beam is modulated by the copropagating ion beam. This density modulation is a result of Coulomb collisions between the individual particles of the two beams. The pairwise, stochastic part of the interactions impacts the overall performance of the CeC process. We present the first simulations of the density modulations of the electron beams from a collisional picture of the dynamics, considering the proof-of-principle CeC experiments at Brookhaven National Laboratory. These simulations were performed using PHAD, which is the first efficient, large-scale collisional numerical method in beam physics that we have previously developed and benchmarked. Realistic beam distributions and external fields have been optimized to provide strong modulation signals necessary for variations of coherent electron cooling systems. Cooling performance limits and potential collisionless simulation pitfalls are pointed out. Published by the American Physical Society 2024

43 PARTICLE ACCELERATORS↗
DOE OSTI2025

Machine protection system for coherent electron cooling experiment

The coherent electron cooling (CeC) experiment employs a 15 MeV electron beam with up to a few milliamperes current which is capable of destroying the vacuum equipment or intercepting beam diagnostics. The high-current beam can be delivered to two different dumps. RF systems include normal conducting and superconducting cavities which also require protection from abnormal conditions. In this paper, we describe in detail the design and operation of the machine protection system for the CeC accelerator.

43 PARTICLE ACCELERATORS↗
DOE OSTI2018

Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Chainer, Timothy J.↗
DOE OSTI2018

Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

Methods are provided for facilitating cooling of an electronic component. The methods include providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

42 ENGINEERING↗
DOE OSTI2018

Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Chainer, Timothy J.↗
DOE OSTI2021

Demonstration of Electron Cooling using a Pulsed Beam from an Electrostatic Electron Cooler

Electron cooling continues to be an invaluable technique to reduce and maintain the emittance in hadron storage rings in cases where stochastic cooling is inefficient and radiative cooling is negligible. Extending the energy range of electron coolers beyond what is feasible with the conventional, electrostatic approach necessitates the use of RF fields for acceleration and, thus, a bunched electron beam. To experimentally investigate how the relative time structure of the two beams affects the cooling properties, we have set up a pulsed-beam cooling device by adding a synchronized pulsing circuit to the conventional electron source of the CSRm cooler at Institute of Modern Physics *. We show the effect of the electron bunch length and longitudinal ion focusing strength on the temporal evolution of the longitudinal and transverse ion beam profile and demonstrate the detrimental effect of timing jitter as predicted by theory and simulations. Compared to actual RF-based coolers, the simplicity and flexibility of our setup will facilitate further investigations of specific aspects of bunched cooling such as synchro-betatron coupling and phase dithering.

Bruker, M. W.↗
DOE OSTI2021

Demonstration of Electron Cooling using a Pulsed Beam from an Electrostatic Electron Cooler

Electron cooling continues to be an invaluable technique to reduce and maintain the emittance in hadron storage rings in cases where stochastic cooling is inefficient and radiative cooling is negligible. Extending the energy range of electron coolers beyond what is feasible with the conventional, electrostatic approach necessitates the use of RF fields for acceleration and, thus, a bunched electron beam. To experimentally investigate how the relative time structure of the two beams affects the cooling properties, we have set up a pulsed-beam cooling device by adding a synchronized pulsing circuit to the conventional electron source of the CSRm cooler at Institute of Modern Physics *. We show the effect of the electron bunch length and longitudinal ion focusing strength on the temporal evolution of the longitudinal and transverse ion beam profile and demonstrate the detrimental effect of timing jitter as predicted by theory and simulations. Compared to actual RF-based coolers, the simplicity and flexibility of our setup will facilitate further investigations of specific aspects of bunched cooling such as synchro-betatron coupling and phase dithering.

Bruker, M. W.↗
DOE OSTI2019

Notes on adjusting gold ion momentum in RHIC to optimize electron cooling at injection

The proposed electron cooling of low-energy gold ions in RHIC and the detection of ion-electron recombination are reviewed in [1]. Optimal cooling requires that the gold ions have the same velocity as the electrons in the cooling section of the RHIC ring. This can be accomplished by making small adjustments of either the ion or the electron momentum.Such adjustments are necessary because although we can set the momentum with good accuracy, this may not be good enough to land precisely on the sweet spot where, as detected by the recombination monitor, the cooling is maximized.

43 PARTICLE ACCELERATORS↗
DOE OSTI2023

First benchmarked electron cooling simulations from first principles

We present the first microscopic electron cooling simulations from first principles with accurate prediction of cooling time. These simulations were performed using our previously developed numerical method, PHAD, which is the first efficient large-scale collisional numerical method in beam physics. The simulation results are benchmarked with the experimental data of the low energy bunched electron cooling of ion beams at the storage ring CSRm at the IMP facility in China. Here, we have accurately considered the nonlinear dynamics in the whole accelerator system in addition to the electron cooling section. As a result, our simulations correctly reproduced cooling times of the experiments from first principles and without any tuning or fitting parameters in the code.

43 PARTICLE ACCELERATORS↗
DOE OSTI2019

Emittance growth generated by bunched beam electron cooling

The low energy RHIC electron cooling (LEReC) project at Brookhaven employs a linac to supply electrons with kinetic energies from 1.6 to 2.6 MeV. Along with cooling the stored ion beam the electron bunches create a coherent space charge field which can cause emittance growth. This process is investigated both analytically and through simulation.

43 PARTICLE ACCELERATORS↗
DOE OSTI2023

JSPEC: A Program for IBS and Electron Cooling Simulation

JSPEC (JLab Simulation Package on Electron Cooling) is an open-source C++ program developed at Jefferson Lab to simulate the evolution of the ion beam under the intrabeam scattering effect and/or the electron cooling effect. JSPEC includes various models of the ion beam, the electron beam, and the friction force, aiming to reflect the latest advances in the field and to provide a useful tool to the community. JSPEC has been benchmarked against other cooling simulation codes and experimental data. It has been used to support the cooler design for JLEIC, an earlier JLab design for the Electron-Ion Collider. A Python wrapper of the C++ code, pyJSPEC, for Python 3.x environment has also been developed and released. It allows users to run JSPEC simulations in a Python environment and makes it possible for JSPEC to collaborate with other accelerator and beam modeling programs, as well as plentiful Python tools in data visualization, optimization, machine learning, etc. In this report, we introduce the features of JSPEC, with a focus on the latest development, and demonstrate how to use JSPEC and pyJSPEC with sample codes and numerical examples.

Accelerator Physics↗
DOE OSTI2021

JSPEC: A Program for IBS and Electron Cooling Simulation

Intrabeam scattering is an important collective effect that can deteriorate the properties of a high-intensity beam, and electron cooling is a method to mitigate the IBS effect. JSPEC (JLab Simulation Package for Electron Cooling) is an open-source program developed at Jefferson Lab, which simulates the evolution of the ion beam under the IBS and/or the electron cooling effect. JSPEC has been benchmarked with BETACOOL and experimental data. In this report, we will introduce the features of JSPEC, including the friction force calculation, the IBS expansion rate and electron cooling rate calculation, and the beam-dynamic simulations for the electron cooling process; explain how to set up the simulations in JSPEC; and demonstrate the benchmarking results.

Zhang, He↗