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At least 37 records · Page 2

Next Generation Heat Transfer Fluids for Two-Phase Immersion Cooling of Data Centers

The purpose of this study is to evaluate the performance of next generation dielectric fluids in a Two-Phase Immersion Cooling (2PIC) system, which was designed for use in data centers. Hence, this report contains the performance evaluations of a new developmental dielectric fluid, Opteon™ 2P50, in a commercially available small-scale 2PIC system under typical and off-design range of operating conditions. Accordingly, ambient temperature and thermal loads were varied to simulate different ambient conditions. Additionally, this research report describes the development of a semi-empirical lumped model to predict the energy efficiency of the 2PIC system using Opteon™ 2P50 across a wide range of conditions. The model aims to offer a comprehensive understanding of the system’s efficiency and potential improvements. The outcomes of this study are expected to contribute to the adoption of sustainable 2PIC cooling technologies in data centers.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

A remarkable CHF of 345W/cm 2 is achieved in a wicked-microchannel using HFE-7100

Boiling heat transfer of dielectric fluids is a promising cooling technique for thermal management of microelectronic systems. However, the critical heat flux achievable is generally low, because of the poor thermophysical properties of these fluids. Here, to address this dilemma, we propose a new cooling concept to substantially enhance global liquid supply during phase-change process using enhanced capillary-driven force. Additionally, dedicated vapor pathways are designed among a bank of micro-pillars to facilitate vapor removal. In this work, new wicks comprised of silicon micro-pinfin arrays are explored to significantly enhance the flow boiling heat transfer performance. To examine the functionalities of this wick, experiments on HFE-7100 were carried out with mass velocities varying from 247 to 3,465 kg/m 2 s. To explore the enhancement mechanisms and to analyze the capillary-assisted flow boiling process, visualization studies were conducted. The results indicate that sustainable evaporation induced by wick microstructures and efficient liquid supply are the enhancement mechanisms compared to parallel microchannels with solid walls. It is found that the overall heat transfer coefficient is substantially increased up to 75%. Remarkably, a high critical heat flux (CHF) of approximately 345 W/cm 2 is recorded at G = 3,465 kg/m 2 s at coolant inlet temperature of ~20 °C. Equally importantly, this noticeable enhancement of CHF value is associated with drastically decreased pressure drops compared to microchannels decorated with μ-pinfin fences.

36 MATERIALS SCIENCE↗

Multiple Carrier Generation at an Exceptionally Low Energy Threshold

Multiple carrier generation (MCG), a process wherein two or more carriers are generated from a single high-energy absorbed photon, holds immense promise for quantum sensing, metrology, low-threshold lasers, and photovoltaics. Despite its potential, MCG has faced obstacles such as low efficiency and a high threshold photon energy at least twice the band gap (2?Eg) of the semiconductor, limiting its application only to a class of materials with low Eg. Here, we present a new approach that overcomes this limitation by leveraging carrier-donor scattering to excite secondary electrons from donor states strategically positioned below the conduction band. Our method relies on strong Coulomb interaction, reduced dielectric screening, slow hot carrier cooling, and strictly follows the energy conservation rules. We experimentally demonstrated this idea in a model system of monolayer (1L) MoS2 by exploiting electron-donating chalcogen vacancy states. We observed an exceptionally low MCG threshold of ~1.12?Eg for the first time in 1L MoS2. Remarkably, the quantum yield can be further increased to >3 by increasing the photon energy to 1.65?Eg, representing a substantial advancement over existing methods. Our findings extend the horizon of MCG into next-generation high-performance optoelectronic devices with an on-demand operating spectral range spanning from infrared to ultraviolet.

CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS↗

Comparison of the dielectric and magnetocaloric properties of bulk and film of GdFe 0.5 Cr 0.5 O 3

Here, we report a comparison of the magnetic, magnetocaloric, and dielectric properties of 50% iron substituted GdCrO 3 (GdFe 0.5 Cr 0.5 O 3 ) bulk pellet and 960 nm thick film of GdFe 0.5 Cr 0.5 O 3 (GFCO). The 960 nm film was synthesized on a platinized-silicon substrate by chem. soln. deposition and spin-coating methods. The X-ray diffraction scans of the bulk sample and the film as well as the morphology of the film as examined by the field-emission scanning electron microscope indicate phase-pure and polycrystalline nature of these samples. XPS was used to deermine the valence states of Gd, Fe, and Cr. The temp. dependence of the dielectric const. from 225 to 700 K shows peaks at T C = 525 K for the bulk and ≈450 K for the film due to ferroelectric to paraelectric transitions, since elec. polarization vs elec. field hysteresis loops are observed. at room temp. The dielectric studies in the bulk GFCO for T > T C indicate a relaxor-like behavior. The measurements of the magnetization (M) of the samples as a function of temp. (5-350 K) and magnetic field (H) up to 7 T (=70 kOe) depict hysteresis behavior at low temps. due to the canted antiferromagnetic order of Fe 3+ /Cr 3+ below the Néel temp. of ≈275 K. The M vs H isotherms at various temps. are used to det. and compare the magnetic entropy change (-ΔS) and relative cooling power (RCP) of the two samples, yielding (-ΔS) = 30.7 J/kg K (18.8 J/kg K) and RCP = 566.5 J/kg (375 J/kg) for the bulk (960 nm film) samples of GFCO at 7 K and 7 T, resp. The plot of RCP vs T shows that magnetic cooling for this system is most effective for T < 30 K. Comparatively smaller magnitudes of (-ΔS) and RCP for the film vis-a-vis the bulk sample of GFCO scale with its reduced magnetization. This suggests that further improvements in the quality of the films are needed to improve their magnetization and hence their magnetocaloric properties, possibly making them useful for on-chip cooling in miniaturized devices.

36 MATERIALS SCIENCE↗

Measurement and analysis of cryogenic sapphire dielectric resonators and DROs

Presented are the experimental and computational results of a study on a new kind of dielectric resonator oscillator (DRO). It consists of a cooled, cylindrically symmetric sapphire resonator surrounded by a metallic shield and is capable of higher Q's than any other dielectric resonator. Isolation of fields to the sapphire by the special nature of the electromagnetic mode allows the very low loss of the sapphire itself to be expressed. Calculations show that the plethora of modes in such resonators can be effectively reduced through the use of a ring resonator with appropriate dimensions. Experimental results show Q's ranging from 3 x 10 to the 8th at 77 K to 10 to the 9th at 4.2 K. Performance is estimated for several types of DROs incorporating these resonators. Phase noise reductions in X-band sources are indicated at values substantially lower than those previously available.

Dick, G. J.↗

Thermal Management of Discretized Heaters Using CuW Microchannel Heat Sinks and FC3283

Single-phase cooling using microchannel heat sinks (MCHS) has become a popular approach for overcoming the thermal challenges associated with high-powered microelectronic devices. Thermal management is one of the largest barriers to higher power densities in electronics and frequently limits overall device performance. The implementation of forced convective cooling via single-phase liquid cooling in MCHS reduces the thermal resistance resulting in lower device temperatures at high-power conditions, which can decrease the package size and extend the lifespan of devices. The goal of the work described in this article was to investigate practical cooling solutions for laser diode bars. This study examined the effectiveness of a copper tungsten (CuW) microchannel heat sink paired with a dielectric coolant (FC3283) for dissipating both discrete and uniform heat fluxes up to 600 W/cm2 across a 0.25-cm2 surface area through a numerical and experimental study. CuW was chosen as the MCHS material because it is thermal expansion matched to GaAs, which is a common laser diode substrate. FC3283 serves as a dielectric coolant that is compatible with power electronics cooling. The microchannels utilized in this work were approximately $365$ $μ$ m deep and $100$ $μ$ m wide resulting in a hydraulic diameter of $160$ $μ$ m. The study investigated the cooling performance across a variety of applied power loads and flow rates to determine optimal effectiveness. The resulting thermal resistance ranged from 0.15 cm2 K/W at the highest flow rate to 0.26 cm2 K/W at the lowest flow rate. Further, the resulting thermal performance from this study demonstrates the importance of considering discrete heat sources separately from uniform heat sources and proved that the unique combination of CuW microchannels with FC3283 can be a promising cooling option toward future advancements of laser diode bars and other high-power microelectronics.

42 ENGINEERING↗

Technology of thin-rod Yb : YAG amplifiers with a high pulse energy and average power

Technology for producing thin-rod Yb : YAG laser amplifiers is improved, which is aimed at increasing the output pulse energy and includes the development of a new method for mounting active elements into a cooling system and employment of more persistent dielectric coatings of rod ends. An influence of a thermal lens on the beam size in an active element is theoretically studied and the parameters are found, which provide equal beam sizes at input and output rod ends. The output pulse energy of 4 mJ is obtained without optical breakdown of the output end, which substantially exceeds the previously obtained results. The amplifier demonstrates an average power of 60 W and maintains a high beam quality. (paper)

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

Ceramic Heat Pipe for Thermal Management of a High Frequency Inductor

As the power density of electric machines and power electronics continues to increase to meet the demands of more electric aircraft, the thermal management of these devices becomes increasingly important. Ideally, the thermal management solution of the device should have high thermal conductivity and be electrically insulating so that it can be directly integrated with the device in question. Technical ceramics are a class of materials that meet these two requirements. Direct liquid cooling by submerging electric components in a dielectric fluid is an alternate option, but adds system complexity and may incur pumping loss. In this work, the thermal management solution for a high frequency inductor is presented. A conventional wicked heat pipe is designed that is made from a solid ceramic case with a sintered ceramic wick. This heat pipe can provide structural support for the core and windings and is electrically insulating, so it does not incur any additional eddy current losses from the high frequency magnetic fields. It does not require additional pumping power, because conventional wicked heat pipes are passive devices. In this paper, the manufacturing process of the ceramic heat pipe is also presented. It is shown that the sintering of large diameter spherical ceramic particles is difficult due to their high specific surface area and low surface free energy. To overcome this difficulty, a flux material was used to initiate liquid phase sintering. The results of the sintering trials show that for the 120 μm diameter α-Al2O3powder selected for the wick, the combination of 1650°C sintering temperature and the addition of 5 wt% talc sintered the porous matrix together sufficiently for use as a heat pipe wic

High-frequency Inductor↗

Ceramic Heat Pipe for Thermal Management of a High Frequency Inductor

As the power density of electric machines and power electronics continues to increase to meet the demands of more electric aircraft, the thermal management of these devices becomes increasingly important. Ideally, the thermal management solution of the device should have high thermal conductivity and be electrically insulating so that it can be directly integrated with the device in question. Technical ceramics are a class of materials that meet these two requirements. Direct liquid cooling by submerging electric components in a dielectric fluid is an alternate option, but adds system complexity and may incur pumping loss. In this work, the thermal management solution for a high frequency inductor is presented. A conventional wicked heat pipe is designed that is made from a solid ceramic case with a sintered ceramic wick. This heat pipe can provide structural support for the core and windings and is electrically insulating, so it does not incur any additional eddy current losses from the high frequency magnetic fields. It does not require additional pumping power, because conventional wicked heat pipes are passive devices. In this paper, the manufacturing process of the ceramic heat pipe is also presented. It is shown that the sintering of large diameter spherical ceramic particles is difficult due to their high specific surface area and low surface free energy. To overcome this difficulty, a flux material was used to initiate liquid phase sintering. The results of the sintering trials show that for the 120 μm diameter α-Al2O3 powder selected for the wick, the combination of 1650°C sintering temperature and the addition of 5 wt% talc sintered the porous matrix together sufficiently for use as a heat pipe wick.

High frequency inductor↗

An Exploratory Study of Thermoelectrostatic Power Generation for Space Flight Applications

A study has been made of a process in which a solar heating cycle is combined with an electrostatic cycle for generating electrical power for space vehicle applications. The power unit, referred to as a thermoelectrostatic generator, is a thin film, solid dielectric capacitor alternately heated by solar radiation and cooled by radiant emission. The theory of operation to extract electrical power is presented. Results of an experiment to illustrate the principle are described. Estimates of the performance of this type of device in space in the vicinity of earth are included. Values of specific power of several kilowatts per kilogram of generator weight are calculated for such a device employing polyethylene terephthalate dielectric.

Beam, Benjamin H.↗

Solid State Ultracapacitor

An ink of the formula: 60-80% by weight BaTiO3 particles coated with SiO2; 5-50% by weight high dielectric constant glass; 0.1-5% by weight surfactant; 5-25% by weight solvent; and 5-25% weight organic vehicle. Also a method of manufacturing a capacitor comprising the steps of: heating particles of BaTiO3 for a special heating cycle, under a mixture of 70-96% by volume N2 and 4-30% by volume H2 gas; depositing a film of SiO2 over the particles; mechanically separating the particles; incorporating them into the above described ink formulation; depositing the ink on a substrate; and heating at 850-900 C for less than 5 minutes and allowing the ink and substrate to cool to ambient in N2 atmosphere. Also a dielectric made by: heating particles of BaTiO3 for a special heating cycle, under a mixture of 70-96% by volume N2 and 4-30% by volume H2 gas; depositing a film of SiO2 over the particles; mechanically separating the particles; forming them into a layer; and heating at 850-900 C for less than 5 minutes and allowing the layer to cool to ambient in N2 atmosphere.

Rolin, Terry D.↗

Electrical properties of lunar soil sample 15301,38

Electrical property measurements have been made on an Apollo 15 lunar soil sample in ultrahigh vacuum from room temperature to 827 C for the frequency spectrum from 100 Hz through 1 MHz. The dielectric constant, the total ac loss tangent, and the dc conductivity were measured. The dc conductivity showed no thermal hysteresis, but an irreversible (in vacuum) thermal effect was found in the dielectric loss tangent on heating above 700 C and during the subsequent cooling. This appears to be related to several effects associated with lunar glass above 700 C. The sample also showed characteristic low-frequency dispersion in the dielectric constant with increasing temperature, presumably due to Maxwell-Wagner intergranular effects. The dielectric properties may be fitted to a model involving a Cole-Cole frequency distribution that is relatively temperature-independent below 200 C and follows a Boltzmann temperature distribution with an activation energy of 2.5 eV above 200 C. The dc conductivity is fitted by an exponential temperature distribution and becomes the dominant loss above 700 C.

Olhoeft, G. R.↗

Electrostatic Discharge Testing of Carbon Composite Solar Array Panels for the Europa Mission to Jupiter

Carbon composite solar array panel coupons similar to those considered for use on the planned NASA Europa Mission were exposed to energetic electrons to observe the size and rate of electrostatic discharge production. The discharge size and rate were found to be primarily dependent on the quantity of dielectric binder pooled on the surface of the sample. Cooling the samples to cryogenic temperatures increased the size of discharges but an end of mission radiation dose had only minimal effects. Samples were composed of M55J carbon composite impregnated with an RS3 binder. Additional samples tested included a co-cured Kapton surface.

Green, Nelson W.↗

High-resolution neutron diffraction determination of noncollinear antiferromagnetic order in the honeycomb magnetoelectric Fe 4 ⁢Nb 2⁢ O 9

Magnetoelectric systems offer potential for device applications exploiting coupled states between electric and magnetic properties. Among magnetoelectric materials, Fe 4 ⁢Nb 2 ⁢O 9 has attracted special attention because of its pronounced dielectric signal at high magnetic transition temperatures. However, the magnetic ground state, which is essential information for understanding its unusual magnetoelectricity, remains unclarified. Here, we report a noncollinear magnetic ground state of Fe 4 ⁢Nb 2 ⁢O 9 . To examine the magnetoelectric effect associated with sequential magnetic and structural transitions upon cooling, we conducted combined x-ray diffraction, magnetic susceptibility, magnetization, dielectric constant, and magnetodielectric experiments. Powder neutron diffraction experiments revealed a series of magnetic Bragg peaks and clear splitting of peaks via structural transition. Magnetic Rietveld refinements, combined with group theory analysis, determined a noncollinear antiferromagnetic structure including a significant 𝑐-axis moment component at 1.5 K. This article provides insights into the understanding of its magnetoelectric properties.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Characterization of Highly Thermally Conductive Organic Substrates for a Double-Sided Cooled Power Module

Abstract Silicon-Carbide (SiC) power devices have become a promising option for traditional Silicon (Si) due to the superior material properties. To fully take advantage of the SiC devices, a high-performance power device packaging solution is necessary. This study proposes a cost-effective double-sided cooled (DSC) 1.2 kV SiC half-bridge power module using organic epoxy-resin composite dielectric (ERCD) substrates. The high mechanical and thermal performance of the power module is achieved by the low-modulus, moderate thermal conductivity, and relatively thin (120 μm) layer of ERCD material compared with traditional metal-clad ceramic approaches. This novel organic dielectric can withstand high voltage (5 kV @ 120 μm) and operate up to 250°C continuously, which is indispensable for high power applications. The thermal modeling results show that the equivalent thermal resistance junction-to-case (Rjc_eq) of the DSC power module using dual direct bonded copper (DBC) is 17% higher than the dual ERCD configuration. Furthermore, a non-insulated DSC power module concept is proposed for maximizing thermal performance by considering thermal vias in the ERCD substrate and direct-soldered heat sink. A thought process for optimization of thermal via design is demonstrated and it shows up to 24% of improvement on thermal performance compared with the insulated DSC power module.

Double-sided cooling, epoxy-resin composite dielec↗