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In-Situ Measurement of Crystalline Silicon Modules Undergoing Potential-Induced Degradation in Damp Heat Stress Testing for Estimation of Low-Light Power Performance
The extent of potential-induced degradation of crystalline silicon modules in an environmental chamber is estimated using in-situ dark I-V measurements and applying superposition analysis. The dark I-V curves are shown to correctly give the module power performance at 200, 600 and 1,000 W/m 2 irradiance conditions, as verified with a solar simulator. The onset of degradation measured in low light in relation to that under one sun irradiance can be clearly seen in the module design examined; the time to 5% relative degradation measured in low light (200 W/m 2 ) was 28% less than that of full sun (1,000 W/m 2 irradiance). The power of modules undergoing potential-induced degradation can therefore be characterized in the chamber, facilitating statistical analyses and lifetime forecasting.
Collisionless damping of hydromagnetic waves in relativistic plasma. I - Weak Landau damping - Heating of the Crab Nebula.
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Overall Performance Losses and Activated Mechanisms in Double Glass and Glass-backsheet Photovoltaic Modules with Monofacial and Bifacial PERC Cells, under Accelerated Exposures
Commercial PV modules have various packaging choices nowadays, which influence their long-term reliability. This study compared the degradation behaviors of sixteen module variants from two brands with varying encapsulant materials (EVA or POE), encapsulant types, module architectures (GB or DG), and cell types (monofacial or bifacial) using null hypothesis testing to determine statistical significant findings. The modules were exposed for 2,520 hours under two accelerated exposures: modified damp heat (mDH) and modified damp heat with full-spectrum light (mDH+FSL). For both brands, two DG module variants with UV-Cutoff rear encapsulant are found to have significantly lower average power loss than the module variants of EVA+GB with opaque rear encapsulant after each accelerated exposure. Metallization interconnect corrosion is identified as the primary degradation mechanism. Furthermore, unsupervised hierarchical clustering finds that the degradation behaviors of modules from one brand with a more strict manufacturing quality control depends on module architectures only.
Tearing and reliability of photovoltaic module backsheets
We report that the backsheet in photovoltaic modules belongs to an important class of layered materials where the tearing behavior of the individual layers does not necessarily represent the tearing behavior of the entire backsheet. Such characteristic arises from the interaction between the individual layers during the tearing process, where one layer of the backsheet is mechanically constrained by its neighboring layers and the layers may debond from each other. The mechanical constraint and debonding change the amount of energy dissipated during tearing and affect the overall tearing energy. In this article, we exposed a wide selection of backsheets with polymers including ethylene-vinyl acetate (EVA), polyethylene terephthalate (PET), polyvinylidene fluoride (PVDF), and ethylene tetrafluoroethylene (ETFE) to damp heat (85°C/85%RH) for up to 2000 hours. We report on the effect of damp heat on the tearing energy as a function of damp heat exposure. We developed a model that describes the tearing energy of a layered structure by accounting for the tearing of the individual layers in the backsheet, the effect of mechanical constraint, and the adhesive debonding between the layers. Additionally, we explore the relationship between the microstructural change in the polymers which resulted from the damp heat exposure and the mechanical properties using modulated differential scanning calorimetry (MDSC), small and wide angle X-ray scattering (SAXS and WAXS), and tensile testing.
Field-dependent nonelectronic contributions to thermal conductivity in a metallic ferromagnet with low Gilbert damping
Heat conduction in metals is typically dominated by electron transport since electrons carry both charge and heat. In magnetic metals magnons, or spin waves, excitations of the magnetic order can be used to transport information. Heat conduction via magnons has been previously shown mostly for insulating magnets with low Gilbert damping and resulting long spin-wave lifetimes where conduction electrons cannot contribute. Here we show that thin films of properly optimized metallic ferromagnetic (FM) alloys show significant nonelectronic contributions to heat conduction, which furthermore depend on the direction of an applied magnetic field. These measurements are enabled by micromachined thermal isolation platforms optimized for thermal conductivity measurements of thin-film systems. Electrical conductivity measurements on exactly the same samples allow application of the Wiedemann-Franz relation, which shows large nonelectronic contributions to thermal conductivity for the cobalt-iron alloy with 25% Co. This composition has been shown to have exceptionally low damping for a metallic FM. The thermal conductivity of a 75-nm-thick film of the 25% Co alloy changes by more than 20% at some temperatures, while a reference sample with 50% cobalt that has much higher damping shows no field-direction dependence. Our measurements indicate that applied magnetic fields alter the magnon lifetimes in these films and that these magnons contribute to thermal conductivity in this metallic magnetic alloy with low Gilbert damping.
Performance and durability of electrically conductive tape for shingled Si heterojunction technology cells
We report electrically conductive tape (ECT) was characterized and used to assemble shingled cell strings at low temperature to achieve high reliability Pb- and Ag-free interconnections. The volume resistivity for two considered ECTs are 0.13 ± 0.06 mΩ·cm and 0.47 ± 0.20 mΩ·cm and specific contact resistances, 6.85± 2.00 mΩ·cm 2 and 6.30 ± 0.37 mΩ·cm 2 using the emerging IEC 62788-8-1 Technical Specification for assessment of electrically conductive adhesives (ECA). Durability and performance of the technology in glass–glass mini modules were evaluated with temperature cycling, damp heat testing, and combined-accelerated stress testing (CAST). Through temperature cycling (-40°C to 85°C) applying five times the mini module short-circuit current in forward bias and in the multi climate CAST protocol, there was negligible degradation of fill factor after replacing connectors at the modules' cable leads; however, CAST resulted in short circuit current loss attributed to degradation in light collection by the cells, not the ECT. The IEC 61215-2 85°C, 85% relative humidity damp heat testing showed susceptibility of the HJT cells to effects of humidity in the electroluminescence intensity around the module perimeter that degraded power performance by 4% (relative). Contrasting the IEC 61215-2 qualification testing-based damp heat testing with CAST, factors such as the optical stress of CAST may precipitate the degradation of the modules whereas the humidity levels and duration of IEC 61215-2 damp heat testing may lead to excessive levels of humidity diffused into the modules, potentially resulting in degradation that is unrepresentative of the field.
The Role of Water on the Interfacial Adhesion in Si Solar Modules
Delamination of solar module interfaces often occurs in field-tested solar modules after decades of service due to environmental stressors such as humidity. As water diffuses into the module, failure mechanisms like corrosion and delamination are significantly affected. In the presence of water, the interfaces between EVA and the cell, glass, and backsheet all experience losses of adhesion exposing the module to accelerated degradation. Understanding the relation between interfacial adhesion and water content inside PV modules can help mitigate detrimental power losses. Water content measurements via short wave infrared reflectometry combined with 180 degrees peel tests were used to study and quantify the effect of water ingress and egress on adhesion. Changes in adhesion strength for different module interfaces are quantified, correlating spatial distribution of water content to adhesion for damp heat and dry heat exposed samples. After 1000 hours of damp heat exposure, decreases in adhesion strength of approximately 1 N/mm were noted for all interfaces.
Lessons from the IEC Durability of Adhesion Accelerated Test Sequence
The IEC 62788-1-1 and IEC 63209-2 standards use aging sequences for durability of adhesion in photovoltaic (PV) modules, which may be evaluated using the single cantilever beam (SCB) test. Because the encapsulant forms critical interfaces with the front glass and solar cells, degradation at those interfaces under ultraviolet (UV) exposure, elevated temperature, and humidity can lead to interfacial delamination - compromising the long-term reliability. In this work, adhesion durability of UV-transmitting poly(ethylene-co-vinyl acetate) (EVA) encapsulant to glass and to silicon solar cells is evaluated after sequenced UV and damp heat aging (85C/85%RH). Laminates were prepared using StarPhire solar front glass with thin glass or PERC cells, and two EVA formulations with different concentrations of siloxane coupling agent. Adhesion was quantified by measuring critical debond energy using the SCB method. Both formulations exhibit similar qualitative trends, while different adhesion is observed at the periphery despite the use of low-shrink manufacturing. The results show that while glass/EVA adhesion remains stable or increases after UV exposure and shows only moderate changes after damp heat, the EVA/cell interface exhibits an irreversible loss of adhesion following UV and then damp heat exposure. Although glass/EVA interfaces generally exhibit lower debond energies, the EVA/cell interface is significantly more vulnerable to UV-driven degradation, identifying it as the dominant reliability risk location through early- and intermediate-module life. These results demonstrate that accelerated aging sequences can expose large, interface-specific losses in adhesion durability and underscore the importance of interface engineering for long-term PV module reliability.
Vibration damping and heat transfer using material phase changes
A method and apparatus wherein phase changes in a material can dampen vibrational energy, dampen noise and facilitate heat transfer. One embodiment includes a method for damping vibrational energy in a body. The method comprises attaching a material to the body, wherein the material comprises a substrate, a shape memory alloy layer, and a plurality of temperature change elements. The method further comprises sensing vibrations in the body. In addition, the method comprises indicating to at least a portion of the temperature change elements to provide a temperature change in the shape memory alloy layer, wherein the temperature change is sufficient to provide a phase change in at least a portion of the shape memory alloy layer, and further wherein the phase change consumes a sufficient amount of kinetic energy to dampen at least a portion of the vibrational energy in the body. In other embodiments, the shape memory alloy layer is a thin film. Additional embodiments include a sensor connected to the material.
Test-to-Failure of Crystalline Silicon Modules: Preprint
Accelerated lifetime testing of five crystalline silicon module designs was carried out according to the Terrestrial Photovoltaic Module Accelerated Test-to-Failure Protocol. This protocol compares the reliability of various module constructions on a quantitative basis. The modules under test are subdivided into three accelerated lifetime testing paths: 85..deg..C/85% relative humidity withsystem bias, thermal cycling between 40..deg..C and 85..deg..C, and a path that alternates between damp heat and thermal cycling. The most severe stressor is damp heat with system bias applied to simulate the voltages that modules experience when connected in an array. Positive 600 V applied to the active layer with respect to the grounded module frame accelerates corrosion of the silver gridfingers and degrades the silicon nitride antireflective coating on the cells. Dark I-V curve fitting indicates increased series resistance and saturation current around the maximum power point; however, an improvement in junction recombination characteristics is obtained. Shunt paths and cell-metallization interface failures are seen developing in the silicon cells as determined byelectroluminescence, thermal imaging, and I-V curves in the case of negative 600 V bias applied to the active layer. Ability to withstand electrolytic corrosion, moisture ingress, and ion drift under system voltage bias are differentiated.
PV encapsulant formulations and stress test conditions influence dominant degradation mechanisms
Polyethylene-based poly(ethylene-co-vinyl acetate) (EVA), polyolefin elastomer (POE), and thermoplastic polyolefin (TPO) are common polymer candidates for photovoltaic (PV) module encapsulants. The choice of encapsulant must be carefully considered in novel module designs, such as bifacial glass/glass laminates, to limit performance degradation through loss of optical transmittance, mechanical integrity, and corrosion - as well as potential-induced degradation. Encapsulant quality and resilience against environmental stressors are readily influenced by the additives in the encapsulant formulation. Here, we show that, the changes in optical transmittance after UV aging result from the discoloration caused by interactions between additives, and optical scattering from changes in the polymer crystal structure. We observed competing cross-linking and chain scission mechanisms, with their kinetics influenced by the presence of oxygen and elevated temperatures. Increasing chamber temperatures from 55 °C to 85 °C during the UV stress test amplified encapsulant discoloration and promoted polymer cross-linking, causing severe, irreversible damage that remains to be proven field relevant. Damp heat aging was found to be insufficient to produce significant encapsulant degradation; however, combining stress tests sequentially allowed detection of further degradation beyond the limitations of the damp heat test alone. Appropriate degradation screening methods are necessary to uncover potential encapsulant weaknesses.
Final Technical Report - Recovery Act: Organic Coatings as Encapsulants for Low Cost, High Performance PV Modules
The objective of this project was to evaluate the feasibility of utilizing PPG's commercial organic coatings systems as efficient, modernized encapsulants for low cost, high performance, thin film photovoltaic modules. Our hypothesis was that the combination of an anticorrosive coating with a more traditional barrier topcoat would mitigate many electrochemical processes that are now responsible for the significant portion of photovoltaic (PV) failures, thereby nullifying the extremely high moisture barrier requirements of currently used encapsulation technology. Nine commercially available metal primer coatings and six commercially available top coatings were selected for screening. Twenty-one different primer/top coat combinations were evaluated. The primer coatings were shown to be the major contributor to corrosion inhibition, adhesion, and barrier properties. Two primer coatings and one top coating were downselected for testing on specially-fabricated test modules. The coated test modules passed initial current leakage and insulation testing. Damp Heat testing of control modules showed visible corrosion to the bus bar metal, whereas the coated modules showed none. One of the primer/top coat combinations retained solar power performance after Damp Heat testing despite showing some delamination at the EVA/solar cell interface. Thermal Cycling and Humidity Freeze testing resulted in only one test module retaining its power performance. Failure modes depended on the particular primer/top coating combination used. Overall, this study demonstrated that a relatively thin primer/top coating has the potential to replace the potting film and backsheet in crystalline silicon-based photovoltaic modules. Positive signals were received from commercially available coatings developed for applications having performance requirements different from those required for photovoltaic modules. It is likely that future work to redesign and customize these coatings would result in a coating system meeting the requirements for photovoltaic module encapsulation.
Accelerated testing of module-level power electronics for long-term reliability
This work has applied a suite of long-term-reliability accelerated tests to a variety of module-level power electronics (MLPE) devices (such as microinverters and optimizers) from five different manufacturers. This dataset is one of the first (only the paper by Parker et al. entitled “Dominant factors affecting reliability of alternating current photovoltaic modules,” in Proc. 42nd IEEE Photovoltaic Spec. Conf., 2015, is reported for reliability testing in the literature), as well as the largest, experimental sets in public literature, both in the sample size (five manufacturers including both dc/dc and dc/ac units and 20 units for each test) and the number of experiments (six different experimental test conditions) for MLPE devices. The accelerated stress tests (thermal cycling test per IEC 61215 profile, damp heat test per IEC 61215 profile, and static temperature tests at 100 and 125 °C) were performed under powered and unpowered conditions. The first independent long-term experimental data regarding damp heat and grid transient testing, as well as the longest term (>9 month) testing of MLPE units reported in the literature for thermal cycling and high-temperature operating life, are included in these experiments. Additionally, this work is the first to show in situ power measurements, as well as periodic efficiency measurements over a series of experimental tests, demonstrating whether certain tests result in long-term degradation or immediate catastrophic failures. Lastly, the result of this testing highlights the performance of MLPE units under the application of several accelerated environmental stressors.
Surface Modification of Backsheets Using Coupling Agents for Roll-To-Roll Processed Thin-Film Solar Photovoltaic (PV) Module Packaging Application
For many flexible electronic and photonic devices, moisture stability is one of the most important factors that affects its short- and long-term performance. To maintain the performance, the device should be packaged in such a way that it hermetically blocks moisture from the device; however, in practice, it is rather difficult to achieve. The more practical solution is to impede the moisture ingress to the device. In optoelectronic devices that will be outdoors like solar cells, the interfacial adhesion strength between the encapsulant layer (adhesive) and a moisture barrier layer is also a critical parameter. This paper presents surface modifications of poly(ethylene terephthalate) (PET) carrier films, one of the layers in the trilayer barrier film that directly adheres to an encapsulant, using chemical, UV/ozone, and both treatments to improve adhesion with the thermoset encapsulant polymer material. Whereas previous studies also utilized treatment methods to increase the wettability characteristics, in this paper, we not only present the results of the adhesion strength upon various techniques to achieve good adhesion but also screen their behavior upon exposure to a damp–heat (60 °C, 90% RH) environment. Here, we found that the combined treatment method increases the adhesion by up to 12.1-fold and demonstrates up to a 200% increase in adhesion strength even upon our severe damp–heat environmental condition.
Potential-Induced Degradation-Delamination Mode in Crystalline Silicon Modules: Preprint
A test sequence producing potential-induced degradation-delamination (PID-d) in crystalline silicon modules has been tested and found comparable under visual inspection to cell/encapsulant delamination seen in some fielded modules. Four commercial modules were put through this sequence, 85 degrees C, 85%, 1000 h damp heat, followed by an intensive PID stress sequence of 72 degrees C, 95% RH, and -1000 V, with the module face grounded using a metal foil. The 60 cell c-Si modules exhibiting the highest current transfer (4.4 center dot 10-4 A) exhibited PID-d at the first inspection after 156 h of PID stress. Effects promoting PID-d are reduced adhesion caused by damp heat, sodium migration further reducing adhesion to the cells, and gaseous products of electrochemical reactions driven by the applied system voltage. A new work item proposal for an IEC test standard to evaluate for PID-d is anticipated.
A Custom High-Throughput Optical Mapping Instrument (OMI) for Accelerated Stress Testing of PV Module Materials
The performance and integrity of photovoltaic (PV) modules and materials may be assessed through optical characterizations. We have developed a custom Optical Mapping Instrument (OMI) to improve measurement throughput time, facilitate automated measurements, and obtain spatial information relative to commercial benchtop spectrophotometer instruments. Both the key components and the methods used to improve the measurements are described. The measurement precision for the OMI is benchmarked for hemispherical transmittance relative to a previous round-robin study for commercial spectrophotometers. Example mapping measurements and their implications are given for specimens from other studies, including: (1) the depletion of the UV absorber is revealed for specimens beyond a certain size after standardized artificial ultraviolet (UV) weathering, (2) an optical degradation by internal haze formation is confirmed following Damp Heat (85°C/85% relative humidity) testing, (3) the better uniformity of the wear pattern for falling sand abrasion is used to select the DIN 52348 fixture over the ASTM D968 fixture, and (4) the local (millimeter-scale) heterogeneity of surface contamination in the soiling-prone location of Dubai relative to Kuwait. The results of the UV study have already been used to improve the standardized weathering of encapsulants. The example for Damp Heat testing is given to increase awareness of a degradation believed to be ubiquitously occurring in safety and design-type qualification testing of PV modules.