Complementary variational principles in neutron diffusion theory.
Complementary variational principles in neutron diffusion theory
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Complementary variational principles in neutron diffusion theory
Spacecraft onboard data handling system with MSI complementary MOS arrays, describing various components
Bipolar n-p-n transistors fabrication to increase driving capabilities of complementary MOS transistors while retaining low power dissipation
Complementary metal oxide semiconductor and bipolar transistors fabrication on same integrated circuit chip by C-squared technology
Two new processes form complementary transistors in monolithic semiconductor circuits, require fewer steps /infusions/ than previous methods, and eliminate such problems as nonuniform h sub FE distribution, low yield, and large device formation.
Complementary regenerative transistorized switch circuit employing positive and negative feedback
Broadband distribution amplifier with complementary pair transistor output stages
Beam-lead technology application to complementary MOS IC processing
Rate 1/2 convolutional error correcting binary codes with complementary generators, discussing synthesis and search procedure for largest free distance
An electrostatic shield for complementary MOS integrated circuits was developed to minimize the adverse effects of stray electric fields created by the potentials in the metal interconnections. The process is compatible with silicon gate technology. N-doped polycrystalline silicon was used for all the gates and the shield. The effectiveness of the shield was demonstrated by constructing a special field plate over certain transistors. The threshold voltages obtained on an oriented silicon substrate ranged from 1.5 to 3 V for either channel. Integrated inverters performed satisfactorily from 3 to 15 V, limited at the low end by the threshold voltages and at the high end by the drain breakdown voltage of the n-channel transistors. The stability of the new structure with an n-doped silicon gate as measured by the shift in C-V curve under 200 C plus or minus 20 V temperature-bias conditions was better than conventional aluminum gate or p-doped silicon gate devices, presumably due to the doping of gate oxide with phosphorous.
The relationship between the complementary variational principle and duality in mathematical programming is demonstrated through a geometric approach in a Hilbert space setting. A necessary and sufficient condition for the existence of such a principle is given in the case of a convex functional constrained by linear dynamics. Its relationship to the Kuhn-Tucker saddle point theory is indicated. Applications to various programming and control problems are discussed.
A high frequency oscillator, having both good short and long term stability, is formed by including a piezoelectric crystal in the base circuit of a first bi-polar transistor circuit, the bi-polar transistor itself operated below its transitional frequency and having its emitter load chosen so that the input impedance, looking into the base thereof, exhibits a negative resistance in parallel with a capacitive reactance. Combined with this basic circuit is an auxiliary, complementary, second bi-polar transistor circuit of the same form with the piezoelectric crystal being common to both circuits. By this configuration small changes in quiescent current are substantially cancelled by opposite variations in the second bi-polar transistor circuit, thereby achieving from the oscillator a signal having its frequency of oscillation stable over long time periods as well as short time periods.
A discrete complementary variational principle is developed and applied to linear and nonlinear discrete-time optimal control systems. Using the variational approach, a primal-dual relationship is established. This relationship provides a precise measure of system suboptimality independent of any a priori knowledge of the optimal solution.
Complementary metal-oxide-semiconductor (CMOS) structure has relatively high speed, high breakdown voltage, high transconductance and high packing densities.
A modified complementary filtering technique for estimating aircraft roll rate was developed and flown in a research helicopter to determine whether higher gains could be achieved. Use of this technique did, in fact, permit a substantial increase in system frequency bandwidth because, in comparison with first-order filtering, it reduced both noise amplification and control limit-cycle tendencies.
The complete sequence used to manufacture complementary metal oxide semiconductor (CMOS) integrated circuits is described. The fixed-gate array concept is presented as a means of obtaining CMOS integrated circuits in a fast and reliable fashion. Examples of CMOS circuits fabricated by both the conventional method and the fixed-gate array method are included. The electrical parameter specifications and characteristics are given along with typical values used to produce CMOS circuits. Temperature-bias stressing data illustrating the thermal stability of devices manufactured by this process are presented. Results of a preliminary study on the radiation sensitivity of circuits manufactured by this process are discussed. Some process modifications are given which have improved the radiation hardness of our CMOS devices. A formula description of the chemicals and gases along with the gas flow rates is also included.
A new complementary MOS structure has been fabricated consisting of a p-channel DMOS transistor and an n-channel double-diffused VMOS transistor. The transconductance of each transistor was between 0.85-0.98 of the theoretical transconductance. The threshold voltages have been adjusted by either ion implantation or by adjusting the diffusion profiles. The inverter operation is similar to that of standard CMOS.
The fabrication techniques for creation of complementary metal oxide semiconductor integrated circuits at George C. Marshall Space Flight Center are described. Examples of C-MOS integrated circuits manufactured at MSFC are presented with functional descriptions of each. Typical electrical characteristics of both p-channel metal oxide semiconductor and n-channel metal oxide semiconductor discrete devices under given conditions are provided. Procedures design, mask making, packaging, and testing are included.