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All sourcesNASA NTRSDOE OSTI
NASA NTRS2015

Body of Knowledge (BOK) for Copper Wire Bonds

Copper wire bonds have replaced gold wire bonds in the majority of commercial semiconductor devices for the latest technology nodes. Although economics has been the driving mechanism to lower semiconductor packaging costs for a savings of about 20% by replacing gold wire bonds with copper, copper also has materials property advantages over gold. When compared to gold, copper has approximately: 25% lower electrical resistivity, 30% higher thermal conductivity, 75% higher tensile strength and 45% higher modulus of elasticity. Copper wire bonds on aluminum bond pads are also more mechanically robust over time and elevated temperature due to the slower intermetallic formation rate - approximately 1/100th that of the gold to aluminum intermetallic formation rate. However, there are significant tradeoffs with copper wire bonding - copper has twice the hardness of gold which results in a narrower bonding manufacturing process window and requires that the semiconductor companies design more mechanically rigid bonding pads to prevent cratering to both the bond pad and underlying chip structure. Furthermore, copper is significantly more prone to corrosion issues. The semiconductor packaging industry has responded to this corrosion concern by creating a palladium coated copper bonding wire, which is more corrosion resistant than pure copper bonding wire. Also, the selection of the device molding compound is critical because use of environmentally friendly green compounds can result in internal CTE (Coefficient of Thermal Expansion) mismatches with the copper wire bonds that can eventually lead to device failures during thermal cycling. Despite the difficult problems associated with the changeover to copper bonding wire, there are billions of copper wire bonded devices delivered annually to customers. It is noteworthy that Texas Instruments announced in October of 2014 that they are shipping microcircuits containing copper wire bonds for safety critical automotive applications. An evaluation of copper wire bond technology for applicability to spaceflight hardware may be warranted along with concurrently compiling a comprehensive understanding of the failure mechanisms involved with copper wire bonded semiconductor devices.

Body of Knowledge (BOK)↗
NASA NTRS2004

Calibration, Data Acquisition, and Post Analysis of Turbulent Fluid Flow in a Calibration Jet Using Hot-wire Anemometry

The Turbine Branch concentrates on the following areas: Computational Fluid Dynamics (CFD), and implementing experimental procedures to obtain physical modeling data. Hot-wire Anemometry is a valuable tool for obtaining physical modeling data. Hot-wire Anemometry is likely to remain the principal research tool for most turbulent air/gas flow studies. The Hot-wire anemometer consists of a fine wire heated by electric current. When placed in a fluid stream, the hot-wire loses heat to the fluid by forced convection. In forced convection, energy transfer is due to molecular motion imposed by an extraneous force moving fluid parcels. When the hot-wire is in "equilibrium", the rate of heat input to the wire is equal to the rate of heat loss at the wire ends. The equality between heat input and heat loss is the basis for King s equation, which relates the electrical parameters of the hot-wire to the flow parameters of the fluid. Hot-wire anemometry is based on convective heat transfer from a heated wire element placed in a fluid flow. Any change in the fluid flow condition that affects the heat transfer from the heated element will be detected virtually instantaneously by a constant-temperature Hot-wire anemometry system. The system implemented for this research is the IFA 300. The system is a fully-integrated, thermal anemometer-based system that measures mean and fluctuating velocity components in air, water, and other fluids. It also measures turbulence and makes localized temperature measurements. A constant-temperature anemometer is a bridge and amplifier circuit that controls a tiny wire at constant temperature. As a fluid flow passes over the heated sensor, the amplifier senses the bridge off-balance and adjusts the voltage to the top of the bridge, keeping the bridge in balance. The voltage on top of the bridge can then be related to the velocity of the flow. The bridge voltage is sensitive to temperature as well as velocity and so the built-in thermocouple circuit can be attached to a thermocouple that can measure the fluid temperature. Additional information is included in the original extended abstract.

Moreno, Michelle↗
NASA NTRS2005

In Situ Electrochemical Deposition of Microscopic Wires

A method of fabrication of wires having micron and submicron dimensions is built around electrochemical deposition of the wires in their final positions between electrodes in integrated circuits or other devices in which the wires are to be used. Heretofore, nanowires have been fabricated by a variety of techniques characterized by low degrees of controllability and low throughput rates, and it has been necessary to align and electrically connect the wires in their final positions by use of sophisticated equipment in expensive and tedious post-growth assembly processes. The present method is more economical, offers higher yields, enables control of wire widths, and eliminates the need for post-growth assembly. The wires fabricated by this method could be used as simple electrical conductors or as transducers in sensors. Depending upon electrodeposition conditions and the compositions of the electroplating solutions in specific applications, the wires could be made of metals, alloys, metal oxides, semiconductors, or electrically conductive polymers. In this method, one uses fabrication processes that are standard in the semiconductor industry. These include cleaning, dry etching, low-pressure chemical vapor deposition, lithography, dielectric deposition, electron-beam lithography, and metallization processes as well as the electrochemical deposition process used to form the wires. In a typical case of fabrication of a circuit that includes electrodes between which microscopic wires are to be formed on a silicon substrate, the fabrication processes follow a standard sequence until just before the fabrication of the microscopic wires. Then, by use of a thermal SiO-deposition technique, the electrodes and the substrate surface areas in the gaps between them are covered with SiO. Next, the SiO is electron-beam patterned, then reactive-ion etched to form channels having specified widths (typically about 1 m or less) that define the widths of the wires to be formed. Drops of an electroplating solution are placed on the substrate in the regions containing the channels thus formed, then the wires are electrodeposited from the solution onto the exposed portions of the electrodes and into the channels. The electrodeposition is a room-temperature, atmospheric-pressure process. The figure shows an example of palladium wires that were electrodeposited into 1-mm-wide channels between gold electrodes.

Yun, Minhee↗
NASA NTRS1995

Evaluation of Pd-Cr Wires for Strain Gage Application

A newly developed alloy, palladium-13 weight percent chromium (Pd13Cr), was identified by United Technologies Research Center under a NASA contract to be the best material for high temperature strain gage applications. An electrical resistance strain gage that can provide accurate static strain measurement to a temperature higher than that of a commercially available gage is urgently needed in aerospace and aeronautics research. A strain gage made of a 25.4 micron (1 mil) diameter Pd13Cr wire has been recently demonstrated to be usable for static strain measurements to 800 C. This compares to the 400 C temperature limit of the commercially available strain gages. The performance of the Pd-Cr gage, however, strongly depends on the quality of the Pd13Cr wire. Four batches of Pd-Cr wires purchased from three different manufacturers were therefore evaluated to determine the best source of the wire for strain gage applications. The three suppliers were Precious Metal Institute in China, Sigmund Cohn Co., and G & S Titanium, Inc. in the United States. Two batches of wires obtained from Previous Metal Institute in 1987 and 1992, respectively are referred to herein as China87 and China92 wires. The mechanical, chemical and electrical properties of these wires, both as-received and after high temperature exposures at 800 C for 50 hours were analyzed. The elastic modulus and the failure strength of the wires were evaluated using a tensile test machine equipped with a laser speckle strain measurement system. The chemical and microstructural properties of the wires were inspected using a plasma atomic emission spectrometer and a scanning electron microscope (SEM) equipped with an energy dispersive X-ray spectroscope (EDS). The electrical stability and repeatability of the wires were determined by measuring the electrical resistance of the wires during three thermal cycles to 1000 C and a ten-hour soak at 1000 C. As a result of this study, the wire which has the highest strength, the least impurities content, the best oxidation resistance and the best electrical stability will be selected for upcoming strain gage applications.

Lei, Jih-Fen↗
NASA NTRS2002

Investigating the Use of Ultrasonic Guided Waves for Aging Wire Insulation Assessment

Aging wiring has become a critical issue to DoD, NASA, FAA, and Industry. The problem is that insulation on environmentally aged wire becomes brittle and cracks. This exposes the underlying conductive wire to the potential for short circuits and fire. The difficulty is that techniques to monitor aging wire problems focus on applying electrical sensing techniques that are not very sensitive to the wire insulation. Thus, the development of methods to quantify and monitor aging wire insulation is highly warranted. Measurement of wire insulation stiffness by ultrasonic guided waves is being examined. Initial laboratory tests were performed on a simple model consisting of a solid cylinder and then a solid cylinder with a polymer coating. Experimental measurements showed that the lowest order axisymmetric mode may be sensitive to stiffness changes in the wire insulation. To test this theory, mil-spec wire samples MIL-W-81381, MIL-W-22759/34, and MIL-W-22759/87 (typically found in aircraft) were heat-damaged in an oven, in a range of heating conditions. The samples were 12, 16, and 20 gauge and the heat-damage introduced material changes in the wire-insulation that made the originally flexible insulation brittle and darker in color. Axisymmetric mode phase velocity increased for the samples that were exposed to heat for longer duration. For example, the phase velocity in the 20-gauge MIL-W-22759/34 wire changed from a baseline value of 2790m/s to 3280m/s and 3530m/s for one-hour exposures to 3490C and 3990C, respectively. Although the heat-damage conditions are not the same as environmental aging, we believe that with further development and refinements, the ultrasonic guided waves can be used to inspect wire-insulation for detrimental environmental aging conditions.

Anastasi, Robert F.↗
NASA NTRS2005

Environmental Influence of Gravity and Pressure on Arc Tracking of Insulated Wires Investigated

Momentary short-circuit arcs between a defective polyimide-insulated wire and another conductor may thermally char (pyrolize) the insulating material. The charred polyimide, being conductive, can sustain the short-circuit arc, which may propagate along the wire through continuous pyrolization of the polyimide insulation (arc tracking). If the arcing wire is part of a multiple-wire bundle, the polyimide insulation of other wires within the bundle may become thermally charred and start arc tracking also (flash over). Such arc tracking can lead to complete failure of an entire wire bundle, causing other critical spacecraft or aircraft failures. Unfortunately, all tested candidate wire insulations for aerospace vehicles were susceptible to arc tracking. Therefore, a test procedure was designed at the NASA Lewis Research Center to select the insulation type least susceptible to arc tracking. This test procedure addresses the following three areas of concern: (1) probability of initiation, (2) probability of reinitiation (restrike), and (3) extent of arc tracking damage (propagation rate). Item 2 (restrike probability) is an issue if power can be terminated from and reapplied to the arcing wire (by a switch, fuse, or resettable circuit breaker). The degree of damage from an arcing event (item 3) refers to how easily the arc chars nearby insulation and propagates along the wire pair. Ease of nearby insulation charring can be determined by measuring the rate of arc propagation. Insulation that chars easily will propagate the arc faster than insulation that does not char very easily. A popular polyimide insulated wire for aerospace vehicles, MIL-W-81381, was tested to determine a degree of damage from an arcing event (item 3) in the following three environments: (1) microgravity with air at 1-atm pressure, (2) 1g with air at 1 atm, and (3) 1g within a 10^-6 Torr vacuum. The microgravity 1-atm air was the harshest environment, with respect to the rate of damage of arc tracking, for the 20 AWG (American Wiring Gauge) MIL-W-81381 wire insulation type . The vacuum environment resulted in the least damage. Further testing is planned to determine if the environmental results are consistent between insulation types and to evaluate the other two parameters associated with arc tracking susceptibility.

Source record↗
NASA NTRS2008

Integrating the Gradient of the Thin Wire Kernel

A formulation for integrating the gradient of the thin wire kernel is presented. This approach employs a new expression for the gradient of the thin wire kernel derived from a recent technique for numerically evaluating the exact thin wire kernel. This approach should provide essentially arbitrary accuracy and may be used with higher-order elements and basis functions using the procedure described in [4].When the source and observation points are close, the potential integrals over wire segments involving the wire kernel are split into parts to handle the singular behavior of the integrand [1]. The singularity characteristics of the gradient of the wire kernel are different than those of the wire kernel, and the axial and radial components have different singularities. The characteristics of the gradient of the wire kernel are discussed in [2]. To evaluate the near electric and magnetic fields of a wire, the integration of the gradient of the wire kernel needs to be calculated over the source wire. Since the vector bases for current have constant direction on linear wire segments, these integrals reduce to integrals of the form

Champagne, Nathan J.↗
NASA NTRS2009

Lunar Module Wiring Design Considerations and Failure Modes

This slide presentation reviews the considerations for the design of wiring for the Lunar Module. Included are a review of the choice of conductors and insulations, the wire splicing (i.e., crimping, and soldering), the wire connectors, and the fabrication of the wire harnesses. The problems in fabrication include the wires being the wrong length, the damage due to the sharp edges, the requried use of temproary protective covers and inadequate training. The problems in the wire harness installation include damge from sharp eges, work on adjacent harnesses, connector damage, and breaking wires. Engineering suggestions from the Apollo-era in reference to the conductors that are reviewed include: the use of plated conductors, and the use of alloys for stronger wiring. In refernce to insulation, the suggestions from Apollo era include the use of polymer tape-wrap wire insulation due to the light weight, however, other types of modern insulation might be more cost-effective. In reference to wire splices and terminal boards the suggestions from the Apollo Era include the use of crimp splices as superior to solder splices, joining multiple wire to a common point using modular plug-ins might be more reliable, but are heavier than crimp splicing. For connectors, the lessons from the Apollo era indicate that a rear environmental seal that does not require additional potting is preferred, and pins should be crimped or welded to the incoming wires and be removable from the rear of the connector.

Interbartolo, Michael↗
NASA NTRS2010

Reusable Hot-Wire Cable Cutter

During the early development stage of balloon deployment systems for missions, nichrome wire cable cutters were often used in place of pyro-actuated cutters. Typically, a nichrome wire is wrapped around a bundle of polymer cables with a low melting point and connected to a relay-actuated electric circuit. The heat from the nichrome reduces the strength of the cable bundle, which quickly breaks under a mechanical load and can thus be used as a release mechanism for a deployment system. However, the use of hand-made heated nichrome wire for cutters is not very reliable. Often, the wrapped nichrome wire does not cut through the cable because it either pulls away from its power source or does not stay in contact with the cable being cut. Because nichrome is not readily soldered to copper wire, unreliable mechanical crimps are often made to connect the nichrome to an electric circuit. A self-contained device that is reusable and reliable was developed to sever cables for device release or deployment. The nichrome wire in this new device is housed within an enclosure to prevent it from being damaged by handling. The electric power leads are internally connected within the unit to the nichrome wire using a screw terminal connection. A bayonet plug, a quick and secure method of connecting the cutter to the power source, is used to connect the cutter to the power leads similar to those used in pyro-cutter devices. A small ceramic tube [0.25-in. wide 0.5-in. long (.6.4-mm wide 13-mm long)] houses a spiraled nichrome wire that is heated when a cable release action is required. The wire is formed into a spiral coil by wrapping it around a mandrel. It is then laid inside the ceramic tube so that it fits closely to the inner surface of the tube. The ceramic tube provides some thermal and electrical insulation so that most of the heat generated by the wire is directed toward the cable bundle in the center of the spiral. The ceramic tube is cemented into an aluminum block, which holds it in position. The leads of the nichrome wire are attached to screw terminals that connect them to power leads. A bayonet plug mounted at the bottom of the rectangular block connects the power leads to a relay circuit. A thin aluminum shell encloses the entire structure, leaving access points to attach to the bayonet plug and to feed a cable into the cylinder. The access holes for the deployment cable are a smaller diameter than the nichrome coil to prevent the cable from coming in direct contact with the nichrome when loaded. It uses the same general method of severing a cable with a heated wire as was used previously, but implements it in such a way that it is more reliable and less prone to failure. It creates a mechanism to create repeatability that was nonexistent in the previous method.

Pauken, Michael T.↗
NASA NTRS2013

Detectors Ensure Function, Safety of Aircraft Wiring

Pedro Medelius waited patiently in his lab at Kennedy Space Center. He had just received word that a colleague was bringing over a cable from a Space Shuttle solid rocket booster to test Medelius new invention. Medelius was calm until his colleague arrived, with about 30 other people. "Talk about testing under pressure," says Medelius. "There were people there from the Navy, the Air Force, and the Federal Aviation Administration." After the group s arrival, Medelius took a deep breath and connected his Standing Wave Reflectometer (SWR) to the cable. He wiggled the cable around, and the display showed a fault (a short or open circuit in wire) about an inch and a half inside the connector on the cable. His colleague questioned the results, because he had already checked that area on the cable. Medelius used the SWR to check again but got the same result. "That is when we took the cable apart and looked inside," Medelius says. "Lo and behold, that was exactly where the fault was." The impetus for Medelius new wire inspection technology came about in 1999 when one of the space shuttles lost power due to a fault somewhere in its more than 200 miles of electrical wiring. "The backup circuit was activated and prevented a major dysfunction, but nevertheless, there was a problem with the wiring," Medelius describes. Even though technicians used a device called a multimeter to measure the electrical current to find which wire had a fault, it could not pinpoint exactly where on the wire the fault was located. For that, technicians had to visually inspect the wire. "Sometimes they would have to remove the whole wire assembly and visually inspect every single wire. It was a very tedious operation because the wires are behind cabinets. They go all over the place in the shuttle," says Medelius. "NASA needed an instrument capable of telling them exactly where the faults were occurring." To meet NASA s needs for a highly precise device to inspect electrical power bundles, wires, and connectors, Medelius devised the SWR. "It came down to what was affected when a wire is short circuited or opened," he says. "We worked out a few equations based on physical principles." The SWR proved very sensitive, and the technology was patented.

Source record↗
NASA NTRS2005

Space Shuttle Columbia Aging Wiring Failure Analysis

A Space Shuttle Columbia main engine controller 14 AWG wire short circuited during the launch of STS-93. Post-flight examination divulged that the wire had electrically arced against the head of a nearby bolt. More extensive inspection revealed additional damage to the subject wire, and to other wires as well from the mid-body of Columbia. The shorted wire was to have been constructed from nickel-plated copper conductors surrounded by the polyimide insulation Kapton, top-coated with an aromatic polyimide resin. The wires were analyzed via scanning electron microscope (SEM), energy dispersive X-Ray spectroscopy (EDX), and electron spectroscopy for chemical analysis (ESCA); differential scanning calorimetry (DSC) and thermal gravimetric analysis (TGA) were performed on the polyimide. Exemplar testing under laboratory conditions was performed to replicate the mechanical damage characteristics evident on the failed wires. The exemplar testing included a step test, where, as the name implies, a person stepped on a simulated wire bundle that rested upon a bolt head. Likewise, a shear test that forced a bolt head and a torque tip against a wire was performed to attempt to damage the insulation and conductor. Additionally, a vibration test was performed to determine if a wire bundle would abrade when vibrated against the head of a bolt. Also, an abrasion test was undertaken to determine if the polyimide of the wire could be damaged by rubbing against convolex helical tubing. Finally, an impact test was performed to ascertain if the use of the tubing would protect the wire from the strike of a foreign object.

McDaniels, Steven J.↗
NASA NTRS1989

Electromagnetic scattering by a straight thin wire

The traveling-wave energy, which multiply diffracts on a straight thin wire, is represented as a sum of terms, each with a distinct physical meaning, that can be individually examined in the time domain. Expressions for each scattering mechanism on a straight thin wire are cast in the form of four basic electromagnetic wave concepts: diffraction, attachment, launch, and reflection. Using the basic mechanisms from P. Ya. Ufimtsev (1962), each of the scattering mechanisms is included into the total scattered field for the straight thin wire. Scattering as a function of angle and frequency is then compared to the moment-method solution. These analytic expressions are then extended to a lossy wire with a simple approximate modification using the propagation velocity on the wire as derived from the Sommerfeld wave on a straight lossy wire. Both the perfectly conducting and lossy wire solutions are compared to moment-method results, and excellent agreement is found. As is common with asymptotic solutions, when the electrical length of wire is smaller than 0.2 lambda the results lose accuracy. The expressions modified to approximate the scattering for the lossy thin wire yield excellent agreement even for lossy wires where the wire radius is on the order of skin depth.

Shamansky, Harry T.↗
NASA NTRS1990

Composite superconducting wires obtained by high-rate tinning in molten Bi-Pb-Sr-Ca-Cu-O system

The preparation of high-T(sub c) superconducting long composite wires by short-time tinning of the metal wires in a molten Bi-Pb-Sr-Ca-Cu-O compound is discussed. The application of this method to the high-T(sub c) materials is tested, possibly for the first time. The initial materials used for this experiment were ceramic samples with nominal composition Bi(1.5)Pb(0.5)Sr2Ca2Cu3O(x) and T(sub c) = 80 K prepared by the ordinary solid-state reaction, and industrial copper wires from 100 to 400 microns in diameter and from 0.5 to 1 m long. The continuously moving wires were let through a small molten zone (approximately 100 cubic mm). The Bi-based high-T(sub c) ceramics in a molten state is a viscous liquid and it has a strongly pronounced ability to spread on metal wire surfaces. The maximum draw rate of the Cu-wire, at which a dense covering is still possible, corresponds to the time of direct contact of wire surfaces and liquid ceramics for less than 0.1 s. A high-rate draw of the wire permits a decrease in the reaction of the oxide melt and Cu-wire. This method of manufacture led to the fabrication of wire with a copper core in a dense covering with uniform thickness of about h approximately equal to 5 to 50 microns. Composite wires with h approximately equal to 10 microns (h/d approximately equal to 0.1) sustained bending on a 15 mm radius frame without cracking during flexing.

Grozav, A. D.↗
NASA NTRS2002

Evaluating Thermally Damaged Polyimide Insulated Wiring (MIL-W-81381) with Ultrasound

A series of experiments to investigate the use of ultrasound for measuring wire insulation have been conducted. Initial laboratory tests were performed on MIL-W-81381/7,/12, and /21 aviation wire, a wire that has polyimide (Kapton Registered Trademark) layers for insulation. Samples of this wiring were exposed to 370C temperatures for different periods of time to induce a range of thermal damage. For each exposure, 12 samples of each gauge (12, 16, and 20 gauges) were processed. The velocity of the lowest order axisymmetric ultrasonic guided mode, a mode that is sensitive to the geometry and stiffness of the wire conductor and insulation, was measured. The phase velocity for the 20-gauge MIL-W-81381/7 wire had a baseline value of 3023 +/- 78 m/s. After exposure to the high temperatures, the wire's phase velocity rapidly increased, and reached an asymptotic value of 3598 +/- 20 m/s after 100 hours exposure. Similar behavior was measured for the 16 gauge MIL-W-81381/21 wire and 12 gauge MIL-W-81381/12 wire which had baseline values of 3225 +/- 22 m/s and 3403 +/- 33 m/s respectively, and reached asymptotic values of 3668 +/- 19 m/s, and 3679 +/- 42 m/s respectively. These measured velocity changes represent changes of 19, 14, and 8 percent respectively for the 20, 16, and 12 gauge wires. Finally, some results for a wire with an ethylene tetrafluoroethylene insulation are reported. Qualitatively similar behaviors are noted ultrasonically.

Madaras, Eric I.↗
NASA NTRS2015

Thermal Testing and Integration: Magnetospheric MultiScale (MMS) Observatories with Digital 1-Wire Sensors

Thermocouples require two thin wires to be routed out of the spacecraft to connect to the ground support equipment used to monitor and record the temperature data. This large number of wires that exit the observatory complicates integration and creates an undesirable heat path during testing. These wires exiting the spacecraft need to be characterized as a thermal short that will not exist during flight. To minimize complexity and reduce thermal variables from these ground support equipment (GSE) wires, MMS pursued a hybrid path for temperature monitoring, utilizing thermocouples and digital 1-wire temperature sensors. Digital 1-wire sensors can greatly reduce harness mass, length and complexity as they can be spliced together. For MMS, 350 digital 1-wire sensors were installed on the spacecraft with only 18 wires exiting as opposed to a potential 700 thermocouple wires. Digital 1-wire sensors had not been used in such a large scale at NASAGSFC prior to the MMS mission. During the MMS thermal vacuum testing a lessons learned matrix was formulated that will assist future integration of 1-wires into thermal testing and one day into flight.

Sensors↗
DOE OSTI2026

Optimal Litz Wire Design for High-Power Wireless Charging System

In this study, an optimized Litz wire and polyphase coil winding design is proposed for high-power wireless charging systems operating at 85 kHz frequency. Litz wire in a wireless charging system contributes to more than half of the losses of the system, making it a critical design component. Here, the Litz wire is optimized through Finite Element Analysis (FEA) considering electrical and mechanical design aspects and the design was validated through experimental tests on different Litz wires with various strand-diameters, twisting ratio, and number of strands. The proposed optimal Litz wire maximizes the system efficiency considering the tradeoff between coil resistance and mutual inductance. The optimal Litz wire shows that Litz wire constructed with the 63µm strands significantly outperform the traditionally used Litz wire with 100µm strand diameter. Additionally, the coil with optimal Litz wire design shows 60% reduction in the copper volume for the same loss, and at the same time increase the coil-to-coil efficiency by more than 2% by increasing the mutual inductance and reducing coil current. The optimized Litz wire was implemented in a 22-kW wireless charging system achieving 94.7% efficiency.

Aydin, Emrullah [ORNL]↗
NASA NTRS2001

Manually Operated Welding Wire Feeder

A manual welding wire feeder apparatus comprising a bendable elongate metal frame with a feed roller mounted at the center thereof for rotation about an axis transverse to the longitudinal axis of the frame. The frame ends are turned up as tabs and each provided with openings in alignment with each other and the mid-width center of the roller surface. The tab openings are sized to accommodate welding wire and each extends to a side edge of the tab, both opening on the same side of the frame, whereby welding wire can be side-loaded onto the frame. On the side of the frame, opposite the roller a lock ring handle is attached tangentially and is rotatable about the attachment point and an axis perpendicular to the frame. The device is grasped in the hand normally used to hold the wire. A finger is placed through the loop ring and the frame positioned across the palm and lower fingers. The thumb is positioned atop the wire so it can be moved from the back of the frame across the roller, and towards the front. In doing so, the wire is advanced at a steady rate in axial alignment with the tab openings and roller. To accommodate different wire diameters the frame is bendable about its center in the plane of the frame axis and wire so as to keep the wire in sufficient tension against the roller and to keep the wire fixed when the frame is tilted and thumb pressure released.

Rybicki, Daniel J.↗
NASA NTRS2004

Cyclic Oxidation of High-Temperature Alloy Wires in Air

High-temperature alloy wires are proposed for use in seal applications for future re-useable space vehicles. These alloys offer the potential for improved wear resistance of the seals. The wires must withstand the high temperature environments the seals are subjected to as well as maintain their oxidation resistance during the heating and cooling cycles of vehicle re-entry. To model this, the wires were subjected to cyclic oxidation in stagnant air. of this layer formation is dependent on temperature. Slow growing oxides such as chromia and alumina are desirable. Once the oxide is formed it can prevent the metal from further reacting with its environment. Cyclic oxidation models the changes in temperature these wires will undergo in application. Cycling the temperature introduces thermal stresses which can cause the oxide layer to break off. Re-growth of the oxide layer consumes more metal and therefore reduces the properties and durability of the material. were used for cyclic oxidation testing. The baseline material, Haynes 188, has a Co base and is a chromia former while the other two alloys, Kanthal A1 and PM2000, both have a Fe base and are alumina formers. Haynes 188 and Kanthal A1 wires are 250 pm in diameter and PM2000 wires are 150 pm in diameter. The coiled wire has a total surface area of 3 to 5 sq cm. The wires were oxidized for 11 cycles at 1204 C, each cycle containing a 1 hour heating time and a minimum 20 minute cooling time. Weights were taken between cycles. After 11 cycles, one wire of each composition was removed for analysis. The other wire continued testing for 70 cycles. Post-test analysis includes X-Ray Diffraction (XRD), Scanning Electron Microscopy (SEM) and Energy Dispersive Spectroscopy (EDS) for phase identification and morphology.

Reigel, Marissa M.↗