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All sourcesNASA NTRSDOE OSTI
NASA NTRS2018

Maximum Sample Temperature for Mars Sample Return: A Historical Perspective

Since the first Mars Sample Return (MSR) report published by the Jet Propulsion Laboratory (JPL) in 1974 [1], a series of panels, reports, and white papers have recognized the importance of sample temperature and offered an informed sample maximum temperature (henceforth SMT) limit for returning martian samples to Earth. The Mars Sample Handling and Requirements Panel (MSHARP, 1999) stated that "[t]he main issue in sample preservation is temperature" [2]. More recently, the Mars Exploration Program Analysis Group (MEPAG)'s "Science Priorities for Mars Sample Return" report (2008), declared that "[s]ignificant loss, particularly to biological studies, occurs if samples reach +50C for three hours", whereby "scientific objectives related to life goals could be seriously compromised" [3]. By contrast, the Mars 2020 mission has adopted a SMT of +60C as spelled out in Beaty et al., 2016 [4]. Samples will be collected and then deposited on the surface in sealed tubes for possible retrieval and return to Earth. Beaty et al. [4] calculates that the samples will experience maximum temperatures of ~+30 to +60C, depending on latitude. At present, there is no mission requirement for the measurement/data logging of sample temperature during this period. We will explore the history of martian SMTs, as they have been recorded since 1974 [1], effectively representing input across multiple generations of Mars scientists. Ten separate publications present SMTs for MSR samples [1-10]. One report [10] is for a mission concept specifically designed to exclude life detection investigations, and recommended an SMT of 50C. Another did not specify a temperature, recommending "Mars ambient temperature" [5]. Of the remaining eight, SMTs are given as: -30C [1], -20C [3], 60C [4], -73 to 41C depending on sample type [6], -40C [7], -43 to 13C depending on type [2,8], and -33C [9]. If we restrict the temperatures to samples highlighted in the Mars 2020 mission goals, i.e. organics-bearing and sedimentary rocks, then the average SMT is -28+/-39C (n=8). Applying a Dixon's Q Test at P=0.05 (two-tailed), the 60C SMT [4] fails with Q=0.602 versus Qcrit=0.526. Excluding the outlier produces an average SMT of -40+/-17C (n=7). Therefore, the average SMT expressed by the Mars science community over the past 44 years (two generations) is a sample temperature no greater than -40C. The difference in chemical reaction rates between this average SMT and Beaty et al [4] can be estimated using the Arrhenius equation. Assuming a generic chemical reaction with an activation energy of 50 kJ/mol and a pre-exponential factor invariant with temperature, this reaction will proceed 2300x faster at 60C than at -40C. To illustrate the effects of the increased reaction rate, consider 10 ppb of alanine in a Mars 2020 cache, and assume that it becomes unmeasurable if it degrades to 1 ppb, as per the Mars 2020 Organic Contamination Panel contamination limits [11]. If we illustrate the effect with an arbitrary degradation rate such that the alanine will become undetectable in ten years at -40C, then the same 10 ppb alanine degrades beyond detectability in only 38 days at 60C. Further research is required to quantify expected analyte losses in the cached samples due to thermal processing.

Fries, Marc↗
DOE OSTI2020

Discrepancy in the Critical State Void Ratio of Poorly Graded Sand due to Shear Strain Localization

The critical state (CS) concept is a theoretical framework that models the constitutive behavior of soils, including sand and other granular materials. It supports the notion of a unique postfailure state, where the soil ultimately experiences continuous shearing with no change in the plastic volumetric strain. However, the published literature has frequently noted the nonconvergence of sand specimens with different initial densities to a unique CS in the compression plane due to many factors such as specimen fabric, particle morphology, breakage, and grain size distribution. This paper examines the CS for poorly graded (uniform) glass beads and 3 different types of silica sands using 50 conventional triaxial compression (CTC) experiments, 12 oedometer tests, and in situ synchrotron microcomputed tomography (SMT) scans for 10 CTC experiments. The results of the 50 CTC experiments revealed a diffused CS zone in the compression plane, which was further examined using the in situ SMT scans. A thorough three-dimensional image analysis of the SMT scans accurately quantified the evolution of the local void ratio (elocal) versus axial compression within zones of intensive shearing toward the center of the specimen. The evolution of the void ratio was also measured using the entire volume of the specimen (eglobal). At the CS, the elocal/eglobal ratio was assessed to be ~1.25 when a single shear band developed within the scanned specimens and ~1.1-1.15 for specimens that failed via external bulging that was internally manifested by the development of multiple shear bands. This finding suggests that the CS zone in the compression plane can be attributed to the common wrong consideration of eglobal evolution in lieu of elocal within the developing shear bands. Furthermore, the lack of shear band development in uniaxial compression has made the results of the oedometer test reliable in quantifying the CS parameters in the compression plane.

58 GEOSCIENCES↗
NASA NTRS1993

TAB interconnects for space concentrator solar cell arrays

The Boeing Company has evaluated the use of Tape Automated Bonding (TAB) and Surface Mount Technology (SMT) for a highly reliable, low cost interconnect for concentrator solar cell arrays. TAB and SMT are currently used in the electronics industry for chip interconnects and printed circuit board assembly. TAB tape consists of sixty-four 3-mil/1-oz tin-plated copper leads on 8-mil centers. The leads are thermocompression gang bonded to GaAs concentrator solar cell with silver contacts. This bond, known as an Inner Lead Bond (ILB), allows for pretesting and sorting capability via nondestruct wire bond pull and flash testing. Destructive wire pull tests resulted in preferred mid-span failures. Improvements in fill factor were attributed to decreased contact resistance on TAB bonded cells. Preliminary thermal cycling and aging tests were shown excellent bond strength and metallurgical results. Auger scans of bond sites reveals an Ag-Cu-Tin composition. Improper bonds are identified through flash testing as a performance degradation. On going testing of cells are underway at Lewis Research Center. SMT techniques are utilized to excise and form TAB leads post ILB. The formed leads' shape isolates thermal mismatches between the cells and the flex circuit they are mounted on. TABed cells are picked and placed with a gantry x-y-z positioning system with pattern recognition. Adhesives are selected to avoid thermal expansion mismatch and promote thermal transfer to the flex circuit. TAB outer lead bonds are parallel gap welded (PGW) to the flex circuit to finish the concentrator solar cell subassembly.

Avery, J.↗
DOE OSTI2024

Experimental investigation of the influence of drainage condition on change in saturation of sheared sand

Here, this paper investigates the validity of the interpretation of results from testing saturated axisymmetric triaxial compression (ATC) sand specimens utilising three-dimensional (3D) synchrotron micro-computed tomography (SMT) to probe localised events that are completely missed or misinterpreted when analysing ATC measurements based on global standard measurements. Drained and undrained experiments were conducted at low and high back-pressures (BPs) coupled with multiple in situ 3D SMT to acquire high-resolution scans of the specimens at different axial strains. Specimens tested under low BP exhibited a large pore air volume change, which was not detected by the pump system that represents standard volume measurement. The increase in air volume caused a significant reduction in the degree of saturation leading to a possible transition from saturated to partially saturated constitutive behaviour. Undrained experiments exhibited a significant volume change contrary to the assumption of negligible volumetric strain for saturated undrained experiments. Air bubbles within the shear band for drained and undrained low-BP specimens showed opposite capillary pressure responses, increased for drained and decreased for undrained cases, due to the variation in the mechanism by which each of the two experiments predominantly counters the volume expansion within the shear band.

capillary pressure↗
DOE OSTI2026

A comparison of wrought and powder metallurgical FeCrAl claddings under simulated LWR accident transients

Iron-chromium-aluminum (FeCrAl) alloys are potential accident tolerant fuel (ATF) cladding candidates for light-water reactors but are difficult to fabricate as thin-walled tubes via conventional cast-and-wrought routes. Powder metallurgy (PM) offers a manufacturing alternative with improved compositional control, but its transient accident performance has not been directly benchmarked against wrought variants. This study evaluates the burst behavior of commercially developed PM-processed FeCrAl alloys, PM-C26M (Fe-12Cr-6Al-2Mo) and the high precipitate density FA-SMT (Fe-22Cr-5Al-3Mo), under simulated light-water reactor accident transient conditions. Burst testing was conducted using the Severe Accident Test Station with heating rates of 5 °C/s and 50 °C/s and internal pressures ranging from 25 MPa to 100 MPa. PM-C26M reproduced wrought C26M burst behavior within 7–37 °C across the stress range, indicating that PM processing does not compromise transient strength. FA-SMT exhibited markedly higher burst temperatures and reduced heating-rate sensitivity, consistent with its engineered precipitate strengthening. FA-SMT rupture exhibited axial "unzipping" rather than the lateral tearing characteristic of PM- and wrought C26M. Post-test EBSD and fractography indicate that this behavior is strongly correlated with strain-gated intergranular void nucleation associated with the dense precipitate architecture of FA-SMT, a response absent in the comparatively clean PM-C26M matrix and consistent with rupture morphologies reported for oxide-dispersion strengthened (ODS) FeCrAl of similar base-matrix chemistry to PM-C26M. These findings highlight the potential of powder metallurgy as a viable fabrication route for ATF claddings from an accident performance standpoint.

Bell, Sam [ORNL] (ORCID:0000000251905657)↗
NASA NTRS1996

Quality and Reliability of BGA and SMT Components

Spacecraft electronics including those used at the Jet Propulsion Laboratory (JPL), demand production of highly reliable assemblies. More than 400 test vehicles were assembled using ceramic and plastic ball grid arrays (BGAs), LCCs, J-leads, and gull wing components.

BGA components SMT components BGA SMT spacecraft e↗
DOE OSTI2025

Influence of gradation on shear behavior and pore water response of sand

Here, this paper examines the influence of particle size distribution (PSD) on the shearing behavior of sand using axisymmetric triaxial compression (ATC) testing in conjunction with 3D imaging using synchrotron micro-computed tomography (SMT). Angular sand was sieved to obtain a narrow gradation (uniform) and a wide gradation (non-uniform) with uniformity coefficients (C u ) of 1.2 and 3.0, respectively. Experiments were conducted under drained conditions and a constant effective cell pressure (σ$^{'}_3$) of 50 kPa at low and high back pressures (BP). Results of paired ATC-SMT were analyzed in terms of global constitutive behavior, strain localization, and localized flow characteristics. A new particle tracking algorithm is developed to expose strain localization. Relative particle translation gradient (RPTG) results revealed that gradation affects how early the shear band develops and a tendency for narrow gradation to exhibit varying degrees of diffused shear band at high axial strain (ε 1 ) even though a clear single shear band was observed at the peak strength. Geometric tortuosity (τ) is used as a quantitative parameter to assess flow changes and the efficiency of the flow path. Representative elementary volumes (REVs) inside and outside the shear band were analyzed and the results showed a variation in flow path characteristics where wide gradation specimens had preferential flow paths.

Computed tomography↗
NASA NTRS2010

SimCheck: An Expressive Type System for Simulink

MATLAB Simulink is a member of a class of visual languages that are used for modeling and simulating physical and cyber-physical systems. A Simulink model consists of blocks with input and output ports connected using links that carry signals. We extend the type system of Simulink with annotations and dimensions/units associated with ports and links. These types can capture invariants on signals as well as relations between signals. We define a type-checker that checks the wellformedness of Simulink blocks with respect to these type annotations. The type checker generates proof obligations that are solved by SRI's Yices solver for satisfiability modulo theories (SMT). This translation can be used to detect type errors, demonstrate counterexamples, generate test cases, or prove the absence of type errors. Our work is an initial step toward the symbolic analysis of MATLAB Simulink models.

Roy, Pritam↗
DOE OSTI2020

Decarburization and Carburization Behavior of Grade 91 Steel in Sodium Environments

Two heats of G91 steel have been investigated in sodium at 550-650°C to understand its corrosion behaviour, microstructural evolution, and tensile properties. Sodium exposure tests of subsized tensile and coupon specimens of G91 base metal and weldment were conducted in Argonne’s forced convection sodium materials testing loops. Maximum exposure times of ~39,000 h at 550°C, ~37,000 h at 600°C, and ~20,000 h at 650°C have been achieved, respectively. Thermal aging experiments of G91 steel were conducted in parallel, and the data of the sodium-exposed specimens were compared with the thermal aging data of the same heat to isolate the thermal aging effect from the effect of sodium exposure. It was found that the tensile strength of G91 steel can be reduced by more than 50% after sodium exposures at 650°C. The effect of a sodium environment on tensile properties is largely dependent on the carburization/decarburization behavior of G91 steel exposed to sodium. The carbon concentrations in sodium in Argonne’s SMT-1 and SMT-2 loops were determined by the equilibration method. The carbon activity in sodium was established by equilibrating high-purity nickel in sodium, analyzing the material for carbon, and using the reported data on the carbon solubility for this material. The carbon activity results were combined with the carbon solubility data in sodium to establish the carbon concentration in sodium. The carbon concentrations in the SMT-1 and SMT-2 loop were estimated to be 1.23 and 0.25 ppm, respectively. With this initial success, we will continue to monitor the carbon contents in the two loops to correlate the microstructural and mechanical property changes with the sodium purity. Future experiments will also consider sodium exposure tests in controlled carbon activities. Online monitoring and control of carbon contents in sodium in nuclear reactors would also be of interest. Thermodynamic analysis was conducted to understand the carburization-decarburization behavior of G91 steel exposed to sodium in the SMT-1 and SMT-2 loops. The equilibrium carbon activity in the alloy was evaluated by the thermodynamics of M 23 C 6 carbides. The calculated carburization-decarburization boundary showed that G91 would undergo decarburization at 650°C in the SMT-1 loop and carburization at 600°C in the SMT-2 loop, which is consistent with our findings from the sodium exposure tests. Future work will include thermodynamic analysis of the carbon concentration – activity relationship including the effect of carbide-forming elements, vanadium and niobium in G91 steel. Kinetics of carbon diffusion and the effect on microstructure and mechanical performance under various service conditions will also be investigated. The ultimate goal is to understand the mechanisms and the kinetics of carbon transfer in the sodium-steel system and to provide a basis for predicting the effect of long-term decarburization-carburization process on the integrity of reactor components.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗
NASA NTRS2016

Graphical Visualization of Human Exploration Capabilities

NASA's pioneering space strategy will require advanced capabilities to expand the boundaries of human exploration on the Journey to Mars (J2M). The Evolvable Mars Campaign (EMC) architecture serves as a framework to identify critical capabilities that need to be developed and tested in order to enable a range of human exploration destinations and missions. Agency-wide System Maturation Teams (SMT) are responsible for the maturation of these critical exploration capabilities and help formulate, guide and resolve performance gaps associated with the EMC-identified capabilities. Systems Capability Organization Reporting Engine boards (SCOREboards) were developed to integrate the SMT data sets into cohesive human exploration capability stories that can be used to promote dialog and communicate NASA's exploration investments. Each SCOREboard provides a graphical visualization of SMT capability development needs that enable exploration missions, and presents a comprehensive overview of data that outlines a roadmap of system maturation needs critical for the J2M. SCOREboards are generated by a computer program that extracts data from a main repository, sorts the data based on a tiered data reduction structure, and then plots the data according to specified user inputs. The ability to sort and plot varying data categories provides the flexibility to present specific SCOREboard capability roadmaps based on customer requests. This paper presents the development of the SCOREboard computer program and shows multiple complementary, yet different datasets through a unified format designed to facilitate comparison between datasets. Example SCOREboard capability roadmaps are presented followed by a discussion of how the roadmaps are used to: 1) communicate capability developments and readiness of systems for future missions, and 2) influence the definition of NASA's human exploration investment portfolio through capability-driven processes. The paper concludes with a description of planned future work to modify the computer program to include additional data and of alternate capability roadmap formats currently under consideration.

Rodgers, Erica M.↗
DOE OSTI2022

Proposed Material Properties, Allowable Stresses, and Design Curves of Diffusion Bonded Alloy 800H for the ASME Code Section III Division 5

Abstract Increased interest in compact heat exchangers (CHXs) to serve as intermediate heat exchangers of very high temperature reactors resulted in significant research and development on their design, analysis, and construction. Printed circuit heat exchangers are a type of CHXs with high thermal efficiency and compactness achieved through diffusion bonding a stack of etched plates with millimeter scaled channels. The diffusion bonding process changes the microstructural and mechanical properties of the wrought metal plates. The current nonnuclear design code ASME section VIII, division 1 captures the material property change through a “joint efficiency factor.” However, the current nuclear design code ASME section III, division 5 does not address or support the diffusion bonded material properties. Hence, there is a need to develop allowable stresses, isochronous curves, and fatigue life curves for various diffusion bonded alloys. In this study, Alloy 800H material was selected to establish the diffusion bonded material properties under tension, creep, fatigue, and creep-fatigue loads at elevated temperatures in the range 550–760 °C. A set of tests on diffusion bonded Alloy 800H (DB 800H) were performed and the acquired data are used in developing allowable stresses Sy, Su, Sr, Sm, St, Smt, So, isochronous curves and fatigue life curves according to the ASME section III, division 5 requirements. This paper also presents detailed procedures used in developing the ASME code section III division 5 design provisions for diffusion bonded Alloy 800H.

Engineering↗
NASA NTRS2010

Advanced Flip Chips in Extreme Temperature Environments

The use of underfill materials is necessary with flip-chip interconnect technology to redistribute stresses due to mismatching coefficients of thermal expansion (CTEs) between dissimilar materials in the overall assembly. Underfills are formulated using organic polymers and possibly inorganic filler materials. There are a few ways to apply the underfills with flip-chip technology. Traditional capillary-flow underfill materials now possess high flow speed and reduced time to cure, but they still require additional processing steps beyond the typical surface-mount technology (SMT) assembly process. Studies were conducted using underfills in a temperature range of -190 to 85 C, which resulted in an increase of reliability by one to two orders of magnitude. Thermal shock of the flip-chip test articles was designed to induce failures at the interconnect sites (-40 to 100 C). The study on the reliability of flip chips using underfills in the extreme temperature region is of significant value for space applications. This technology is considered as an enabling technology for future space missions. Flip-chip interconnect technology is an advanced electrical interconnection approach where the silicon die or chip is electrically connected, face down, to the substrate by reflowing solder bumps on area-array metallized terminals on the die to matching footprints of solder-wettable pads on the chosen substrate. This advanced flip-chip interconnect technology will significantly improve the performance of high-speed systems, productivity enhancement over manual wire bonding, self-alignment during die joining, low lead inductances, and reduced need for attachment of precious metals. The use of commercially developed no-flow fluxing underfills provides a means of reducing the processing steps employed in the traditional capillary flow methods to enhance SMT compatibility. Reliability of flip chips may be significantly increased by matching/tailoring the CTEs of the substrate material and the silicon die or chip, and also the underfill materials. Advanced packaging interconnects technology such as flip-chip interconnect test boards have been subjected to various extreme temperature ranges that cover military specifications and extreme Mars and asteroid environments. The eventual goal of each process step and the entire process is to produce components with 100 percent interconnect and satisfy the reliability requirements. Underfill materials, in general, may possibly meet demanding end use requirements such as low warpage, low stress, fine pitch, high reliability, and high adhesion.

Ramesham, Rajeshuni↗
DOE OSTI2026

Pyctos

Pyctos is a concolic testing framework for standard, dynamically-typed Python. Pyctos is able to generate exhaustive test inputs reaching 100% coverage for a subset of pure Python in the absence of type annotations, even where modern fuzzers would fail. Pyctos's underlying reasoning engine is the CVC5 SMT solver, though Z3 is also supported. Pyctos also supports a growing subset of the standard library and some third-party libraries, such as NumPy.

Washbourne, ErickN [Lawrence Livermore National La↗
DOE OSTI2024

Initial Alloy 709 constitutive models for use with the ASME design by inelastic analysis and EPP+SMT design methods

This report details a preliminary inelastic constitutive model describing the behavior of Alloy 709. This model will serve two purposes: (1) integration into Nonmandatory Appendix HBB-Z of the ASME Boiler & Pressure Vessel Code Section III, Division 5 and (2) extrapolating cyclic test data to difficult to measure conditions for formulating improved creep-fatigue design methods. For both applications, the model must accurately capture the material behavior across a wide range of temperatures and a variety of test conditions, both monotonic and cyclic. For this purpose we adopt a universal model form under consideration to standardize the description of high temperature constitutive models in the ASME Code. This report briefly restates that model form and how we calibrate the model against the test data, summarizes the test database, and validates the final, trained model by comparison to the experimental tests.

36 MATERIALS SCIENCE↗
NASA NTRS2017

Thermal cycling testing to failure of a ceramic column grid array package for space applications

Ceramic column grid array (CCGA) packages have been used increasingly in logic and microprocessor functions, telecommunications, flight avionics boards, payload electronics boards, engineering navigational and science cameras, electronic assemblies, and other applications, because of their inherent advantages such as high electrical interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount technology (SMT) packaging assembly processes. Because these advanced electronic packages tend to have less solder-joint strain-relief than do leaded flat-pack electronic packages, the reliability of CCGA packages in challenging thermal environments is a very important consideration for their short- and long-term use in JPL-NASA space missions. In this study, we assembled daisy chains of polyimide printed wiring boards from CCGA-interconnect packages, inspected the boards nondestructively, and then subjected them to thermal cycling to assess their reliability in thermal environments from +125°C to -40°C±25°C. The test hardware consists of a CCGA 1752 package (CN version). The package was divided into four daisy-chained sections that were electrically monitored for their continuity during thermal cycling. The CCGA 1752 package is roughly 45 mm × 45 mm with a 42-mm × 42-mm array of 80%/20% Pb/Sn columns on a 1.00-mm pitch. The resistance of the daisy-chained CCGA interconnects was continuously monitored during thermal cycling in a gaseous nitrogen environment. Electrical continuity resistance measurements as a function of thermal cycling are reported here; tests to date have shown significant change to an open circuit in daisy-chain resistance as a function of thermal cycling. The change in interconnect resistance becomes increasingly noticeable with increasing number of thermal cycles. This paper describes the experimental thermal-cycling test results of CCGA 1752 package reliability testing under an extremely wide temperature range. The first failure was observed at 1479th thermal cycle. We report the thermal-cycle reliability test data for ~2500 thermal cycles.

Ramesham, Rajeshuni↗
NASA NTRS2019

Integrating Realizability Checking in FRET

Realizability (alternatively referred to as relative consistency or implementability) - checking whether a specification can be implemented by an open system - has been the subject of extensive study. Realizability can be viewed as a stronger analysis method when compared to consistency checking in that it does not only check whether the system works in some environment, but instead whether the system works in all environments. In this report, we experiment and build on the approach presented by Gacek et al. that supports checking realizability of contracts involving infinite theories using SMT solvers. In particular, we 1) extend the Formal Requirements Elicitation Tool (FRET) to support generation of Lustre contracts that can be checked for realizability with the JKind k-induction and fix point generation engines; 2) study a compositional way for checking realizability based on the notion of connected components; and 3) test our approach and the capabilities of the JKind realizability engines on a large subset of the Lockheed Martin Cyber Physical System Challenge Problems.

Kooi, David↗
NASA NTRS2017

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Aquirre, Fernando↗