CSP Reliability for Single-and Double-Sided Assemblies
This paper reviews the package trend towards further miniaturization of emerging chip scale package (CSP).
CSP chip scale package thermal cycle solder joint ↗
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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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CSPs Assembly Reliability
Availability of board solder joint reliability information is critical to the wider implementation of Chip Scale Packages (CSPs).
Reliability↗
Automated patient monitoring system
Radio-linked patient monitoring system collects several channels of physiological data from as many as 64 hospital patients and transmits the data in digital form to a central control station. The system consists of a central control station and battery-operated patient units comprising small strap-on electronics packages.
Bedard, R. E.↗
Integral valve provides automatic relief and remote venting
In-line, pilot-operated, differential area, poppet type valve provides both automatic relief of a tank at a precise over-pressure and remote control of tank venting. Relief and vent operations are separate functions incorporated in an integral valve package.
Gilmore, R. F.↗
Pocket-size microwave radiation hazard detector
Inexpensive lightweight unit is easily carried in coat pocket or attached to belt, detector sounds alarm in presence of dangerous microwave radiation levels. Unit consists of antenna, detector, level sensor, keyed oscillator, and speaker. Antenna may be single equiangular spiral or set of orthogonal slot dipoles. Signal detector is simple diode in small package.
Kolbly, R. B.↗
Feasibility study of low angle planetary entry
The feasibility of a Jovian entry by a probe originally designed for Saturn and Uranus entries is examined. An entry probe is described which is capable of release near an outer planet's sphere of influence and descent to a predetermined target entry point in the planet's atmosphere. The probe is designed so as to survive the trapped particle radiation belts and an entry heating pulse. Data is gathered and relayed to an overflying spacecraft bus during descent. Probe variations for two similar missions are described. In the first flyby of Jupiter by a Pioneer spacecraft launched during the 1979 opportunity is examined parametrically. In the second mission an orbiter based on Pioneer and launched in 1980 is defined in specific terms. The differences rest in the science payloads and directly affected wiring and electronics packages.
Defrees, R. E.↗
Hearing-aid tester
Hearing aids are automatically checked by circuit that applies half-second test signal every thirty minutes. If hearing-aid output is distorted, too small, or if battery is too low, a warning lamp is activated. Test circuit is incorporated directly into hearing-aid package.
Kessinger, R.↗
Shuttle orbiter - IUS/DSP satellite interface contamination study
The results of a contamination analysis on the Defense Support Program (DSP) satellite during launch and deployment by the Space Transportation System (STS) are presented. Predicted contaminant deposition was also included on critical DSP surfaces during the period soon after launch when the DSP is in the shuttle orbiter bay with the doors closed, the bay doors open, and during initial deployment. Additionally, a six sided box was placed at the spacecraft position to obtain directional contaminant flux information for a general payload while in the bay and during deployment. The analysis included contamination sources from the shuttle orbiter, IUS and cradle, the DSP sensor and the DSP support package.
Rantanen, R. O.↗
Interferometry and holography in a low-gravity environment
The groundwork for the use of advanced optical measurement techniques in Space Shuttle materials processing in space (MPS) experiments is being laid in tests, conducted aboard a NASA KC-135 aircraft flying a parabolic trajectory, involving a Mach-Zehnder interferometer and a sideband holographic unit. The two experiments described are (1) the observation of flow during solidification, in which fluid concentration and temperature profiles were measured during unidirectional solidification of a saturated NH4Cl-H2O solution, and (2) the observation of electrodeposition flow, in which interferometry is used to provide quantitative data required in the understanding of electrochemical process transport properties. The free-floating holographic unit was operated in the microgravity environment to both test the practicality of optical systems in such conditions and test the shock and vibration characteristics of the package.
Owen, R. B.↗
Modification of the Electromagnetic Levitator (EML) Hardware
The goals of this project are: (1) to study the upgrade requirements and approaches needed for incorporation of an Electromagnetic Levitator (EML) into the shuttle orbiter, (2) to work with members of the Electromagnetic Containerless Processing science working group (SWG) to define future experiments for the EML, and (3) to assist these investigators in further development of ground-based experiment techniques to the limits possible in the terrestrial gravitational environment. Present work is directed toward: (1) upgrading the EML flight apparatus to meet requirements of safety and integration interfaces with the MSL orbiter carrier, (2) development of new experiment components required to carry out approved experiments in undercooled solidification and associated fluid flow studies directed by MIT, and (3) construction, test, qualification and integration assistance for the EML MSL flight package.
Frost, R. T.↗
Display system software for the integration of an ADAGE 3000 programmable display generator into the solid modeling package C.A.D. software
A software system that integrates an ADAGE 3000 Programmable Display Generator into a C.A.D. software package known as the Solid Modeling Program is described. The Solid Modeling Program (SMP) is an interactive program that is used to model complex solid object through the composition of primitive geomeentities. In addition, SMP provides extensive facilities for model editing and display. The ADAGE 3000 Programmable Display Generator (PDG) is a color, raster scan, programmable display generator with a 32-bit bit-slice, bipolar microprocessor (BPS). The modularity of the system architecture and the width and speed of the system bus allow for additional co-processors in the system. These co-processors combine to provide efficient operations on and rendering of graphics entities. The resulting software system takes advantage of the graphics capabilities of the PDG in the operation of SMP by distributing its processing modules between the host and the PDG. Initially, the target host computer was a PRIME 850, which was later substituted with a VAX-11/785. Two versions of the software system were developed, a phase 1 and a phase 2. In phase 1, the ADAGE 3000 is used as a frame buffer. In phase II, SMP was functionally partitioned and some of its functions were implemented in the ADAGE 3000 by means of ADAGE's SOLID 3000 software package.
Montoya, R. J.↗
Software management tools: Lessons learned from use
Experience in inserting software project planning tools into more than 100 projects producing mission critical software are discussed. The problems the software project manager faces are listed along with methods and tools available to handle them. Experience is reported with the Project Manager's Workstation (PMW) and the SoftCost-R cost estimating package. Finally, the results of a survey, which looked at what could be done in the future to overcome the problems experienced and build a set of truly useful tools, are presented.
Reifer, D. J.↗
Design of a fiber-optic transmitter for microwave analog transmission with high phase stability
The principal considerations in the design of fiber-optic transmitters for highly phase-stable radio frequency and microwave analog transmission are discussed. Criteria for a fiber-optic transmitter design with improved amplitude and phase-noise performance are developed through consideration of factors affecting the phase noise, including low-frequency laser-bias supply noise, the magnitude and proximity of external reflections into the laser, and temperature excursions of the laser-transmitter package.
Logan, R. T., Jr.↗
ChemCam Science Objectives for the Mars Science Laboratory (MSL) Rover
ChemCam consists of two remote sensing instruments. One, a Laser-Induced Breakdown Spectroscopy (LIBS) instrument provides rapid elemental composition data on rocks and soils within 13 m of the rover. By using laser pulses, it can remove dust or profile through weathering layers remotely. The other instrument, the Remote Micro-Imager (RMI), provides the highest resolution images between 2 m and infinity. At approximately 80 Rad field of view, its resolution exceeds that of MER Pancam by at least a factor of four. The ChemCam instruments are described in a companion paper by Maurice et al. Here we present the science objectives for the ChemCam instrument package.
Wiens, R.↗
ChemCam Science Objectives for the Mars Science Laboratory (MSL) Rover
ChemCam consists of two remote sensing instruments. One, a Laser-Induced Breakdown Spectroscopy (LIBS) instrument provides rapid elemental composition data on rocks and soils within 13 m of the rover. By using laser pulses, it can remove dust or profile through weathering layers remotely. The other instrument, the Remote Micro-Imager (RMI), provides the highest resolution images between 2 m and infinity. At approximately 80 Rad field of view, its resolution exceeds that of MER Pancam by at least a factor of four. The ChemCam instruments are described in a companion paper by Maurice et al. [1]. Here we present the science objectives for the ChemCam instrument package.
Wiens, R.↗
Chip Scale Package Implementation Challenges
The JPL-led MicrotypBGA Consortium of enterprises representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
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Chip Scale Package Issues
Availability of board solder joint reliability information is critical to the wider implementation of Chip Scale Packages (CSPs).
solder↗
A Systems Approach for Quality and Reliability of Chip Scale Package Assembly
This paper reviews many factors that affect interconnect reliability of commercial-off-the-shelf (COSTS) chip scale package (CSP) assemblies.
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