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Implementation of Statistical Process Control: Evaluating the Mechanical Performance of a Candidate Silicone Elastomer Docking Seal

The National Aeronautics and Space Administration has been developing a novel docking system to meet the requirements of future exploration missions to low-Earth orbit and beyond. A dynamic gas pressure seal is located at the main interface between the active and passive mating components of the new docking system. This seal is designed to operate in the harsh space environment, but is also to perform within strict loading requirements while maintaining an acceptable level of leak rate. In this study, a candidate silicone elastomer seal was designed, and multiple subscale test articles were manufactured for evaluation purposes. The force required to fully compress each test article at room temperature was quantified and found to be below the maximum allowable load for the docking system. However, a significant amount of scatter was observed in the test results. Due to the stochastic nature of the mechanical performance of this candidate docking seal, a statistical process control technique was implemented to isolate unusual compression behavior from typical mechanical performance. The results of this statistical analysis indicated a lack of process control, suggesting a variation in the manufacturing phase of the process. Further investigation revealed that changes in the manufacturing molding process had occurred which may have influenced the mechanical performance of the seal. This knowledge improves the chance of this and future space seals to satisfy or exceed design specifications.

docking seal

Supplier Outreach and Process Control (SOPC) and Supplier Rating Initiative (SRI)

The viewgraph presentation presents an overview of NASA's Supplier Outreach and Process Control (SOPC) and Supplier Risk Initiatives. The discussion of the SOPC examines its importance, current groups who are involved, provides a mission statement, and describes outreach activities and how suppliers are selected. The discussion of the Supplier Risk Initiative examines the variety of ways that integrity, availability, and assurance factor in to supplier risk and describes a new supplier rating program.

quality control

QPA-CLIPS: A language and representation for process control

QPA-CLIPS is an extension of CLIPS oriented towards process control applications. Its constructs define a dependency network of process actions driven by sensor information. The language consists of three basic constructs: TASK, SENSOR, and FILTER. TASK's define the dependency network describing alternative state transitions for a process. SENSOR's and FILTER's define sensor information sources used to activate state transitions within the network. Deftemplate's define these constructs and their run-time environment is an interpreter knowledge base, performing pattern matching on sensor information and so activating TASK's in the dependency network. The pattern matching technique is based on the repeatable occurrence of a sensor data pattern. QPA-CIPS has been successfully tested on a SPARCStation providing supervisory control to an Allen-Bradley PLC 5 controller driving molding equipment.

Freund, Thomas G.

Estimation of the processes controlling variability in phytoplankton pigment distributions on the southeastern U.S. continental shelf

Five coastal-zone-color-scanner images from the southeastern U.S. continental shelf are combined with concurrent moored current meter measurements to assess the processes controlling the variability in chlorophyll concentration and distribution in this region. An equation governing the space and time distribution of a nonconservative quantity such as chlorophyll is used in the calculations. The terms of the equation, estimated from observations, show that advective, diffusive, and local processes contribute to the plankton distributions and vary with time and location. The results from this calculation are compared with similar results obtained using a numerical physical-biological model with circulation fields derived from an optimal interpolation of the current meter observations and it is concluded that the two approaches produce different estimates of the processes controlling phytoplankton variability.

Mcclain, Charles R.

Cameras for semiconductor process control

The application of X-ray topography to semiconductor process control is described, considering the novel features of the high speed camera and the difficulties associated with this technique. The most significant results on the effects of material defects on device performance are presented, including results obtained using wafers processed entirely within this institute. Defects were identified using the X-ray camera and correlations made with probe data. Also included are temperature dependent effects of material defects. Recent applications and improvements of X-ray topographs of silicon-on-sapphire and gallium arsenide are presented with a description of a real time TV system prototype and of the most recent vacuum chuck design. Discussion is included of our promotion of the use of the camera by various semiconductor manufacturers.

Porter, W. A.

A fuzzy classifier system for process control

A fuzzy classifier system that discovers rules for controlling a mathematical model of a pH titration system was developed by researchers at the U.S. Bureau of Mines (USBM). Fuzzy classifier systems successfully combine the strengths of learning classifier systems and fuzzy logic controllers. Learning classifier systems resemble familiar production rule-based systems, but they represent their IF-THEN rules by strings of characters rather than in the traditional linguistic terms. Fuzzy logic is a tool that allows for the incorporation of abstract concepts into rule based-systems, thereby allowing the rules to resemble the familiar 'rules-of-thumb' commonly used by humans when solving difficult process control and reasoning problems. Like learning classifier systems, fuzzy classifier systems employ a genetic algorithm to explore and sample new rules for manipulating the problem environment. Like fuzzy logic controllers, fuzzy classifier systems encapsulate knowledge in the form of production rules. The results presented in this paper demonstrate the ability of fuzzy classifier systems to generate a fuzzy logic-based process control system.

Karr, C. L.

Process controls introduction of selected impurities into semiconductor wafers

Modified three-step process controls the concentration of lithium diffused as a dopant into the base region of a diffused n-on-p silicon solar cell wafer. Part of the surface layer of the base region of the p-type silicon containing the diffused dopant is removed, prior to redistributing the remaining portion of the dopant into the bulk of the wafer.

Bartholomay, W. C.

Methods of measurement for semiconductor materials, process control, and devices

The development of methods of measurement for semiconductor materials, process control, and devices is discussed. The following subjects are also presented: (1) demonstration of the high sensitivity of the infrared response technique by the identification of gold in a germanium diode, (2) verification that transient thermal response is significantly more sensitive to the presence of voids in die attachment than steady-state thermal resistance, and (3) development of equipment for determining susceptibility of transistors to hot spot formation by the current-gain technique.

Bullis, W. M.

Interoperability for Space Mission Monitor and Control: Applying Technologies from Manufacturing Automation and Process Control Industries

Various issues associated with interoperability for space mission monitor and control are presented in viewgraph form. Specific topics include: 1) Space Project Mission Operations Control Architecture (SuperMOCA) goals and methods for achieving them; 2) Specifics on the architecture: open standards ad layering, enhancing interoperability, and promoting commercialization; 3) An advertisement; 4) Status of the task - government/industry cooperation and architecture and technology demonstrations; and 5) Key features of messaging services and virtual devices.

Jones, Michael K.

Derivation of sequential, real-time, process-control programs

The use of weakest-precondition predicate transformers in the derivation of sequential, process-control software is discussed. Only one extension to Dijkstra's calculus for deriving ordinary sequential programs was found to be necessary: function-valued auxiliary variables. These auxiliary variables are needed for reasoning about states of a physical process that exists during program transitions.

Marzullo, Keith

Methods of measurement for semiconductor materials, process control, and devices

Activities directed toward the development of methods of measurement for semiconductor materials, process control, and devices are described. Topics investigated include: measurements of transistor delay time; application of the infrared response technique to the study of radiation-damaged, lithium-drifted silicon detectors; and identification of a condition that minimizes wire flexure and reduces the failure rate of wire bonds in transistors and integrated circuits under slow thermal cycling conditions. Supplementary data concerning staff, standards committee activities, technical services, and publications are included as appendixes.

Bullis, W. M.

Methods of measurement for semiconductor materials, process control, and devices

Activities directed toward the development of methods of measurement for semiconductor materials, process control, and devices are described. Accomplishments include the determination of the reasons for differences in measurements of transistor delay time, identification of an energy level model for gold-doped silicon, and the finding of evidence that it does not appear to be necessary for an ultrasonic bonding tool to grip the wire and move it across the substrate metallization to make the bond. Work is continuing on measurement of resistivity of semiconductor crystals; study of gold-doped silicon; development of the infrared response technique; evaluation of wire bonds and die attachment; measurement of thermal properties of semiconductor devices, delay time, and related carrier transport properties in junction devices, and noise properties of microwave diodes; and characterization of silicon nuclear radiation detectors.

Bullis, W. M.