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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRSDate not supplied

PCB Quality Metrics that Drive Reliability

Risk-based technology infusion is a deliberate and systematic process that defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2021 Events provides the audience a snapshot of quality variations in printed-wiring-board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed-wiring-board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends are then matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk-based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.

Printed circuit boards↗
NASA NTRS1985

Anvil for Flaring PCB Guide Pins

Spring-loaded anvil results in fewer fractured pins. New anvil for flaring guide pins in printed-circuit boards absorbs approximately 80 percent of press force. As result fewer pins damaged, and work output of flaring press greatly increased.

Winn, E.↗
NASA NTRS2007

Removal of PCB and other halogenated organic contaminants found in ex situ structures

Emulsified systems of a surfactant-stabilized, biodegradable water-in-solvent emulsion with bimetallic particles contained with the emulsion droplets are useful at removing PCBs from ex situ structures. The hydrophobic emulsion system draws PCBs through the solvent/surfactant membrane. Once inside the membrane, the PCBs diffuse into the bimetallic particles and undergo degradation. The PCBs continue to enter, diffuse, degrade, and biphenyl will exit the particle maintaining a concentration gradient across the membrane and maintaining a driving force of the reaction.

Quinn, Jacqueline↗
NASA NTRS2007

Removal of PCB and Other Halogenated Organic Contaminants found in Ex Situ Structures

Emulsified systems or a surfactant-stabilized, biodegradable water-in-solvent emulsion with bimetallic particles contained with the emulsion droplets are useful at removing PCBs from ex situ structures. The hydrophobic emulsion system draws PCBs through the solvent/surfactant membrane. Once inside the membrane, the PCBs diffuse into the bimetallic particles and undergo degradation. The PCBs continue to enter, diffuse, degrade, and biphenyl will exit the particle maintaining a concentration gradient across the membrane and maintaining a driving force of the reaction.

Quinn, Jacqueline↗
NASA NTRS2009

Removal of PCB and other halogenated organic contaminants found in ex situ structures

Emulsified systems of a surfactant-stabilized, biodegradable water-in-solvent emulsion with bimetallic particles contained with the emulsion droplets are useful at removing PCBs from ex situ structures. The hydrophobic emulsion system draws PCBs through the solvent/surfactant membrane. Once inside the membrane, the PCBs diffuse into the bimetallic particles and undergo degradation. The PCBs continue to enter, diffuse, degrade, and biphenyl will exit the particle maintaining a concentration gradient across the membrane and maintaining a driving force of the reaction.

Quinn, Jacqueline W.↗
NASA NTRS2017

24-71 GHz PCB Array for 5G-ISM

This presentation discusses the development of a low form factor Ultra-Wideband at Ka-Band and up to the Millimeter-Wave Spectrum.

phased array↗
NASA NTRS2020

PCB Quality Metrics that Drive Reliability (PD 18)

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2019 Events provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions.

Sood, Bhanu↗
NASA NTRS2012

Focal Plane Alignment Utilizing Optical CMM

In many applications, an optical detector has to be located relative to mechanical reference points. One solution is to specify stringent requirements on (1) mounting the optical detector relative to the chip carrier, (2) soldering the chip carrier onto the printed circuit board (PCB), and (3) installing the PCB to the mechanical structure of the subsystem. Figure 1 shows a sketch of an optical detector mounted relative to mechanical reference with high positional accuracy. The optical detector is typically a fragile wafer that cannot be physically touched by any measurement tool. An optical coordinate measuring machine (CMM) can be used to position optical detectors relative to mechanical reference points. This approach will eliminate all requirements on positional tolerances. The only requirement is that the PCB is manufactured with oversized holes. An exaggerated sketch of this situation is shown in Figure 2. The sketch shows very loose tolerances on mounting the optical detector in the chip carrier, loose tolerance on soldering the chip carrier to the PCB, and finally large tolerance on where the mounting screws are located. The PCB is held with large screws and oversized holes. The PCB is mounted loosely so it can move freely around. The optical CMM measures the mechanical reference points. Based on these measurements, the required positions of the optical detector corners can be calculated. The optical CMM is commanded to go to the position where one detector corner is supposed to be. This is indicated with the cross-hairs in Figure 2(a). This figure is representative of the image of the optical CMM monitor. Using a suitable tapping tool, the PCB is manually tapped around until the corner of the optical detector is at the crosshairs of the optical CMM. The CMM is commanded to another corner, and the process is repeated a number of times until all corners of the optical detector are within a distance of 10 to 30 microns of the required position. The situation is sketched in Figure 2(b) (the figure also shows the tapping tool and where to tap). At this point the fasteners for the PCB are torqued slightly so the PCB can still move. The PCB location is adjusted again with the tapping tool. This process is repeated 3 to 4 times until the final torque is achieved. The oversized mounting holes are then filled with a liquid bonding agent to secure the board in position (not shown in the sketch). A 10- to 30-micron mounting accuracy has been achieved utilizing this method..

Liebe, Carl Christian↗
NASA NTRS2022

KSC Headquarters Building Area SWMU 104 Soil Interim Measure Report for LOC 2D and LOC 2E Kennedy Space Center, Florida

This Interim Measure (IM) Report for Location of Concern (LOC) 2D and LOC 2E summarizes the activities associated with implementation of an IM to address soil and concrete contamination at the Kennedy Space Center (KSC) Headquarters Building Area (KHQA) located at KSC, Florida. KHQA has been designated Solid Waste Management Unit (SWMU) 104 under KSC’s Resource Conservation and Recovery Act Corrective Action Program. The IM consisted of excavating/removing residual polychlorinated biphenyl (PCB) contamination in soil and concrete from two separate areas, LOC 2D and LOC 2E, which were associated with electrical transformer locations. IM activities were conducted in accordance with the Interim Measure Work Plan (IMWP), Revision 1, for KHQA dated June 2018, which was approved by the Florida Department of Environmental Protection in a correspondence letter dated April 2016 and the United States Environmental Protection Agency in a correspondence letter dated August 2018. The objective of the IM was to remove all remaining contaminated media with total PCB concentrations greater than the State of Florida Residential Soil Cleanup Target Level (RSCTL) (0.5 milligrams per kilogram [mg/kg]). This cleanup goal meets unrestrictive re-use conditions in Florida, and is below federal regulations for PCB Bulk Remediation Waste Cleanup of 1 mg/kg for high occupancy, unrestricted use areas, as outlined in 40 Code of Federal Regulations (CFR) 761.61(a). The timeline of the IM was coordinated with demolition of the former KSC Headquarters Building (demolished in 2021) in order to safely remove contaminated media after electrical equipment was de-energized and removed from the site. Excavation activities were conducted between January 10, 2022, and February 8, 2022, and included two waste streams for off-site disposal: (1) PCB-remediation waste greater than or equal to 50 mg/kg, and (2) PCB-remediation waste less than 50 mg/kg. A total of approximately 347 cubic yards (478 tons) of PCB-contaminated soil and concrete was initially removed from the LOC 2D and LOC 2E areas, as defined in the IMWP. An additional 4.35 tons of soil and concrete were removed based on verification sampling, which was conducted until the cleanup goal was achieved. The total area of excavation from both LOC 2D and LOC 2E was approximately 5,186 square feet (0.12 acres), and excavation depths ranged from 0.5 to 4.0 feet below land surface Excavated soils and concrete were stockpiled based on waste stream and subsequently transported and disposed of at Waste Connections of Osceola County, LLC – JED Landfill in St. Cloud, Florida (PCBs less than 50 mg/kg) or the Chemical Waste Management Landfill in Emelle, Alabama (PCBs greater than or equal to 50 mg/kg). Following excavation, clean backfill was brought to the site and provided to the Demolition Contractor to complete backfill and grading in conjunction with their final site restoration activities from building demolition. Post-IM groundwater sampling was conducted in May 2022 at three monitoring wells installed in April 2022 to confirm that PCBs did not leach into groundwater. These wells were installed where the highest PCB concentrations were detected at LOC 2D, LOC 2E, and from the Building Perimeter IM (previously completed in 2020). All PCB results in groundwater were non-detect. Volatile organic compounds were also analyzed based on potential past use of solvents in transformers with PCB-dielectric fluids and the potential release of dielectric fluids containing volatile organic compounds, and all results were non-detect. Based on completion of a successful IM at LOC 2D and LOC 2E, as well as previous remedial actions that have addressed other contamination at KHQA (SWMU 104), No Further Action without controls will be recommended for SWMU 104. NASA will submit separate Site Rehabilitation Completion Order request documentation for SWMU 104 to support an NFA without controls recommendation.

PCB↗
NASA NTRS2016

Command and Data Handling Branch Internship

Modular Integrated Stackable Layers (MISL) is a computer system designed for simple, fast, and cost effective flexible reconfiguration in space environments such as the ISS and Orion projects for various uses. Existing applications include wireless and wired communications, data acquisition and instrumentation, and camera systems, and potential applications include bus protocol converters and subsystem control. MISL is based on Texas Instruments (TI)' MSP430 16-bit ultra-low-power microcontroller device. The purpose of my project was to integrate the MISL system with a liquid crystal display (LCD) touchscreen. The LCD, manufactured by Crystalfontz and part number CFAF320240F-035T-TS, is a 320 by 240 RGB resistive color screen including an optional carrier board. The vast majority of the project was done with Altium Designer, a tool for printed circuit board (PCB) schematic capture, 3D design, and FPGA (Field Programmable Gate Array) development. The new PCB was to allow the LCD to directly stack to the rest of MISL. Research was done with datasheets for the TI microcontroller and touchscreen display in order to meet desired hardware specifications. Documentation on prior MISL projects was also utilized. The initial step was to create a schematic for the LCD, power bus, and data bus connections between components. A layout was then designed with the required physical dimensions, routed traces and vias, power and ground planes, layer stacks, and other specified design rules such as plane clearance and hole size. Multiple consultation sessions were held with Hester Yim, the technical discipline lead for the Command and Data Handling Branch, and Christy Herring, the lead PCB layout designer in the Electronic Design and Manufacturing Branch in order to ensure proper configuration. At the moment, the PCB is awaiting revision by the latter-mentioned branch. Afterwards, the board will begin to undergo the manufacturing and testing process. Throughout the internship at Johnson Space Center, I gained several technical and professional skills. I gained proficiency in Altium Designer and experience using subversion clients, as well as knowledge in PSpice with OrCAD and battery design for spaceflight from on-site. I also gained networking, organization, and communication skills throughout meetings with coworkers and other interns. This internship at Johnson Space Center has impacted my future aspirations by further inspiring me to follow a career path into space rated engineering technology and human spaceflight applications. After graduation, I plan to attend graduate Modular Integrated Stackable Layers (MISL) is a computer system designed for simple, fast, and cost effective flexible reconfiguration in space environments such as the ISS and Orion projects for various uses. Existing applications include wireless and wired communications, data acquisition and instrumentation, and camera systems, and potential applications include bus protocol converters and subsystem control. MISL is based on Texas Instruments’ MSP430 16 bit ultra-low power microcontroller device. The purpose of my project was to integrate the MISL system with a liquid crystal display touchscreen. The LCD, manufactured by Crystalfontz and part number CFAF320240F-035T-TS, is a 320x240 RGB resistive color screen including an optional carrier board.The vast majority of the project was done with Altium Designer, a tool for printed circuit board (PCB) schematic capture, 3D design, and FPGA development. The new PCB was to allow the LCD to directly stack to the rest of MISL. Research was done with datasheets for the TI microcontroller and touchscreen display in order to meet desired hardware specifications. Documentation on prior MISL projects was also utilized. The initial step was to create a schematic for the LCD, power bus, and data bus connections between components. A layout was then designed with the required physical dimensions, routed traces and vias, power and ground planes, layer stacks, and other specified design rules such as plane clearance and hole size. Multiple consultation sessions were held with Hester Yim, the technical discipline lead for the Command and Data Handling Branch, and Christy Herring, the lead PCB layout designer in the Electronic Design and Manufacturing Branch in order to ensure proper configuration. At themoment, the PCB is awaiting revision by the latter-mentioned branch. Afterwards, the board will begin to undergo the manufacturing and testing process.Throughout the internship at Johnson Space Center, I gained several technical and professional skills. I gained proficiency in Altium Designer and experience using subversion clients, as well as knowledge in PSpice with OrCAD and battery design for spaceflight from on-site. I also gained networking, organization, and communication skills throughout meetings with coworkers and other interns. This internship at Johnson Space Center has impacted my future aspirations by further inspiring me to follow a career path into space rated engineering technology and human spaceflight applications. After graduation, I plan to attend graduate school for a master's or doctorate degree in electrical or computer engineering.

Billings, Rachel Mae↗
NASA NTRS2024

Shallow Soil Polychlorinated Biphenyl Site Assessment Report

This report presents a summary of the shallow soil polychlorinated biphenyl (PCB) site assessment activities that occurred from December 2020 through July 2022 at General Services Administration Reclamation Yard, Solid Waste Management Unit (SWMU) 010, located at the John F. Kennedy Space Center (KSC), Florida. The site is monitored under KSC’s Resource Conservation and Recovery Act Corrective Action Program, which also meets the requirements of Chapter 62-780, Florida Administrative Code. For the purposes of this report, three separate shallow soil plumes, known as the Northeast Shallow Soil PCB Plume, Southeast Shallow Soil PCB Plume, and West Shallow Soil PCB Plume, were identified for this site. The activities presented in this report include seven field events conducted between December 2020 and July 2022, which include shallow soil sample collection in the Northeast, Southeast, and West Shallow Soil PCB Plumes. AECOM Technical Services, Inc., personnel collected 330 soil samples from 118 boring locations. The samples were collected at 0.5-foot depth intervals to various depths based on analytical results and depth to groundwater. The soil samples were submitted to a fixed-based laboratory for analysis by United States Environmental Protection Agency Method 8082A for total PCBs. Several soil samples had PCB concentrations above the State of Florida Direct Exposure Residential and Industrial Soil Cleanup Target Levels (SCTLs), and two soil samples had PCB concentrations above the State of Florida Leachability for Groundwater. No soil borings were located beneath impervious surfaces, such as concrete or asphalt. The current Land Use Control Implementation Plan (LUCIP) covers PCBs in soils above the residential SCTL, which includes the paved areas.

PCBs↗
NASA NTRS2024

Shallow Soil Polychlorinated Biphenyl Site Assessment Report: General Services Administration Reclamation Yard Solid Waste Management Unit 010

This report presents a summary of the shallow soil polychlorinated biphenyl (PCB) site assessment activities that occurred from December 2020 through July 2022 at General Services Administration Reclamation Yard, Solid Waste Management Unit (SWMU) 010, located at the John F. Kennedy Space Center (KSC), Florida. The site is monitored under KSC’s Resource Conservation and Recovery Act Corrective Action Program, which also meets the requirements of Chapter 62-780, Florida Administrative Code. For the purposes of this report, three separate shallow soil plumes, known as the Northeast Shallow Soil PCB Plume, Southeast Shallow Soil PCB Plume, and West Shallow Soil PCB Plume, were identified for this site. The activities presented in this report include seven field events conducted between December 2020 and July 2022, which include shallow soil sample collection in the Northeast, Southeast, and West Shallow Soil PCB Plumes. AECOM Technical Services, Inc., personnel collected 330 soil samples from 118 boring locations. The samples were collected at 0.5-foot depth intervals to various depths based on analytical results and depth to groundwater. The soil samples were submitted to a fixed-based laboratory for analysis by United States Environmental Protection Agency Method 8082A for total PCBs. Several soil samples had PCB concentrations above the State of Florida Direct Exposure Residential and Industrial Soil Cleanup Target Levels (SCTLs), and two soil samples had PCB concentrations above the State of Florida Leachability for Groundwater. No soil borings were located beneath impervious surfaces, such as concrete or asphalt. The current Land Use Control Implementation Plan (LUCIP) covers PCBs in soils above the residential SCTL, which includes the paved areas.

soil assessment↗
NASA NTRS2013

Compact Radar Transceiver with Included Calibration

The Digital Beamforming Synthetic Aperture Radar (DBSAR) is an eight-channel phased array radar system that employs solid-state radar transceivers, a microstrip patch antenna, and a reconfigurable waveform generator and processor unit. The original DBSAR transceiver design utilizes connectorized electronic components that tend to be physically large and heavy. To achieve increased functionality in a smaller volume, PCB (printed circuit board) transceivers were designed to replace the large connectorized transceivers. One of the most challenging problems designing the transceivers in a PCB format was achieving proper performance in the calibration path. For a radar loop-back calibration path, a portion of the transmit signal is coupled out of the antenna feed and fed back into the receiver. This is achieved using passive components for stability and repeatability. Some signal also leaks through the receive path. As these two signal paths are correlated via an unpredictable phase, the leakage through the receive path during transmit must be 30 dB below the calibration path. For DBSAR s design, this requirement called for a 100-dB isolation in the receiver path during transmit. A total of 16 solid-state L-band transceivers on a PCB format were designed. The transceivers include frequency conversion stages, T/R switching, and a calibration path capable of measuring the transmit power-receiver gain product during transmit for pulse-by-pulse calibration or matched filtering. In particular, this calibration path achieves 100-dB isolation between the transmitted signal and the low-noise amplifier through the use of a switching network and a section of physical walls achieving attenuation of radiated leakage. The transceivers were designed in microstrip PCBs with lumped elements and individually packaged components for compactness. Each transceiver was designed on a single PCB with a custom enclosure providing interior walls and compartments to isolate transceiver subsystems from radiated interference. The enclosure also acts as a heat sink for the voltage regulators and power amplifiers inside the system. The PCB transceiver design produces transmit pulses of 2 W with an arbitrary duty cycle. Each transceiver is fed by an external 120-MHz signal transmit and two 1,140-MHz local oscillator signals. The received signal is amplified and down-converted to 120 MHz and is fed to the data processor. The transceiver dimensions are approximately 3.5 11.5 0.6 in. (9 29 1.5 cm). The PCB transceiver design reduces the volume and weight of the DBSAR instrument while maintaining the functionality found in the original design. Both volume and weight are critical for airborne and flight remote sensing instrumentation.

McLinden, Matthew↗
NASA NTRS2023

Stand Alone Electrical Equipment PRL 227a (Formerly PRL 227 LOC3) Confirmatory Sampling Report Addendum

HydroGeoLogic, Inc. (HGL) prepared this Confirmatory Sampling Report Addendum (CSRA) for the National Aeronautics and Space Administration (NASA), Kennedy Space Center (KSC), Florida. PRL 227a Location of Concern (LOC) 3 is located on 10th Street, west of the former Vertical Processing Facility (M7-1469), SWMU 077. The Load Break Switches (LBS) were installed in 1986 and are suspected to have formerly contained dielectric fluid that contained polychlorinated biphenyls (PCBs). The LBS were replaced in 1993 with new LBSs that do not contain PCBs. The LBS are located on a concrete pad surrounded by grass that is mowed and maintained. A total of 330 soil samples were collected between June 2020 and December 2022 from 88 locations at depths ranging from 0-0.5 to 19-20 ft bls. In general, soil samples collected from depths less than 5 ft were collected via hand auger and samples collected beyond 5 ft bls were collected using a direct-push technology drill rig. Soil samples collected from greater than 5 ft bls to 20 ft bls were collected to confirm PCBs were not present at depth in the aquifer matrix. Delineation samples were collected using an approximately 20 ft horizontal spacing. PCB impacted soil has been completely delineated to the State of Florida residential soil cleanup target level (SCTL) at PRL 227a horizontally and vertically. PCB concentrations have been identified above the residential and industrial SCTL as well as concentrations greater than or equal to 50 ppm requiring coordination with EPA and disposal at a facility authorized under TSCA. Based upon the CSRA sampling, an interim measure is recommended to remove PCB impacted soil above the residential SCTL. The total volume of PCB impacted soil to be removed is 591.6 cubic yards. This includes approximately 9.3 cubic yards of soil with PCB concentrations greater than or equal to 50 ppm. An interim measure work plan is included as an attachment to this report.

electrical equipment↗