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Powder bed fusion (PBF) additive manufacturing (AM) enables the creation of parts with complexity and functionality levels that were previously impossible with traditional manufacturing methods. By modifying the laser power, hatch spacing, or the numerous other processing parameters, the PBF process supports the production of a wide set of materials and geometries. However, that same process parameter design flexibility causes the process-design space of PBF to be massive and expensive to explore experimentally. Another challenge is quality variation across a build. As a part is being built, geometric variance between locations, such as at a thin-wall section vs. the bulk material, may cause the specified processing parameters to no longer be acceptable for producing defect-free printing. Furthermore, if the processing parameters deviate during the print process, it is difficult to assess if the part will still perform satisfactorily. Integrated Computational Materials Engineering (ICME) provides a way to understand and address these various challenges. This talk will present advancements in process-structure simulations of PBF at NASA Langley Research Center. The ability to simulate grain-scale PBF microstructures using the Physically Based Monte Carlo method will be demonstrated and compared to experimental measurements. Techniques for simulating three-dimensional lack-of-fusion and keyhole porosity defects based on the specific processing conditions and approaches for integrating the two porosity prediction techniques alongside the computational microstructure evolution models will be shown. Finally, the integration of simulated PBF microstructures, embedded process defects, and crystal plasticity finite element models to elucidate the interaction of porosity and microstructure on micromechanical fields will be demonstrated. These integrated techniques demonstrate an example of using ICME to relate processing to performance for PBF AM materials. With continued maturity, it is hoped that such ICME approaches will lead to next-generation computational-materials supported qualification and certification of AM parts.