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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
DOE OSTI2022

Building Blocks for Secure and Prosperous Defense Critical Supply Chains: A Case Study from Microelectronics

Securing defense-critical supply chains, built on resilient and sustainable microelectronics fabrication and deployment, is a national imperative and one that requires an investment in basic and applied research, development, and deployment into industries in (and out of) the Defense Industrial Base (DIB). Critical next steps include the development of pilots for revolutionary concepts in a new formal verification model and the Cyber-Physical Passport (CPP) concept for chain of custody. Critical infrastructure leadership should take action with a sense of urgency. Working in conjunction with the Under Secretary for Acquisition and Sustainment, the Assistant Secretary of Defense for Research and Engineering should establish pilot programs with the Defense Advanced Research Projects Agency and the service labs to build and test both concepts in legacy and new system development.. Additionally, the Pentagon may be aware that an existing Manufacturing Innovation Institute is piloting, with the semiconductor industry, cyber innovations to provide verifiable security properties and guarantees of physical functions to build a more cyber secure, resilient and efficient micro-electronics supply chain.

99 GENERAL AND MISCELLANEOUS↗
DOE OSTI2018

The Application of MCNP6.2 Unstructured Mesh Geometry Capabilities to the Study of Heavy Ion Single Event Effect on Microelectronic Devices and the Reactor Physics Analysis - 25691

Unstructured meshes allow irregular or complex geometries to be modeled precisely in Monte Carlo radiation transport codes. Through this capability, it is possible to share an unstructured mesh model between multiple codes that use unstructured mesh geometry and thus improving coupled multi-physics simulations. In this work, unstructured meshes are used to model energy deposition from heavy ion strikes for single event effects on microelectronic devices as well as neutron flux mapping of nuclear reactor configurations. In each case, MCNP6.2's unstructured mesh functionality and applicability to the problem is demonstrated and analyzed. (authors)

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2018

1D SbSeI, SbSI, and SbSBr With High Stability and Novel Properties for Microelectronic, Optoelectronic, and Thermoelectric Applications

Mechanical exfoliation of 2D materials has triggered an explosive interest in lowdimensional material research. We extend this idea to 1D van derWaals materials. Three 1D semiconductors (SbSeI, SbSI and SbSBr) with high stability and novel electronic properties are discovered using first principles calculations. Both the dynamical and the thermal stability of these 1D materials are examined. We demonstrate that their nanowire thinner than 7 Å can be easily obtained by mechanical exfoliation, hydrothermal method or sonochemical method. The bulk-to-1D transition results in dramatic changes in band gap, effective mass and static dielectric constant due to quantum confinement, making 1D SbSeI a highly promising channel material for transistors with gate length shorter than 1 nm. Under small uniaxial strain, these materials are transformed from indirect into direct band gap semiconductors, paving the way for optoelectronic devices and mechanical sensors. Moreover, the thermoelectric performance of these materials is significantly improved over their bulk counterparts. These highly desirable properties render SbSeI, SbSI and SbSBr promising 1D materials for applications in future microelectronics, optoelectronics, mechanical sensors, and thermoelectrics.

36 MATERIALS SCIENCE↗
DOE OSTI2018

Structural Evolution of Molybdenum Disulfide Prepared by Atomic Layer Deposition for Realization of Large Scale Films in Microelectronic Applications

Molybdenum disulfide (MoS 2 ) films are attractive materials for electronic and optoelectronic devices, but the temperatures used in the chemical vapor deposition (CVD) of these materials are too high for device integration. Recently, a low-temperature atomic layer deposition (ALD) process was demonstrated for growth of MoS 2 films at 200 °C using MoF 6 and H 2 S. However, the as-deposited films were amorphous and required annealing to obtain the desired layered structure. The MoS 2 films were sulfur-deficient; however, after annealing the crystallinity improved. To study the structure of these films and the process by which they crystallize, we performed in this work X-ray absorption spectroscopy and high-energy X-ray scattering experiments on both as-deposited and annealed MoS 2 films. Analysis indicated that molybdenum atoms in the as-deposited films were well coordinated with sulfur but not well coordinated with other molybdenum atoms when compared to a crystalline reference. Further analysis revealed clusters of the sulfur-rich phase [Mo 3 S(S 6 ) 2 ] 2– , which decomposed after annealing in H 2 and H 2 S at 400 and 600 °C. When compared to the sulfur-deficient films reported previously for this ALD process, the sulfur-rich phase found here indicates that nucleation on the substrate plays an important role in the resulting film stoichiometry, which could be tuned to produce higher quality films for microelectronic applications.

36 MATERIALS SCIENCE↗
DOE OSTI2024

New Roadmap for Microelectronics: Charting the Semiconductor Industry's Path Over the Next 5, 10, and 20 Years

In the past, the role of strategic planning for semiconductor industry was met by the International Technology Roadmap for Semiconductors (ITRS), serving as a guiding light that provided manufacturers, designers, equipment suppliers, and researchers with direction years in advance. By providing a common framework for coordination across semiconductor industry stakeholders, technology development efforts were efficient and aligned. However, the dissolution of the ITRS in 2015 left a void, leading to years of disjointed efforts. Recognizing the need for unified guidance, the industry rallied for the creation of a new strategic plan, the Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap (2023) was developed, through the efforts of hundreds of industry, academic and government experts, to provide detailed strategies for achieving these goals. This comprehensive plan outlines ambitious goals for the industry's future.

HPC, Roadmap, AI, Liquid Cooling, Power, Silicon, ↗
DOE OSTI2024

Exascale-Enabled Models and Algorithms for Microelectronics Applications (MicroEleX) v1

The MicroEleX code package contains a variety of models and algorithms for physical modeling of microelectronic circuitry, including electrostatics, electrodynamics, superconducting physics, micromagnetics, multi-ferroic systems, and quantum transport. MicroEleX leverages the AMReX software framework to provide scalability on GPU-based supercomputing architectures. The code is open source and designed to be algorithmically flexible so developers can incorporate enhanced or customized physics.

Nonaka, Andy↗
DOE OSTI2022

Federated Learning and Differential Privacy: What might AI-Enhanced co-design of microelectronics learn?

Data is a valuable commodity, and it is often dispersed over multiple entities. Sharing data or models created from the data is not simple due to concerns regarding security, privacy, ownership, and model inversion. This limitation in sharing can hinder model training and development. Federated learning can enable data or model sharing across multiple entities that control local data without having to share or exchange the data themselves. Differential privacy is a conceptual framework that brings strong mathematical guarantee for privacy protection and helps provide a quantifiable privacy guarantee to any data or models shared. The concepts of federated learning and differential privacy are introduced along with possible connections. Lastly, some open discussion topics on how federated learning and differential privacy can tied to AI-Enhanced co-design of microelectronics are highlighted.

29 ENERGY PLANNING, POLICY, AND ECONOMY↗
DOE OSTI2024

A rapid, pulsed laser testing approach for single event latch-up screening in microelectronics

A pulsed laser testing system for rapid screening of single-event latch-up (SEL) in microelectronics with real-time visualization of sensitive nodes via photo-emission is presented. We provide a detailed overview of the system, followed by SEL threshold measurements in an analog-to-digital converter (AD9240). We find that SEL thresholds are comparable to measurements taken with a low-repetition rate, fixed beam system, and demonstrate full-die scanning speeds can be an order of magnitude faster

Andrus, Liam Padraic↗
DOE OSTI2022

Materials for a Sustainable Microelectronics Future: Electric Field Control of Magnetism with Multiferroics

This article is written on behalf of many colleagues, collaborators, and researchers in the field of complex oxides as well as current and former students and postdocs who continue to enable and undertake cutting-edge research in the field of multiferroics, magnetoelectrics, and the pursuit of electric-field control of magnetism. What I present is something that is extremely exciting from both a fundamental science and applications perspective and has the potential to revolutionize our world, particularly from a sustainability perspective. To realize this potential will require numerous new innovations, both in the fundamental science arena as well as translating these scientific discoveries into real applications. Thus, this article will attempt to bridge the gap between fundamental materials physics and the actual manifestations of the physical concepts into real-life applications. Further, I hope this article will help spur more translational research within the broad materials community.

36 MATERIALS SCIENCE↗
DOE OSTI2022

Analog Quantum Simulation of the Dynamics of Open Quantum Systems with Quantum Dots and Microelectronic Circuits

We introduce a general setup for the analog quantum simulation of the dynamics of open quantum systems based on semiconductor quantum dots electrically connected to a chain of quantum RLC electronic circuits. The dots are chosen to be in the regime of spin-charge hybridization to enhance their sensitivity to the RLC circuits while mitigating the detrimental effects of unwanted noise. In this context, we establish an experimentally realizable map between the hybrid system and a qubit coupled to thermal harmonic environments of arbitrary complexity that enables the analog quantum simulation of open quantum systems. We assess the utility of the simulator by numerically exact emulations that indicate that the experimental setup can faithfully mimic the intended target even in the presence of its natural inherent noise. We further provide a detailed analysis of the physical requirements on the quantum dots and the RLC circuits needed to experimentally realize this proposal that indicates that the simulator can be created with existing technology. The approach can exactly capture the effects of highly structured non-Markovian quantum environments typical of photosynthesis and chemical dynamics, and offer clear potential advantages over conventional and even quantum computation. The proposal opens a general path for effective quantum dynamics simulations based on semiconductor quantum dots.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗