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23 records · Page 2

The NASA Spacecraft Transponding Modem

A new deep space transponder is being developed by the Jet Propulsion Laboratory for NASA. The Spacecraft Transponding Modem (STM) implements the standard transponder functions and the channel service functions that have previously resided in spacecraft Command/Data Subsystems. The STM uses custom ASICs, MMICs, and MCMs to reduce the active device parts count to 70, mass to I kg, and volume to 524 cc. The first STMs will be flown on missions launching in the 2003 time frame. The STM tracks an X-band uplink signal and provides both X-band and Ka-band downlinks, either coherent or non-coherent with the uplink. A NASA standard Command Detector Unit is integrated into the STM, along with a codeblock processor and a hardware command decoder. The decoded command codeblocks are output to the spacecraft command/data subsystem. Virtual Channel 0 (VC-0) (hardware) commands are processed and output as critical controller (CRC) commands. Downlink telemetry is received from the spacecraft data subsystem as telemetry frames. The STM provides the following downlink coding options: the standard CCSDS (7-1/2) convolutional coding, ReedSolomon coding with interleave depths one and five, (15-1/6) convolutional coding, and Turbo coding with rates 1/3 and 1/6. The downlink symbol rates can be linearly ramped to match the G/T curve of the receiving station, providing up to a 1 dB increase in data return. Data rates range from 5 bits per second (bps) to 24 Mbps, with three modulation modes provided: modulated subcarrier (3 different frequencies provided), biphase-L modulated direct on carrier, and Offset QPSK. Also, the capability to generate one of four non-harmonically related telemetry beacon tones is provided, to allow for a simple spacecraft status monitoring scheme for cruise phases of missions. Three ranging modes are provided: standard turn around ranging, regenerative pseudo-noise (PN) ranging, and Differential One-way Ranging (DOR) tones. The regenerative ranging provides the capability of increasing the ground received ranging SNR by up to 30 dB. Two different avionics interfaces to the command/data subsystem's data bus are provided: a MIL STD 1553B bus or an industry standard PCI interface. Digital interfaces provide the capability to control antenna selection (e.g., switching between high gain and low gain antennas) and antenna pointing (for future steered Ka-band antennas).

Berner, Jeff B.↗

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Aquirre, Fernando↗

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Schatzel, Donald↗

64Mb COTS DRAMs: A Variety of SEE Responses

Advanced commercial DRAMs are particularly attractive to designers for space applications needing large memory arrays due to resulting savings in mass, volume, and power.

(MCMs)↗