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All sourcesNASA NTRSDOE OSTI
NASA NTRS2016

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Schatzel, Donald↗
NASA NTRS1993

An atlas of high-resolution IRAS maps on nearby galaxies

An atlas of far-infrared IRAS maps with near 1 arcmin angular resolution of 30 optically large galaxies is presented. The high-resolution IRAS maps were produced with the Maximum Correlation Method (MCM) image construction and enhancement technique developed at IPAC. The MCM technique, which recovers the spatial information contained in the overlapping detector data samples of the IRAS all-sky survey scans, is outlined and tests to verify the structural reliability and photometric integrity of the high-resolution maps are presented. The infrared structure revealed in individual galaxies is discussed. The atlas complements the IRAS Nearby Galaxy High-Resolution Image Atlas, the high-resolution galaxy images encoded in FITS format, which is provided to the astronomical community as an IPAC product.

Rice, Walter↗
NASA NTRS1993

Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH) program

A joint military-commercial effort to evaluate multichip module (MCM) structures is discussed. The program, Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH), has been designed to identify the failure mechanisms that are possible in MCM structures. The RELTECH test vehicles, technical assessment task, product evaluation plan, reliability modeling task, accelerated and environmental testing, and post-test physical analysis and failure analysis are described. The information obtained through RELTECH can be used to address standardization issues, through development of cost effective qualification and appropriate screening criteria, for inclusion into a commercial specification and the MIL-H-38534 general specification for hybrid microcircuits.

Fayette, Daniel F.↗
NASA NTRS1992

Low energy CMOS for space applications

The current focus of NASA's space flight programs reflects a new thrust towards smaller, less costly, and more frequent space missions, when compared to missions such as Galileo, Magellan, or Cassini. Recently, the concept of a microspacecraft was proposed. In this concept, a small, compact spacecraft that weighs tens of kilograms performs focused scientific objectives such as imaging. Similarly, a Mars Lander micro-rover project is under study that will allow miniature robots weighing less than seven kilograms to explore the Martian surface. To bring the microspacecraft and microrover ideas to fruition, one will have to leverage compact 3D multi-chip module-based multiprocessors (MCM) technologies. Low energy CMOS will become increasingly important because of the thermodynamic considerations in cooling compact 3D MCM implementations and also from considerations of the power budget for space applications. In this paper, we show how the operating voltage is related to the threshold voltage of the CMOS transistors for accomplishing a task in VLSI with minimal energy. We also derive expressions for the noise margins at the optimal operating point. We then look at a low voltage CMOS (LVCMOS) technology developed at Stanford University which improves the power consumption over conventional CMOS by a couple of orders of magnitude and consider the suitability of the technology for space applications by characterizing its SEU immunity.

Panwar, Ramesh↗
NASA NTRS1994

Radiative interactions in multi-dimensional chemically reacting flows using Monte Carlo simulations

The Monte Carlo method (MCM) is applied to analyze radiative heat transfer in nongray gases. The nongray model employed is based on the statistical narrow band model with an exponential-tailed inverse intensity distribution. The amount and transfer of the emitted radiative energy in a finite volume element within a medium are considered in an exact manner. The spectral correlation between transmittances of two different segments of the same path in a medium makes the statistical relationship different from the conventional relationship, which only provides the non-correlated results for nongray methods is discussed. Validation of the Monte Carlo formulations is conducted by comparing results of this method of other solutions. In order to further establish the validity of the MCM, a relatively simple problem of radiative interactions in laminar parallel plate flows is considered. One-dimensional correlated Monte Carlo formulations are applied to investigate radiative heat transfer. The nongray Monte Carlo solutions are also obtained for the same problem and they also essentially match the available analytical solutions. the exact correlated and non-correlated Monte Carlo formulations are very complicated for multi-dimensional systems. However, by introducing the assumption of an infinitesimal volume element, the approximate correlated and non-correlated formulations are obtained which are much simpler than the exact formulations. Consideration of different problems and comparison of different solutions reveal that the approximate and exact correlated solutions agree very well, and so do the approximate and exact non-correlated solutions. However, the two non-correlated solutions have no physical meaning because they significantly differ from the correlated solutions. An accurate prediction of radiative heat transfer in any nongray and multi-dimensional system is possible by using the approximate correlated formulations. Radiative interactions are investigated in chemically reacting compressible flows of premixed hydrogen and air in an expanding nozzle. The governing equations are based on the fully elliptic Navier-Stokes equations. Chemical reaction mechanisms were described by a finite rate chemistry model. The correlated Monte Carlo method developed earlier was employed to simulate multi-dimensional radiative heat transfer. Results obtained demonstrate that radiative effects on the flowfield are minimal but radiative effects on the wall heat transfer are significant. Extensive parametric studies are conducted to investigate the effects of equivalence ratio, wall temperature, inlet flow temperature, and nozzle size on the radiative and conductive wall fluxes.

Liu, Jiwen↗
NASA NTRS1994

Constraints as a destriping tool for Hires images

Images produced from the Maximum Correlation Method sometimes suffer from visible striping artifacts, especially for areas of extended sources. Possible causes are different baseline levels and calibration errors in the detectors. We incorporated these factors into the MCM algorithm, and tested the effects of different constraints on the output image. The result shows significant visual improvement over the standard MCM Method. In some areas the new images show intelligible structures that are otherwise corrupted by striping artifacts, and the removal of these artifacts could enhance performance of object classification algorithms. The constraints were also tested on low surface brightness areas, and were found to be effective in reducing the noise level.

Cao, YU↗
NASA NTRS1996

Chip-on-Board Technology 1996 Year-end Report (Design, Manufacturing, and Reliability Study)

The major impetus for flight qualifying Chip-On-Board (COB) packaging technology is the shift in emphasis for space missions to smaller, better, and cheaper spacecraft and satellites resulting from the NASA New Millenium initiative and similar requirements in DoD-sponsored programs. The most important benefit that can potentially be derived from miniaturizing spacecraft and satellites is the significant cost saving realizable if a smaller launch vehicle may be employed. Besides the program cost saving, there are several other advantages to building COB-based space hardware. First, once a well-controlled process is established, COB can be low cost compared to standard Multi-Chip Module (MCM) technology. This cost competitiveness is regarded as a result of the generally greater availability and lower cost of Known Good Die (KGD). Coupled with the elimination of the first level of packaging (chip package), compact, high-density circuit boards can be realized with Printed Wiring Boards (PWB) that can now be made with ever-decreasing feature size in line width and via hole. Since the COB packaging technique in this study is based mainly on populating bare dice on a suitable multi-layer laminate substrate which is not hermetically sealed, die coating for protection from the environment is required. In recent years, significant improvements have been made in die coating materials which further enhance the appeal of COB. Hysol epoxies, silicone, parylene and silicon nitride are desirable because of their compatible Thermal Coefficient of Expansion (TCE) and good moisture resistant capability. These die coating materials have all been used in the space and other industries with varying degrees of success. COB technology, specifically siliconnitride coated hardware, has been flown by Lockheed on the Polar satellite. In addition, DARPA has invested a substantial amount of resources on MCM and COB-related activities recently. With COB on the verge of becoming a dominant player in DoD programs, DARPA is increasing its support of the availability of KGDs which will help decrease their cost. Aside from the various major developments and trends in the space and defense industries that are favorable to the acceptance and widespread use of'COB packaging technology, implementing COB can be appealing in other aspects. Since the interconnection interface is usually the weak link in a system, the overall circuit or system reliability may actually be improved because of the elimination of a level of interconnect/packaging at the chip. With COB, mixing packaging technologies is possible. Because some devices are only available in commercial plastic packages, populating a multi-layer laminate substrate with both bare dice and plastic-package parts is inevitable. Another attractive feature of COB is that re-workability is possible if die coating is applied only on the die top. This method allows local replacement of individual dice that were found to be defective instead of replacing an entire board. In terms of thermal management, unpackaged devices offer a shorter thermal resistance path than their packaged counterparts thereby improving thermal sinking and heat removal from the parts.

Le, Binh Q.↗
NASA NTRS2000

Thermal Characterization for a Modular 3-D Multichip Module

NASA Goddard Space Flight Center has designed a high-density modular 3-D multichip module (MCM) for future spaceflight use. This MCM features a complete modular structure, i.e., each stack can be removed from the package without damaging the structure. The interconnection to the PCB is through the Column Grid Array (CGA) technology. Because of its high-density nature, large power dissipation from multiple layers of circuitry is anticipated and CVD diamond films are used in the assembly for heat conduction enhancement. Since each stacked layer dissipates certain amount of heat, designing effective heat conduction paths through each stack and balancing the heat dissipation within each stack for optimal thermal performance become a challenging task. To effectively remove the dissipated heat from the package, extensive thermal analysis has been performed with finite element methods. Through these analyses, we are able to improve the thermal design and increase the total wattage of the package for maximum electrical performance. This paper provides details on the design-oriented thermal analysis and performance enhancement. It also addresses issues relating to contact thermal resistance between the diamond film and the metallic heat conduction paths.

Fan, Mark S.↗
NASA NTRS2002

Spacewire on Earth orbiting scatterometers

The need for a high speed, reliable and easy to implement communication link has led to the development of a space flight oriented version of IEEE 1355 called SpaceWire. SpaceWire is based on high-speed (200 Mbps) serial point-to-point links using Low Voltage Differential Signaling (LVDS). SpaceWIre has provisions for routing messages between a large network of processors, using wormhole routing for low overhead and latency. {additionally, there are available space qualified hybrids, which provide the Link layer to the user's bus}. A test bed of multiple digital signal processor breadboards, demonstrating the ability to meet signal processing requirements for an orbiting scatterometer has been implemented using three Astrium MCM-DSPs, each breadboard consists of a Multi Chip Module (MCM) that combines a space qualified Digital Signal Processor and peripherals, including IEEE-1355 links. With the addition of appropriate physical layer interfaces and software on the DSP, the SpaceWire link is used to communicate between processors on the test bed, e.g. sending timing references, commands, status, and science data among the processors. Results are presented on development issues surrounding the use of SpaceWire in this environment, from physical layer implementation (cables, connectors, LVDS drivers) to diagnostic tools, driver firmware, and development methodology. The tools, methods, and hardware, software challenges and preliminary performance are investigated and discussed.

serial↗
NASA NTRS2006

Quantifying the Seasonal and Interannual Variability of North American Isoprene Emissions Using Satellite Observations of the Formaldehyde Column

Quantifying isoprene emissions using satellite observations of the formaldehyde (HCHO) columns is subject to errors involving the column retrieval and the assumed relationship between HCHO columns and isoprene emissions, taken here from the GEOS-CHEM chemical transport model. Here we use a 6-year (1996-2001) HCHO column data set from the Global Ozone Monitoring Experiment (GOME) satellite instrument to (1) quantify these errors, (2) evaluate GOME-derived isoprene emissions with in situ flux measurements and a process-based emission inventory (Model of Emissions of Gases and Aerosols from Nature, MEGAN), and (3) investigate the factors driving the seasonal and interannual variability of North American isoprene emissions. The error in the GOME HCHO column retrieval is estimated to be 40%. We use the Master Chemical Mechanism (MCM) to quantify the time-dependent HCHO production from isoprene, alpha- and beta-pinenes, and methylbutenol and show that only emissions of isoprene are detectable by GOME. The time-dependent HCHO yield from isoprene oxidation calculated by MCM is 20-30% larger than in GEOS-CHEM. GOME-derived isoprene fluxes track the observed seasonal variation of in situ measurements at a Michigan forest site with a -30% bias. The seasonal variation of North American isoprene emissions during 2001 inferred from GOME is similar to MEGAN, with GOME emissions typically 25% higher (lower) at the beginning (end) of the growing season. GOME and MEGAN both show a maximum over the southeastern United States, but they differ in the precise location. The observed interannual variability of this maximum is 20-30%, depending on month. The MEGAN isoprene emission dependence on surface air temperature explains 75% of the month-to-month variability in GOME-derived isoprene emissions over the southeastern United States during May-September 1996-2001.

Palmer, Paul I.↗
NASA NTRS2003

Prototype Parts of a Digital Beam-Forming Wide-Band Receiver

Some prototype parts of a digital beamforming (DBF) receiver that would operate at multigigahertz carrier frequencies have been developed. The beam-forming algorithm in a DBF receiver processes signals from multiple antenna elements with appropriate time delays and weighting factors chosen to enhance the reception of signals from a specific direction while suppressing signals from other directions. Such a receiver would be used in the directional reception of weak wideband signals -- for example, spread-spectrum signals from a low-power transmitter on an Earth-orbiting spacecraft or other distant source. The prototype parts include superconducting components on integrated-circuit chips, and a multichip module (MCM), within which the chips are to be packaged and connected via special inter-chip-communication circuits. The design and the underlying principle of operation are based on the use of the rapid single-flux quantum (RSFQ) family of logic circuits to obtain the required processing speed and signal-to-noise ratio. RSFQ circuits are superconducting circuits that exploit the Josephson effect. They are well suited for this application, having been proven to perform well in some circuits at frequencies above 100 GHz. In order to maintain the superconductivity needed for proper functioning of the RSFQ circuits, the MCM must be kept in a cryogenic environment during operation.

Kaplan, Steven B.↗
NASA NTRS2012

Analysis of Microcrafters in Materials Specimens after Long-Term Exposure on ISS Surface

The "Komplast" experiment has been carried out on the ISS by the Khrunichev Space Center jointly with other Russian scientific centers since 1998. The experiment incorporates the "Komplast" cartridges on the FGB exterior, which are fitted with materials specimens and sensors. The cartridges were sent into orbit together with FGB on 20 November 1998. In March 2011, two of the cartridges were taken back from the ISS by the "Discovery" American space shuttle after being exposed in the open space for 12 years. In the framework of this experiment the subject of analysis is the effect of the space environment on the exposed specimens of various materials. This report covers the analysis results of the surface morphology of various materials taken from the "Komplast" cartridges exposed to hits of micrometeors and micronic particles of space debris. Analysis is made of microcraters of 5 to 250 mcm in specimens of polished metals and silicone comprised in the sensor for micrometeoric particles. The report represents optic and scanning electron microscope images of craters formed in the specimens by high-velocity and low-velocity particles impacting the surface. By virtue of the electronic microscope, data on composition of the substance in the craters and of the substance of the low-velocity particles are obtained. The data make it possible to differentiate the particles as the natural-origin particles or anthropogenic-origin space debris particles. Distribution of craters and low-velocity particles in the size range of 5 to 50 mcm is obtained. The data are compared with the existing models of fluxes of natural-origin and artificial-origin microparticles on the ISS orbit. Inhomogeneous particles of complicated configuration are discovered on the surface of the analyzed specimens, whose origin are not uniquely determined and are to be the subject of further study.

Shaevich, S. K.↗
NASA NTRSDate not supplied

Medical Countermeasure Requirements for Meeting Permissible Radiation Exposure Limits in Space

The space radiation environment consists of ionizing radiation that poses healthrisks to crew members who embark on a mission to Mars. NASA requiresthat astronaut career radiation limits for the Risk of Exposure Induced Death(REID) should not exceed 3% at the upper 95% confidence level for cancermortality. However, the lifetime career limit is likely to be exceeded for eventhe shortest round-trip mission scenario to Mars. As such, approaches fordirectly reducing the radiation risk, despite the large uncertainties, are beinginvestigated. A recent study showed that medical countermeasures (MCM)which reduced background cancer mortality rates may be effective in mitigatingthe REID, where the data employed in the sensitivity analysis were limited tocohort studies of aspirin and warfarin. The present work addresses the generalMCM requirements that are needed to meet the lifetime career exposure limitsby examining modifications to the background cancer mortality rates, radiationquality factor, and low-LET radiation risk models for a Mars mission scenario.These results may be used to help inform decision-makers about potentialexperimental measurements that facilitate the greatest propensity for MCM risk reduction.

Charles M Werneth↗
NASA NTRS1996

A 1-Gigabit Memory System on a multi-Chip Module for Space Applications

Current spaceborne applications desire compact, low weight, and high capacity data storage systems along with the additional requirement of radiation tolerance. This paper discusses a memory system on a multi-chip module (MCM) that is designed for space applications.

data storage data storage systems multi-chip modul↗
NASA NTRS1980

Laser-heated thruster

The development of a computer program for the design of the thrust chamber for a CW laser heated thruster was examined. Hydrodgen was employed as the propellant gas and high temperature absorber. The laser absorption coefficient of the mixture/laser radiation combination is given in temperature and species densities. Radiative and absorptive properties are given to determine radiation from such gas mixtures. A computer code for calculating the axisymmetric channel flow of a gas mixture in chemical equilibrium, and laser energy absorption and convective and radiative heating is described. It is concluded that: (1) small amounts of cesium seed substantially increase the absorption coefficient of hydrogen; (2) cesium is a strong radiator and contributes greatly to radiation of cesium seeded hydrogen; (3) water vapor is a poor absorber; and (4) for 5.3mcm radiation, both H2O/CO and NO/CO seeded hydrogen mixtures are good absorbers.

Kemp, N. H.↗
NASA NTRS1981

Coronal loops and active region structure

Synoptic H-alpha Ca K, magnetograph and Skylab soft X-ray and EUV data were compared for the purpose of identifying the basic coronal magnetic structure of loops in a 'typical' active region and studying its evolution. A complex of activity in July 1973, especially McMath 12417, was emphasized. The principal results are: (1) most of the brightest loops connected the bright f plage to either the sunspot penumbra or to p satellite spots; no non-flaring X-ray loops end in umbrae; (2) short, bright loops had one or both ends in regions of emergent flux, strong field or high field gradients; (3) stable, strongly sheared loop arcades formed over filaments; (4) EFRs were always associated with compact X-ray arcades; and (5) loops connecting to other active regions had their bases in outlying plage of weak field strength in McM 417 where H-alpha fibrils marked the direction of the loops

Webb, D. F.↗
NASA NTRS1989

Multi-spacecraft testing of time-dependent interplanetary MHD models for operational forecasting of geomagnetic storms

An MHD 2-1/2D, time-dependent model is used, together with observations of six solar flares during February 3-7, 1986, to demonstrate global, large-scale, compound disturbances in the solar wind over a wide range of heliolongitudes. This scenario is one that is likely to occur many times during the cruise, possibly even encounter, phases of the Multi-Comet Mission. It is suggested that a model such as this one should be tested with multi-spacecraft data (such as the MCM and earth-based probes) with several goals in view: (1) utility of the model for operational real-time forecasting of geomagnetic storms, and (2) scientific interpretation of certain forms of cometary activities and their possible association with solar-generated activity.

Dryer, M.↗
NASA NTRS1993

An application protocol for CAD to CAD transfer of electronic information

The exchange of Computer Aided Design (CAD) information between dissimilar CAD systems is a problem. This is especially true for transferring electronics CAD information such as multi-chip module (MCM), hybrid microcircuit assembly (HMA), and printed circuit board (PCB) designs. Currently, there exists several neutral data formats for transferring electronics CAD information. These include IGES, EDIF, and DXF formats. All these formats have limitations for use in exchanging electronic data. In an attempt to overcome these limitations, the Navy's MicroCIM program implemented a project to transfer hybrid microcircuit design information between dissimilar CAD systems. The IGES (Initial Graphics Exchange Specification) format is used since it is well established within the CAD industry. The goal of the project is to have a complete transfer of microelectronic CAD information, using IGES, without any data loss. An Application Protocol (AP) is being developed to specify how hybrid microcircuit CAD information will be represented by IGES entity constructs. The AP defines which IGES data items are appropriate for describing HMA geometry, connectivity, and processing as well as HMA material characteristics.

Azu, Charles C., Jr.↗