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Scanning microscopy in microcircuit failure analysis

A three-phase microcircuit failure analysis procedure is presented. In the first phase, the device is nondestructively tested and the data obtained is correlated with the circumstances surrounding the failure event. The device is then subjected to a limited nondestructive analysis dominated by optical and scanning electron microscopy (SEM). Knowing that microcircuits usually fail from manufacturing defects or misuse, the analyst looks for one of the probable mechanisms. The SEM has two special operating modes that provide unique data for nondestructive analysis: voltage contrast and conductive current. These are used with other SEM modes and surface analysis techniques to analyze complicated microcircuits. The last phase includes the destructive procedures. The end product of these analyses is a corrective action that will yield a highly reliable system.

Nicolas, D. P.

Failure analysis of aluminum alloy components

Analysis of six service failures in aluminum alloy components which failed in aerospace applications is reported. Identification of fracture surface features from fatigue and overload modes was straightforward, though the specimens were not always in a clean, smear-free condition most suitable for failure analysis. The presence of corrosion products and of chemically attacked or mechanically rubbed areas here hindered precise determination of the cause of crack initiation, which was then indirectly inferred from the scanning electron fractography results. In five failures the crack propagation was by fatigue, though in each case the fatigue crack initiated from a different cause. Some of these causes could be eliminated in future components by better process control. In one failure, the cause was determined to be impact during a crash; the features of impact fracture were distinguished from overload fractures by direct comparisons of the received specimens with laboratory-generated failures.

Johari, O.

Application of the cubic polynomial strength criterion to the failure analysis of composite materials

A comparative failure analysis is presented based on the application of quadratic and cubic forms of the tensor polynomial lamina strength criterion to various composite structural configurations in a plane stress state. Failure loads have been predicted for off-angle laminates under simple loading conditions and for symmetric-balanced laminates subject to varying degrees of biaxial tension, including configurations subject to multimode failures. Some experimental data are also provided to support these calculations. From these results, the necessity of employing a cubic strength criterion to accurately predict the failure of composite laminae is demonstrated.

Tennyson, R. C.

Failure Analysis of Sapphire Refractive Secondary Concentrators

Failure analysis was performed on two sapphire, refractive secondary concentrators (RSC) that failed during elevated temperature testing. Both concentrators failed from machining/handling damage on the lens face. The first concentrator, which failed during testing to 1300 C, exhibited a large r-plane twin extending from the lens through much of the cone. The second concentrator, which was an attempt to reduce temperature gradients and failed during testing to 649 C, exhibited a few small twins on the lens face. The twins were not located at the origin, but represent another mode of failure that needs to be considered in the design of sapphire components. In order to estimate the fracture stress from fractographic evidence, branching constants were measured on sapphire strength specimens. The fractographic analysis indicated radial tensile stresses of 44 to 65 MPa on the lens faces near the origins. Finite element analysis indicated similar stresses for the first RSC, but lower stresses for the second RSC. Better machining and handling might have prevented the fractures, however, temperature gradients and resultant thermal stresses need to be reduced to prevent twinning.

Salem, Jonathan A.

Failure analysis of electronic parts: Laboratory methods

Failure analysis test methods are presented for use in analyzing candidate electronic parts and in improving future design reliability. Each test is classified as nondestructive, semidestructive, or destructive. The effects upon applicable part types (i.e. integrated circuit, transitor) are discussed. Methodology is given for performing the following: immersion tests, radio graphic tests, dewpoint tests, gas ambient analysis, cross sectioning, and ultraviolet examination.

Anstead, R. J.

Urine monitoring system failure analysis and operational verification test report

Failure analysis and testing of a prototype urine monitoring system (UMS) are reported. System performance was characterized by a regression formula developed from volume measurement test data. When the volume measurement test data. When the volume measurement data was imputted to the formula, the standard error of the estimate calculated using the regression formula was found to be within 1.524% of the mean of the mass of the input. System repeatability was found to be somewhat dependent upon the residual volume of the system and the evaporation of fluid from the separator. The evaporation rate was determined to be approximately 1cc/minute. The residual volume in the UMS was determined by measuring the concentration of LiCl in the flush water. Observed results indicated residual levels in the range of 9-10ml, however, results obtained during the flushing efficiency test indicated a residual level of approximately 20ml. It is recommended that the phase separator pumpout time be extended or the design modified to minimize the residual level.

Glanfield, E. J.

Probabilistic low cycle fatigue failure analysis with application to liquid propellant rocket engines

A probabilistic Low Cycle Fatigue (LCF) failure analysis of a candidate turbine disk for use in a turbopump of a rocket engine of the Space Shuttle Main Engine class is described. A state-of-the-art LCF failure prediction method was used in a Monte Carlo simulation to generate a distribution of failure lives. A stochastic Stress/Life (S/N) model was used for materials characterization. The LCF failure model expresses fatigue life as a function of stochastic parameters including environmental parameters, loads, material properties, structural parameters, and model specification errors. The rationale for the particular characterization of each stochastic input parameter is described. The results and interpretation of the failure analysis are given.

Newlin, L.

Failure analysis of a Stirling engine heat pipe

Failure analysis was conducted on a heat pipe from a Stirling Engine test rig which was designed to operate at 1073 K. Premature failure had occurred due to localized overheating at the leading edge of the evaporator fin. It was found that a crack had allowed air to enter the fin and react with the sodium coolant. The origin of the crack was found to be located at the inner surface of the Inconel 600 fin where severe intergranular corrosion had taken place.

Moore, Thomas J.

Real-time automated failure analysis for on-orbit operations

A system which is to provide real-time failure analysis support to controllers at the NASA Johnson Space Center Control Center Complex (CCC) for both Space Station and Space Shuttle on-orbit operations is described. The system employs monitored systems' models of failure behavior and model evaluation algorithms which are domain-independent. These failure models are viewed as a stepping stone to more robust algorithms operating over models of intended function. The described system is designed to meet two sets of requirements. It must provide a useful failure analysis capability enhancement to the mission controller. It must satisfy CCC operational environment constraints such as cost, computer resource requirements, verification, and validation. The underlying technology and how it may be used to support operations is also discussed.

Kirby, Sarah

Space Shuttle Stiffener Ring Foam Failure Analysis, a Non-Conventional Approach

The Space Shuttle Program made use of the excellent properties of rigid polyurethane foam for cryogenic tank insulation and as structural protection on the solid rocket boosters. When foam applications de-bond, classical methods of failure analysis did not provide root cause of the failure of the foam. Realizing that foam is the ideal media to document and preserve its own mode of failure, thin sectioning was seen as a logical approach for foam failure analysis to observe the three dimensional morphology of the foam cells. The cell foam morphology provided a much greater understanding of the failure modes than previously achieved.

cryogenic tank insulation

Space Shuttle Stiffener Ring Foam Failure Analysis, a Non-Conventional Approach.

The Space Shuttle Program made use of the excellent properties of rigid polyurethane foam for cryogenic tank insulation and as structural protection on the solid rocket boosters. When foam applications de-bond, classical methods of failure analysis did not provide root cause of the failure of the foam. Realizing that foam is the ideal media to document and preserve its own mode of failure, thin sectioning was seen as a logical approach for foam failure analysis to observe the three dimensional morphology of the foam cells. The cell foam morphology provided a much greater understanding of the failure modes than previously achieved.

Foam

Failure Analysis of Discrete Damaged Tailored Extension-Shear-Coupled Stiffened Composite Panels

The results of an analytical and experimental investigation of the failure of composite is tiffener panels with extension-shear coupling are presented. This tailored concept, when used in the cover skins of a tiltrotor aircraft wing has the potential for increasing the aeroelastic stability margins and improving the aircraft productivity. The extension-shear coupling is achieved by using unbalanced 45 plies in the skin. The failure analysis of two tailored panel configurations that have the center stringer and adjacent skin severed is presented. Finite element analysis of the damaged panels was conducted using STAGS (STructural Analysis of General Shells) general purpose finite element program that includes a progressive failure capability for laminated composite structures that is based on point-stress analysis, traditional failure criteria, and ply discounting for material degradation. The progressive failure predicted the path of the failure and maximum load capability. There is less than 12 percent difference between the predicted failure load and experimental failure load. There is a good match of the panel stiffness and strength between the progressive failure analysis and the experimental results. The results indicate that the tailored concept would be feasible to use in the wing skin of a tiltrotor aircraft.

Baker, Donald J.

Progressive Failure Analysis of Composite Stiffened Panels

A new progressive failure analysis capability for stiffened composite panels has been developed based on the combination of the HyperSizer stiffened panel design/analysis/optimization software with the Micromechanics Analysis Code with Generalized Method of Cells (MAC/GMC). MAC/GMC discretizes a composite material s microstructure into a number of subvolumes and solves for the stress and strain state in each while providing the homogenized composite properties as well. As a result, local failure criteria may be employed to predict local subvolume failure and the effects of these local failures on the overall composite response. When combined with HyperSizer, MAC/GMC is employed to represent the ply level composite material response within the laminates that constitute a stiffened panel. The effects of local subvolume failures can then be tracked as loading on the stiffened panel progresses. Sample progressive failure results are presented at both the composite laminate and the composite stiffened panel levels. Deformation and failure model predictions are compared with experimental data from the World Wide Failure Exercise for AS4/3501-6 graphite/epoxy laminates.

Bednarcyk, Brett A.

Failure Analysis of CCD Image Sensors Using SQUID and GMR Magnetic Current Imaging

During electrical testing of a Full Field CCD Image Senor, electrical shorts were detected on three of six devices. These failures occurred after the parts were soldered to the PCB. Failure analysis was performed to determine the cause and locations of these failures on the devices. After removing the fiber optic faceplate, optical inspection was performed on the CCDs to understand the design and package layout. Optical inspection revealed that the device had a light shield ringing the CCD array. This structure complicated the failure analysis. Alternate methods of analysis were considered, including liquid crystal, light and thermal emission, LT/A, TT/A SQUID, and MP. Of these, SQUID and MP techniques were pursued for further analysis. Also magnetoresistive current imaging technology is discussed and compared to SQUID.

Felt, Frederick S.

Incorporation of a progressive failure analysis method in the CSM testbed software system

Analysis of the postbuckling behavior of composite shell structures pose many difficult and challenging problems in the field of structural mechanics. Current analysis methods perform well for most cases in predicting the postbuckling response of undamaged components. To predict component behavior accurately at higher load levels, the analysis must include the effects of local material failures. The CSM testbed software system is a highly modular structural analysis system currently under development at Langley Research Center. One of the primary goals of the CSM testbed is to provide a software environment for the development of advanced structural analysis methods and modern numerical methods which will exploit advanced computer architecture such as parallel-vector processors. Development of a progressive failure analysis method consists of the design and implementation of a processor which will perform the ply-level progressive failure analysis and the development of a geometrically nonlinear analysis procedure which incorporates the progressive failure processor. Regarding the development of the progressive failure processor, two components are required: failure criteria and a degradation model. For the initial implementation, the failure criteria of Hashin will be used. For a matrix failure which typically indicates the development of transverse matrix cracks, the ply properties will be degraded. Work to date includes the design of the progressive failure analysis processor and initial plans for the controlling geometrically nonlinear analysis procedure. The implementation of the progressive failure analysis has begun. Access to the model database and the Hashin failure criteria are completed. Work is in progress on the input/output operations for the processor related data and the finite element model updating procedures. In total the progressive failure processor is approximately one-third complete.

Arenburg, Robert T.

Failure analysis methods for capacitors

The basic steps in the failure analysis of discrete capacitors used in electronic circuit boards and hybrid assemblies are described. These steps include: visual examination; functional test; disassembly; isolation of the failure site; and documentation.

Hildenbrand, R. L.