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Scanning ultrasonic apparatus designed for use in nondestructive inspection of electron-beam welds between heat-exchanger tube and end fittings. Includes ultrasonic probe, scanning mechanism, ultrasonic-signal-generating and -processing circuits, and computers. Not necessary to immerse any part of apparatus or tube/fitting assembly in water during inspection. Output ultrasonic-test signals displayed on computer to reveal defects.
To better understand the nature of particulates in low-Earth orbit (LEO), and their effects on spacecraft hardware, we are analyzing residues found in impacts on the Long Duration Exposure Facility (LDEF) tray clamps. LDEF experiment trays were held in place by 6 to 8 chromic-anodized aluminum (6061-T6) clamps that were fastened to the spacecraft frame using three stainless steel hex bolts. Each clamp exposed an area of approximately 58 sq cm (4.8 cm x 12.7 cm x .45 cm, minus the bolt coverage). Some 337 out of 774 LDEF tray clamps were archived at JSC and are available through the Meteoroid & Debris Special Investigation Group (M&D SIG). Optical scanning of clamps, starting with Bay/Row A01 and working toward H25, is being conducted at JSC to locate and document impacts as small as 40 microns. These impacts are then inspected by Scanning Electron Microscopy/Energy Dispersive X-ray Analysis (SEM/EDXA) to select those features which contain appreciable impact residue material. Based upon the composition of projectile remnants, and using criteria developed at JSC, we have made a preliminary discrimination between micrometeoroid and space debris residue-containing impact features. Presently, 13 impacts containing significant amounts of unmelted and semi-melted micrometeoritic residues were forwarded to Centre National d'Etudes Spatiales (CNES) in France. At the CNES facilities, the upgraded impacts were analyzed using a JEOL T330A SEM equipped with a NORAN Instruments, Voyager X-ray Analyzer. All residues were quantitatively characterized by composition (including oxygen and carbon) to help understand interplanetary dust as possibly being derived from comets and asteroids.
Discussed here are the first Secondary Ion Mass Spectroscopy (SIMS) analysis of projectile material deposited in extended impact features on Ge wafers from the trailing edge. Although most capture cells lost their plastic film covers, they contain extended impact features that apparently were produced by high velocity impacts when the plastic foils were still intact. Detailed optical scanning of all bare capture cells from the trailing edge revealed more than 100 impacts. Fifty-eight were selected by scanning electron microscope (SEM) inspection as prime candidates for SIMS analysis. Preliminary SIMS measurements were made on 15 impacts. More than half showed substantial enhancements of Mg, Al, Si, Ca, and Fe in the impact region, indicating micrometeorites as the projectiles.
The NASA Marshall Space Flight Center Annual Report is presented. A description of research and development projects is included. Topics covered include: space science; space systems; transportation systems; astronomy and astrophysics; earth sciences; solar terrestrial physics; microgravity science; diagnostic and inspection system; information, electronic, and optical systems; materials and manufacturing; propulsion; and structures and dynamics.
The Long Duration Exposure Facility (LDEF) has provided an excellent opportunity to understand the nature of directed atomic oxygen interactions with protected polymers and composites. Although there were relatively few samples of materials with protective coatings on their external surfaces on LDEF which were exposed to a high atomic oxygen fluence, analysis of such samples has enabled an examination of the shape of atomic oxygen undercut cavities at defect sites in the protective coatings. Samples of front-surface aluminized (Kapton) polyimide were inspected by scanning electron microscopy to identify and measure crack defects in the aluminum protective coatings. After chemical removal of the aluminum coating, measurements were also made of the width of the oxidized undercut cavities below the crack defects. The LDEF flight undercut cavity geometries were then compared with Monte Carlo computational model undercut cavity predictions. The comparison of the LDEF results and computational modeling indicates agreement in specific undercut cavity geometries for atomic oxygen reaction probabilities dependent upon the 0.68 to 3.0 power of the energy. However, no single energy dependency was adequate to replicate flight results over a variety of aluminum crack widths.
Sheet cork and cork filled epoxy provide external insulation for the Reusable Solid Rocket Motor (RSRM) on the Nation's Space Transportation System (STS). Interest in the reliability of the external insulation bonds has increased since the Columbia incident. A non-destructive test (NDT) method that will provide the best inspection for these bonds has been under evaluation. Electronic Shearography has been selected as the primary NDT method for inspection of these bond lines in the RSRM production flow. ATK Launch Systems Group has purchased an electronic shearography system that includes a vacuum chamber that is used for evaluation of test parts and custom vacuum windows for inspection of full-scale motors. Although the electronic shearography technology has been selected as the primary method for inspection of the external bonds, other technologies that exist continue to be investigated. The NASA/Marshall Space Flight Center (MSFC) NDT department has inspected several samples for comparison with electronic shearography with various inspections systems in their laboratory. The systems that were evaluated are X-ray backscatter, terahertz imaging, and microwave imaging. The samples tested have some programmed flaws as well as some flaws that occurred naturally during the sample making process. These samples provide sufficient flaw variation for the evaluation of the different inspection systems. This paper will describe and compare the basic functionality, test method and test results including dissection for each inspection technology.
The development of methods of measurement for semiconductor materials, process control, and devices is reported. Significant accomplishments include: (1) Completion of an initial identification of the more important problems in process control for integrated circuit fabrication and assembly; (2) preparations for making silicon bulk resistivity wafer standards available to the industry; and (3) establishment of the relationship between carrier mobility and impurity density in silicon. Work is continuing on measurement of resistivity of semiconductor crystals; characterization of generation-recombination-trapping centers, including gold, in silicon; evaluation of wire bonds and die attachment; study of scanning electron microscopy for wafer inspection and test; measurement of thermal properties of semiconductor devices; determination of S-parameters and delay time in junction devices; and characterization of noise and conversion loss of microwave detector diodes.
Both tension and compression fatigue behaviors were investigated in four notched graphite/epoxy laminates. After fatigue loading, specimens were examined for damage type and location using visual inspection, light microscopy, scanning electron microscopy, ultrasonic C-scans, and X-radiography. Delamination and ply cracking were found to be the dominant types of fatigue damage. In general, ply cracks did not propagate into adjacent plies of differing fiber orientation. To help understand the varied fatigue observations, the interlaminar stress distribution was calculated with finite element analysis for the regions around the hole and along the straight free edge. Comparison of observed delamination locations with the calculated stresses indicated that both interlaminar shear and peel stresses must be considered when predicting delamination. The effects of the fatigue cycling on residual strength and stiffness were measured for some specimens of each laminate type. Fatigue loading generally caused only small stiffness losses. In all cases, residual strengths were greater than or equal to the virgin strengths.
In experimental manufacturing process, numerically-controlled machine tool temporarily converts into inspection machine by installing electronic touch probes and specially-developed numerical-control software. Software drives probes in paths to and on newly machined parts and collects data on dimensions of parts.
At the NASA Glenn Research Center, we have been training artificial neural networks to interpret the characteristic patterns (see the leftmost image) generated from electronic holograms of vibrating structures. These patterns not only visualize the vibration properties of structures, but small changes in the patterns can indicate structural changes, cracking, or damage. Neural networks detect these small changes well. Our objective has been to adapt the neural-network, electronic-holography combination for inspecting components in Glenn's Spin Rig.
Metal surface finishes of tin, zinc and cadmium are often applied to electronic components, mechanical hardware and other structures. These finishes sometimes unpredictably may form metal whiskers over periods that can take from hours to months or even many years. The metal whiskers are crystalline structures commonly having uniform cross sectional area along their entire length. Typical whisker dimensions are nominally on the order of only a few microns (um) across while their lengths can extend from a few microns to several millimeters. Metal whiskers pose a reliability hazard to electronic systems primarily as an electrical shorting hazard. The extremely narrow dimensions of metal whiskers can make observation with optical techniques very challenging. The videos herein were compiled to demonstrate the complexities associated with optical microscope inspection of electronic and mechanical components and assemblies for the presence or absence of metal whiskers. The importance of magnification, light source and angle of illumination play critical roles in being able to detect metal whiskers when present. Furthermore, it is demonstrated how improper techniques can easily obscure detection. It is hoped that these videos will improve the probability of detecting metal whiskers with optical inspection techniques.
The Solar Maximum Satellite developed electronic problems after operating successfully in space for several years. Astronauts on Space Shuttle mission STS-41C retrieved the satellite into the orbiter cargo bay, replaced defective components, and re-deployed the repaired satellite into orbit. The defective components were returned to Earth for study. The space-exposed surfaces were examined. The approach and objectives were to: document morphology of impact; find and analyze projectile residue; classify impact by origin; determine flux distribution; and determine implications for space exposure. The purpose of the shuttle witness plate experiment was to detect impacts from PAM D2 solid rocket motor; determine flux and size distribution of particles; and determine abrasion effects on various conditions. Results are given for aluminum surfaces, copper surfaces, stainless steel surfaces, Inconel surfaces, and quartz glass surfaces.
Many industrial and aerospace processes involving the joining of materials, require sufficient surface cleanliness to insure proper bonding. Processes as diverse as painting, welding, or the soldering of electronic circuits will be compromised if prior inspection and removal of surface contaminants is inadequate. As process requirements become more stringent and the number of different materials and identified contaminants increases, various instruments and techniques have been developed for improved inspection. One such technique based on the principle of Optically Stimulated Electron Emission (OSEE) has been explored for a number of years as a tool for surface contamination monitoring. Some of the benefits of OSEE are: it's non-contacting; requires little operator training; and has very high contamination sensitivity. This paper describes the development of a portable OSEE based surface contamination monitor. The instrument is suitable for both hand-held and robotic inspections with either manual or automated control of instrument operation. In addition, instrument output data is visually displayed to the operator and may be output to an external computer for archiving or analysis.
Many industrial and aerospace processes involving the joining of materials, require sufficient surface cleanliness to insure proper bonding. Processes as diverse as painting, welding, or the soldering of electronic circuits will be compromised if prior inspection and removal of surface contaminants is inadequate. As process requirements become more stringent and the number of different materials and identified contaminants increases, various instruments and techniques have been developed for improved inspection. One such technique, based on the principle of Optically Stimulated Electron Emission (OSEE), has been explored for a number of years as a tool for surface contamination monitoring. Some of the benefits of OSEE are: it is non-contacting; requires little operator training; and has very high contamination sensitivity. This paper describes the development of a portable OSEE based surface contamination monitor. The instrument is suitable for both hand-held and robotic inspections with either manual or automated control of instrument operation. In addition, instrument output data is visually displayed to the operator and may be sent to an external computer for archiving or analysis.
Gold plate beneath weldment reveals areas of excess penetration during X-ray inspection. Technique is applicable to critical electron-beam welds, such as those in gas turbines and pressure vessels.
Screening procedures for the final precap visual inspection of microcircuits used in electronic system components are described as an aid in training personnel unfamiliar with microcircuits. Processing techniques used in industry for the manufacture of monolithic and hybrid components are presented and imperfections that may be encountered during this inspection are discussed. Problem areas such as scratches, voids, adhesions, and wire bonding are illustrated by photomicrographs. This guide can serve as an effective tool in training personnel to perform precap visual inspections efficiently and reliably.
An apparatus and method for performing quality inspections on a test surface based on optically stimulated emission of electrons. In one embodiment, the apparatus comprises a device for producing optical radiation having a plurality of different spectrum lines, selecting at least one of the spectrum lines, and directing the selected spectrum line to the test surface, and circuitry for detecting a current of photoelectrons emitted from the test surface, generating a signal indicative of photoelectron current, and for indicating a condition of quality based on the generated signal indicative of the photoelectron current. In one embodiment, the method comprises producing optical radiation having a plurality of different spectrum lines, selecting at least one of the spectrum lines and directing the selected spectrum line to the test surface, detecting a current of photoelectrons emitted from the test surface and generating a signal indicative of photoelectron current, and indicating a condition of quality based on the generated signal indicative of the photoelectron current.
For high reliability applications, visual inspection has been the key technique for most conventional electronic package assemblies. Now, the use of x-ray technique has become an additional inspection requirement for quality control and detection of unique defects due to manufacturing of advanced electronic array packages such as ball grid array (BGAs) and chip scale packages (CSPs).