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At least 37 records · Page 2

A Module Experimental Process System Development Unit (MEPSDU)

The technical readiness of a cost effective process sequence that has the potential for the production of flat plate photovoltaic modules which met the price goal in 1986 of $.70 or less per Watt peak was demonstrated. The proposed process sequence was reviewed and laboratory verification experiments were conducted. The preliminary process includes the following features: semicrystalline silicon (10 cm by 10 cm) as the silicon input material; spray on dopant diffusion source; Al paste BSF formation; spray on AR coating; electroless Ni plate solder dip metallization; laser scribe edges; K & S tabbing and stringing machine; and laminated EVA modules.

Source record↗

Crack Growth of D6 Steel in Air and High Pressure Oxygen

Fracture and subcritical flaw growth characteristics were experimentally deter­mined for electroless nickel plated D6 steel in dry air and high pressure oxygen environments as applicable to the Lunar Module/Environmental Control System (LM/ECS) descent gaseous oxygen (GOX) tank. The material tested included forgings, plate, and actual LM/ECS descent GOX tank material. Parent metal and TIG (tungsten inert gas) welds were tested. Tests indicate that proof testing the tanks at 4000 pounds per square inch or higher will insure safe operation at 3060 pounds per square inch. Although significant flaw growth can occur during proofing, subsequent growth of flaws during normal tank operation is negligible.

Bixler, W. D.↗

Solar cell contact pull strength as a function of pull-test temperature

Four types of solar cell contacts were given pull-strength tests at temperatures between -173 and +165 C. Contacts tested were: (1) solder-coated titanium-silver contacts on n-p cells, (2) palladium-containing titanium-silver contacts on n-p cells, (3) titanium-silver contacts on 0.2-mm-thick n-p cells, and (4) solder-coated electroless-nickel-plated contacts on p-n cells. Maximum pull strength was demonstrated at temperatures significantly below the air mass zero cell equilibrium temperature of +60 C. At the lowest temperatures, the chief failure mechanism was silicon fracture along crystallographic planes; at the highest temperatures, it was loss of solder strength. In the intermediate temperatures, many failure mechanisms operated. Pull-strength tests give a good indication of the suitability of solar cell contact systems for space use. Procedures used to maximize the validity of the results are described.

Yasui, R. K.↗

Silicon Sheet Growth Development for the Large Area Sheet Task of the Low Cost Solar Array Project. Heat Exchanger Method - Ingot Casting Fixed Abrasive Method - Multi-Wire Slicing

Solar cells fabricated from HEM cast silicon yielded up to 15% conversion efficiencies. This was achieved in spite of using unpurified graphite parts in the HEM furnace and without optimization of material or cell processing parameters. Molybdenum retainers prevented SiC formation and reduced carbon content by 50%. The oxygen content of vacuum cast HEM silicon is lower than typical Czochralski grown silicon. Impregnation of 45 micrometers diamonds into 7.5 micrometers copper sheath showed distortion of the copper layer. However, 12.5 micrometers and 15 micrometers copper sheath can be impregnated with 45 micrometers diamonds to a high concentration. Electroless nickel plating of wires impregnated only in the cutting edge showed nickel concentration around the diamonds. This has the possibility of reducing kerf. The high speed slicer fabricated can achieve higher speed and longer stroke with vibration isolation.

Schmid, F.↗

Array automated assembly task, phase 2. Low cost silicon solar array project

Several modifications instituted in the wafer surface preparation process served to significantly reduce the process cost to 1.55 cents per peak watt in 1975 cents. Performance verification tests of a laser scanning system showed a limited capability to detect hidden cracks or defects, but with potential equipment modifications this cost effective system could be rendered suitable for applications. Installation of electroless nickel plating system was completed along with an optimization of the wafer plating process. The solder coating and flux removal process verification test was completed. An optimum temperature range of 500-550 C was found to produce uniform solder coating with the restriction that a modified dipping procedure is utilized. Finally, the construction of the spray-on dopant equipment was completed.

Rhee, S. S.↗

Experiments with diamond-turned metal X-ray mirrors

It is noted that the primary advantages of diamond turning technology for the fabrication of X-ray telescope mirrors is in the smoothness of the finished surface and the control of the position of the cutter afforded by the precision slides and computer-assisted positioners which form the surface. The paper summarizes the Caltech work in attempting to make Wolter Type I telescope mirrors using the diamond turning facilities at the Oak Ridge Y-12 laboratory. Attention is given to such factors as the use of aluminum with copper plating and electroless nickel coating. It is found that although the diamond turning capability of the Y-12 lab is capable of making good X-ray mirror contours, there are problems in the process which have limited the accuracy achieved by this technique.

Garmire, G. P.↗

Braze alloy process and strength characterization studies for 18 nickel grade 200 maraging steel with application to wind tunnel models

A comprehensive study of braze alloy selection process and strength characterization with application to wind tunnel models is presented. The applications for this study include the installation of stainless steel pressure tubing in model airfoil sections make of 18 Ni 200 grade maraging steel and the joining of wing structural components by brazing. Acceptable braze alloys for these applications are identified along with process, thermal braze cycle data, and thermal management procedures. Shear specimens are used to evaluate comparative shear strength properties for the various alloys at both room and cryogenic (-300 F) temperatures and include the effects of electroless nickel plating. Nickel plating was found to significantly enhance both the wetability and strength properties for the various braze alloys studied. The data are provided for use in selecting braze alloys for use with 18 Ni grade 200 steel in the design of wind tunnel models to be tested in an ambient or cryogenic environment.

Bradshaw, James F.↗

An Experimental Investigation of Silicone-to-Metal Bond Strength in Composite Space Docking System Seals

The National Aeronautics and Space Administration (NASA) is currently developing a new universal docking mechanism for future space exploration missions called the Low Impact Docking System (LIDS). A candidate LIDS main interface seal design is a composite assembly of silicone elastomer seals vacuum molded into grooves in an electroless nickel plated aluminum retainer. The strength of the silicone-tometal bond is a critical consideration for the new system, especially due to the presence of small areas of disbond created during the molding process. In the work presented herein, seal-to-retainer bonds of subscale seal specimens with different sizes of intentional disbond were destructively tensile tested. Nominal specimens without intentional disbonds were also tested. Tension was applied either uniformly on the entire seal circumference or locally in one short circumferential length. Bond failure due to uniform tension produced a wide scatter of observable failure modes and measured load-displacement behaviors. Although the preferable failure mode for the seal-to-retainer bond is cohesive failure of the elastomer material, the dominant observed failure mode under the uniform loading condition was found to be the less desirable adhesive failure of the bond in question. The uniform tension case results did not show a correlation between disbond size and bond strength. Localized tension was found to produce failure either as immediate tearing of the elastomer material outside the bond region or as complete peel-out of the seal in one piece. The obtained results represent a valuable benchmark for comparison in the future between adhesion loads under various separation conditions and composite seal bond strength.

Gaier, James R.↗

Lunar Glovebox Balance with Wireless Technology

The most important equipment required for processing lunar samples is a high-quality mass balance for maintaining accurate weight inventory, security, and scientific study. After careful review, a Curation Office memo by Michael Duke in 1978 chose the Mettler PL200 to be used for sample weight measurements inside the gloveboxes (Fig. 3). These commercial off-the-shelf (COTS) balances did not meet the strict accepted material requirements in the Lunar lab. As a result, each balance housing, weighing pan, and wiring was custom retrofitted to meet Lunar Operating Procedure (LOP) 54 requirements [for material construction restrictions]. The original design drawings for the custom housings, readout support stands, and wiring were done by the JSC engineering directorate. The 1977- 1978 schematics, drawings, and files are now housed in the curation Data Center. Per the design specifications, the housing was fabricated from aluminum grade 6061 T6, seamless welds, and anodized per MIL-A-8625 type I, class I. The balance feet were TFE Teflon and any required joints were sealed with Viton A gaskets. The readout display and support stands outside the glovebox were fabricated from 300 series stainless steel with #4 finish and mounted to the glovebox with welded bolts. Wire harnesses that linked the balance with the outside display and power were encapsulated with TFE Teflon and transported through custom Deutsch wire bulk head pass-through systems from inside to outside the glovebox. These Deutsch connectors were custom fabricated with 316L stainless steel bodies, Viton A O-rings, aluminum 6061 with electroless nickel plating, Teflon (replacing the silicone), and gold crimp connectors (no soldering). Many of the Deutsch connectors may have been used in the Apollo program high vacuum complex in building 37 and date to about 1968 to 1970.

Zeigler, Ryan A.↗

Analysis and evaluation in the production process and equipment area of the low-cost solar array project

The attributes of the various metallization processes were investigated. It is shown that several metallization process sequences will lead to adequate metallization for large area, high performance solar cells at a metallization add on price in the range of $6. to 12. m squared, or 4 to $.8/W(peak), assuming 15% efficiency. Conduction layer formation by thick film silver or by tin or tin/lead solder leads to metallization add-on prices significantly above the $6. to 12/m squared range c.) The wet chemical processes of electroless and electrolytic plating for strike/barrier layer and conduction layer formation, respectively, seem to be most cost effective.

Wolf, M.↗

Revealing the microstructure of materials

The objectives are to demonstrate how the microstructure of materials may be revealed by abrasive polishing and chemical etching, and to illustrate how microstructural information is used to monitor manufacturing processes, provide in-depth inspection, and perform failure analysis. Microstructural analysis is the procedure used to reveal the internal microstructural details of a material or part by sectioning and polishing the cut surface so that it may be examined under a suitable microscope. A printed wiring board was selected as the test material because it contains both metals and nonmetals that have distinctive microstructures, and because this technique is used throughout the electronic industry as a key quality control tool. The three principle component materials in printed circuit boards are glass/epoxy laminates faced with copper foil; copper, deposited by both electroless and electrolytic plating; and tin/lead solder. Sample preparation, mounting, grinding, polishing, and examination and analysis are discussed.

Nelson, James A.↗

Replicate Wolter-I x-ray mirrors

Cylindrical (hyperbolic - parabolic Wolter I) mirrors have been electroformed from nickel over an electroless nickel-phosphorous (NiP) plated aluminum mandrel in support of the NASA AXAF-S x-ray spectrometer program. The electroless nickel was diamond turned and polished to achieve a surface finish of 10 angstroms rms or better. Gold was then plated on the nickel alloy after an electrochemical passivation step. Next a heavy layer of pure nickel was plated one millimeter thick with controlled stress at zero using a commercial PID program to form the actual mirror. This shell was removed from the NiP alloy coated mandrel by cryogenic cooling and contraction of the aluminum to release the mirror. It is required that the gold not adhere well to the NiP but all other plated coatings must exhibit good adherence. Four mirrors were fabricated from two mandrels prepared by this method. The area of each part is 0.7 square meters (7.5 square feet).

Engelhaupt, D. E.↗

An experimental investigation of silicon wafer surface roughness and its effect on the full strength of plated metals

Plated silicon wafers with surface roughness ranging from 0.4 to 130 microinches were subjected to tensile pull strength tests. Electroless Ni/electroless Cu/electroplated Cu and electroless Ni/electroplated Cu were the two types of plate contacts tested. It was found that smoother surfaces had higher pull strength than rougher, chemically etched surfaces. The presence of the electroless Cu layer was found to be important to adhesion. The mode of fracture of the contact as it left the silicon was studied, and it was found that in almost all cases separation was due to fracture of the bulk silicon phase. The correlation between surface roughness and mode of contact failure is presented and interpreted.

Spiers, G. D.↗

Extreme ultraviolet reflection efficiencies of diamond-turned aluminum, polished nickel, and evaporated gold surfaces

Measured reflection efficiencies are presented for flat samples of diamond-turned aluminum, nickel, and evaporated gold surfaces fabricated by techniques suited for EUV telescopes. The aluminum samples were 6.2-cm-diameter disks of 6061-T6, the electroless nickel samples were formed by plating beryllium disks with 7.5-microns of Kanigen. Gold samples were produced by coating the aluminum and nickel samples with 5 strips of evaporated gold. Reflection efficiencies are given for grazing angles in the 5-75 degree range. The results indicate that for wavelengths over about 100 A, the gold-coated nickel samples yield highest efficiencies. For shorter wavelengths, the nickel samples yield better efficiencies. 500 A is found to be the optimal gold thickness.

Malina, R. F.↗

Cosmic X-ray telescope for ARIES rocket observations

A rocket-borne Wolter Type I X-ray telescope having a focal length of 2.3m, an entrance aperture of 66cm and a geometrical area of 380cm2 is nearing completion. The telescope mirrors are formed by diamond turning their figures into forged aluminum substrates of 5083 alloy. These diamond-turned substrates are subsequently plated with a thin coating of electroless nickel and polished to obtain the final X-ray reflecting surfaces. Details of the rocket payload, the X-ray telescope, its calculated response and the experience gained in selecting the mirror substrate alloy are discussed and the current status of the telescope is reviewed.

Catura, R. C.↗

The automated array assembly task of the low-cost silicon solar array project, phase 2

Several specific processing steps as part of a total process sequence for manufacturing silicon solar cells were studied. Ion implantation was identified as the preferred process step for impurity doping. Unanalyzed beam ion implantation was shown to have major cost advantages over analyzed beam implantation. Further, high quality cells were fabricated using a high current unanalyzed beam. Mechanically masked plasma patterning of silicon nitride was shown to be capable of forming fine lines on silicon surfaces with spacings between mask and substrate as great as 250 micrometers. Extensive work was performed on advances in plated metallization. The need for the thick electroless palladium layer was eliminated. Further, copper was successfully utilized as a conductor layer utilizing nickel as a barrier to copper diffusion into the silicon. Plasma etching of silicon for texturing and saw damage removal was shown technically feasible but not cost effective compared to wet chemical etching techniques.

Coleman, M. G.↗