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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2

Wave emissions from dc and modulated electron beams on STS 3

During the third Space Shuttle Columbia flight (STS 3) in March 1982, investigations were conducted to assess the electrical, electromagnetic, and plasma environment of the orbiter and to diagnose wave emissions and related plasma effects due to the injection of an electron beam into the surrounding ionosphere. Attention is given to wave emissions and related plasma processes which were stimulated by the first electron beam emissions from the Space Shuttle. The on-orbit measurements are compared to measurements made in a space simulation chamber. Instrumentation and operations are considered along with the plasma effects of beam emissions, wave emissions from dc beams, wave emissions from VLF-modulated beams, and wave emissions from ELF-modulated beams.

Shawhan, S. D.

Ceramic wiring board increases packaging density of electronic modules

Ceramic multilayer wiring board interconnects large scale integration /LSI/ modules which dissipate nearly 2W/cc. Extremely high packaging density is possible by application of alumina cover hermetically sealed to board. Signal interconnections are completely dependent on transfer heat between layers.

Hamley, L. D.

Improved shelf for electronic modules

Self-alining slide assembly improves air flow. Alinement accuracy is incorporated into assembly at time of fabrication, reducing requirement for mounting-hole location accuracy. Amount of labor needed for installation, necessary machining, hardware, and number of mounting points are reduced from previous support system. Load-bearing capability is built into mounting platform.

Marzek, R. A.

Cryogenic Pressure Calibrator for Wide Temperature Electronically Scanned (ESP) Pressure Modules

Electronically scanned pressure (ESP) modules have been developed that can operate in ambient and in cryogenic environments, particularly Langley's National Transonic Facility (NTF). Because they can operate directly in a cryogenic environment, their use eliminates many of the operational problems associated with using conventional modules at low temperatures. To ensure the accuracy of these new instruments, calibration was conducted in a laboratory simulating the environmental conditions of NTF. This paper discusses the calibration process by means of the simulation laboratory, the system inputs and outputs and the analysis of the calibration data. Calibration results of module M4, a wide temperature ESP module with 16 ports and a pressure range of +/- 4 psid are given.

Faulcon, Nettie D.

Electronics for Mars Exploration Rover and beyond

Mars exploration seeks to understand the potential for life elsewhere in the universe; characterize the present and past climate and climate processes; understand geological processes affecting Mars' interior, crust, and surface; and, develop the knowledge and technology necessary for eventual human exploration. The design of a Mars Exploration rover is discussed, in particular it electronic components. The avionics development activities for the subsystem and hardware functionality are outlined. The functions and interfaces of the Rover Electronics Module, Cruise Electronics Module, and Lander Electronics Module are highlighted.

avionics

High density electronic packaging module with improved cooling assembly

Cold plate increases heat transfer within high density electronic module. Tapered pins improve heat transfer process by providing larger surface pressure with increased planar area. Cooling technique increases thermal contact where planar area is limited, interface pressure increases the heat transfer coefficient.

Martin, J. H.

Method of disjoining adhesively bonded electronic cordwood modules

Embedment of resistive heating elements in a cordwood module used for packaging electronic components, facilitates separation of the adhesive bond between the module, and metal heat sink and the potting material without damaging the components. Electrical power applied to the elements causes breakdown of bonding material.

Sacramone, P. J.

Modulation of cosmic-ray electrons.

An analytical approach is presented that provides qualitative insight into both observations and numerical calculations of cosmic-ray electron modulation and embodies, as a natural feature of a specific model, two cosmic-ray components whose temporal variations are uncorrelated. In the light of this approach, it is shown that the origin and time variations of the steep spectrum of electrons observed below 20 MeV may be explained by a simple method in which the spectrum of interplanetary cosmic rays is decomposed at low energies into two independently varying components.

Earl, J. A.

Modular Standards for Space Power Systems

This presentation presents an approach to provide commonality for future space power systems through a set of modular power standards. The approach presented breaks down the electrical power conversion and distribution system into the lowest level functions, which are represented by power electronics modules, and serve as the foundational building blocks of the system. A series of Modular Power Standards has been developed to define the functions and interfaces of the lowest level of the electrical power system, or for each type of power electronics module. The power electronics modules, when integrated with a common chassis and backplane, can then be built up into modular electronics assemblies, which have been demonstrated and characterized in a relevant ground test environment.

Gardner, Brent G.

Overview of the NASA LISA Laser System Development

NASA Goddard Space Flight Center (GSFC) is developing the Laser System (LS) for the Laser Interferometer Space Antenna (LISA) mission, led by the European Space Agency (ESA) with a launch date of 2035. The LS under development at NASA GSFC consists of the Laser Head (LH), the Frequency Reference System (FRS), and the Power Monitor (PMON) Detector Assemblies. Since late 2017, we have been developing various models to advance the technology readiness level (TRL) for the LH from prototype (TRL4) to a system model demonstration in a relevant environment (TRL6). For the LH and FRS, the models further breakdown into the optical and electronics modules where the LH is made up of the Laser Optical Module (LOM) and the Laser Electronics Module (LEM) and the FRS consists of the FRS Optical Reference Cavity (FRS-O) and the FRS Electronics (FRS-E). The LS development follows the established NASA process in demonstrating the performance requirements [1] through the TRL4 effort and then advancing the form factor and package design to meet relevant environment requirements and qualifying the TRL6 design through rigorous testing and performance verification for space applications. The LOM for the LH is a main oscillator power amplifier (MOPA) with wavelength of 1064 nm and nominal output power of 2 Watt throughout the mission. The low-power, low-noise main oscillator (MO) is a custom micro non-planar ring oscillator (µNPRO) [2] that is phase modulated then amplified by the forward pumped ytterbium-dope fiber power amplifier (PA) stage to meet the output power requirement. The FRS is baselined on the GRACE Follow-On (GFO) [3] approach with updated FRS-E design to work with the LH-LEM. The PMON is located on the Optical Bench Assembly (OBA) [4] that samples a small portion of the LH output signal and provides the feedback signal to the LH-LEM for relative intensity noise (RIN) control. In this paper, we will report on the latest status of the LH testing and system level tests, explain the other subsystems involved in the test campaigns, and discuss the path to bring each LS subsystem to TRL6. We will also present the NASA GSFC roadmap in advancing the LISA LS to TRL6+ and plans for future system level testing as well as the preparation for space flight development to meet the LISA launch date of 2035.

amplifier

Three-dimensional modular electronic interconnection system

A three-dimensional connection system uses a plurality of printed wiring boards with connectors completely around the printed wiring boards, and connected by an elastomeric interface connector. The device includes internal space to allow room for circuitry. The device is formed by stacking an electronics module, an elastomeric interface board on the electronics module such that the interface board's exterior makes electrical connection with the connectors around the perimeter of the interface board, but the internal portion is open to allow room for the electrical devices on the printed wiring board. A plurality of these devices are stacked between a top stiffener and a bottom device, and held into place by alignment elements.

Bolotin, Gary S.